JP2011044481A - Manufacturing device for electronic circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing device for an electronic circuit board that can form a high-density electronic circuit by an ink jet method and can save the trouble and time for manufacture more than before. <P>SOLUTION: The manufacturing device 1 for the electronic circuit board includes a laser 3 configured to form a predetermined hydrophilic pattern on a water-repellent surface of a substrate B having the water-repellent surface by irradiating the substrate B with light or an electron beam, and an ink head 2 having a print head 21 for discharging ink containing a conductive component onto the pattern. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic circuit board manufacturing apparatus.

  In recent years, it has been studied to manufacture an electronic circuit board by applying the technology of an ink jet recording apparatus (for example, see Patent Document 1). In this method, a predetermined circuit pattern is formed on a substrate by discharging ink in which metal particles are dispersed onto the substrate. Such a method is called an ink jet method, and it is sufficient to discharge a metal ink only to a portion necessary for a wiring pattern as compared with a conventional photolithography method. It has the advantage that can be reduced.

JP 2007-296425 A

  By the way, with the recent increase in the density of electronic circuits, the wiring width and the pitch between wirings have become very small. However, in the conventional ink jet method, the metal ink ejected from the ink head spreads on the substrate surface after landing on the substrate, and thus it is difficult to form an electronic circuit having a small wiring width and wiring pitch. It was. Moreover, much labor and time are required to form such a high-density electronic circuit.

  The present invention has been made in view of the above points, and an object of the present invention is to provide an electronic circuit board capable of forming a high-density electronic circuit by an ink-jet method and capable of reducing the labor and time of manufacturing as compared with the prior art. It is to provide a manufacturing apparatus.

  An electronic circuit board manufacturing apparatus according to the present invention includes a hydrophilic portion forming apparatus that forms a predetermined pattern having hydrophilicity on a surface of a substrate by irradiating the substrate having a water-repellent surface with light or an electron beam, And an ink head having a print head for discharging ink containing a conductive component on the pattern.

  According to the present invention, a high-density electronic circuit can be formed. In addition, it is possible to reduce manufacturing effort and time as compared with the prior art.

It is a front view which shows the principal part of the manufacturing apparatus of the electronic circuit board which concerns on 1st Embodiment. (A)-(e) is sectional drawing which shows a series of processes which manufacture an electronic circuit board. (A)-(f) is sectional drawing which shows a series of processes which manufacture the electronic circuit board of a multilayer structure. (A)-(d) is sectional drawing which shows the process of manufacture of a through hole. (A)-(c) is a schematic diagram which shows a series of processes which manufacture a circuit pattern in the board | substrate provided with the electronic device. (A)-(c) is a schematic diagram which shows a series of processes which manufacture a circuit pattern in the board | substrate provided with the electronic device. It is a front view which shows the principal part of the manufacturing apparatus of another electronic circuit board. (A) is a perspective view of the manufacturing apparatus of the electronic circuit board based on 2nd Embodiment, (b) is a front view of the principal part of the manufacturing apparatus, (c) is sectional drawing of a circuit board. (A)-(d) is a schematic diagram which shows a series of processes which manufacture an electronic circuit board. (A)-(c) is a schematic diagram which shows a series of processes which manufacture an electronic circuit board. (A) is a perspective view of the manufacturing apparatus of the electronic circuit board based on 3rd Embodiment, (b) is a front view of the principal part of the manufacturing apparatus. (A)-(d) is a schematic diagram which shows a series of processes which manufacture a circuit board. (A)-(c) is a schematic diagram which shows a series of processes which manufacture a circuit board. It is a perspective view of the manufacturing apparatus of the electronic circuit board which concerns on other embodiment.

<First Embodiment>
(Configuration of electronic circuit board manufacturing equipment)
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, an electronic circuit board manufacturing apparatus (hereinafter simply referred to as a manufacturing apparatus) 1 according to the present embodiment includes an ink head 2 that discharges conductive ink. The ink head 2 performs a so-called ink jet type ejection operation. The “inkjet type” in the present invention means an ink ejection method based on an inkjet technique. Furthermore, “inkjet” includes various known methods, for example, various continuous methods such as a binary deflection method or a continuous deflection method, and various on-demand methods such as a thermal method or a piezoelectric element method. .

  The manufacturing apparatus 1 includes an ink head 2, a laser 3, and an ultraviolet irradiation device 4. In FIG. 1 and the like, the symbol Y indicates the main scanning direction. In the present embodiment, the main scanning direction Y is the left-right direction. The sub-scanning direction, which is a direction orthogonal to the main scanning direction, is the direction in which the substrate B is transported and is the front-rear direction.

  A guide rail 10 extending in the main scanning direction Y is provided inside the ink jet printer 1. A belt-like bed 11 is disposed below and in front of the central portion of the guide rail 10. The bed 11 is a portion that supports the substrate B when ink is ejected by the ink head 2 or when the substrate B is processed by the laser 3. Ink ejection and processing on the substrate B are performed on the bed 11.

  The ink head 2 is a head that ejects ink toward the substrate B. The ink head 2 includes a plurality of print heads 21 having nozzles 20 that eject ink, and a print head carriage 22 that supports these print heads 21. The print head carriage 22 is engaged with the guide rail 10 so as to be movable in the left-right direction. The print head 21 ejects ink droplets downward from the nozzles 20. In order from the front right side, hydrophilic UV curable ink, water-repellent UV curable ink, yellow UV curable ink, white UV curable ink, metal nano ink in which copper particles are dispersed, and silver particles are sequentially applied to each print head 21. The dispersed metal nano ink ink is supplied. Here, the term “hydrophilic” refers to a property that the surface of a substance does not repel water and water tends to become familiar with the surface. More specifically, the contact angle of water droplets on a substance is 25 degrees or less. “Water repellency” refers to the property that when a water droplet is dropped on the surface of a certain substance, the water droplet is repelled and becomes almost spherical. More specifically, the contact angle of water droplets on a substance is 60 degrees or more. “Metal nano ink” refers to an ink containing dispersed fine metal particles. The particle surface is coated with an organic substance so that the metal fine particles are not fused in the ink. As the metal fine particles, nickel, manganese, or the like is appropriately used. Instead of the metal nano ink, other conductive ink, for example, an ink containing a resistance material or a semiconductor component may be used. These are all inks containing a conductive component. The yellow or white UV curable ink is a printing ink for printing characters, symbols, and the like on the substrate B, for example. However, yellow or white UV curable ink is not essential for forming an electronic circuit. Therefore, the print head 21 that discharges the ink may be omitted. Further, the color of the printing ink is not limited to yellow or white, and other colors of ink can be used.

  The ultraviolet irradiation device 4 is a device that irradiates ultraviolet curable ink with ultraviolet rays, and is configured by an ultraviolet light emitting diode in this embodiment. In addition, the structure of the ultraviolet irradiation device 4 is not limited at all, and may be composed of, for example, a halogen lamp. The ultraviolet irradiation device 4 is attached to the right side portion of the print head carriage 22 via the connecting member 30. The ultraviolet irradiation device 4 moves in the left-right direction together with the ink head 2. That is, the ultraviolet irradiation device 4 is guided by the guide rail 10 via the print head carriage 22 and moves in the left-right direction. However, the ultraviolet irradiation device 4 itself may be configured to be guided by the guide rail 10. A magnet 31 is attached to the left side of the print head carriage 22.

Next, the laser 3 will be described. The laser 3 is an example of a hydrophilic portion forming apparatus, and includes a laser irradiation apparatus for performing laser processing on the substrate B. The laser 3 emits, for example, a CO ₂ laser, a YAG laser, an excimer laser, and the like, but the specific types of laser light are not limited to these. The laser 3 incorporates a lens (not shown) that can change the focused diameter even during laser irradiation, depending on the type of processing. It is also possible to set the irradiation intensity per unit area to be constant by changing the condensing diameter. The laser 3 may be provided with a fan. Thereby, it becomes easy to collect smoke generated during laser processing. A magnet 32 is attached to the right side of the laser 3. The laser 3 has a built-in carriage 33 that moves in the main scanning direction Y, and the laser 3 can travel in the main scanning direction Y along the guide rail 10. However, the carriage may be provided in the ink head 2 instead of the laser 3. Alternatively, carriages may be provided on both the laser 3 and the ink head 2.

  The drive device of the carriage 33 is not limited at all. For example, a driving roller may be provided in the vicinity of one end of the guide rail 10, a driven roller may be provided in the vicinity of the other end, and a driving belt to which the carriage 33 is fixed may be wound around these rollers. According to such a configuration, when the driving roller rotates, the driving belt travels, and the carriage 33 moves in the main scanning direction Y.

  As shown in FIG. 1, when the magnet 31 of the ink head 2 and the magnet 32 of the laser 3 come into contact with each other, the magnets 31 and 32 are attracted, so that the laser 3 and the ink head 2 are connected to each other. The right end portion of the guide rail 10 is the home position of the ink head 2. The laser 3 and the ink head 2 are connected at the home position of the ink head 2. After the connection, the ink head 2 moves in the main scanning direction Y together with the laser 3. On the other hand, when the laser 3 moves to the left side with the ink head 2 fixed at the home position, the connection between the laser 3 and the ink head 2 is released. When the connection is released, the ink head 2 stands by at the home position, and only the laser 3 moves in the main scanning direction Y. A fixing device (not shown) for fixing the ink head 2 is provided in the vicinity of the home position. Thus, the magnets 31 and 32 have a function of detachably connecting the laser 3 and the ink head 2. The carriage 33 and the print head carriage 22 are detachably connected by magnets 31 and 32. In addition, operation | movement of each part of the manufacturing apparatus 1 is controlled by a control apparatus (not shown).

(Electronic circuit board manufacturing method)
Next, the manufacturing method of the electronic circuit board by the manufacturing apparatus 1 will be described.

  First, while the ink head 2 reciprocates in the main scanning direction Y, the print head 21 ejects hydrophilic ultraviolet curable ink toward the substrate B made of silicon or the like, and the ultraviolet irradiation device 4 irradiates ultraviolet rays. The ultraviolet curable ink is cured. Thereby, as shown in FIG. 2A, a hydrophilic layer (hereinafter referred to as a hydrophilic layer) P is formed on the surface of the substrate B. Next, the print head 21 discharges the water-repellent ultraviolet curable ink toward the surface of the hydrophilic layer P, and the ultraviolet irradiation device 4 irradiates the ultraviolet ray to cure the ultraviolet curable ink. As a result, a water repellent layer (hereinafter referred to as a water repellent layer) Q is formed on the hydrophilic layer P as shown in FIG.

  Next, laser processing with the laser 3 is performed. That is, laser light is irradiated from the laser 3 to the water repellent layer Q. As a result, as shown in FIG. 2C, the portion of the water-repellent layer Q irradiated with the laser light disappears, and the hydrophilic layer P is exposed to the outside. The laser 3 moves in the main scanning direction Y and the substrate B on the bed 11 is transported in the sub-scanning direction X, so that the pattern groove 40 corresponding to the wiring pattern of the electronic circuit is formed in the water repellent layer Q. Form. According to laser processing, it is easy to form a fine pattern groove 40. In the present embodiment, a pattern groove 40 having a width of about 10 microns is formed.

  Next, as shown in FIG. 2D, the metal nano ink R containing silver or copper particles is ejected from the print head 21 into the pattern groove 40. As shown in FIG. 2D, since the ink R does not spread on the surface of the water repellent layer Q, the width of the ink R can be suppressed to the same level as the width of the pattern groove 40. That is, a wiring pattern with a short line width can be formed. Next, laser light is irradiated from the laser 3 to the metal nano ink R. Thereby, as shown in FIG.2 (e), the solvent and organic substance of the metal nano ink R are melt | dissolved and removed, and the sintered body S of a metal particle is produced | generated. The whole of the fired body S becomes a wiring pattern of an electronic circuit.

  As described above, a two-dimensional wiring pattern can be formed. However, the manufacturing apparatus 1 according to the present embodiment can also form a three-dimensional wiring pattern. Next, a method for forming a three-dimensional wiring pattern will be described.

  In the case of forming a three-dimensional wiring pattern, first, as shown in FIG. 3A, the hydrophilic layer P1 and the water repellent layer Q1 are sequentially formed on the substrate B as described above. A pattern groove 40 is formed in Q1. Then, after discharging the metal nano ink R into the pattern groove 40, the metal nano ink R is baked. As a result, a first-layer wiring pattern is formed. Next, as shown in FIG. 3B, hydrophilic UV curable ink is applied from the print head 21 onto the wiring pattern of the first layer, that is, over the entire water repellent layer Q1 and the fired body S1. Discharge. Next, ultraviolet rays are irradiated from the ultraviolet irradiation device 4 to cure the hydrophilic ultraviolet curable ink, thereby forming the hydrophilic layer P2. Next, water-repellent ultraviolet curable ink is ejected from the print head 21, and ultraviolet rays are irradiated from the ultraviolet irradiation device 4 to cure the water-repellent ultraviolet curable ink. Thereby, as shown in FIG.3 (c), the water repellent layer Q2 is formed on the hydrophilic layer P2.

  Next, as shown in FIG. 3D, a pattern groove 40 corresponding to the wiring pattern of the second layer is formed in the water repellent layer Q2 by the laser 3. Then, as shown in FIG. 3E, the metal nano ink R is ejected from the print head 21 into the pattern groove 40. Next, as shown in FIG. 3 (f), the metal nano-ink R is baked by the laser 3. A second-layer wiring pattern is formed by the fired body S2.

  The first-layer wiring pattern and the second-layer wiring pattern can be conducted through the following through holes. The through hole is formed as follows. As shown in FIG. 3D, the groove 40 is formed only in the water repellent layer Q2 in the portion where the second-layer wiring pattern is formed. On the other hand, as shown in FIG. 4A and FIG. 4B, a groove 40 penetrating the water repellent layer Q2 and the hydrophilic layer P2 is formed by the laser 3 in the portion where the through hole is formed. Note that the first layer of the metal nano-ink R or a fired body thereof is provided in a portion where the through hole is formed. Next, as shown in FIG. 4C, the metal nano ink R is discharged from the print head 21 into the groove 40. Then, the metal nano ink R is baked by the laser 3 (see FIG. 4D). As a result, a through hole that connects the wiring pattern of the first layer and the wiring pattern of the second layer is formed.

  Although the above electronic circuit is an electronic circuit having a two-layer structure, an electronic circuit having three or more layers can be manufactured in the same manner.

(Effect of embodiment)
As described above, in the manufacturing apparatus 1 according to the present embodiment, since the metal nano ink R is ejected into the pattern groove 40 of the water repellent layer Q, the metal nano ink R after ejection is prevented from spreading to the surroundings. And the width of the metal nano-ink R can be shortened. Further, since the pattern groove 40 of the water repellent layer Q is formed by the laser 3, it can be easily miniaturized and formed with high accuracy. Therefore, a circuit pattern having a desired wiring width and wiring pitch can be formed. As a result, a high-density electronic circuit board A can be obtained.

  In addition, the manufacturing apparatus 1 according to this embodiment can perform all the series of steps from the formation of the hydrophilic layer P and the water repellent layer Q to the substrate B to the generation of the fired body S. For this reason, the electronic circuit board A can be manufactured easily and efficiently. It is possible to reduce the time and labor of production than before.

  Further, since the ink head 2 moves in the main scanning direction Y along the same guide rail 10 as the laser 3, the mutual positional relationship between the ink head 2 and the laser 3 can be maintained well. The formation of the pattern groove 40 and the discharge of the metal nano ink R to the pattern groove 40 can be performed with high accuracy.

(Modification)
The manufacturing apparatus 1 can also be applied to a case where a circuit pattern is formed between electronic devices such as an integrated circuit, a resistor, and a capacitor incorporated in advance on the substrate B. Hereinafter, as an example, as shown in FIG. 5A, a rectangular parallelepiped electronic device (for example, a CPU) 50 is provided at the center portion, and terminals 51 are provided at each end of the substrate B located on the four sides. A case where a circuit pattern is formed will be described. First, as shown in FIG. 5B, hydrophilic ultraviolet curable ink is ejected from the ink head 2, and this is irradiated with ultraviolet rays by the ultraviolet irradiation device 4. As a result, a hydrophilic layer P having a substantially triangular cross section is formed around the electronic device 50 and has a slope that slopes downward as it goes outward. Next, as shown in FIG. 5 (c), the water-repellent ultraviolet curable ink is ejected from the ink head 2 onto the inclined surface of the hydrophilic layer P and irradiated with ultraviolet rays by the ultraviolet irradiation device 4. Thereby, the water repellent layer Q is formed so as to cover the surface of the hydrophilic layer P. Then, as shown to Fig.6 (a), the laser beam is irradiated to the water-repellent layer Q from the laser 3, and the one part is lose | disappeared. As a result, a pattern groove 40 that connects the terminal 51 and the terminal 52 of the electronic device 50 facing the terminal 51 is formed. Next, as shown in FIG. 6B, the metal nano ink R is ejected from the ink head 2 into the pattern groove 40. Thus, the terminals 51 and 52 are connected via the metal nano ink R. Thereafter, as shown in FIG. 6C, the metal nano-ink R is irradiated with laser light from the laser 3. The metal nano ink R is fired, and the terminals 51 and 52 are connected in a conductive state via the fired body S.

  In the above-described embodiment, the ink head 2 is provided with the print head 21 capable of ejecting hydrophilic or water-repellent ultraviolet curable ink, but these may be omitted as appropriate. Instead of this, it is also possible to use, for example, a substrate B provided with hydrophilicity and water repellency in advance. For the substrate B having hydrophilicity in advance, the water-repellent layer Q may be formed with water-repellent ultraviolet curable ink. If a substrate provided with a hydrophilic layer P in the lower portion and a water-repellent layer Q in the upper portion in advance is used, it is not necessary to discharge each ultraviolet curable ink.

  As described above, the ink head 2 of the manufacturing apparatus 1 includes the print head 21 that ejects printing ink. Therefore, information such as a model number can be printed on the electronic circuit board A after manufacture. That is, the manufacturing and printing of the electronic circuit board A can be performed by the single manufacturing apparatus 1.

  Further, for example, a substrate B having water repellency in advance is irradiated with laser light from the laser 3 so that a part of the water repellency is modified to be hydrophilic, or water repellant ultraviolet irradiation ink is ejected onto the substrate B for water repellency. After the layer Q is formed, it may be irradiated with laser light to modify the part to be hydrophilic. As described above, when the water repellency is modified to be hydrophilic, the hydrophilic pattern does not become the pattern groove as in the above embodiment, but is formed flush with the water repellent layer Q.

  The laser 3 can also be configured by appropriately combining a plurality of heads that irradiate the same or different types of lasers. For example, the laser 3 shown in FIG. 7 includes two heads 3a and 3b that can irradiate YAG laser light and excimer laser light. Further, a height detection sensor 53 for measuring the distance to the processing surface may be provided on the side surface of one head 3a. In this way, it is possible to keep the laser condensing diameter by the laser 3 constant based on the measurement result by the height detection sensor 53.

  Further, the substrate B can be cut by the manufacturing apparatus 1 by appropriately setting the type and intensity of the laser 3.

  The substrate B is not limited to a rigid body, and may be a film-like flexible substrate.

Second Embodiment
The electronic circuit board manufacturing apparatus according to the present invention can also be configured as follows. As shown in FIG. 8, the manufacturing apparatus 1 according to the present embodiment includes a plasma irradiation apparatus 3A as a hydrophilic portion forming apparatus, a camera 61, a mask 62, an ink head 2, a baking furnace 63, and a bed 11. It has. Further, the manufacturing apparatus 1 includes a control device 90. The plasma irradiation device 3 </ b> A runs along the guide rail 60 in the main scanning direction Y and irradiates the plasma light downward. The plasma irradiation apparatus 3A can be used at atmospheric pressure. The camera 61 is detachably attached to the side portion of the plasma irradiation apparatus 3A via a magnet or the like. When the camera 61 is attached to the plasma irradiation apparatus 3A, the camera 61 moves in the main scanning direction Y along the guide rail 60 together with the plasma irradiation apparatus 3A. The camera 61 functions as a recognition device that recognizes an image of a pattern hole of a mask 62 described later, and is configured by a digital camera in this embodiment. The mask 62 is made of stainless steel disposed below the plasma irradiation apparatus 3A and the camera 61 and having a predetermined pattern hole. As shown in FIG. 8B, the ink head 2 can move in the main scanning direction Y along the guide rail 10. The firing furnace 63 is disposed in front of the ink head 2. The bed 11 conveys the substrate B in the sub-scanning direction X. The recognition device is not limited to the camera 61. Further, the baking apparatus is not limited to the baking furnace 63.

  In the manufacturing apparatus 1 configured as described above, the electronic circuit board A is manufactured as follows. First, as shown in FIGS. 9A and 9B, a substrate B having a water repellent layer Q on the surface is attached on the bed 11. Holes 64 are formed in the four corners of the substrate B. The board B is fixed by inserting the pin 65 provided in the bed 11 into the hole 64. Next, as shown in FIG. 9C, a mask 62 is disposed above the substrate B. In this state, as shown in FIG. 9D, the substrate B is irradiated with plasma light from the plasma irradiation apparatus 3A through the pattern hole of the mask 62. In this way, the plasma-treated water repellent layer Q is modified from water repellency to hydrophilicity, and a hydrophilic pattern is formed. At that time, the camera 61 is separated from the plasma irradiation apparatus 3A.

  Next, as shown in FIG. 10A, the plasma irradiation apparatus 3 </ b> A moves in the main scanning direction Y along with the camera 61, and the mask 62 is scanned by the camera 61. It should be noted that when a plurality of similar electronic circuit boards A are manufactured, this scanning operation is sufficient, and the scanning operation is not necessary for the second and subsequent manufacturing. For this reason, the efficiency of a series of work is achieved. The scan result of the camera 61 is sent to the control device 90, and the control device 90 recognizes the position, shape, dimension, etc. of the pattern hole of the mask 62. In other words, the control device 90 recognizes the hydrophilic pattern formed on the substrate B. The control device 90 controls the ink head 2 and the bed 11 so that the metal nano ink is ejected onto the pattern. That is, as shown in FIG. 10B, after the substrate B is conveyed by the bed 11 in the sub-scanning direction X, the metal nano ink R is transferred from the ink head 2 to the hydrophilicity of the substrate B as shown in FIG. It is discharged onto the pattern. As shown in FIG. 8C, since the periphery of the hydrophilic pattern 40A is made of the water repellent layer Q, the metal nano ink R ejected on the hydrophilic pattern 40A is prevented from spreading to the periphery. Thereafter, the substrate B is conveyed by the bed 11 in the sub-scanning direction X, and the metal nano ink R is baked in the baking furnace 63.

  In the present embodiment, the following effects can be obtained as well as the same effects as in the first embodiment. That is, in this embodiment, the hydrophilic pattern 40A is formed by combining the plasma treatment by the plasma irradiation apparatus 3A and the mask 62 manufactured with high accuracy. For this reason, the hydrophilic pattern 40A is accurately formed. In addition, an accurate processing signal is sent from the control device 90 to the ink head 2 based on an actual scan result by the camera 61 instead of a drawing pattern prepared in advance. For this reason, a highly accurate circuit pattern is formed by the ink head 2. That is, the dimension of the mask 62 may change due to tension, temperature change, or the like generated in the mask 62. According to this embodiment, even if the dimension changes, the pattern hole of the mask 62 after the change is recognized. be able to. Therefore, a highly accurate circuit pattern can be formed.

  Further, since it is not necessary to provide the ink head 2 with ink ejection data corresponding to the mask 62, electronic circuits having different patterns can be easily manufactured by simply replacing the mask 62. According to the present embodiment, the circuit pattern can be easily changed.

  If there are many circuit boards A to be manufactured, only the plasma treatment may be performed first, and then the metal nano ink R may be ejected collectively to draw a circuit pattern. However, it is preferable that the metal nano-ink R be ejected immediately after the plasma treatment because the modification effect by the plasma may be reduced with the passage of time.

  The hydrophilic portion forming apparatus in the above embodiment is the plasma irradiation apparatus 3A that irradiates plasma light. However, instead of this, for example, an apparatus that irradiates an electron beam or the like may be used. Also in this case, the same effect can be obtained.

<Third Embodiment>
Further, the manufacturing apparatus 1 according to the second embodiment can be configured by changing a part thereof as follows. In this embodiment, as shown in FIGS. 11A and 11B, a camera 61 as a recognition device is integrally attached to the side portion of the ink head 2. Further, as shown in FIG. 11A, a cleaner 67 having a brush 66 that is rotationally driven at the lower end portion is disposed between the plasma irradiation device 3A and the ink head 2. Further, as shown in FIG. 12B and the like, in this embodiment, different colors of ink are applied to the surface of the substrate B in order to divide the surface of the substrate B into a plurality of regions. Specifically, the region C is colored blue, the region D is red, and the region E is colored yellow. The ink is preferably organic and has water repellency. The ink may be applied by screen printing or the like, or may be applied by the ink head 2 of the manufacturing apparatus 1.

  Also in the present embodiment, as shown in FIGS. 12A to 12D and FIGS. 13A to 13C, an electronic circuit board is manufactured in substantially the same manner as in the second embodiment. However, when the substrate B is irradiated with plasma light from the plasma irradiation apparatus 3A, the ink coating film on the irradiated portion is removed. Also in this case, the water repellent layer Q of the substrate B located in the portion where the coating film has been removed is modified from water repellency to hydrophilicity. Thereafter, the substrate B is transported in the sub-scanning direction X by the bed 11 and passes below the cleaner 67. At that time, foreign matter such as ink dash adhering to the surface of the substrate B is cleanly removed by the rotating plush 66. Thereafter, the substrate B stops at a position below the ink head 2. The substrate B is scanned by the camera 61. Since the regions C to E of the substrate B are colored and the color of the portion modified to be hydrophilic is removed, the hydrophilic pattern can be easily recognized by the camera 61. In the second embodiment, the pattern hole of the mask 62 is regarded as the hydrophilic pattern of the substrate B, and the hydrophilic pattern is indirectly recognized. On the other hand, in this embodiment, the hydrophilic pattern of the substrate B is directly recognized. Therefore, the recognition accuracy of the hydrophilic pattern can be improved.

  Further, if the color classification is performed as described above, different types of ink can be ejected for each color based on the scan result. The control device 90 can recognize the hydrophilic pattern and in which region the hydrophilic pattern is formed based on the scan result. Therefore, the control device 90 can control the ink head 2 so as to eject different ink for each region. For example, ink containing copper is applied to the hydrophilic pattern 40C in the blue region, ink containing silver is applied to the hydrophilic pattern 40D in the red region, and ink containing gold is applied to the hydrophilic pattern 40E in the yellow region. Can be made. Further, as information for identifying the region of the substrate B, the following may be adopted instead of the color. For example, inks having different reflection intensities are applied to the substrate B, or even the same kind of ink is applied so as to have different thicknesses. In this case, instead of the camera 61, a sensor for recognizing these reflection strengths and thicknesses may be used as the recognition device. In addition, the area can be identified by numbers, characters, barcodes, or the like. Also in this case, each region can be recognized by scanning with the camera 61, and the type of metal nano-ink R to be ejected and the coating amount thereof can be appropriately changed for each region.

  Also in this embodiment, a circuit pattern is formed by the ink head 2 based on the actual scan result by the camera 61. For this reason, even when there is distortion or displacement in the mounting of the substrate B to the bed 11, a high-quality electronic circuit substrate A can be manufactured.

(Modification)
In the above embodiment, the surface of the substrate B is color-coded by a plurality of colors. However, a single color ink different from the ground color of the substrate B may be applied to the entire surface. Also in this case, the hydrophilic pattern of the substrate B can be directly recognized by the camera 61.

  Alternatively, the metal nano-ink R ejected on the hydrophilic pattern may be scanned by the camera 61 to confirm the presence or absence of a missing part. If there is a missing part, the metal nano ink R is discharged again to correct it. By performing such re-examination and correction, the yield is improved.

  In the above embodiment, the ink head 2 and the plasma irradiation device 3A are configured to move in the main scanning direction Y. However, such a configuration is not necessarily required. For example, as illustrated in FIG. 14, the ink head 2 and the plasma irradiation device 3 </ b> A are formed wide in the main scanning direction Y and configured not to move in the main scanning direction Y. May be. In this case, the camera 61 may be movable or non-movable in the main scanning direction Y. However, when the camera 61 is not movable, the scanning range is expanded so that the entire area in the main scanning direction Y can be scanned. There is a need.

<Other embodiments>
Other processing machines may be provided in the hydrophilic portion forming apparatus (laser 3 in the first embodiment, plasma irradiation apparatus 3A in the second and third embodiments). Thereby, it is possible to perform machining on the substrate B or the like.

DESCRIPTION OF SYMBOLS 1 Electronic circuit board manufacturing apparatus 2 Ink head 3 Laser (hydrophilic part forming apparatus)
3A Plasma irradiation device (hydrophilic part forming device)
10 Guide rail 21 Print head 40 Pattern groove (pattern)
61 Camera (recognition device)
62 Mask 63 Firing furnace (firing device)
90 Controller B Substrate P Hydrophilic layer Q Water repellent layer R Ink

Claims (12)

A hydrophilic part forming apparatus for forming a predetermined pattern having hydrophilicity on the surface of the substrate by irradiating the substrate having a water repellent surface with light or an electron beam;
An ink head having a print head for discharging ink containing a conductive component on the pattern;
An electronic circuit board manufacturing apparatus comprising: A guide rail for guiding the movement of the hydrophilic portion forming device and the ink head in a predetermined direction;
The substrate includes a hydrophilic layer and a water-repellent layer provided on the hydrophilic layer,
2. The electron according to claim 1, wherein the hydrophilic portion forming device is a laser that forms a groove having a predetermined pattern in which the hydrophilic layer is exposed by irradiating the water-repellent layer of the substrate with laser light. Circuit board manufacturing equipment.   The electronic circuit board manufacturing apparatus according to claim 2, wherein the laser bakes the ink by irradiating the ink ejected into the groove with laser light. The ink head has a print head for discharging water-repellent ink,
4. The electronic circuit board manufacturing apparatus according to claim 2, wherein the water-repellent layer of the substrate is formed by water-repellent ink ejected from the print head. The ink head has a print head for discharging hydrophilic ink,
The apparatus for manufacturing an electronic circuit board according to claim 2, wherein the hydrophilic layer of the substrate is formed by hydrophilic ink ejected from the print head.   The electronic circuit board manufacturing apparatus according to claim 1, wherein the ink head includes a print head that discharges printing ink.   The hydrophilic portion forming apparatus has hydrophilicity by modifying a part of the surface of the substrate by irradiating the surface of the substrate with plasma light or an electron beam through a mask in which a predetermined pattern hole is formed. The electronic circuit board manufacturing apparatus according to claim 1, wherein the apparatus is an irradiation apparatus for forming the pattern. A recognition device for recognizing the pattern of the substrate by recognizing the pattern hole of the mask;
A control device that receives information on the pattern from the recognition device and controls the ink head to eject the ink onto the pattern;
The electronic circuit board manufacturing apparatus according to claim 7, further comprising a baking apparatus that bakes the ink. On the surface of the substrate, a coating film having a color different from the ground color of the substrate is provided,
The irradiation device irradiates the surface of the substrate with plasma light through the mask, and forms the pattern by erasing a part of the coating film,
A recognition device for recognizing the pattern based on the color of the surface of the substrate;
A control device that receives information on the pattern from the recognition device and controls the ink head to eject the ink onto the pattern;
The electronic circuit board manufacturing apparatus according to claim 7, further comprising a baking apparatus that bakes the ink. A plurality of information for identifying each of a plurality of regions is attached to the surface of the substrate,
The irradiation device irradiates the surface of the substrate with plasma light through the mask, and forms the pattern by erasing a part of the information,
A recognition device for recognizing the information and the pattern on the surface of the substrate;
A control device that receives the information and the pattern information from the recognition device, and controls the ink head to eject different types of ink onto patterns in different regions;
The electronic circuit board manufacturing apparatus according to claim 7, further comprising a baking apparatus that bakes the ink. The ink is an ink that cures when irradiated with ultraviolet rays,
The electronic circuit board manufacturing apparatus according to claim 2, further comprising an ultraviolet irradiation device that is guided by the guide rail and moves in the predetermined direction to irradiate the ink with ultraviolet rays. First and second carriages movable along the guide rails and detachably connected to each other;
The first carriage is provided in the laser;
The electronic circuit board manufacturing apparatus according to claim 2, wherein the second carriage is provided in the ink head.

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