CN101019143A - Tape with built-in IC chip, method for manufacturing the tape, and sheet with build-in IC chip - Google Patents
Tape with built-in IC chip, method for manufacturing the tape, and sheet with build-in IC chip Download PDFInfo
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- CN101019143A CN101019143A CN 200580030303 CN200580030303A CN101019143A CN 101019143 A CN101019143 A CN 101019143A CN 200580030303 CN200580030303 CN 200580030303 CN 200580030303 A CN200580030303 A CN 200580030303A CN 101019143 A CN101019143 A CN 101019143A
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Abstract
本发明涉及IC芯片不易受到机械外力、IC芯片不发生脱落或损伤的内置IC芯片的片材以及使用于该内置IC芯片的片材上的内置IC芯片的带及其制造方法。该内置IC芯片的带的特征在于：IC芯片(10)的全部或一部分埋设在设置于带本体上的凹部(20a)中，带本体(20)包括依次层压的第一基材(21)、由粘结剂构成的粘结剂层(22)、第二基材(23)，所述凹部(20a)及其周边部分的第二基材(23)被除去，且所述凹部(20a)的粘结剂层(22)的粘结剂被推开，所述被推开的粘结剂填充在所述IC芯片(10)的周面与第二基材(23)之间的间隙中。
The present invention relates to an IC chip-embedded sheet which is less susceptible to mechanical external force and does not cause the IC chip to fall off or be damaged, an IC chip-embedded tape used on the IC chip-embedded sheet, and a method for manufacturing the same. The tape with built-in IC chip is characterized in that: all or part of the IC chip (10) is buried in the recess (20a) provided on the tape body, and the tape body (20) includes first substrates (21) laminated in sequence , an adhesive layer (22) made of adhesive, a second base material (23), the second base material (23) of the concave portion (20a) and its peripheral portion is removed, and the concave portion (20a ) of the adhesive layer (22) is pushed away, and the pushed away adhesive fills the gap between the peripheral surface of the IC chip (10) and the second substrate (23) middle.
Description
Technical field
The sheet material of build-in IC chip that the present invention relates to be used in the band and the manufacture method thereof of the build-in IC chip in the sheet material of build-in IC chip and use the band of this build-in IC chip.
The application serve as for 2005-10052 number a basis opinion right of priority with Japan's special permission application 2004-267162 number of on September 14th, 2004 application and Japan's special permission application of application on January 18th, 2005, with its content quotation in this instructions.
Background technology
In recent years, along with the progress of reprography, the forgery of securities class becomes easily, has become serious social concern, so, taked various anti-pseudogames in order to prevent improper correction, the forgery of bank note, exchange ticket, check, stock certificate, passport, I.D., card etc.
As anti-pseudogame, developed a kind of between ply of paper, copying into the counterfeit prevention paper thread that is called " line " (band), that be called as so-called clamp paper (patent documentation 1～4).Clamp paper is owing to copying the technical requirement height of lambda line, so be suitable as false proof measure, be widely used in bank note or the exchange ticket etc. in various countries.
In addition, in order further to improve the antifalse effect of clamp paper, also proposed a kind of decorative pattern or online surface of destroying and formed the small literal that constitutes by the metal evaporation layer or the technology (patent documentation 5) of small image.
Recently, in order to improve antifalse effect, a kind of will being encased in as the method (patent documentation 6) in the scraps of paper or this tablet of plastic sheet at the line that the single face of film in a narrow margin is bonded with the IC chip proposed again.
Patent documentation 1: Japanese kokai publication sho 48-75808 communique
Patent documentation 2: Japanese kokai publication sho 50-88377 communique
Patent documentation 3: Japanese kokai publication sho 51-130308 communique
Patent documentation 4: Japanese kokai publication hei 10-292297 communique
Patent documentation 5: Japanese kokai publication hei 10-219597 communique
Patent documentation 6: TOHKEMY 2002-319006 communique
The counterfeit prevention paper of the line of the disclosed IC of being bonded with chip is compared with the counterfeit prevention paper that only uses line in use as the above-mentioned patent documentation 6, has given play to better antiforge function.But, may produce following problem on its structure.
(1) because the part of the bonding IC chip of line is a bossing, the IC chip is subjected to external force and peels off easily.Especially on the position of the mechanical external force in being subjected to machine hand's preface (tinsel, squeezer, dryer, calenderstack), heat energy etc., the IC chip might be peeled off from line and come off, when such coming off taken place when, because in machine hand's preface, be difficult to detect dropping situations, so following problem can take place: after copying paper as after the Counterfeit-proof certificate printing, when confirming to have the IC chip to come off product,, also must print mint-mark again with numbering (to the number of Counterfeit-proof certificate volume) even have only one.In addition, in when circulation with when using, the IC chip also might break away from.
(2) because the part of the bonding IC chip of line is a bossing, thus might be because the external force of calender etc. self be damaged the IC chip, thus damage circuit, function.
In order to reduce to be applied to the external force on the IC chip, expected that also the part at the insertion line of paper is provided with the structure of groove.But this situation also is that the part of bonding IC chip is thicker and become bossing than the part of having only film.Therefore, the effect of avoiding external force to concentrate is limited.
(3) because band and IC chip partly have the thickness of 25～100 μ m, so when being encased in the ply of paper, it is big that the thickness of the portion of packing into becomes,
I. paper crimping.
Ii. wrinkling.
Iii. gloss variation.
(4) owing to the thickness part of the paper of the portion of packing into cause concavo-convex, have unaccommodated mode of printing.
Summary of the invention
Problem to be solved by this invention is: sheet material that a kind of IC chip is difficult to be subjected to the build-in IC chip that mechanical external force, IC chip can not come off or damage and band and the manufacture method thereof of using the build-in IC chip on the sheet material of this build-in IC chip are provided.
In order to address the above problem, the present invention includes following mode:
(1) is used in the band of the build-in IC chip in the sheet material of build-in IC chip, it is characterized in that, comprise IC chip and the band body that is provided with recess, all or part of of described IC chip is embedded in the described recess, described band body comprises first base material, be laminated to the adhesive layer that constitutes by cementing agent on described first base material, be laminated to second base material on the described adhesive layer, second base material of described recess and peripheral part thereof is removed, and the cementing agent of the adhesive layer of described recess is open, and the described cementing agent that is open is filled in the side face and the gap between second base material of described IC chip.
(2) according to the band of (1) described build-in IC chip, wherein the IC chip all is embedded in the band body.
(3) according to the band of (1) or (2) described build-in IC chip, wherein said cementing agent is a hot-melt resin.
(4) manufacture method of the band of the build-in IC chip that uses in the sheet material of build-in IC chip is characterized in that comprising: body forms operation, across adhesive layer lamination first base material and second base material that are made of cementing agent, forms band body; Loading port forms operation, and a part of removing second base material forms IC chip loading port; And the operation of packing into, the IC chip is encased in adhesive layer from IC chip loading port.
(5) manufacture method of the band of basis (4) described build-in IC chip, wherein said cementing agent is a hot-melt resin, the described operation of packing into is carried out under heated condition.
(6) manufacture method of the band of basis (4) or (5) described build-in IC chip, wherein said loading port forms operation and is undertaken by laser radiation.
(7) sheet material of build-in IC chip, it is characterized by (1)～(3) in pack into the inside of tablet of the band of each described build-in IC chip.
(8) according to the sheet material of the build-in IC chip described in (7), wherein tablet is that multilayer is copied paper.
(9) according to the sheet material of (8) described build-in IC chip, all or part of of the position part of packing into of layer that wherein is incorporated with the band of build-in IC chip is to manufacture paper with pulp under the state of non-cohesive sheet stock.
(10) according to the sheet material of (7) described build-in IC chip, the state that exposes with its part of the band of the build-in IC chip inside of tablet of packing into wherein.
(11) sheet material of build-in IC chip is characterized in that, the band of the build-in IC chip of each record sticks on the tablet in (1)～(3).
According to the invention of (1)～(3), because all or part of of IC chip is embedded in the band body, so be not vulnerable to mechanical external force.In addition, because be filled with cementing agent between the side face of IC chip and second base material, the IC chip is securely fixed on the band body.Therefore, utilize the band of build-in IC chip of the present invention, can obtain that the IC chip does not come off or the sheet material of the build-in IC chip that damages.
According to the invention of (4)～(6), can obtain the band of build-in IC chip of the present invention easily.
According to the invention of (7)～(11), can obtain that the IC chip does not come off or the sheet material of the build-in IC chip that damages.Therefore, when using as Counterfeit-proof certificate, the product even generation IC chip comes off can not cause being numbered the situation that (to the number of Counterfeit-proof certificate volume) prints again yet.
Especially the invention of basis (9),
I. the thickness difference of the paper of band and chip part disappears, and can obtain not take place to break, rise the paper of pleat, gloss variation.
Ii. can prevent to damage the IC chip because of part is subjected to external pressure.
Iii. can print with all mode of printings.
Description of drawings
Fig. 1 is the vertical view of schematic construction of first embodiment that the band of the build-in IC chip that the present invention relates to is shown.
Fig. 2 is the cut-open view of schematic construction of first embodiment that the band of the build-in IC chip that the present invention relates to is shown.
Fig. 3 is the cut-open view of schematic construction of second embodiment that the band of the build-in IC chip that the present invention relates to is shown.
Fig. 4 is the cut-open view of schematic construction of the 3rd embodiment that the band of the build-in IC chip that the present invention relates to is shown.
Fig. 5 is the cut-open view of schematic construction of the 4th embodiment that the band of the build-in IC chip that the present invention relates to is shown.
Fig. 6 is the process chart of manufacture method that the band of the build-in IC chip that the present invention relates to is shown.
Fig. 7 is the process chart of manufacture method that the band of the build-in IC chip that the present invention relates to is shown.
Fig. 8 is the process chart of manufacture method that the band of the build-in IC chip that the present invention relates to is shown.
Fig. 9 is the vertical view of schematic construction of first embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown.
Figure 10 is the cut-open view of schematic construction of first embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown.
Figure 11 is the vertical view of schematic construction of variation of first embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown.
Figure 12 is the cut-open view of schematic construction of variation of first embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown.
Figure 13 is the vertical view of schematic construction of other variation of first embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown.
Figure 14 is the cut-open view of schematic construction of other variation of first embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown.
Figure 15 is the vertical view of schematic construction of second embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown.
Figure 16 is the cut-open view of schematic construction of second embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown.
Figure 17 is the cut-open view of schematic construction of the 3rd embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown.
Figure 18 is the cut-open view of schematic construction of the 4th embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown.
Symbol description
The band of 1 build-in IC chip
2 tablets
3 literal of copying
10 IC chips
20 band bodies
21 first base materials
22 adhesive layers
23 second base materials
Embodiment
The present invention is described in detail with reference to the accompanying drawings.In addition, in the employed accompanying drawing of following explanation, for convenience of explanation, its dimension scale is different from the physical size ratio, especially thickness direction is amplified to illustrate.
The band of＜build-in IC chip 〉
(first embodiment of the band of build-in IC chip)
Fig. 1, Fig. 2 are the schematic configuration diagram of first embodiment of the band of the build-in IC chip that the present invention relates to, and Fig. 1 is a vertical view, and Fig. 2 is a cut-open view.
As shown in Figure 1 and Figure 2, the band of the build-in IC chip of present embodiment comprises IC chip 10 and band body 20, and IC chip 10 is embedded among the recess 20a of band body 20.
The width of band body 20 without limits, but width is preferably set to 1～5mm.Preferably the longer the better for length, but can be set in 500～20000m.
The adhesive layer 22 and second base material 23 that band body 20 comprises first base material 21 of lamination successively, is made of cementing agent.The part of the encirclement recess 20a of second base material 23 is removed, with this part as IC chip loading port 20b.
This IC chip 10 is IC chips that the assembling antenna forms in IC (integrated circuit).IC chip 10 is by providing electric energy to it, thereby can utilize the contactless identification mode to read and/or write the information that is stored in the storer.
Though the manufacture method of IC chip 10 is not particularly limited, for example, can make with the method for record in the described patent documentation 6.
The antenna of IC chip 10 preferably forms resonant circuit that is made of coil part and capacitor element and the antenna that can obtain microwave energy and signal with the conducting chip.
In this case, less in order to utilize microwave by time constant is set at, for example, be set at 2 nanohenry by inductance with coil, be 2 pico farads etc. with capacitance settings, thereby can utilize the finding circuit to realize resonant circuit.Like this, can be on the small IC chip of the length of side smaller or equal to the planar dimension of 0.5mm with antenna configurations.
With forming coil part and the capacitor element parallel connection or the series connection of antenna, be connected on the high frequency receiving circuit that in small IC chip, to realize.
Though the material of first base material and second base material is not particularly limited, can use paper, plastic sheeting etc.Wherein, in first base material and second base material one uses paper, another band that uses plastic sheeting to copy in paper etc. the time as the band of build-in IC chip, and elongation is little, and is therefore preferred.
As the base material of plastic sheeting, can adopt various materials according to insulativity, physical strength, purposes.For example comprise: the polyester based resins such as common extrusion film of polyethylene terephthalate, polybutylene terephthalate, poly-naphthoic acid glycol ester, polyethylene terephthalate/isophthalic ester multipolymer, terephthalic acids/cyclohexanedimethanol/glycol copolymer, cyclohexanedimethanol/glycol copolymer, polyethylene terephthalate/poly-naphthoic acid glycol ester; Polyamide-based resins such as nylon 6, nylon 66, NYLON610; Polyolefin-based resins such as tygon, polypropylene, polymethylpentene; Vinylites such as Polyvinylchloride; Propylene resins such as polyacrylate, polymethacrylate, polymethylmethacrylate; Polyimide, polyamide-Ya amide resin, polytrimethylene ether-inferior acid amides such as Ya acid amides are resin; Engineering resins such as polyarylate, polysulfones, polyethersulfone, polyphenylene oxide, polyphenylene sulfide (PPS), Nomex, polyetherketone, polyethers nitrile, polyetheretherketone, polyether thiourea hydrochlorate; Phenylethylene resin series such as polycarbonate, polystyrene, HTPS, AS resin, ABS resin; Cellulose-based films such as viscose paper, Triafol T, cellulose diacetate, nitrocellulose etc.
Though be not particularly limited as paper, the paper that contains the metal that produce to hinder with communicating by letter of IC chip 10 etc. is unaccommodated.In addition, can use synthetic paper as required.
Material as adhesive layer 22, consider cohesive force, vinyl can preferably be used in the aspects of handling such as easy degree, acrylic resin, styrene resin, vestolit, the polyvinylidene chloride resin, the ethylene/vinyl acetate copolymer resin, butyral resin, vibrin, polyamide, acrylic resin, nitrile is a resin, the butadiene-based resin, halogenated rubber, polyurethane series resin, cellulose-based resin, gel, phenolics, urea-formaldehyde resin, melamine formaldehyde resin, epoxy resin, unsaturated polyester resin, organic siliconresin, alkyd resin, acrylic resin, furane resin, or constitute the multipolymer etc. of the monomer of above resin.
Wherein vibrin, low density polyethylene, random polypropylene, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-ethyl acrylate multipolymer, ethene-isobutyl acrylate copolymer, vinyl acetate-butenoic acid multipolymer, vinyl acetate-anhydrous benzene dioctyl phthalate multipolymer, SIS, styrene-butadiene-styrene block copolymer, styrene-ethylene-butylene-styrene segmented copolymer, nylon 12, terephthalic acids-1,3 butylene glycol based copolymer etc. are preferred uses.Independent or the two or more mixing uses of hot-melt adhesive that this thermal plastic high polymer is constituted all are fine certainly, in addition, also can use with hardening agent.
Especially preferred hot-melt resin.Because recess 20a can be set at an easy rate, and fixing IC chip 10 by heating.
The band of the build-in IC chip of present embodiment is embedded in the band body 20 all because of IC chip 10, so be not vulnerable to mechanical external force.In addition, because be filled with cementing agent between the side face of IC chip 10 and second base material 23, so IC chip 10 can be securely fixed on the band body 20.Therefore, utilize the band of the build-in IC chip of present embodiment, can obtain the sheet material of the build-in IC chip that IC chip 10 can not come off or damage.
In addition, in the present embodiment, the gross thickness of the adhesive layer 22 and second base material 23 equates with the thickness of IC chip 10.Like this, not only do not increase the thickness of band body 20 in vain, and IC chip 10 integral body can be embedded among the recess 20a of band body 20.
(second embodiment of the band of build-in IC chip)
Fig. 3 is the cut-open view of schematic construction of second embodiment that the band of the build-in IC chip that the present invention relates to is shown.The vertical view of present embodiment is because of identical with Fig. 1 of first embodiment, so omit.In addition, in Fig. 3, to the textural element mark identical with Fig. 2 identical symbol, omit its detailed description.
In the present embodiment, the major part of IC chip 10 is embedded among the recess 20a of band body 20.Therefore, with the surface of pasting band body 20 on the time compare and be not easy to be subjected to mechanical external force.In addition, be filled with cementing agent between the side face of IC chip 10 and second base material 23, so IC chip 10 is securely fixed on the band body 20.Therefore, utilize the IC chip 10 of present embodiment, can obtain the sheet material of the build-in IC chip that IC chip 10 can not come off or damage.
(the 3rd embodiment of the band of build-in IC chip)
Fig. 4 is the cut-open view of schematic construction of the 3rd embodiment that the band of the build-in IC chip that the present invention relates to is shown.The vertical view of present embodiment and first embodiment are basic identical, so omit.In addition, in Fig. 4,, omit its detailed description to the textural element mark same-sign identical with Fig. 2.
In the present embodiment, the upper surface side that is embedded in the IC chip 10 among the recess 20a of band body 20 is formed with the cap 22c of cementing agent.For this cap 22c, as hereinafter described, in the time of in recess 20a that IC chip 10 is packed into, be present in cementing agent in the recess 20a and be squeezed and become filling part 22b, and rest parts is removed.
Because cap 22c, IC chip 10 to the first embodiments of present embodiment more are not vulnerable to mechanical external force.In addition, be securely fixed in more in the band body 20 than first embodiment.Therefore, utilize the band of the build-in IC chip of present embodiment, can obtain the sheet material of the build-in IC chip that IC chip 10 can not come off or damage.
(the 4th embodiment of the band of build-in IC chip)
Fig. 5 is the cut-open view of schematic construction of the 4th embodiment that the band of the build-in IC chip that the present invention relates to is shown.The vertical view of present embodiment is identical with Fig. 1 of first embodiment, therefore omits.In addition, in Fig. 5, the identical symbol of textural element mark to identical with Fig. 2 omits its detailed description.
In the present embodiment, the lower face side of the IC chip 10 in being embedded in the recess 20a of band body 20, be the base portion 22d that the downside of recess 20a is formed with cementing agent.
In addition, in above-mentioned first～the 3rd embodiment,,, be negligible degree for thickness though remaining on the position corresponding with this base portion 22d have a spot of cementing agent.Relative therewith, base portion 22d has certain thickness in the present embodiment.
For the band of the build-in IC chip of present embodiment, because being embedded in all in the band body 20 of IC chip, so be not vulnerable to mechanical external force.In addition, IC chip 10 is because by base portion 22d and first base material, 21 bondings, so be securely fixed in more on the body 20 than first embodiment.Therefore, utilize the band of the build-in IC chip of present embodiment, can obtain the sheet material of the build-in IC chip that IC chip 10 can not come off or damage.
(other embodiments of the band of build-in IC chip)
In the respective embodiments described above, whichever all forms recess 20a and does not reach structure in first base material 21, makes recess 20a arrive structure in first base material 21 but also can form.But the state that first base material 21 is set to connect is not preferred.
In addition, in the respective embodiments described above, whichever all is illustrated the structure of having only an IC chip 10, but also can be in the band of build-in IC chip built-in a plurality of IC chips 10.
The manufacture method of the band of＜build-in IC chip 〉
Below, the band of the build-in IC chip that relates to above-mentioned first embodiment is an example, and the manufacture method of the band of build-in IC chip is described.
At first, as shown in Figure 6, prepare the band body 20 (body formation operation) that lamination successively has first base material 21, adhesive layer 22 and second base material 23.
Form in the operation at body, the sheet material of first base material, 21 usefulness of the adhesive bond wide cut of preferred use formation adhesive layer and the sheet material of second base material, 23 usefulness then, cut off according to the width of expecting, obtain the band body 20 of elongated strip.
Then as shown in Figure 7, remove second base material 23, form IC chip loading port 20b (loading port formation operation) in the part of surrounding the position that forms recess 20a.
Form in the operation at loading port, the preferred employing utilizes laser radiation to remove the laser forming method of second base material 23.Like this, can on the position of expectation, form small opening exactly.In addition, by adjusting laser intensity, can have no damage ground and keep this locational first base material 21.
Except that the laser forming method, forming process, the piston boosting forming process of can also adopt injection molding method, accurate die stamped method, the pressing of utilizing the convex body, vacuum forming method, press empty forming process, vacuum being pressed empty and usefulness, utilize the methods such as Plastic Forming method of concave-convex type.
Then, as shown in Figure 8, with IC chip 10 from the IC chip loading port 20b adhesive layer 22 (operation of packing into) of packing into.Like this, can obtain the band of Fig. 1, build-in IC chip shown in Figure 2.Herein, the cementing agent that is loaded into the part of IC chip 10 be squeezed and outside the side face of IC chip 10 side shifting, become filling part 22b as shown in Figure 2.
In the operation of packing into, on the position that forms recess 20a, the cementing agent of adhesive layer 22 need have flowability or plasticity.On the one hand, for the global shape of retainer belt body 20, except forming the position of recess 20a, the cementing agent of preferred binder layer 22 does not have flowability and keeps to a certain degree intensity.
Therefore, as cementing agent, preferred cementing agent that is made of thermoplastic resin or the cementing agent that contains thermoplastic resin of using only to concentrating heating near the position that forms recess 20a, only finds to have flowability and plasticity in this part.When especially using hot-melt resin, can obtain flowability at an easy rate, so preferred by heating.
In addition, form in the operation, when using the laser forming method, can utilize laser to heat adhesive layer 22 at above-mentioned loading port.At this moment, in the operation of packing into, do not need to prepare once more heating arrangement, therefore make and become easy.
The sheet material of＜build-in IC chip 〉
(first embodiment of the sheet material of build-in IC chip)
Fig. 9, Figure 10 are the schematic configuration diagram of first embodiment of the sheet material of the build-in IC chip that the present invention relates to, and Fig. 9 is a planimetric map, and Figure 10 is the cut-open view along the X-X ' of Fig. 9.
As Fig. 9, shown in Figure 10, the sheet material of the build-in IC chip of present embodiment be by the build-in IC chip that the present invention relates to 1 and tablet 2 constitute, and build-in IC chip with 1 inside that is encased in tablet 2.
The material of tablet 2 is not limited to paper, can also use plastic sheeting.Wherein, when using paper, be with 1 what machine hand's preface can be packed build-in IC chip into, therefore preferred.
As the method for the sheet material of the build-in IC chip of making present embodiment, can be set forth in the method that one deck is manufactured paper with pulp or multilayer is manufactured paper with pulp of the band of the build-in IC chip of packing in machine hand's preface, perhaps that a plurality of substrate sheets are bonding method.
The method of manufacturing paper with pulp as one deck, can be listed below method: with from the perching knife of for example fourdrinier paper machine to copying the paper stock that gauze provides, with build-in IC chip be with 1 to send, be formed at can pack into 1 (the Jap.P. spy opens clear 51-13039 number) of being with of build-in IC chip of the ply of paper inside of copying on the gauze with burying underground; Or be provided with to the paper stock that flows out from the liquid of fourdrinier paper machine stream case pack into build-in IC chip with 1 charging apparatus, that utilizes on one side that airflow makes build-in IC chip is with 1 to be contactless state with paper stock, Yi Bian copy 1 (Japanese patent laid-open 2-169790 number) of being with into build-in IC chip.
Method as multilayer is manufactured paper with pulp, can adopt following method: use for example multi-groove type cylinder paper machine manufacturing to comprise two-layer copying when closing paper at least, make before each ply of paper overlaps, with build-in IC chip be with 1 be encased in copy between ply of paper into.At this moment, preferably make at least three layers of the ply of paper that comprises outermost a pair of ply of paper and internal layer copy and close paper.
Under the situation that multilayer is manufactured paper with pulp, preferably at all or part of of the position of packing into of the layer of the band that is incorporated with build-in IC chip, manufacture paper with pulp in non-caked sheet stock ground.More specifically, preferably in the layer of the band that is incorporated with build-in IC chip, the part of using the width suitable with the width of the band of build-in IC chip that non-cohesive sheet stock is set is manufactured paper with pulp.
But the part of non-caked sheet stock does not require to be same width with the band of build-in IC chip yet, does not produce in the concavo-convex scope in the sheet surface of build-in IC chip, wideer narrower can.The side that the part of non-caked sheet stock is wideer than the band of build-in IC chip even the band of build-in IC chip contingency when packing into is crawled, can not expose from this inadherent part, so preferred yet.
And, also needn't under the situation of non-caked raw material, manufacture paper with pulp continuously, for example,, bond repeatedly and non-caked sheet stock with several millimeters intervals for the paper of the part of burying the IC chip underground is thick thinner.
Figure 11, Figure 12 are the schematic configuration diagram that the variation of first embodiment is shown, and Figure 11 is a planimetric map, and Figure 12 is the cut-open view along the XIV-XIV ' of Figure 11.Similarly, Figure 13, Figure 14 are the schematic configuration diagram that other variation of first embodiment are shown, and Figure 13 is a planimetric map, and Figure 14 is the cut-open view along the XIV-XIV ' of Figure 13.
In the sheet material of the build-in IC chip of these variation, tablet 2 forms three-decker, promptly is provided with internal layer 2b between as outermost upper strata 2a and the 2c of lower floor, and build-in IC chip be with the 1 internal layer 2b that packs into.And in internal layer 2b, what be provided with non-caked sheet stock in the position with 1 of the build-in IC chip of packing into copies top 2d.This width of copying top 2d is set to wideer than the width with 1 of build-in IC chip.
In the variation of Figure 11, Figure 12, copy top 2d be arranged on continuously the build-in IC chip of packing into on part or all of 1 position.On the other hand, in the variation of Figure 13, Figure 14, be provided with at interval in the part (being equivalent to bury underground the part of IC chip) with 1 position of the build-in IC chip of packing into.
When adopting the method that one deck is manufactured paper with pulp or multilayer is manufactured paper with pulp, if ply of paper and build-in IC chip be with 1 not bond securely, build-in IC chip be with 1 may be subjected to certain drawing and break away from between the ply of paper.As solution to the problems described above, for example can adopt and in the size press liquid of machine hand's preface, use water-soluble binder, perhaps in advance build-in IC chip with 1 on coating thermoplastic resin or water-soluble binder improve method with the bonding intensity of ply of paper.In addition, also consider by use film and paper as build-in IC chip with 1 base material, thereby improve and the bonding intensity of ply of paper.
Then, method the describing to utilizing bonding a plurality of substrate sheets with build-in IC chip with 1 method that is encased between ply of paper.At this moment, the material of substrate sheets is not limited to paper, can also use plastic sheeting etc.
As being used in bonding cementing agent, hot-melt adhesive that can enumerate water-soluble binder, constitutes by thermal plastic high polymer and thermosetting adhesive etc., but the preferred curing type type that is difficult to peel off again after bonding of using.
In cohesive force, on the aspects of handling such as easy degree, that can preferably use has: vinyl, acrylic resin, styrene resin, vestolit, vinylidene resin, the ethylene/vinyl acetate copolymer resin, butyral resin, vibrin, polyamide, acryl resin, nitrile is a resin, the butadiene-based resin, halogenated rubber, polyurethane series resin, cellulose-based resin, gel, phenolics, urea-formaldehyde resin, melamine formaldehyde resin, epoxy resin, unsaturated polyester resin, organic siliconresin, alkyd resin, the aryl resin, furane resin or constitute the multipolymer of the monomer of above resin.
Wherein vibrin, low density polyethylene, random polypropylene, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-ethyl acrylate multipolymer, ethene-isobutyl acrylate copolymer, vinyl acetate-butenoic acid multipolymer, vinyl acetate-anhydrous benzene dioctyl phthalate multipolymer, SIS, styrene-butadiene-styrene block copolymer, styrene-ethylene-butylene-styrene segmented copolymer, nylon 12, terephthalic acids-1,3 butylene glycol based copolymer etc. are preferred uses.The hot-melt adhesive that this thermal plastic high polymer is constituted is used alone or in mixture of two or more certainly and all is fine, and in addition, also can use with hardening agent.
As bonding concrete grammar, method such as can be listed below: with build-in IC chip be with 1 to be configured on arbitrary substrate sheets surface, adhesive-coated is on another substrate sheets surface that will engage, bonded to each other with these substrate sheets; Perhaps, on the substrate sheets surface, adhesive layer is set in advance, then dispose build-in IC chip with 1 state under overlapping and bonding with another substrate sheets; Moreover, with build-in IC chip be with 1 to be configured on arbitrary substrate sheets surface, and sandwich film like or pulverous cementing agent in the above, overlapping with another substrate sheets again, then,, make substrate sheets bonded to each other with this film or powder heating and melting.If consider bonding stability, operating efficiency etc., most preferably carry out bonding method making time coating cementing agent bonded to each other between the base material.
In addition, when using the film like cementing agent, can adopt vacuum method, utilize cryosphere platen press that hot linging handles etc., when using Powdered cementing agent, can adopt electrostatic applications, net roll shape dispersion method, moltenly penetrate method, spray-on process, serigraphy etc.
(second embodiment of the sheet material of build-in IC chip)
Figure 15, Figure 16 are the schematic configuration diagram of second embodiment of the sheet material of the build-in IC chip that the present invention relates to, and Figure 15 is a planimetric map, and Figure 16 is the cut-open view along the XVI-XVI ' of Figure 15.
As Figure 15, shown in Figure 16, what the sheet material of the build-in IC chip of present embodiment comprised the build-in IC chip that the present invention relates to is with 1 and tablet 2, build-in IC chip with 1 inside of packing tablet 2 into.But the part with 1 of build-in IC chip is the state that exposes at the window portion 2e place that is arranged on the tablet 2.In the present embodiment, also copy literal 3 being applied with on the window portion 2e.
Method as the sheet material of the build-in IC chip of making present embodiment, method such as can be listed below: bury band mechanism in the paper stock suspension on copying the gauze line underground, this band mechanism the protuberance front end with concavo-convex guiding piece have for build-in IC chip with 1 groove that passes (the fair 5-085680 of Jap.P. spy); In the going barrel on the fourdrinier paper machine line compressed-air atomizer is set, the build-in IC chip that utilizes pressurized air to blow off discontinuously to be encased in advance in the l Water Paper with the slurry on 1,1 (Japanese patent laid-open 06-272200 number) of being with of exposing build-in IC chip; Will be processed into concavo-convex net as the online of cylinder paper machine, make the jog with 1 contact and the net surface of packing into of build-in IC chip, be with 1 to copy the build-in IC chip into window open section (No. the 4462866th, United States Patent (USP)).
And, when using the manufacturing of multi-groove type cylinder paper machine to comprise that paper is closed in two-layer at least the copying of the ply of paper of outermost ply of paper and internal layer, also can adopt following method: on outermost ply of paper (or ply of paper of internal layer), form window portion off and on, before the ply of paper that makes it with the internal layer that does not have window portion (or outermost ply of paper) overlaps, with build-in IC chip be with 1 to be encased between the ply of paper, what make build-in IC chip is with 1 to expose from window portion.
(the 3rd, the 4th embodiment of the sheet material of build-in IC chip)
Figure 17, Figure 18 are the 3rd embodiment that the sheet material of the build-in IC chip that the present invention relates to is shown, the cut-open view that reaches the schematic construction of the 4th embodiment.
As Figure 17, shown in Figure 180, the sheet material of the build-in IC chip of these embodiments also be comprise the build-in IC chip that the present invention relates to respectively be with 1 and tablet 2.
In the 3rd embodiment shown in Figure 17, the sticking in the groove that is arranged on the tablet 2 of build-in IC chip with 1.On the other hand, in the 4th embodiment shown in Figure 180, the sticking on the surface of tablet 2 of build-in IC chip with 1.
The 3rd embodiment can utilize groove to build-in IC chip be with 1 to protect, prevent that it is subjected to mechanical external force, more more preferred than the 4th embodiment.In addition, the degree of depth of groove can because of IC chip, build-in IC chip with 1, the thickness or the material change in good time of tablet 2, but be preferably 0.5～2 times of IC chip thickness.
As the effective ways of the sheet material of the build-in IC chip of making the 3rd embodiment, only be incorporated with in the ply of paper build-in IC chip with 1 part skiving, the groove with 1 of the build-in IC chip that is formed for packing into is effective method.
Particularly, can use the known technology of copying.For example, method such as can be listed below: online welding iron wire, metal, resin, paper etc. on the cylinder cylinder, or paste with cementing agent; Coating composition or resin stop up mesh on the net; Directly apply concavo-convex to paper machine itself; Utilize photoresist installation mold on the net; Under the state of l Water Paper, be blown into pressurized air to the part that will form groove; Under the state of l Water Paper, to form the part of groove with the friction roller friction.
Utilize embodiment to further describe the present invention below, but the invention is not restricted to these embodiment.
(embodiment 1)
The making of the band of build-in IC chip
With thickness be the hot melt of 30 μ m to stick with paste (trade name: バ イ ロ Application GA-3410, Japan's weaving (strain) is made) bond thickness be that polyethylene terephthalate (PET) film and the thickness of 12 μ m is the paper of 40 μ m, make the layered product that thickness is 82 μ m.With its width that cuts into 2.5mm, make the band body that length is 1000m.
Then on ply of paper, offer the IC chip loading port of the horizontal and vertical 0.6mm of being.The opening of IC chip loading port is by forming to ply of paper side irradiating laser.
Then, be heated near the IC chip loading port with band body under 130 ℃ the state, with the length of side is that the small IC chip of the about 70 μ m of 0.5mm, thickness is packed into from IC chip loading port, near the IC chip bottom arrives pet layer, make the band that small IC chip is embedded in the build-in IC chip in the band body substantially fully.
The manufacturing 1 of the sheet material of build-in IC chip
Utilization has the cylinder paper machine of the column barrel of double flute, copies the sheet material that closes two-layer build-in IC chip with the chart speed degree manufacturing of copying that 50m/ divides.At this moment, (dry weight is 51g/m at ground floor
2Paper) (dry weight is 51g/m with the second layer
2Paper) between pack into the band of above-mentioned build-in IC chip, make the sheet material of build-in IC chip.
The manufacturing 2 of the sheet material of build-in IC chip
Utilize three layers of paper machine of cylinder, copy and close three layers with the speed of copying that 50m/ divides, the band (thickness of largest portion is 70 μ m) of packing into and accompanying the IC chip is made the sheet material of build-in IC chip.At this moment, ground floor (dry weight 25g/m
2) and the second layer (dry weight 55g/m
2) copy with usual way and to close, close the 3rd layer of (dry weight 25g/m copying
2) time packs into and accompany the band of IC chip.
In second layer cylinder, be the part of the non-cohesive raw material of 10mm in order on the position of band of packing into, to constitute width, pasting width on a week of cylinder is the banded continued labelling of 10mm.Like this, make the sheet material that there are not the build-in IC chip of projection in non-cohesive sheet stock and band portion with the width of 10mm.
The manufacturing 3 of the sheet material of build-in IC chip
Utilize three layers of paper machine of cylinder, copy and close three layers with the speed of copying that 50m/ divides, the band (largest portion thickness is 70 μ m) of packing into and accompanying the IC chip is made the sheet material of build-in IC chip.At this moment, ground floor (dry weight 25g/m
2) and the second layer (dry weight 55g/m
2) copy with usual way and to close, close the 3rd layer of (dry weight 25g/m copying
2) time packs into and accompany the band of IC chip.
In second layer cylinder, be the part of not adhering to raw material of 10mm in order on the position of band of packing into, to constitute width, pasting width with 2 millimeters interval on a week of cylinder is the band mark of 10mm.Like this, make the sheet material of build-in IC chip with the width of 10mm, wherein with 2mm non-cohesive sheet stock at interval, and there is not projection in band portion.
The manufacturing 4 of the sheet material of build-in IC chip
Utilization has the cylinder paper machine of four layers of column barrel, copies and closes four layers with the speed of copying that 50m/ divides, and makes the sheet material of build-in IC chip.At this moment, (dry weight 5 is respectively 51g/m for the ground floor and the second layer
2Paper) copy with usual way and to close, close the 3rd layer of (dry weight 51g/m copying
2Paper) time pack into the band of the build-in IC chip identical with embodiment 1.
In addition, in the 3rd layer of cylinder, be the part of not adhering to raw material of 10mm in order on the position of band of packing into, to constitute width, pasting width on a week of cylinder is the banded continued labelling of 10mm.On the 4th layer of cylinder, binding mark is copied and is closed on drum surface, makes that can form the length of side with predetermined interval on the position of the band that is incorporated with build-in IC chip is the window of 10mm.Like this, the part of making non-cohesive sheet stock and band with the width of 10mm does not have the sheet material of build-in IC chip of projection, and this sheet material can be from the paper surface be watched the build-in IC chip that is enclosed in the ply of paper with predetermined space.
(embodiment 2)
Utilization has the cylinder paper machine of three layers of column barrel, copies and closes three layers with the speed of copying that 50m/ divides, and makes the paper of build-in IC chip.At this moment, the ground floor and the second layer (are dry weight 51g/m
2Paper) copy with usual way and to close, close the 3rd layer of (dry weight 51g/m copying
2Paper) time pack into the band of the build-in IC chip identical with embodiment 1.
In the 3rd layer of cylinder, be the window of 10mm in order on the position of the band of the build-in IC chip of packing into, to form the length of side with predetermined space, and on drum surface binding mark and copy and close.Like this, make the sheet material of build-in IC chip, wherein, the band of the build-in IC chip in the ply of paper of packing into can be watched from the paper surface with predetermined space.
(embodiment 3)
Is 150g/m with roll coater at basic weight
2Paper on the coating ethylene-vinyl acetate copolymer cementing agent (trade name " サ イ PVC ノ one Le DBA107 ", サ イ デ Application chemical company system), making coating weight is 10g/m
2, be 150g/m when on this cement face, pasting basic weight
2Paper the time, between two pieces of paper, be enclosed among the embodiment 1 band of the build-in IC chip that uses, thereby make the sheet material of build-in IC chip.
(embodiment 4)
The making of the band of build-in IC chip
With polyester is that hot melt paste (trade name: ア ロ Application メ Le ト PES-111EE, East Asia synthetic (strain) manufacturing) is the PET film of 25 μ m with the mutual bond thickness of 30 μ m thickness, makes the layered product that thickness is 80 μ m.It is cut into the 2.5mm width, make the band body that length is 1500m.
Then on a side PET film, form the horizontal and vertical IC chip loading port that is 0.6mm.The opening of IC chip loading port is to form by with laser one side's PET film side being shone.
Then, be heated near the IC chip loading port with band body under 180 ℃ the state, with the length of side is that the small IC chip that 0.5mm, thickness are about 70 μ m is packed into from IC chip loading port, near the position of the pet layer that arrives the opposing party bottom it, the major part of making small IC chip is embedded in the band of the build-in IC chip in the band body.
The manufacturing of the sheet material of build-in IC chip
Utilization has the cylinder paper machine of three layers of column barrel, copies and closes three layers with the speed of copying that 50m/ divides, and makes the paper of build-in IC chip.At this moment, (dry weight is 51g/m for the ground floor and the second layer
2Paper) copy with usual way and to close, close the 3rd layer of (dry weight 51g/m copying
2Paper) time pack into the band of above-mentioned build-in IC chip.
In the 3rd layer of cylinder, be the window of 7mm in order on the position of the band of the build-in IC chip of packing into, to form the length of side with predetermined space, binding mark and copy and close on drum surface.Thus, make the sheet material of following build-in IC chip: the band that can watch the build-in IC chip in the ply of paper of packing into predetermined space from the paper surface.
Utilize possibility on the industry
The band of build-in IC chip of the present invention and the sheet material of build-in IC chip can be effectively Utilization is in bank note, exchange ticket, check, stock certificate, passport, identity card, logistic label class Deng on.
Claims (11)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP267162/2004 | 2004-09-14 | ||
| JP2004267162 | 2004-09-14 | ||
| JP010052/2005 | 2005-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101019143A true CN101019143A (en) | 2007-08-15 |
Family
ID=38727256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200580030303 Pending CN101019143A (en) | 2004-09-14 | 2005-09-13 | Tape with built-in IC chip, method for manufacturing the tape, and sheet with build-in IC chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101019143A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332102A (en) * | 2010-07-13 | 2012-01-25 | 凸版印刷(上海)有限公司 | Contactless card with sheet metal and realization method thereof |
| CN109447206A (en) * | 2018-12-11 | 2019-03-08 | 捷德（中国）信息科技有限公司 | Identification card and its manufacturing method with glass matrix |
| CN109447207A (en) * | 2018-12-11 | 2019-03-08 | 捷德（中国）信息科技有限公司 | Identification card and its manufacturing method with ceramic matrix |
-
2005
- 2005-09-13 CN CN 200580030303 patent/CN101019143A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332102A (en) * | 2010-07-13 | 2012-01-25 | 凸版印刷(上海)有限公司 | Contactless card with sheet metal and realization method thereof |
| CN109447206A (en) * | 2018-12-11 | 2019-03-08 | 捷德（中国）信息科技有限公司 | Identification card and its manufacturing method with glass matrix |
| CN109447207A (en) * | 2018-12-11 | 2019-03-08 | 捷德（中国）信息科技有限公司 | Identification card and its manufacturing method with ceramic matrix |
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