CN100589031C - A kind of light curing inkjet resist for printed circuit board and preparation method thereof - Google Patents

Abstract

The invention relates to a photocurable inkjet resist for printed circuit boards and a preparation method thereof. The use of carboxyl-containing acrylate oligomers, acrylate low-viscosity resins, and free radical and cationic mixed curing methods makes the resist have good film release properties, short curing time, and high resolution. The technology of inkjet resist is sprayed on the specific area of the copper clad laminate, and the anti-etching pattern is formed after photocuring. The prepared cured film has high hardness, good flexibility and good corrosion resistance.

Description

A kind of light curing inkjet resist for printed circuit board and preparation method thereof

Technical field:

The invention relates to a photocurable inkjet resist for printed circuit boards and a preparation method thereof.

Background technique:

Photoresist, also known as photoresist, is mainly used in the microfabrication process of integrated circuits and semiconductor discrete devices in the electronics industry. The first photoresist used by humans in the electronics industry was the polyvinyl alcohol cinnamate and its derivatives photoresist system synthesized by Eastman-Kodak Company in 1954. In 1958, the same company developed cyclized rubber—biazide photoresist, which made the industrialization of integrated circuit production a reality.

The traditional manufacturing process of printed circuit board (PCB) includes substrate processing, gluing, pre-baking, exposure, middle-baking, developing, post-baking, and degumming. In the production process, multiple or even dozens of photolithography operations are often required, and the above-mentioned work cycle needs to be completed each time the photolithography is performed, and the process is very complicated. At the same time, even if the mask is closely attached to the PCB board pre-coated with photoresist material by vacuuming, there will still be gaps between layers, resulting in diffraction during exposure, making The image is distorted. Therefore, the resolution, alignment and product yield of PCB boards produced by traditional methods are difficult to meet the requirements.

Inkjet technology to manufacture PCB boards is to use a special inkjet printer to directly spray photoresist on the desired place on the copper clad board to obtain circuit patterns, without the need for complex processes such as development and mask making process. Compared with the traditional process, this method greatly simplifies the manufacturing process of the PCB board, saves cost, and effectively improves the resolution of the PCB board because no mask is required.

US 005270368A discloses a photocurable anti-etching inkjet ink, which contains two or more acrylic resins, a photoinitiator, and an organic vehicle (solvent). The selected resin has a high viscosity, and the viscosity is reduced by adding a solvent to meet the requirements of inkjet. However, the addition of volatile solvents cannot meet the current environmental protection requirements, and will also have a negative impact on the resolution of the PCB board. US 20060154033 A1 reports a method and ink for preparing electronic devices. The prepared anti-etching ink does not contain solvent, and the requirement of inkjet can be satisfied by selecting suitable monomers. However, the light curing speed of this anti-etching ink is slow, which is not conducive to improving the resolution of the PCB board.

Contents of the invention

The object of the present invention is to provide a novel photocurable inkjet resist for printed circuit board (PCB) and a preparation method thereof. The use of carboxyl-containing acrylate oligomers, acrylate low-viscosity resins, and free radical and cationic mixed curing methods makes the resist have good film release properties, short curing time, and high resolution. The technology of inkjet resist is sprayed on the specific area of the copper clad laminate, and the anti-etching pattern is formed after photocuring. The prepared cured film has high hardness, good flexibility and good corrosion resistance.

A kind of printed circuit board (PCB) of the present invention uses novel photocurable ink-jet resist, and its composition and mass percentage are:

A acrylate oligomer 10% to 60%, the preferred range is 20% to 50%, wherein the carboxyl-containing acrylate oligomer accounts for 10 to 90% of component A, the preferred range is 40 to 80%, Acrylic low-viscosity resin accounts for 10-90% of component A, preferably 20-60%;

B acrylate active monomer 20-70%, preferably 30-60%;

C vinyl ether active monomer 5-50%, the preferred range is 10-30%;

D photoinitiator 1～8%, preferred scope is 3～5%;

E dye 0.5-5%, the preferred range is 1-2%;

F defoamer 0.1 ~ 1.0%;

G leveling agent 0.1~1.0%;

H wetting and dispersing agent 0.1～1.0%;

I polymerization inhibitor 0.1～1.0%.

The carboxyl group-containing acrylate oligomer is a carboxyl group-containing oligomer with a viscosity range of 100-6000mPa·s (25°C), a preferred range of 100-3000mPa·s (25°C), and an acid value range of 20-200mgKOH/g. One of polyester acrylate, carboxyl-containing acrylate, carboxyl-containing methacrylate, aromatic acid half-acrylic acid, aromatic acid half-methacrylic acid or their mixture, wherein the acid value represents the low The carboxyl content of the polymer.

The acrylate low-viscosity resin is an acrylate resin with a viscosity range of 100-500 mPa·s (25° C.). This low-viscosity resin has low viscosity and high functionality, which can effectively increase the photocuring speed of the system while reducing the viscosity, thereby improving the resolution of the resist.

The acrylate reactive monomer is a mixture of three functional reactive acrylate monomers of monofunctional group, bifunctional group and multifunctional group in a mass ratio of 1-3:3-5:1-3.

Monofunctional acrylate monomers are any one or combination of the following substances: butyl acrylate, isooctyl acrylate, isodecyl acrylate, lauryl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, methyl Hydroxyethyl Acrylate, Hydroxypropyl Methacrylate, Glycidyl Methacrylate, Isobornyl Acrylate, Tetrahydrofuryl Methyl Methacrylate, Phenoxyethyl Acrylate, Styrene, Vinyl Acetate, N-Vinylpyrrolidone , butyl acrylate, diethylhexyl acrylate, n-hexyl acrylate, cyclohexyl acrylate, n-decyl acrylate, dicyclopentenyloxyethyl acrylate, phenoxyethyl acrylate, 4-hydroxybutyl Polyethylene glycol (350) monomethacrylate, Glycerin carbonate propenyl ether, Dodecyl vinyl ether, Methoxypolyethylene glycol (350) monoacrylate , Methoxypolyethylene glycol (550) monomethacrylate, methoxypolyethylene glycol (550) monoacrylate, methoxytripropylene glycol monoacrylate, methoxypropoxy neopentyl glycol monoacrylate.

The difunctional acrylate monomer is any one or combination of the following substances: neopentyl glycol diacrylate, ethoxy neopentyl glycol diacrylate, propoxy neopentyl glycol diacrylate, Dipropylene glycol diacrylate, tripropylene glycol diacrylate, ethylene glycol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, diethylene glycol diacrylate ester, triethylene glycol diacrylate, polyethylene glycol (200) diacrylate, polyethylene glycol (400) diacrylate, polyethylene glycol (600) diacrylate, bisphenol A diacrylate , Ethylene glycol phthalate diacrylate, triethylene glycol divinyl ether, 1,4-cyclohexyldimethanol divinyl ether, methoxyethoxytrimethylolpropane diacrylate.

Multifunctional acrylate monomers are any one of the following substances or their combination: trimethylolpropane triacrylate, ethoxytrimethylolpropane triacrylate, 9ethoxytrimethylolpropane Triacrylate, propoxytrimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, trimethylolpropane tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate.

The vinyl ether active monomer is any one of the following substances or a combination thereof: triethylene glycol divinyl ether, 1,4-cyclohexyldimethanol divinyl ether, 4-hydroxybutylethylene Base ether, glycerin carbonate propenyl ether, dodecyl vinyl ether.

The photoinitiator is any one of a free radical photoinitiator, a cationic photoinitiator or a mixture with a mass ratio of 3-5:1-3.

The free radical photoinitiator is any one of the following substances or a combination of them: benzoin, benzil, α,α'-dimethylbenzil ketal, α,α-diethoxybenzene Ethanone, 2-hydroxy-2-methyl-1-phenylacetone, 1-hydroxycyclohexylbenzophenone, 2-hydroxy-2-methyl-1-p-hydroxyethyl ether phenylacetone, 2- Methyl 1-(4-methylmercaptophenyl)-2-morpholine 1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinephenyl) 1-butanone, 2,4 , 6-trimethylbenzoylethoxyphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl) Phenylphosphine oxide, 4-p-tolylmercaptobenzophenone, benzophenone, 2,4,6-trimethylbenzophenone, 4-methylbenzophenone, 4,4'-bis( Dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(methyl,ethylamino)benzophenone, isopropylthioxanthene Ketone, 2-chlorothioxanthone, 1-chloro-4-propoxythioxanthone, 2,4-diethylthioxanthone, 2-ethylanthraquinone.

The cationic photoinitiator is any one of the following substances or a combination of them: didodecylphenyliodonium salt, long-chain alkoxydiphenyliodonium salt, bis(4,4'-sulfide three Phenylsulfonium) hexafluoroantimonate, phenylthiophenyldiphenylsulfonium hexafluoroantimonate, bis(4,4'-thioether triphenylsulfonium) hexafluorophosphate, phenylthio Phenyldiphenylsulfonium hexafluorophosphate, η ⁶ -cumyl ferrocene hexafluorophosphate.

The dye is blue or green dye.

The blue dye is any one of the following substances or a combination of them: Acid Turquoise Blue 2G, Acid Blue AS, Acid Blue 2G, Acid Blue 78, Acid Lake Blue V, Acid Brilliant Blue R, Acid Blue G, Weak Acid Dark Blue 5R, Weak Acid Dark Blue GR, Acid Complex Blue GGN, Direct Blue 2B, Direct Fast Blue FRL, Disperse Blue BGL, Disperse Dark Blue H-3G, Disperse Blue FFR, Disperse Emerald Blue HBF, Disperse Blue 2BLN, Disperse Brilliant Blue G, the above are the brand names of blue dyes.

The green dye is any one of the following substances or a combination thereof: vat brilliant green 3B, vat brilliant green 2G, vat olive green B, sulfur brilliant green GB, basic green, all of which are commercial brands of green dyes.

The defoamer used in the present invention, leveling agent, wetting and dispersing agent, polymerization inhibitor all are commonly used in photocuring in the prior art, as: defoamer can be any one or their combination in the following materials: Deqian 2700, 3100, 5300, Tego Foamex 810, Foamex N, Airex 920, Airex 986, BYK 055, BYK 088, BYK 020, BYK 067A, Efka 2720, Efka2721, all of which are defoamers trade name.

The leveling agent can be any one of the following substances or their combination: Deqian 431, 432, 488, 495, 810, Tego Glide 100, Glide 432, Glide 435, Glide 440, Flow 300, Flow 425, Flow ZFS 460, BYK 333, BYK 371, BYK 373, BYK 361, TROY Troysol S366, Corning Perenol S71uv, Perenol S83uv, Efka 3883, all of the above are brand names of leveling agents.

The wetting and dispersing agent can be any one of the following substances or their combination: Deqian DP 983, 912, BYKP-105, Disperbyk-111, Disperbyk-180, Disperbyk-168, Tego Dispers 680UV, Dispers 681UV , Dispers 710, Dispers 652, Corning TexaphorP61, Efka 4800, the above are all wetting and dispersing agent brand names.

The polymerization inhibitor can be any one of the following substances or their combination: p-hydroxyanisole, hydroquinone, 2,6-di-tert-butyl p-cresol, FIRSTCURE ST-1 (trade name), FIRSTCURE ST-2 (trade name).

The present invention also provides a method for preparing a light-curable inkjet resist for printed circuit boards, comprising the following steps in sequence: first, carboxyl-containing acrylate oligomers, acrylate low-viscosity resins, acrylate Stir and mix the reactive monomers and vinyl ether reactive monomers evenly, then add the photoinitiator under the condition of yellow light (filter the light with a wavelength less than 420nm), raise the temperature to fully dissolve the photoinitiator, and then cool down to room temperature. Add dye in proportion, stir until mixed evenly, add leveling agent, wetting and dispersing agent, polymerization inhibitor, defoamer, mix evenly, and make it through filtration.

As mentioned above, after etching, the photoresist should be easily removed under alkaline conditions, and the acid value range should be between 35-40 mgKOH/g. Since the PCB board is made by the inkjet method without the development process, it is not necessary to use two different alkaline solutions to operate the PCB board, so the acid value is no longer harsh. The photo-induced inkjet of the present invention The acid value of the resist is greater than 10 mgKOH/g.

The novel photocurable inkjet resist for PCB prepared by the invention has the following properties: the viscosity is less than or equal to 30mPa·s (40°C), which can ensure the continuous ejection of ink. Acid value ≥ 10mgKOH/g, photocuring time 6s~10s, hardness 2H~3H, adhesion level 0, flexibility 1~2mm, good etching resistance, good alkali solubility. The manufacturing process of the PCB board prepared by the invention is simple, green and environment-friendly, and satisfies the current demand for the PCB board.

Detailed ways

Examples 1-10

See Table 1 for the mass percentage of each component of the new photocurable inkjet resist prepared for printed circuit board (PCB). First, mix carboxyl-containing acrylate oligomers, acrylate low-viscosity resins, acrylate active monomers, and vinyl ether active monomers evenly, then add a photoinitiator under yellow light conditions, and heat up to 50 ℃ to fully dissolve the photoinitiator, then lower it to room temperature and add the dye in proportion, use a stirring, sand milling, and dispersing multipurpose machine to stir for 2 hours until the mixture is uniform, add leveling agent, wetting and dispersing agent, polymerization inhibitor, defoaming agent The agent is mixed evenly and obtained by filtration.

Use an inkjet printer to spray on the surface of the substrate, and then perform photocuring to obtain an experimental sample.

Table 1 The components and dosage (mass percentage concentration) of the new photocurable inkjet resist for PCB board

Continued Table 1

The evaluation results of the novel photocurable inkjet resists for PCBs prepared in Examples 1-10 of the present invention are listed in Table 2. The evaluation method is as follows:

Viscosity: NDJ-79 type rotational viscometer was used to measure the viscosity of the anti-etching ink at 40°C.

Acid value: Accurately weigh 0.1-0.5g of anti-etching ink and dissolve it in 50ml of acetone and absolute ethanol in an equal volume mixture, use phenolphthalein as indicator, and titrate with 0.1mol/L KOH aqueous solution until light red appears as the end point . Acid value (KOH mg/g)=(V×M×56.1)/W. In the formula: V is the aqueous potassium hydroxide volume (ml) consumed by the sample; 56.1 is the molar mass of potassium hydroxide; W is the sample mass; M is the volume molar concentration of potassium hydroxide.

Photocuring time: Spray the anti-etching ink on a dry and clean copper-clad board, then expose the ink-coated substrate under a high-pressure mercury lamp with a photocuring energy of 1000mJ/cm ² , and measure the exposure time.

Pencil hardness: With reference to GB6739-86, use the QHQ type coating pencil scratch hardness tester to measure the pencil hardness of the experimental sample at 25°C.

Adhesion: With reference to GB9256-88, the adhesion of the experimental model is judged by the cross-cut test method.

Flexibility: With reference to GB/T1731-93, use QTX-1 paint film elasticity tester to measure the flexibility of the test sample.

Etching resistance: Immerse the experimental sample in FeCl ₃ etching solution at 45°C and 40 Baume for 10 minutes, and observe the state of the film. There is no change in the coating film at all, the edge is steep as excellent, and the coating film falls off as poor.

Alkali solubility: immerse the test sample in 5% NaOH solution at 60°C for 5 minutes, and observe the release property. The peeling of the coating film is excellent, and the partial peeling is poor.

Table 2 Embodiment 1～10 evaluation results

Claims (6)

1. use in printed circuit board photo-curing ink-jet resist, its composition and quality percentage composition are:

A acrylate quasi-oligomer 10%～60%, wherein carboxylic acrylate quasi-oligomer accounts for 10～90% of A component, and the esters of acrylic acid low viscosity resin accounts for 10～90% of A component;

B esters of acrylic acid activated monomer 20～70%;

C vinyl ethers activated monomer 5～50%;

D light trigger 1～8%;

E dyestuff 0.5～5%;

F defoamer 0.1～1.0%;

G levelling agent 0.1～1.0%;

H wetting dispersing agent 0.1～1.0%;

I polymerization inhibitor 0.1～1.0%;

It is characterized in that: when carboxylic acrylate quasi-oligomer is 25 ℃ of range of viscosities among the component A is 100～6000mPas, and the acid number scope is a kind of in the carboxylic polyester acrylate of 20～200mgKOH/g, carboxylic acrylate, carboxylic methacrylate, aromatic acid acrylic acid half ester, the aromatic acid methacrylic acid half ester or their potpourri; When the esters of acrylic acid low viscosity resin is 25 ℃ of range of viscosities among the component A is the acrylate resin of 100～500mPas;

B component be simple function group, difunctional, three kinds of functional group propenoic acid ester classes of polyfunctional group activated monomer with 1～3: the potpourri that 3～5: 1～3 mass ratio mixes;

Component C is any in the following material or their potpourri: triethylene glycol divinyl ether, 1,4-cyclohexyl dimethanol divinyl ether, 4-hydroxy butyl vinyl ether, glycerol carbonate propenyl ether, dodecyl vinyl.

2. according to the photo-curing ink-jet resist of claim 1, it is characterized in that: the quality percentage composition of following component is in the photo-curing ink-jet resist:

A acrylate quasi-oligomer 20%～50%, wherein carboxylic acrylate quasi-oligomer accounts for 40～80% of A component, and the esters of acrylic acid low viscosity resin accounts for 20～60% of A component;

B esters of acrylic acid activated monomer 30～60%;

C vinyl ethers activated monomer 10～30%;

D light trigger 3～5%;

E dyestuff 1～2%.

3. according to the photo-curing ink-jet resist of claim 1 or 2, said simple function group acrylic ester monomer is any in the following material or their combination: butyl acrylate, Isooctyl acrylate monomer, isodecyl acrylate, lauryl acrylate, hydroxy-ethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methylacrylate, hydroxy propyl methacrylate, glycidyl methacrylate, isobornyl acrylate, methacrylic acid tetrahydrofuran methyl esters, the acrylic acid phenoxy ethyl, styrene, vinyl acetate, the N-vinyl pyrrolidone, the butylacrylic acid ester, the diethylhexyl acrylate, the n-hexyl acrylate, the cyclohexyl acrylate, positive decyl acrylate, dicyclo amylene oxygen ethyl propylene acid esters, phenoxyethyl acrylate, the 4-hydroxy butyl vinyl ether, glycerol carbonate propenyl ether, dodecyl vinyl, methoxy poly (ethylene glycol) 350 monomethacrylates, methoxy poly (ethylene glycol) 350 mono acrylic esters, methoxy poly (ethylene glycol) 550 monomethacrylates, methoxy poly (ethylene glycol) 550 mono acrylic esters, methoxyl tripropylene glycol mono acrylic ester, methoxy propoxy neopentyl glycol mono acrylic ester;

Bifunctional acrylate's class monomer is any in the following material or their combination: neopentylglycol diacrylate, the ethoxy neopentylglycol diacrylate, the propoxyl group neopentylglycol diacrylate, dipropylene glycol class diacrylate, tripropylene glycol class diacrylate, glycol diacrylate, 1, the 4-butanediol diacrylate, 1, the 6-hexanediyl ester, diethylene glycol class diacrylate, triethylene glycol class diacrylate, the Macrogol 200 diacrylate, the PEG400 diacrylate, the Macrogol 600 diacrylate, bisphenol a diacrylate, the phthalic acid glycol diacrylate, triethylene glycol divinyl ether, 1,4-cyclohexyl dimethanol divinyl ether, the methoxy ethoxy trimethylolpropane diacrylate;

Multi-functional acrylate's class monomer is any in the following material or their combination: trimethylolpropane triacrylate, ethoxy trimethylolpropane triacrylate, 9 ethoxy trimethylolpropane triacrylates, propoxyl group trimethylolpropane triacrylate, pentaerythritol triacrylate, tetramethylol methane tetraacrylate, two contract trimethylolpropane tetra-acrylate, dipentaerythritol five acrylate, dipentaerythritol acrylate.

4. according to the photo-curing ink-jet resist of claim 1 or 2, wherein component D is any of radical photoinitiator, cationic photoinitiator or both are with 3～5: the potpourri that 1～3 mass ratio mixes;

Said radical photoinitiator is any in the following material or their combination: benzoin, benzil, α, α '-dimethyl benzil ketals, α, α-diethoxy acetophenone, 2-hydroxy-2-methyl-1-phenylacetone, the 1-hydroxy cyclohexyl phenylketone, 2-hydroxy-2-methyl-1-is to hydroxyethyl ether phenylacetone, 2-methyl 1-(4-first sulfydryl phenyl)-2-morpholine 1-acetone, 2-benzyl-2-dimethylamino-1-(4-morpholinyl phenyl) 1-butanone, 2,4,6-trimethylbenzoyl ethoxyl phenenyl phosphorous oxide, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, two (2,4, the 6-trimethylbenzoyl) phenyl phosphine oxide, 4-is to toluene sulfydryl benzophenone, benzophenone, 2,4, the 6-tri-methyl benzophenone, 4-methyldiphenyl ketone, 4,4 '-two (dimethylamino) benzophenone, 4,4 '-two (lignocaine) benzophenone, 4,4 '-two (methyl, ethylamino) benzophenone, isopropyl thioxanthone, the 2-chlorothiaxanthenone, 1-chloro-4-propoxyl group thioxanthone, 2, the 4-diethyl thioxanthone, the 2-EAQ;

Cationic photoinitiator is any in the following material or their combination: two dodecyl benzene salt compounded of iodine, long-chain alkoxy base diphenyl iodnium, two (4,4 '-thioether triphenyl sulphur) hexafluoro antimonate, thiophenyl phenyl diphenyl sulphur hexafluoro antimonate, two (4,4 '-thioether triphenyl sulphur) hexafluorophosphate, thiophenyl phenyl diphenyl sulphur hexafluorophosphate, the luxuriant iron hexafluorophosphate of η 6-isopropyl benzene.

5. according to the photo-curing ink-jet resist of claim 1 or 2, wherein component E is blueness or green colouring material;

Said blue dyes is any in the following material or their combination: acid bright blue 2G, weak acid blue AS, acid blue 2G, Acid Blue 78, acid sky blue v, acid gorgeous blue R, acid blue G, Weakly Acid Blue 5R, Weakly Acid Blue GR, Acid Complex Blue GGN, direct blue 2B, direct fast blue FRL, Disperse Blue BGL, disperse dark blue H-3G, disperse blue FFR, disperse bright blue HBF, Disperse Blue 2BLN, disperse brilliant blue G;

Green colouring material is any in the following material or their combination: vat brilliant green 3B, vat brilliant green 2G, Vat Olive Green B, sulphur brilliant green G B, Viride Nitens.

6. preparation method who is used for the photo-curing ink-jet resist of printed circuit board (PCB), comprise the following steps: successively at first carboxylic acrylate quasi-oligomer, esters of acrylic acid low viscosity resin, esters of acrylic acid activated monomer, vinyl ethers activated monomer to be mixed, under the gold-tinted condition, add light trigger again, be warming up to light trigger is fully dissolved, reduce to room temperature then and add dyestuff in proportion, be stirred to and mix, add levelling agent, wetting dispersing agent, polymerization inhibitor, defoamer and evenly mix again, make after filtration;

Each is formed and the quality percentage composition is:

A acrylate quasi-oligomer 10%～60%, wherein carboxylic acrylate quasi-oligomer accounts for 10～90% of A component, and the esters of acrylic acid low viscosity resin accounts for 10～90% of A component;

B esters of acrylic acid activated monomer 20～70%;

C vinyl ethers activated monomer 5～50%;

D light trigger 1～8%;

E dyestuff 0.5～5%;

F defoamer 0.1～1.0%;

G levelling agent 0.1～1.0%;

H wetting dispersing agent 0.1～1.0%;

I polymerization inhibitor 0.1～1.0%;

When carboxylic acrylate quasi-oligomer is 25 ℃ of range of viscosities among the component A is 100～6000mPas, and the acid number scope is a kind of in the carboxylic polyester acrylate of 20～200mgKOH/g, carboxylic acrylate, carboxylic methacrylate, aromatic acid acrylic acid half ester, the aromatic acid methacrylic acid half ester or their potpourri; When the esters of acrylic acid low viscosity resin is 25 ℃ of range of viscosities among the component A is the acrylate resin of 100～500mPas;

B component be simple function group, difunctional, the polyfunctional group active acrylate of three kinds of functional groups class monomer with 1～3: the potpourri that 3～5: 1～3 mass ratio mixes;

Component C is any in the following material or their potpourri: triethylene glycol divinyl ether, 1,4-cyclohexyl dimethanol divinyl ether, 4-hydroxy butyl vinyl ether, glycerol carbonate propenyl ether, dodecyl vinyl.