CN100576553C - Solid-state imaging device and manufacturing method thereof - Google Patents

Abstract

Certain 1 position at the junction surface of the boundary portion of inner surface portion, metallic conductor terminal and the hollow case inner surface of hollow case and hollow case and transparent panel, the configuration hardening resin forms the hardening resin after the constituent sclerosis, and the duro-meter hardness of hardening resin is below 80 in the A level.

Description

Solid-state imaging device and manufacturing method thereof

technical field

The present invention relates to a solid-state imaging device and a manufacturing method thereof.

Background technique

At present, a hollow glass-ceramic type case is used for a solid-state imaging device, but since the cost is high, a resin-made hollow case is recently being developed (see Patent Document 1).

However, a solid-state imaging device using a resin hollow case still has some problems in practical use.

For example, ridges where the resin solution overflows the metal mold often occur during box molding, so-called flash. This flash becomes dust during the manufacture of the solid-state imaging device, and it is difficult to completely remove it even through a cleaning process. As a result, after the resin hollow case is closed, powder dust is scattered in the case and adheres to the light-receiving surface of the solid-state imaging device, often causing malfunction of the imaging device.

Also, as the lid material of the closed resin hollow box, transparent plates such as transparent glass and transparent resin are mainly used, but since the thermal expansion difference between the resin forming the box and the metal or glass forming the lid material is large, it is usually caused by molding or Distortion such as warping of the case due to heat during mounting increases. When such deformation exists, the focus of incident light may deviate, causing problems such as incorrect image reading by the solid-state imaging device. In order to prevent the above-mentioned deformation, it is proposed to use an adhesive having an elastic modulus of 5 GPa or less for the adhesive used when attaching the cover material to the box (see Patent Document 2). But its effect is not good enough, especially for a rectangular box like a one-dimensional image sensor, it is still prone to warping.

Therefore, there is a problem that the solid-state imaging device cannot function correctly.

Patent Document 1: Japanese Unexamined Patent Publication No. 6-163950

Patent Document 2: JP-A-2000-12719

Contents of the invention

The present invention has been made in view of the above-mentioned circumstances, and its object is to provide: the malfunction of the solid-state imaging element caused by the powder dust caused by the flash etc. generated during the molding process of the resin hollow case can be prevented, and the airtightness of the hollow case can be improved. A solid-state imaging device and a manufacturing method thereof that realize at least one of the properties and the warpage of the resin-made hollow box itself and can correctly perform the imaging function.

As a result of intensive research, the present inventors have found that at least one of the above-mentioned problems can be solved by molding the above-mentioned resin-made hollow box with a thermoplastic resin, and having a resin using a hardening resin in a specific part of the box, and completed the present invention. . That is, the present invention provides a solid-state imaging device described in the following [1].

[1] A solid-state imaging device that is integrally formed with a substantially rectangular resin base plate and a resin side wall approximately vertically placed on its peripheral edge, and inserted with metal lead terminals, the opening is closed by a transparent plate. The resin hollow box is provided with a metal island on the inner bottom surface of the hollow box, and a solid-state imaging element is glued on the island, and it is characterized in that:

(a) the inner surface of the above-mentioned hollow box,

(b) The boundary between the above-mentioned metal lead terminal and the inner surface of the above-mentioned hollow box, and

(c) At least one part of the junction between the hollow case and the transparent plate is provided with a hardened resin formed by hardening the hardened resin composition, and the hardened resin has a small portable durometer hardness of 80 or less in the A class.

In addition, [2] the hardening resin preferably includes epoxy resins, unsaturated polyester resins, phenolic resins, urea-melamine resins, polyurethane resins, silicone resins, polyimide resins, and acrylic resins. At least 1 species.

Furthermore, the present invention provides the solid-state imaging device shown in the following [3][4] with respect to the metal island provided with the solid-state imaging element and the inner bottom surface of the hollow box.

[3] The solid-state imaging device according to the above [1] or [2], wherein a dike portion is provided on the metal island along a longitudinal direction of the solid-state imaging element.

[4] The solid-state imaging device according to any one of the above [1] to [3], characterized in that: on the inner bottom surface of the above-mentioned case, a side surface close to the above-mentioned metal island is arranged along the longitudinal direction thereof. groove.

In addition, in the present invention, it is more convenient and preferable in terms of production when the above-mentioned curable resin-forming composition is the following [5].

[5] The solid-state imaging device according to any one of [1] to [4] above, wherein the curable resin composition contains an ultraviolet curable resin.

Furthermore, the present invention provides the following method of manufacturing the above-mentioned solid-state imaging device.

[6] is a method of manufacturing a solid-state imaging device, provided in the following order,

(I) Forming is integrally formed by a substantially rectangular resin base plate and a resin side wall approximately vertically placed on the periphery of the base plate, and inserts a metal lead terminal, and a thermoplastic resin hollow that can be closed by a transparent plate at the opening. box process;

(II) the process of cementing the solid-state imaging element on the inner bottom surface of the box;

(III) A step of electrically connecting the electrode of the solid-state imaging element and the metal lead terminal with a bonding wire;

(IV) The process of closing the opening of the box with a transparent plate;

It is characterized in that it has at least one process selected from the following processes:

(i) Forming the composition A by applying a hardening resin to the inner surface of the case and hardening it to form the hardening resin A, thereby covering at least a part of the inner surface of the case and/or the lead terminal and the case in the case with the hardening resin the process of the boundary portion of the inner surface, and

(ii) Apply cured resin composition B to the portion of the opening of the box that is in contact with the transparent plate, and after closing the opening with a transparent plate, seal the opening with cured resin B cured from the cured resin composition B. The process of the opening.

However, the following curable resin composition A and curable resin composition B may be the same or different.

The curable resin-forming composition A in the production method of the above [6] is preferably any one of the following [7] to [9].

[7] The method for manufacturing a solid-state imaging device according to [6] above, wherein the viscosity of the cured resin-forming composition A is 5000 mPa·sec or less.

[8] The method for manufacturing a solid-state imaging device according to [6] or [7] above, wherein the volume shrinkage rate accompanying the curing of the cured resin forming composition A is 5% or less.

[9] The method for manufacturing a solid-state imaging device according to any one of [6] to [8] above, wherein the curable resin forming composition A is ultraviolet curable.

When the curable resin-forming composition A shown in the above [9] is ultraviolet curable, the following production method is also preferable among them.

[10] The method for manufacturing a solid-state imaging device according to any one of the above [9], wherein when the cured resin forming composition A is irradiated with ultraviolet rays to form the cured resin A, the weight of the cured resin A It is 99.8% or more and 100% or less of the weight of the cured resin forming composition A before curing.

[11] The method for manufacturing a solid-state imaging device according to [9] or [10] above, wherein the step (i) is formed by forming a curable resin that imparts ultraviolet curability on the inner surface of the hollow case. Object A, irradiating ultraviolet rays through a sealed transparent plate to make the resin forming composition A a hardened resin A, thereby covering at least a part of the inner surface of the hollow box and/or the metal wire terminal and the resin part in the box with the hardened resin The process of the boundary part.

On the other hand, the curable resin-forming composition B in the production method of the above [6] is preferably any one of the following [12] to [13].

[12] The method for manufacturing a solid-state imaging device according to any one of [6] above, wherein the curable resin-forming composition B has a viscosity of 10000 mPa·sec or more.

[13] The method for manufacturing a solid-state imaging device according to any one of [6] or [11] above, wherein the curable resin-forming composition B is ultraviolet curable.

When the curable resin composition A shown in the above [13] is ultraviolet curable, the following production method is also preferable among them.

[14] A method of manufacturing a solid-state imaging device, wherein the step (ii) is to provide an ultraviolet-curable resin-forming composition B between the upper surface of the hollow case and a transparent plate, and irradiate ultraviolet rays through the transparent plate to make the A process of closing the case by turning the resin-forming composition into a hardened resin.

The solid-state imaging device of the present invention can be easily produced by employing the production methods described in [6] to [14] above, and the solid-state imaging devices described in [2] to [5] above are preferable.

In this way, the solid-state imaging device of [15] was manufactured.

Furthermore, the present invention provides a solid-state imaging device described in the following [16].

[16] A solid-state imaging device, characterized in that: a resin box body (hollow box) having a concave portion; an island provided on the bottom surface of the concave portion; a solid-state imaging element fixed on the island; Lead terminals extending to the outside through the side wall of the case main body; bonding wires connecting the solid-state imaging element and the lead terminals; a pair of protrusions (dikes) extending in the longitudinal direction of the island in contact with both ends of the island in the width direction; and the first cured resin in contact with each outer side surface of the protruding portion.

The pair of protrusions can restrict the movement of the island in the width direction. The light-receiving surface of the solid-state imaging element is exposed, and light of a sufficient amount can be incident on the light-receiving surface. The first cured resin is blocked by the side surface outside the protrusion and does not exist on the light receiving surface. Therefore, according to the solid-state imaging device, accurate imaging can be performed.

Furthermore, the present invention provides a solid-state imaging device described in the following [17].

[17] The solid-state imaging device according to [16] above, comprising: a transparent plate that closes the recess of the case body; and a second cured resin interposed between the case body and the transparent plate. The second curable resin can bond the transparent plate and the case body.

Furthermore, the present invention provides a solid-state imaging device described in the following [18].

[18] The solid-state imaging device according to the above [17], wherein the first cured resin and the second cured resin are continuous.

The first hardening resin and the second hardening resin can be applied in the same process, and the structure is simple.

Furthermore, the present invention provides a solid-state imaging device described in the following [19].

[19] The solid-state imaging device according to the above [16], wherein the first cured resin coats the connecting portion between the bonding wire and the lead terminal.

Since the connecting portion is covered with the first curable resin, the connecting portion can be prevented from deteriorating.

According to the above invention, it is possible to prevent the malfunction of the solid-state imaging element caused by dust, and to make the airtightness in the hollow case more reliable. Therefore, moisture intrusion from the outside of the case and condensation inside the case can also be prevented. Also, according to the present invention, the warpage of the solid-state imaging device after sealing the transparent plate can be significantly reduced. A solid-state imaging device having these effects at the same time can provide a solid-state imaging device with better practicality even among solid-state imaging devices having a resin hollow case that is expected to be cost-effective. Therefore, according to this solid-state imaging device, accurate imaging can be performed.

Description of drawings

FIG. 1 is a schematic cross-sectional view of an example of a solid-state imaging device according to the present invention cut at the center of the device.

2 is a plan view showing an example of a resin hollow case that can be used in the solid-state imaging device of the present invention.

3 is a perspective view schematically showing an example of a resin hollow case that can be used in the solid-state imaging device of the present invention. Hardened resin is not shown.

4 is a detailed perspective view of a solid-state imaging device equipped with a solid-state imaging device housing case.

5 is a perspective view of a central portion of a solid-state imaging device housing case provided with an island having a cutout.

6 is a perspective view of a central portion of a solid-state imaging device housing case provided with divided islands.

FIG. 7 is a diagram for explaining a method of manufacturing the solid-state imaging device storage case.

Detailed ways

Hereinafter, the solid-state imaging device and its manufacturing method according to the embodiment will be described. The same parts adopt the same symbols, and repeated explanations are omitted.

The solid-state imaging device of the present invention is integrally formed by a substantially rectangular resin base plate 22 and a resin side wall 24 substantially vertically placed on its periphery, and a metal lead terminal 40 is inserted, and the opening can be covered by a transparent plate 26. In the closed resin hollow case 20 , at least a part of the resin portion on the inner surface of the resin hollow case 20 and the boundary between the lead terminal 40 and the resin portion are covered with cured resin 32 after curing the resin forming composition.

In addition, the method of manufacturing the solid-state imaging device of the present invention includes the steps of: integrally forming a substantially rectangular resin base plate 22 and a resin side wall 24 vertically provided on its periphery, and inserting the lead terminals 40, The process of fixing the solid-state imaging device 12 on the inner bottom surface of the resin hollow box 20 whose opening can be closed by the transparent plate 26; The inner surface of the hollow case 20 is provided with a resin forming composition to form the cured resin 32, and the hardened resin covers at least a part of the resin part of the inner surface of the resin case 20 and the boundary between the lead terminal 40 and the resin part in the case.

FIG. 1 is a schematic cross-sectional view (cross-sectional view by arrow I-I) of the solid-state imaging device shown in FIG. 2 at a portion where a lead terminal is inserted.

The solid-state imaging device 10 of the present invention has a resin hollow case 20 for accommodating the solid-state imaging device 12, a transparent plate 26 for closing the opening of the hollow case, and an inner bottom surface of the hollow case 20 for fixing the solid-state imaging device 12. The metal island 30 (hereinafter also only referred to as "island") on the top. The solid-state imaging element 12 can take an image of light incident from the outside of the imaging device through the transparent plate 26, and the electrical signal recorded by the solid-state imaging element 12 in response to the incident light can be taken out of the solid-state imaging element 12 through the lead terminal 40 or the like electrically connected to the solid-state imaging element 12. camera device 10 outside.

Instead of the lead terminal 40, a metal protrusion may be provided on the electrode holder, and a wiring board composed of an insulating film and conductor wiring may be electrically connected through the electrode holder.

The solid-state imaging device 12 has a readout unit that has a function of sequentially reading out the arrangement of pixels generating signal charges and the signal charges of the pixel arrangement in response to incident light. Solid-state imaging devices, preferably semiconductor imaging devices having a plurality of pixel arrays, are broadly classified into one-dimensional image sensors (line sensors) with one-dimensional pixel arrays and two-dimensional image sensors (area sensors) with two-dimensional pixel arrays. In the solid-state imaging device or its manufacturing method of the present invention, either a linear sensor or an area sensor may be used as the solid-state imaging element, but a linear sensor is preferably used. As the imaging element, a CCD image sensor, a COMS image sensor, a CMD, a charge injection device, an infrared image sensor, etc. can be illustrated. Also, the representative length of the linear sensor is 2 to 15 cm, preferably 3 to 10 cm.

Examples of the solid-state imaging device of the present invention include facsimile machines, scanners, and barcode readers.

The resin-made hollow box 20 is integrally formed of a substantially rectangular resin-made bottom plate 22 and a resin-made side wall 24 substantially suspended from the peripheral edge of the bottom plate 22 . Both the substantially rectangular resin base plate 22 and the resin side wall 24 have an appropriate thickness for mechanical strength.

The resin base plate 22 is "substantially rectangular" and includes substantially rectangular shapes other than square and rectangular shapes. The term "substantially rectangular" refers to a shape that has parallel long sides but the short side is not perpendicular to the long side even if the short side is straight or the short side is not a straight line, and an extremely vertically elongated ellipse. In addition, the bottom plate shape of the hollow box 20 having parallel long sides, the shape of a rectangle missing four corners, the shape of a rectangle with rounded corners, or the shape of a semicircle instead of a straight line on the short side is also included in the above-mentioned "substantially rectangular shape". shape".

The resin side wall 24 is substantially vertically provided on the peripheral edge of the substantially rectangular resin base plate 22 . The shape and outer area of the resin side wall 24 in contact with the resin base plate 22 are substantially the same as those of the resin base plate 22 . The term "approximately vertical" means not only the resin side walls that are strictly vertical, but also the resin side walls that are slightly enlarged toward the opening. The term "slightly enlarged" means having an inclination within 45°, preferably within 30°, from the vertical direction.

The overall shape of the hollow box can be designed by arbitrarily combining the shapes of the above resin bottom plate and the setting angles of the resin side walls. The hollow box has an area on the inner bottom surface of the hollow box 20 where metallic islands can be provided regardless of the above overall shape.

Metal lead terminals 40 are inserted (embedded) in the hollow resin case 20 used in the present invention.

The lead terminal 40 electrically and mechanically connects the solid-state imaging device and an external circuit. The lead terminal 40 is made of metal, and a well-known metal type can be used. As the metal, copper, copper alloy, and iron alloy can be exemplified, and 42 alloy, which is an alloy of copper or iron 58% nickel 42%, can be preferably used. These metals (alloys) can be used by plating, and examples of materials used for the plating include gold, silver, nickel, and solder.

The lead terminal 40 is preferably formed integrally with the resin composition when the hollow case 20 is formed using a lead frame, and then subjected to processing such as bending or cutting to serve as a lead terminal.

The solid-state imaging element 12 bonded to the island 30 is electrically connected to a lead terminal 40 for transferring read signal charges to the outside of the solid-state imaging device 10 . In FIG. 1 , the solid-state imaging element 12 is connected to a lead terminal 40 by a bonding wire 42 . In order to transmit signal charges read from the solid-state imaging device to the outside of the solid-state imaging device, the electrodes of the solid-state imaging device and lead terminals are connected with bonding wires or the like. The bonding wire 42 is a fine metal wire, and is preferably composed of gold, aluminum, copper, or an alloy mainly composed of these. The method of connecting the bonding wires is determined according to the material of the wire, and examples thereof include ball bonding, wedge bonding, and the like.

The solid-state imaging device 10 is obtained by sealing the opening of the hollow case 20 with the transparent plate 26 after wiring such as a bonding wire. For sealing, a radiation-curable, moisture-curable, or thermosetting resin-forming composition can be used, which will be described in detail later.

Inner peripheral edges of the openings of the side walls 24 made of resin may also be provided with notches for filling the transparent plates.

The hollow box 20 is closed by a transparent panel 26 . Here, the term "transparent plate" refers to a plate-shaped member with a transmittance of 80% or more, preferably 90% or more, for incident light used for imaging, generally in the visible light (400-700nm) and near-infrared regions. When the imaging device is a barcode reader, the transmittance of the red semiconductor laser with a wavelength of 650 nm is important.

Examples of the material of the transparent plate 26 include glass, acrylic resin, polycarbonate, and polymers containing cycloolefin units.

After closing the opening of the hollow box with the transparent plate 26, the opening can be closed with a thermosetting or photosetting adhesive RE. The resin-forming composition 32 for coating the inner surface of the case and for sealing the transparent plate may be cured by irradiating ultraviolet rays through the transparent plate 26 . It is also possible to light-cure the resin-forming composition 32 (adhesive RE) for sealing the transparent plate after thermosetting the resin-forming composition 32 for case inner surface coating. The transparent plate 26 made of glass or a polymer containing a cycloolefin unit is preferably used from the viewpoint of ultraviolet light permeability and heat resistance.

At least a part of the resin portion on the inner surface of the hollow case and the boundary between the lead terminal 40 and the resin portion (inner surface of the case) are covered with cured resin 32 after the resin composition has been cured. Utilize the cover of this cured resin 32, even if the dust that the overflow that produces when hollow resin box is molded brings is mixed in the box, also can prevent it from flying, and sealing transparent plate 26 on the opening can make the closed hollow box Since the airtightness is more reliable, malfunction of the solid-state imaging device can be prevented. For the purpose of preventing dust generation and improving airtightness, as shown in FIG. 1 , it is preferable to cover all or almost all of the resin part and the resin part/metal lead terminal on the inner surface of the box with hardened resin 32 All parts of the boundary portion and all parts of the surface of the lead terminal 40 . Here, "substantially everywhere" refers to 80% or more of the resin portion of the inner surface of the case.

The manufacturing method of the solid-state imaging device according to the present invention includes a step of adhering the solid-state imaging device 12 on the inner bottom surface of the resin hollow case 20, and a step of electrically connecting the electrodes of the solid-state imaging device 12 and the metal lead terminals 40 with bonding wires 42. Thereafter, there is a step of forming hardened resin 32 by applying a resin-forming composition to the inner surface of the hollow box 20, thereby covering at least a part of the resin portion of the inner surface of the resin box and the lead terminals in the box with hardened resin 32 40 and the process of the boundary part of the resin part.

It is preferable to clean the hollow case 20 before bonding the solid-state imaging device 12 . For this cleaning, well-known cleaning methods such as ultrasonic cleaning, spray cleaning, and spray cleaning can be used.

As the hardening resin 32 for sealing the transparent plate and coating the inner surface of the hollow box, well-known thermosetting resins, moisture curing resins, visible light curing resins, and ultraviolet curing resins can be used, and epoxy resins, unsaturated resins, etc. can be exemplified. Polyester resin, phenolic resin, urea-melamine resin, polyurethane resin, silicone resin, polyimide resin, acrylic resin, etc. For the resin-forming composition forming these resins, additives such as polymerization initiators, cross-linking agents, and reaction accelerators, and inorganic components such as silica, etc. fillers etc. The same hardening resin for sealing the transparent plate and the hardening resin for coating the inner surface of the hollow box may be used, or different hardening resins may be used respectively.

As the hardening resin 32 for sealing the transparent plate and coating the inner surface of the hollow box, in order to be hardened in a short time, among the above-mentioned various curable resins, it is preferable to use an ultraviolet curable resin for sealing the transparent plate and coating the inner surface of the hollow box. Both curable resins are most preferably ultraviolet curable resins. When both the hardening resin for sealing the transparent plate and the hardening resin for covering the inner surface of the hollow box are ultraviolet curable resins, the resin covering the inner surface of the hollow box can be formed by irradiating ultraviolet rays from the top of the box after closing the top of the hollow box with a transparent plate The composition and the resin-forming composition closing the transparent plate are cured at the same time, so that the manufacturing cost can be reduced.

Examples of ultraviolet curable resins include acrylate resins formed by radical polymerization of acrylate monomers, polyester-acrylate oligomers, urethane-acrylate oligomers, epoxy-acrylate oligomers, etc. , Epoxy resins formed by cationic catalyzed polymerization based on epoxy compounds, octylhydrazone compounds (Okitasen), etc., silicone resins formed by free radical polymerization or cationic catalyzed polymerization based on polysiloxane derivatives, etc. Among these, epoxy resins and silicone resins are preferably used.

The UV-curable resin-forming composition used in the present invention can be cured by irradiation with ultraviolet rays (tens to 400 nm), and may also have visible light (400 to 700 nm) curability, thermosetting properties, or Moisture-curing properties.

The UV-curable resin-forming composition for coating the inner surface of the hollow box preferably has a curing weight change rate (the weight percentage of the cured resin after curing relative to the weight of the resin-forming composition before curing) by ultraviolet irradiation of 99.8% or more, 100% or less, more preferably 99.9% or more and 100% or less. In addition, as the solid-state imaging device of the present invention, it is preferable to apply an ultraviolet-curable resin-forming composition having such a cured weight change rate to a predetermined portion of the inner surface of the hollow case, and to cover the predetermined portion by irradiating ultraviolet rays. When the weight of the cured resin after curing is greatly reduced relative to the weight of the resin-forming composition before curing, components volatilized during curing may adversely affect the solid-state imaging device, and components volatilized when irradiated with ultraviolet rays through a transparent plate may adhere to the solid-state imaging device. Causes blur on transparent boards.

This curing weight change rate is measured under the following conditions. The weight of the hardened resin after hardening is to put the resin-forming composition before hardening into a glass container with a diameter of about 25 mm and an open top to a thickness of about 3 mm, and irradiate it in an atmosphere of 23 ° C and 50 % RH. The weight of the cured resin hardened by ultraviolet rays (365nm) of about 3000mJ/cm ² immediately after hardening; the weight of the resin-forming composition before hardening is taken out from the sealed ultraviolet-shielding container and put into the above-mentioned glass container The weight of the resin-forming composition.

The cured resin for closing the opening of the hollow case also preferably has the aforementioned rate of change in cured weight.

As a method of applying the resin-forming composition to at least a part of the inner surface of the hollow case and the boundary between the lead terminal 40 and the resin portion, a method of injecting the resin-forming composition into the hollow case from a nozzle using an injector is exemplified.

FIG. 2 is a plan view of the solid-state imaging device 10 . FIG. 3 is a perspective view of the solid-state imaging device 10 shown in FIG. 2 . In the same figure the transparent plate is removed.

The metal island 30 is an arbitrary member and can be used as a flat portion on which the solid-state imaging device 12 is fixed. When the metal island 30 is provided, it is formed so as to be in contact with the inner bottom surface of the resin hollow box 20 having a concave cross section. The solid-state imaging device 12 can be bonded to the island 30 . The fixing method is not particularly limited. The solid-state imaging device 12 can be fixed with an adhesive, solder, or the like, preferably with an adhesive, and more preferably with an insulating resin. The adhesive used to fix the solid-state imaging device 12 is preferably one with high thermal conductivity, preferably 1 W/mK or higher, more preferably 3 W/mK or higher.

The inner bottom surface of the hollow box is covered with hardened resin 32 hardened by the resin forming composition.

When the metal island 30 is provided, its shape is not particularly limited, but is preferably a rectangle having an aspect ratio of 4 or more, and more preferably has an aspect ratio of 4-100.

It is also preferable to provide adjacent cutouts at one or more locations along the side edges in the longitudinal direction of the island. The adjacent cutouts are staggered from opposite sides of the facing long sides of the island. In addition, the notches are not uniformly provided in the longitudinal direction of the island, and when a plurality of adjacent notch groups are provided, they are preferably dispersed and provided at a certain distance.

The island 30 is made of metal. Examples of the metal include copper, copper alloy, aluminum, aluminum alloy, and iron alloy. Copper, aluminum, aluminum alloy, gold-plated copper, and 42 alloy are preferably used. The island 30 may also have a protruding portion protruding in a direction perpendicular to the longitudinal direction, the protruding portion forming an island pressing portion, a part of which is buried in the case and fixed.

The resin hollow box used in the present invention can be formed by injection molding, injection compression molding, compression molding, multi-station molding, or the like. Resins usable for molding are roughly classified into moldable thermosetting resins and thermoplastic resins, and any resin is preferably selected from the viewpoints of flame retardancy, electrical insulation, and strength and rigidity. From the viewpoint of shortening the molding cycle and reducing the molding cost, it is preferable to form the hollow box by injection molding using a thermoplastic resin.

Examples of thermosetting resins that can be used to manufacture the hollow box of the present invention include phenolic resins, urea resins, melamine resins, diallyl phthalate resins, epoxy resins, polyurethane resins, and polyimide resins. As well as unsaturated polyester resins, phenolic resins and epoxy resins are preferably used.

In addition, examples of thermoplastic resins usable in the present invention include polystyrene resins, acrylic resins, polycarbonate resins, polyester resins, polyamide resins, polyacetal resins, polyphenylene ether resins, fluororesins, polycarbonate resins, Phenylsulfide resin, polysulfone resin, polyarylate, polyetherimide resin, polyethersulfone resin, polyetherketone resin, liquid crystal polymer, polyamideimide resin, polyimide resin, etc., preferably Polyester resin, polyamide resin, polyphenylene sulfide resin, liquid crystal polymer are used. These resins may be used alone or in combination as a polymer blend. Liquid crystalline polymers are preferably used in the present invention because they are excellent in fluidity, heat resistance, and rigidity.

The summary of the above-mentioned resins is described in "Polymer Encyclopedia" (published by Maruzen Co., Ltd., September 20, 2016) and documents cited therein.

When forming the hollow box used in the present invention, a resin composition in which a suitable filler is added to the resin can be used. The filler used can be appropriately selected for the purpose of improving strength, rigidity, heat resistance, improving dimensional accuracy, and reducing the coefficient of linear expansion. Examples of fillers that can be used for such purposes include glass fibers (ground glass fibers, short glass fibers, etc.), glass beads, hollow glass spheres, glass powder, mica, talc, clay, silica, alumina, Potassium titanate, wollastonite, calcium carbonate, magnesium carbonate, soda sulfate, calcium sulfate, barium sulfate, calcium sulfite, aluminum hydroxide, magnesium hydroxide, calcium hydroxide, calcium silicate, silica sand, silica, quartz, oxide Titanium, zinc oxide, iron oxide, graphite, molybdenum, asbestos, aluminum silicate fiber, alumina fiber, gypsum fiber, carbon fiber, carbon black, silica, diatomaceous earth, bentonite, sericite, white sand (sirasu) , graphite and other inorganic fillers, potassium titanate whiskers, alumina whiskers, aluminum borate whiskers, silicon carbide whiskers, silicon nitride whiskers and other metal whiskers or non-metal whiskers, etc. In addition, it is preferable to use carbon black having a light-shielding effect, an effect of preventing diffraction of light inside the case, and the like.

(comparative example 1)

A lead frame plated with gold on a copper alloy was embedded in a metal mold, and a resin hollow box (wide 50mm×depth 10mm×height 4mm, thickness 2mm). After cleaning the obtained resin hollow box with ultrapure water in a purification workshop of grade 1,000, immerse it in 500ml of ultrapure water for 20 seconds for ultrasonic cleaning (38kHz), and measure the presence of amount of dust. The measurement of the amount of dust used a liquid particle counter CLS-700 (manufactured by PMS). As a result of the measurement, there were about 1,030 pieces/ml of powder particles with a size of 2 micrometers or more existing in the water after ultrasonic cleaning.

(Example 1)

The inner surface of the resin hollow box obtained in Comparative Example 1 was coated with a UV-curable silicone resin forming composition [TB3161 manufactured by Suri-Bond Co., Ltd.] with a sprayer, and then irradiated with ultraviolet rays of about 3000 mJ/ ^cm2 by a mercury lamp (365nm) to harden the resin-forming composition. The measurement of the number of dust particles was carried out in the same manner as in Comparative Example 1 for the obtained resin-made hollow box. As a result of the measurement, there were about 180 pieces/ml of powder particles with a size of 2 microns or more in the water after ultrasonic cleaning, and it was confirmed that by covering the inner surface of the case with resin, the effect of greatly suppressing the dust falling off from the inner surface of the case was confirmed. In addition, the UV curing weight change rate of the above-mentioned TB3161 was 99.93%.

(comparative example 2)

For the resin hollow box obtained in Comparative Example 1, the above-mentioned ultraviolet curable silicone resin forming composition [TB3161 manufactured by Tri-Bond Co., Ltd.] was applied with a sprayer to the closed position of the transparent plate on the top of the box, and then the glass box was used. After sealing the top of the box with a transparent plate, irradiate ultraviolet light (365nm) of about 3000mJ/cm ² with a mercury lamp to harden the resin forming composition and seal the hollow box. As a result of evaluating the airtightness of the obtained hollow box using a helium gas leak tester HELEN A-250M-LD (manufactured by Anelba Technics Co., Ltd.), leakage of helium gas was detected.

(Example 2)

With respect to the hollow box made of resin covering the inner surface of the box obtained in Example 1 with hardened resin, a hollow box with the upper surface closed with a transparent plate was obtained as in Comparative Example 2. As a result of evaluating the airtightness of the hollow box obtained in the same manner as in Comparative Example 2, almost no leakage of helium gas was detected, and it was confirmed that the boundary between the resin part and the metal lead terminal part on the inner surface of the box was covered with a hardened resin to improve the quality of the box. The effect of airtightness.

(Example 3)

The hollow box made of resin with lead wire terminals produced in Example 1 was cleaned with ultrapure water in a clean room of grade 1,000, then immersed in 500 ml of ultrapure water and ultrasonically cleaned (38kHz) for 20 seconds to wash and dry the resin. Hollow box. After the linear sensor is fixed to the inner surface of the resin case with an adhesive, wiring is performed between the linear sensor and the lead terminal with bonding wires.

On the inner surface of the resin hollow box after wiring, apply the above-mentioned ultraviolet curable silicone resin forming composition [TB3161 manufactured by Suri-Bond Co., Ltd.] with a sprayer, and apply it between the transparent plate and the opening. After the same silicone resin composition was formed, the resin formation composition was cured by irradiating ultraviolet rays (365 nm) at about 3000 mJ/cm ² with a mercury lamp to obtain a solid-state imaging device. Observation of the obtained resin-made hollow case did not reveal blurring on the transparent plate.

The cured resin 32 covering at least a part of the inner surface of the resin case and the boundary between the lead terminals in the case and the resin part will be described in detail below.

The manufacturing method of the solid-state imaging device 10 of the present invention includes in the following order: forming a substantially rectangular resin base plate 22 and a resin side wall 24 substantially vertically formed on its periphery, inserting the lead terminal 40, and opening The process of resin hollow box 20 whose part can be closed by transparent plate 26; the process of bonding the solid-state imaging element 12 on the inner bottom surface of the box; process; and forming a hardening resin 32 by applying a resin forming composition to the inner surface of the hollow box 20 so that at least a part of the inner surface of the resin box and the boundary portion between the lead terminal 40 and the resin part in the box are covered with the hardening resin 32 process. Among them, the viscosity of the resin-forming composition is 10,000 mPa·sec or less at 25°C.

Here, the viscosity of the resin-forming composition is measured based on the single cylinder rotational viscometer method described in JIS K7233. When the viscosity of the resin-forming composition exceeds 10,000 mPa·sec, the fluidity of the resin-forming composition supplied into the cartridge 20 is insufficient, so it tends not to spread into a thin film in the cartridge 20 in a short time.

In addition, after the hollow case 20 is formed, it is preferable to wash and dry the hollow case 20 before fixing the solid-state imaging device 12 . For this cleaning, well-known cleaning methods such as ultrasonic cleaning, spray cleaning, and spray cleaning can be used.

The resin-forming composition for coating the inner surface of a hollow box has a viscosity at 25°C of 10,000 mPa·sec or less, preferably 10 to 10,000 mPa·sec, more preferably 10 to 5,000 mPa·sec. Here, the above-mentioned viscosity is a value measured based on the single cylinder rotational viscometer method described in JIS K7233.

When the viscosity of the resin-forming composition before hardening is high, the workability of applying the resin-forming composition to the inner surface of the resin case by using an injector (liquid precision quantitative injection device) or the like is reduced, because air bubbles are mixed in, or the inner surface of the case is covered. The thickness of the resin-forming composition increases, and curing by ultraviolet irradiation may be insufficient.

In addition, in order to adjust the viscosity of the resin forming composition, adjust the volume shrinkage, or adjust the hardness of the small portable durometer A of the cured resin, it is possible to use a single-functional curable component at the same time as appropriate to become a multi-functional curable component.

In order to close the opening with the transparent plate, the above-mentioned cured resin for coating the inner surface of the hollow box can be used. The same hardening resin may be used for the hardening resin for sealing the transparent plate and the hardening resin for coating the inner surface of the hollow box, or different hardening resins may be used respectively.

The hardening resin used in the present invention preferably has a predetermined pressing hardness.

The hardening resin 32 for covering the inner surface of the hollow box preferably has a small portable durometer hardness (Shore hardness) specified in JIS K7215 of type A (also called "small portable durometer A hardness") of 80 or less. Preferably it is 1-50, More preferably, it is 1-30. When the hardness of the small-sized portable durometer is within the above range, since the hardened resin has moderate hardness, the hardened resin 32 will not be peeled off from the inner wall of the resin box to generate dust, nor will it cause the airtightness in the box to drop. Therefore, there is no fear of cutting the bonding wire 42 connecting the lead terminal 40 and the imaging element 12, etc., so it is preferable.

The cured resin (adhesive RE) used in the adhesive layer for closing the opening with the transparent plate also preferably has a small portable durometer A hardness of 80 or less, more preferably 1-50, and still more preferably 1-30. When the adhesive RE has the above-mentioned hardness of a small portable durometer, since the adhesive has moderate hardness, it is possible to prevent the covering of the transparent plate due to the difference in linear expansion coefficient between the resin case 20 and the transparent plate 26. It is preferable that warpage of the solid-state imaging device after 26 years can be prevented from affecting the imaging performance of the imaging element.

The volume shrinkage rate is based on the method stipulated in Appendix 3 of JIS K6901:1999, using the treatment of the resin cured at room temperature, measuring the density of the resin forming composition and the cured product after curing, and calculating from these values using the following formula volumetric shrinkage.

Volume shrinkage=((D2-D1)/D2)×100

Here, D1 represents the density of the resin-forming composition before curing, and D2 represents the density of the cured product after curing. The UV curing reaction was measured at 23±0.1°C on a cured resin obtained by irradiating ultraviolet rays of approximately 3,000 mJ/cm ² or more using a mercury lamp with a dominant wavelength of 365 nm.

For resin-forming compositions that harden at temperatures higher than room temperature, the volume shrinkage rate can also be measured by the method specified in Appendix 3 above. The specific measurement operation is subject to the operation specified for epoxy resin or unsaturated polyester resin.

The resin-forming composition used in the present invention has a volume shrinkage rate of 5% or less, preferably 4% or less, with curing.

When the volume shrinkage ratio is in the above range, there is no fear of damage to the wire bonding due to the formation of the hardened resin, and the formed hardened resin does not peel off from the inner surface of the box, so the airtightness of the hollow box can be stably maintained, so it is preferable.

The open end of the hollow box can be closed with a thermosetting or photosetting adhesive or the like. It is also possible to simultaneously harden the resin-forming composition for coating the inner surface of the case and for sealing the transparent plate by irradiating ultraviolet rays through the transparent plate. It is also possible to heat-cure the resin-forming composition for coating the inner surface of the case, and then light-cure the resin-forming composition for sealing the transparent plate.

(Example A)

A lead frame plated with gold on a copper alloy was embedded in a metal mold, and a resin hollow box (wide 50mm×depth 10mm×height 4mm, thickness 2mm).

The above-mentioned resin hollow box with lead terminals was cleaned with ultrapure water in a class 1,000 clean room, then immersed in 500ml of ultrapure water for 20 seconds of ultrasonic cleaning (38kHz), and the resin hollow box was cleaned and dried. After the linear sensor is bonded to the inner surface of the resin case with an adhesive, the linear sensor and the lead terminal are wired with bonding wires.

On the inner surface of the resin hollow box after wiring, a UV-curable silicone resin forming composition [TB3080 manufactured by Suri-Bond Co., Ltd., the viscosity at 23°C is 500mPa·sec, and the volume shrinks is supplied using an injector. The rate is 2.7%. ], and the same silicone resin forming composition (adhesive RE) is also applied in a film form between the transparent plate 26 and the opening. The resin-forming composition supplied onto the inner surface of the case by the sprayer is spread substantially uniformly and thinly on the inner surface of the case. The resin-forming composition was cured by irradiating about 3000 mJ/cm ² of ultraviolet rays (365 nm) with a mercury lamp to obtain a solid-state imaging device.

The above-mentioned TB3080 hardened resin test piece has a hardness of A10 on a small portable hardness tester.

There was also no peeling of the hardened resin from the inner surface of the box after UV curing.

(comparative example A)

In Example A, instead of using TB3080 manufactured by Tri-Bond Co., Ltd., TB3164 manufactured by Tri-Bond Co., Ltd. was used (viscosity 50,000 mPa·sec, volume shrinkage rate 0.39%, and the hardness of the small portable hardness tester A after hardening was A30) Exactly the same implementation. The resin forming composition (cured resin 32 ) supplied by the injector is not evenly spread on the case inner surface, and air bubbles tend to remain between the case inner surface and the cured resin composition.

(comparative example B)

In Example A, instead of using TB3080 manufactured by Tri-Bond Co., Ltd., TB3026 manufactured by Tri-Bond Co., Ltd. (viscosity 19,000 mPa·sec, volume shrinkage rate 7.5%) was used, and the hardness of the small portable hardness tester D after hardening was D85) Exactly the same implementation. The resin-forming composition (cured resin 32 ) supplied by the injector was not evenly spread on the case inner surface, and it was confirmed that the resin cured by irradiating ultraviolet rays was partially peeled off from the case inner surface.

Adhesive RE for attaching the transparent board to the box will be described below.

The manufacturing method of the solid-state imaging device of the present invention includes the following steps: forming a substantially rectangular resin base plate 22 and a resin side wall 24 vertically provided on the periphery of the base plate 22 to form an integral body, and inserting the metal lead terminal 40 , and the process of resin hollow box 20 having an opening; the process of bonding the solid-state imaging element 12 on the inner bottom surface of the hollow box 20; the process of electrically connecting the electrodes of the solid-state imaging element 12 and the metal lead terminal 40; The process of applying the adhesive RE to the opening of the hollow box, closing the opening with the transparent plate 26, and curing the adhesive RE to close the opening. The adhesive RE has a viscosity of 10,000 mPa·sec or more, and the hardness of the hardened adhesive RE is 80 or less in the A class.

Details are given below.

The adhesive RE used in the method of manufacturing the solid-state imaging device of the present invention has a viscosity of 10,000 mPa·sec or more, and a hardness of 80 or less in A-grade hardness after curing. Here, the viscosity of the adhesive RE is measured based on the single cylinder rotational viscometer method described in JIS K7233. In addition, the small-sized portable durometer hardness of the adhesive RE after hardening was measured based on the pressing hardness measurement method described in JIS K7215.

The adhesive used in the present invention has a viscosity at 25° C. of 10,000 mPa·sec or more, preferably 10,000 to 150,000 mPa·sec, more preferably 30,000 to 100,000 mPa·sec. Here, the above-mentioned viscosity is a value measured based on the single cylinder rotational viscometer method described in JIS K7233. When the viscosity of the adhesive is less than 10,000 mPa·sec, the adhesive layer between the hollow box and the transparent plate becomes thin, and warpage or distortion easily occurs on the hollow box.

In addition, the adhesive RE used in the present invention preferably has a small portable durometer hardness (Shore hardness) of type A (grade A) (also called "small portable durometer A hardness") after hardening is 80 or less , more preferably 1-50, more preferably 1-30. The hardness of the above-mentioned small portable hardness tester is a value obtained by measuring based on the pressing hardness measurement method described in JIS K7233. When the hardness of the hardened adhesive exceeds 80, the warping of the solid-state imaging device after covering the opening due to the difference in linear expansion coefficient between the resin case and the transparent plate cannot be prevented. occurs, the imaging performance of the solid-state imaging element is degraded.

As a method of applying the adhesive RE to the opening of the hollow case, well-known methods can be used, and a method of applying the adhesive to the target site from a nozzle using a sprayer is exemplified.

As the adhesive RE used in the present invention, radiation-curable, moisture-curable, or thermosetting adhesives satisfying the above-mentioned viscosity and hardness of a small portable durometer can be used, preferably ultraviolet-curable resins, visible light Curing resins, thermosetting resins, and moisture-curing resins.

In addition, the adhesive used in the present invention may have ultraviolet (tens to 400 nm) curable properties, visible light (400 to 700 nm) curable properties, heat curable properties, or moisture curable properties at the same time.

Specific examples of these resins include acrylic resins, epoxy resins, silicone resins, unsaturated polyester resins, phenol resins, urea-melamine resins, polyurethane resins, and polyimide resins.

Among them, ultraviolet curable resins are preferable as the adhesive used in the present invention. When the adhesive is an ultraviolet curable resin, it can be hardened in a short time, so the productivity is strong, and the temperature rise of the box or the transparent plate 26 is small during hardening, so it is difficult to cause a line between the hollow box 20 and the transparent plate 26. Stress such as warpage or skew caused by the difference in expansion coefficient.

The ultraviolet curable resin is as described above.

In the adhesive used in the present invention, additives such as polymerization initiators, crosslinking agents, and reaction accelerators, inorganic fillers such as silica, and rubber components can also be added appropriately according to the purpose according to the needs. These additives or Fillers and the like can also be used in appropriate combination.

In addition, in order to adjust the viscosity of the adhesive or adjust the hardness of the cured adhesive, the single-functional curable component can be appropriately used as a multi-functional curable component, or they can be used in combination.

The method for manufacturing a solid-state imaging device according to the present invention includes the steps of forming a substantially rectangular resin base plate 22 integrally formed with a resin side wall 24 vertically provided on the periphery of the base plate 22, inserting the lead terminals 40, and The operation of the hollow box 20 made of resin with an opening; the operation of bonding the solid-state imaging element 12 on the inner bottom surface of the hollow box 20; the operation of electrically connecting the electrodes of the solid-state imaging element 12 and the metal lead terminal 40; The process of applying adhesive RE to the opening of 20 , closing the opening with the transparent plate 26 , and curing the adhesive RE to close the opening. Each of the above-mentioned steps itself is a general step, and a well-known method can be used.

When forming the hollow box 20 used in this invention, the resin composition which added the appropriate filler to resin can be used.

(Embodiment 1)

A lead frame plated with gold on a copper alloy was embedded in a metal mold, and a resin hollow box ( Width 50mm×depth 10mm×height 4mm, thickness 2mm).

The above-mentioned resin hollow box with lead terminals was cleaned with ultrapure water in a class 1,000 clean room, then immersed in 500ml of ultrapure water for 20 seconds of ultrasonic cleaning (38kHz), and the resin hollow box was cleaned and dried. After the linear sensor is bonded to the inner bottom surface of the resin case with an adhesive, the linear sensor and the lead terminal are wired with bonding wires.

After drying the resin hollow box after wiring, apply UV-curable adhesive sealant 5088 [manufactured by Henkell Japan Co., Ltd., viscosity at 25°C: 65,000mPa·sec] to the opening with a sprayer, and use After closing the opening with a transparent plate, ultraviolet rays (365 nm) of about 3000 mJ/cm ² were irradiated with a mercury lamp to harden the adhesive to obtain a solid-state imaging device.

The resin test piece after hardening of the above-mentioned sealant 5088 has a hardness of 30 on a small portable durometer A.

In the obtained solid-state imaging device, the maximum amount of warpage was 20 μm on the basis of a straight line connecting both longitudinal ends of the bottom plate of the case.

(comparative example 1)

Except that in Example 1, ultraviolet curable resin XE17-303 [manufactured by GE Toshiba Silicone Co., Ltd., viscosity at 25° C.: 4,000 mPa·sec, small portable durometer A hardness after hardening: 17] was used as the adhesive. A solid-state imaging device was manufactured in exactly the same manner as in Example 1 except for the bonding agent.

The maximum warpage amount of the obtained solid-state imaging device was 55 μm.

(Comparative Example II)

In Example 1, UV curable resin XE17-303 [manufactured by Chemitec Co., Ltd., viscosity at 25° C.: 600 mPa·sec, small portable durometer D hardness after hardening: 80] was used as an adhesive, A solid-state imaging device was manufactured in exactly the same manner as in Example 1. In addition, the D hardness of the small portable durometer is the same as the A hardness of the small portable durometer, and is obtained by measurement based on the pressing hardness measurement method described in JIS K7215.

The maximum warpage amount of the obtained solid-state imaging device was 102 μm, and peeling was observed on a part of the adhesive surface between the transparent plate and the opening of the resin case.

Hereinafter, a specific configuration of a solid-state imaging device including the above-mentioned solid-state imaging device storage case will be described.

4 is a detailed exploded perspective view of a solid-state imaging device equipped with a solid-state imaging device housing case.

As described above, the solid-state imaging device storage case 20 has the recessed portion DP for housing in which the solid-state imaging device 12 is to be disposed, and has a resin-made case main body (hollow) in which the dimension in the longitudinal direction X is three times or more the dimension in the width direction. box) 100, and a plurality of lead terminals 40 extending outward from the inside of the storage recess DP via the side wall 24 parallel to the longitudinal direction X of the box main body 100.

This solid-state imaging device includes a solid-state imaging device storage case 20, a solid-state imaging device 12 provided in the storage recess DP, and a transparent plate 26 that closes the opening of the storage recess DP. The vertical and horizontal aspect ratio of the box main body is high, more than 3. When a liquid crystalline polymer is used as the material of the cell main body 100 with a high aspect ratio, an alignment state of the polymer aligned in the longitudinal direction can be obtained, and the heat resistance, strength characteristics, and low expansion are excellent. Furthermore, as described above, it is preferable to contain a filler composed of an inorganic material in the resin. That is, rigidity can be further improved by including a filler made of an inorganic material in the resin. A highly rigid case can be constructed by combining a liquid crystalline polymer and an inorganic material filler. The filler is composed of a plurality of fibrous bodies or acicular bodies, and each fibrous body or acicular body has an aspect ratio of 5 or more.

Furthermore, the aspect ratio of the solid-state imaging device 12 is also 3 or more. The solid-state imaging device 12 is a one-dimensional CCD (line sensor). Since the solid-state imaging device 12 with a high aspect ratio is easily deflected, the present invention is particularly effective when such a solid-state imaging device 12 is used. In addition, the solid-state imaging device 12 may be fixed to the island 30 only by both longitudinal ends of the island 30 .

Reinforcing portions 105 are respectively provided at both ends in the longitudinal direction of the solid-state imaging device housing case 20 . The reinforcing portion 105 is integrally formed with the side wall 24 and protrudes outward along the longitudinal direction X from both longitudinal ends of the box main body 100 . The XY cross-section of the reinforcement part 105 forms a substantially U-shape together with both ends of the cartridge body 100 . The reinforcing portion 105 suppresses warpage or deflection in a direction perpendicular to the side wall 24 . A part of the lead frame is exposed in the space inside the reinforcement part 105 .

The side wall 24 of the box main body 100 has a plurality of concave portions (thin-walled portions, grooves) 104 extending in the longitudinal direction X in which the width direction Y is the depth direction. In this way, the flow of the resin is uniform during resin molding, and the weight can be reduced.

FIG. 5 is a perspective view of a central portion of a solid-state imaging device housing case provided with an island 30 having a slit (notch) 132 .

A pair of resin-made ribs 103 are integrally provided with the bottom plate 22 of the box main body 100 along the longitudinal direction X of the bottom plate 22 of the box main body 100 . A groove LGR is formed therebetween by a pair of ribs 103 . The case main body 100 is a case main body with a small aspect ratio that tends to be strained, and, regardless of whether it is made of resin, in this device, since there are ribs 103 extending in the longitudinal direction X, the vertical direction X perpendicular to the case main body 100 can be suppressed. Warpage or deflection in direction. There are preferably a plurality of ribs 103, and the ribs 103 are preferably located on the extension line in the height direction Z of the side wall 24 from the viewpoint of improving rigidity.

The solid-state imaging device storage case 20 is provided on the bottom surface of the recess DP, and is provided with an island 30 to fix the solid-state imaging device 12, which is continuous with the island 30 and pressed against the island extending in the side wall 24 along the longitudinal direction of the case main body 100. Section 34. Since the island pressing portion 34 extends toward the inside of the side wall 24, the movement of the island 30 relative to the cartridge main body 100 can be restricted, so that the warping of the island 30 and the solid-state imaging device 12 can be suppressed, and variations in the characteristics thereof can be suppressed. deteriorating. In addition, it is also possible to dissipate heat to the outside via the island pressing portion 34 .

The island 30 is provided with slits (notches) 132 extending from one end toward the other end in the width direction at positions other than both ends thereof. Since stress tends to concentrate on the island portion in the vicinity of the slit 132, the island portion bends, and absorbs expansion and contraction, so that the bending of the solid-state imaging element 12 can be suppressed.

Furthermore, the solid-state imaging device storage case 20 includes at least a pair of island pressing portions 34 , which are continuous with the island 30 and extend inwardly of the side wall 24 along the longitudinal direction of the case main body 100 . The pair of island pressing parts 34 are separated in the longitudinal direction X, and the slit 132 is provided near the center position J between the pair of island pressing parts 34 . The position of the island pressing part 34 is defined at the position of the center line of the island pressing part 34 along the width direction of the island 30 . When X ₀ is the distance between a pair of island pressing portions 34 and X ₁ is the distance from the position of one island pressing portion 34 to the central position J, the distance from the other island pressing portion 34 to the central position J is The distance X ₂ is equal to X ₀ /2.

As described above, although warpage to the island 30 is suppressed due to the presence of the pair of island pressing portions 34, since the positions of the pair of island pressing portions 34 are fixed on the side wall 24, stress is easily applied to the island therebetween. 30 near central location J. Since the slit 132 is provided in the vicinity of the central position J, stress is absorbed at this position, and the island part deflects and absorbs expansion and contraction, so that the deflection of the solid-state imaging device 12 can be suppressed.

The slit 132 includes a first slit 132A and a second slit 132B, the first slit 132A extends from one end to the other end in the width direction of the island 30, and the second slit 132B extends from the other end to one end in the width direction of the island. Extending, the first slit 132A and the second slit 132B are disposed across the central position J.

In this case, since the twisting direction of the island 30 in the longitudinal direction at the position where the first slit 132A is formed is opposite to that of the twisting direction in the longitudinal direction of the island 30 at the position where the second slit 132B is formed, the island 30 can be canceled out. The twisting in the longitudinal direction can suppress the twisting in the longitudinal direction of both ends of the island 30 . Moreover, since the first slit 132A and the second slit 132B have a tendency to be symmetrical around a point P on the island 30 between the first slit 132A and the second slit 132B, a longitudinal gap is generated in the island 30. In the case of thermal expansion, the movement of the island 30 in the width direction with respect to the longitudinal center line of the island 30 is restricted.

The deepest portion D of the slit 132 is formed of a curved surface. The curved surface partially includes a cylindrical surface centered on the Z-axis parallel to the thickness direction of the island 30 . In this case, when stress is concentrated on the island 30 at the portion where the slit 132 is formed, the local stress concentration on the deepest portion D can be alleviated, so the durability of the island 30 is excellent. Furthermore, since the deepest part of the slit is formed of a curved surface, it is also possible to reduce flashing during molding.

The interior of the slit 132 is filled with a relatively soft cured resin 32 , and the island 30 at the portion where the slit 132 is formed is easily deflected and can absorb expansion and contraction. The hardening resin 32 is applied on the inner surface portion of the case main body 100 , and is also applied on the boundary portion between the lead terminal 40 and the inner surface portion of the case main body 100 . Hardened resin 32 and RE's small portable durometer hardness is 80 or less in A grade

Furthermore, the case main body 100 is provided with a pair of protrusions (embankments) 101 that are in contact with both ends in the width direction of the island 30 . The protrusion 101 extends in the longitudinal direction of the island 30 . The pair of protrusions 101 can suppress movement of the island 30 in the width direction. The case main body 100 is provided with a pair of grooves SGR extending in the longitudinal direction of the island 30, and the side surfaces of each protrusion 101 constitute one side surface of each groove SGR. That is, on the side surface close to the island 30 and the inner bottom surface of the box, the groove (groove) SGR is suppressed from being arranged in the longitudinal direction. In addition, the protrusion 101 is not provided at the formation position of the slit 132, and the formation position of the slit 132 The upper island 30 is easily deformed.

Furthermore, the light-receiving surface of the solid-state imaging device 12 is exposed, so that sufficiently bright light can be incident on the receiving surface. The first cured resin 32 is blocked by the side surface outside the protrusion 101 and does not exist on the light receiving surface. Therefore, according to the solid-state imaging device, accurate imaging can be performed.

The transparent plate 26 (see FIG. 4 ) closes the recess DP of the case main body 100 , but the second hardening resin RE is interposed between the case main body 100 and the transparent plate 26 . That is, the cured resin RE exists on the junction between the cartridge main body 100 and the transparent plate 26 . The second curable resin RE can bond the transparent plate 26 and the case main body 100 .

Furthermore, the first curable resin 32 is continuous with the second curable resin RE. Since the first curable resin 32 and the second curable resin RE can be applied in the same process, the structure is simple. In addition, the first curable resin 32 covers the connecting portion (see FIG. 1 ) between the bonding wire 42 and the lead terminal 40 , thereby preventing deterioration of the connecting portion.

Fig. 6 is a perspective view of the central portion of the solid-state imaging device housing case provided with partitioned islands.

The pair of islands 30 , 30 are separated in the longitudinal direction of the box main body 100 . That is, since the islands 30, 30 are separated, the island 100 is not fixed to the box body portion 100A between the islands 30, 30 of both sides, so the box body portion 100A is easy to bend, and expansion and contraction can be absorbed, and the fixing can be suppressed. Deflection of the imaging element 12 .

FIG. 7 is a diagram for explaining a method of manufacturing the solid-state imaging device storage case.

In the case of performing injection molding of the solid-state imaging device storage case, the resin RE is poured between the first mold M1 and the second mold M2 having the cavity formed by the case between opposing surfaces. The first mold M1 and the second mold M2 constitute a box molding mold. A lead frame is inserted between the first mold M1 and the second mold M2.

The second mold M2 has a tapered resin introduction hole M21 extending in the Z direction, and has a communication path M22 extending in the X direction from the tip of the resin introduction hole M21. The front end portion of the communication passage 22 constitutes a gate portion, from which the resin RE1 is introduced into the cavity, and the resin flows into the cavity along the X direction. Therefore, when the resin RE1 is a liquid crystalline polymer, the orientations of the polymers constituting it are aligned in the X direction.

After the resin is filled and cured, when the solidified resin is pushed in the direction of the second mold M2 by a plurality of push pins EP penetrating the first mold M1, the solid-state imaging device housing case is completed. That is, the method of the present invention includes a step of injecting and curing resin into the cavities of the molds M1 and M2. Afterwards, the solid-state imaging device 12 is bonded and connected to the island 30, and the solid-state imaging device 12 and the wire terminal 40 are electrically connected by wire bonding. Finally, the upper opening of the box is closed with a transparent plate 26, and the above-mentioned solid-state imaging device is completed.

As described above, the above-mentioned method of manufacturing a solid-state imaging device is set up in the following order:

(1) Forming is integrally formed by a substantially rectangular resin base plate 22 and a resin side wall 24 approximately vertically placed on the periphery of the base plate 22, and a metal lead terminal 40 is inserted, and the opening can be closed by a transparent plate 26. The process of the hollow box 20 made of plastic resin; (II) the process of bonding the solid-state imaging element 12 on the inner bottom surface of the box 20; (III) electrically connecting the electrodes of the solid-state imaging element 12 and the metal lead terminal 40 with bonding wires (IV) the process of closing the opening of the box with the transparent plate 26.

And, have any one process selected from the following processes:

(i) Form hardening resin A (32) by imparting hardening resin forming composition A on the inner surface of the case and hardening it, thereby covering at least a part of the inner surface of the case and/or the lead terminal 40 inside the case with the hardening resin The process of the boundary portion with the inner surface of the case, and (ii) applying hardened resin composition B (RE) to the portion of the opening of the case that is in contact with the transparent plate 26, and after closing the opening with the transparent plate 26, use A step of sealing the opening with the cured resin B after the cured resin composition B has been cured.

The viscosity of cured resin-forming composition A is 5000 mPa·sec or less. The curable resin-forming composition A is a curable resin-forming composition A having a volume shrinkage rate of 5% or less due to the curing of the curable resin-forming composition A, and the curable resin-forming composition A is irradiated with ultraviolet rays to form the curable resin A In this case, the weight of the curable resin A is 99.8% or more and 100% or less of the weight of the curable resin forming composition A before hardening.

In addition, the above-mentioned step (i) is to impart ultraviolet curable curable resin forming composition A on the inner surface of the hollow box, and irradiate ultraviolet rays through the sealed transparent plate 26 to make resin forming composition A into curable resin A, thereby utilizing hardening A step of covering at least a part of the inner surface of the hollow case with the resin 32 and the boundary portion between the metal lead terminal 40 and the resin portion in the case.

Furthermore, as described above, the viscosity of the curable resin-forming composition B is preferably 10000 mPa·sec or more.

The curable resin forming composition B is preferably ultraviolet curable, and the above step (ii) is to impart ultraviolet curable resin forming composition B (RE) between the upper surface of the hollow box and the transparent plate 26, and irradiate through the transparent plate 26. The process of sealing the box by turning the resin-forming composition B into a hardened resin by ultraviolet rays.

Claims (18)

1, a kind of solid camera head, have by the resin system base plate of essentially rectangular and the roughly vertical resin system sidewall that is located on its periphery integrally formed, and plug the metallic conductor terminal, the thermoplastic resin system hollow case that peristome is sealed by transparent panel, the inner bottom surface of this hollow case is provided with the metallic island, cementation has solid-state imager on this island, it is characterized in that:

(a) inner surface portion of above-mentioned hollow case,

(b) the boundary portion of above-mentioned metallic conductor terminal and above-mentioned hollow case inner surface and

(c) junction surface of above-mentioned hollow case and above-mentioned transparent panel

Certain 1 position on, the configuration hardening resin forms the hardening resin after the constituent sclerosis, the duro-meter hardness of aforementioned hardening resin is below 80 in the A level.

2, solid camera head as claimed in claim 1 is characterized in that: aforementioned hardening resin comprises at least a kind that selects from epoxy resin, unsaturated polyester resin, phenolic resins, urea-Melamine resin sheet, polyurethane resin, silicone resin, polyimide resin and acrylic resin group.

3, solid camera head as claimed in claim 1 is characterized in that: on above-mentioned metallic island along the jetty portion that vertically is provided with of above-mentioned solid-state imager.

4, solid camera head as claimed in claim 1 is characterized in that: the side near above-mentioned metallic island on the inner bottom surface of above-mentioned box, vertically is equipped with groove along it.

5, solid camera head as claimed in claim 1 is characterized in that: aforementioned hardening resin constituent comprises uv-hardening resin.

6, a kind of manufacture method of solid-state imager is provided with in the following order:

(I) be shaped integrally formedly, and plug the metallic conductor terminal by the resin system base plate of essentially rectangular and the roughly vertical resin system sidewall that is located on this base plate periphery, and the operation of the thermoplastic resin system hollow case that can be sealed by transparent panel of peristome;

(II) operation of cementation solid-state imager on the inner bottom surface of this box;

(III) utilize closing line to be electrically connected the operation of electrode and this metallic conductor terminal of this solid-state imager;

(IV) seal the operation of this box peristome by transparent panel;

It is characterized in that having some operations of from following operation, selecting:

(i) form constituent A and make its sclerosis form hardening resin A by give hardening resin at this box inner surface, thereby utilize at least a portion that hardening resin covers this box inner surface with and/or this box in this conductor terminal and the operation of the boundary portion of this box inner surface, and

(ii) give hardening resin constituent B at the position that contacts with this transparent panel of the peristome of this box, above-mentioned hardening resin forms the viscosity of constituent B more than 10000mPasec, and after utilizing transparent panel to seal this peristome, utilize hardening resin B after this hardening resin constituent B sclerosis to shut the operation of this peristome.

7, the manufacture method of solid camera head as claimed in claim 6 is characterized in that: above-mentioned hardening resin forms the viscosity of constituent A below 5000mPasec.

8, the manufacture method of solid camera head as claimed in claim 6 is characterized in that: follow above-mentioned hardening resin to form the cubical contraction of sclerosis of constituent A below 5%.

9, the manufacture method of solid camera head as claimed in claim 6 is characterized in that: it is UV cured property that above-mentioned hardening resin forms constituent A.

10, the manufacture method of solid camera head as claimed in claim 9, it is characterized in that: when above-mentioned hardening resin formed irradiation ultraviolet radiation on the constituent A, formation hardening resin A, the weight of this hardening resin A was at more than 99.8% of weight of presclerotic hardening resin formation constituent A, below 100%.

11, the manufacture method of solid camera head as claimed in claim 9, it is characterized in that: above-mentioned operation (i) is, the hardening resin of giving UV cured property on above-mentioned hollow case inner surface forms constituent A, make this resin-shaped become constituent A to become hardening resin A by the transparent panel irradiation ultraviolet radiation of shutting, thus utilize at least a portion that hardening resin covers this hollow case inner surface with and/or this box in this metallic conductor terminal and the operation of the boundary portion of resin part.

12, the manufacture method of solid camera head as claimed in claim 6 is characterized in that: it is UV cured property that this hardening resin forms constituent B.

13, the manufacture method of solid camera head as claimed in claim 12, it is characterized in that: above-mentioned operation (ii) is, on above-mentioned hollow case with transparent panel between give UV cured property resin-shaped become constituent B, thereby make this resin-shaped become constituent B to become the operation that hardening resin seals this box by this transparent panel irradiation ultraviolet radiation.

14, a kind of solid camera head that utilizes the described manufacture method of claim 6 to make.

15, a kind of solid camera head is characterized in that: have:

Resinous box main body with recess;

Be located at the island on the bottom surface of above-mentioned recess;

Be fixed on the solid-state imager on the above-mentioned island;

Sidewall via above-mentioned box main body in the above-mentioned recess extends to outside conductor terminal;

The closing line that connects above-mentioned solid-state imager and above-mentioned conductor terminal;

With above-mentioned to the Width two ends contact, along above-mentioned arrive vertically more than a pair of jut;

With contacted the 1st hardening resin of each outer lateral side of above-mentioned jut.

16, solid camera head as claimed in claim 15 is characterized in that: have:

Seal the transparent panel of the recess of above-mentioned box main body;

Be installed at the 2nd hardening resin between above-mentioned box main body and the above-mentioned transparent panel.

17, solid camera head as claimed in claim 16 is characterized in that: above-mentioned the 1st hardening resin and above-mentioned the 2nd hardening resin are continuous.

18, solid camera head as claimed in claim 15 is characterized in that: the be covered connecting portion of above-mentioned closing line and above-mentioned conductor terminal of above-mentioned the 1st hardening resin.

Images