CN100554852C - 热管及散热模组 - Google Patents
热管及散热模组 Download PDFInfo
- Publication number
- CN100554852C CN100554852C CNB2005100375022A CN200510037502A CN100554852C CN 100554852 C CN100554852 C CN 100554852C CN B2005100375022 A CNB2005100375022 A CN B2005100375022A CN 200510037502 A CN200510037502 A CN 200510037502A CN 100554852 C CN100554852 C CN 100554852C
- Authority
- CN
- China
- Prior art keywords
- condensation chamber
- evaporation
- heat pipe
- road
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 20
- 238000001704 evaporation Methods 0.000 claims abstract description 86
- 230000008020 evaporation Effects 0.000 claims abstract description 86
- 238000009833 condensation Methods 0.000 claims abstract description 84
- 230000005494 condensation Effects 0.000 claims abstract description 84
- 239000007788 liquid Substances 0.000 claims abstract description 42
- 239000012530 fluid Substances 0.000 claims abstract description 34
- 238000005086 pumping Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000005192 partition Methods 0.000 description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010992 reflux Methods 0.000 description 5
- 238000010008 shearing Methods 0.000 description 5
- 238000009834 vaporization Methods 0.000 description 5
- 230000008016 vaporization Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明涉及一种热管,其包括一盖体及一本体,该本体包括一蒸发腔,一冷凝腔,一蒸发道及一回流道,该冷凝腔内设置有多个隔板,至少一个隔板具有一与外界相通的空腔,该蒸发腔具有一蒸汽输出侧及一液体输入侧,该冷凝腔具有一蒸汽输入侧及一液体输出侧,该蒸发道设置于蒸汽输出侧与蒸汽输入侧之间并将蒸发腔与冷凝腔连通,该回流道设置于液体输出侧与液体输入侧之间并将冷凝腔与蒸发腔连通,一工作流体填充于蒸发腔、冷凝腔、回流道及蒸发道所形成的通道中。另外,本发明还提供一种具有该热管的散热模组。该热管可有效解决朝着轻、薄、短、小方向发展的笔记本电脑的散热问题。
Description
【技术领域】
本发明关于一种热管及具有该热管的散热模组。
【背景技术】
热管是一种于密封、低压且导热性能良好的金属壳体内盛装适量工作流体的传热装置,其工作原理是:利用工作流体在壳体内作汽、液两相转化进行吸热或放热。工作流体通常选用汽化热高、流动性好、化学性质稳定、沸点较低的液态物质,如水、乙醇、丙酮等。热管具有一蒸发端及一冷凝端,当蒸发端与热源接触吸收热量时,其内的工作流体受热蒸发并吸收大量汽化热,形成的气体快速扩散到冷凝端冷却而放出热量,冷却后再次形成液体并沿壳体内壁回流,这样往复循环便可将热源产生的热量从热管的蒸发端传递到冷凝端而散发出去。为加速冷却后液体的回流速度,通常在壳体内壁上设置有毛细结构,该毛细结构通常为细小的沟槽,在毛细结构的毛细吸附力作用下,液体的回流速度大大加速。由于热管内的工作流体循环速度快,因此传热效率高,目前热管在散热领域得到广泛而大量应用。
图1及图2为一种传统热管10的示意图,其具有一密封的金属壳体102,壳体102内容腔103抽成低压,并充填有一定量工作流体(图未示)。在壳体102内壁附设有毛细结构104,该毛细结构104为沿壳体102内壁纵向延伸的沟槽。在使用时,热管10一端作为蒸发段A从热源处吸收热量,另一端作为冷凝段B放出热量,工作流体吸热汽化后的蒸汽由蒸发段A向冷凝段B扩散,冷却后的工作流体沿毛细结构104回流。
由于笔记本电脑朝着轻、薄、短、小的方向发展,当该热管10用于笔记本电脑散热模组时,通常需要先将热管10压成扁平状以满足笔记本电脑内空间限制。但热管10直径较小,当将其压扁后使热管10的壳体102间的距离减小,蒸汽在冷凝段B冷凝后聚集形成的液滴使壳体102间的距离进一步减小,导致蒸汽扩散与液体回流的交界面会产生一相互作用的剪切力,该剪切力一方面阻止液体向蒸发段A回流,另一方面阻碍蒸汽往冷凝段B扩散。由于该剪切力的存在,使热管10内工作流体的循环速度大大减慢,降低了热管10的传热性能,对壳体102直径较小的长热管而言,甚至出现冷凝后的液体无法顺利回流至蒸发段A进行循环散热。
因此,有必要提供一种可避免向冷凝端扩散的蒸汽与向蒸发端回流的冷凝液体交汇,提升工作流体循环速率的热管。
【发明内容】
以下,将以实施例说明一种热管及散热模组。
一种热管,其包括一盖体及一本体,该本体包括一蒸发腔,一冷凝腔,一蒸发道及一回流道,该冷凝腔内设置有多个隔板,至少一个隔板具有一与外界相通的空腔,该蒸发腔具有一蒸汽输出侧及一液体输入侧,该冷凝腔具有一蒸汽输入侧及一液体输出侧,该蒸发道设置于蒸汽输出侧与蒸汽输入侧之间并将蒸发腔与冷凝腔连通,该回流道设置于液体输出侧与液体输入侧之间并将冷凝腔与蒸发腔连通,一工作流体填充于蒸发腔、冷凝腔、回流道及蒸发道所形成的通道中。
一种散热模组,其包括:一热管,多个散热鳍片及一风扇,该热管包括一盖体及一本体,该本体包括一蒸发腔,一冷凝腔,一蒸发道及一回流道,该冷凝腔内设置有多个隔板,至少一个隔板具有一与外界相通的空腔,该蒸发腔具有一蒸汽输出侧及一液体输入侧,该冷凝腔具有一蒸汽输入侧及一液体输出侧,该蒸发道设置于蒸汽输出侧与蒸汽输入侧之间并将蒸发腔与冷凝腔连通,该回流道设置于液体输出侧与液体输入侧之间并将冷凝腔与蒸发腔连通,一工作流体填充于蒸发腔、冷凝腔、回流道及蒸发道所形成的通道中;该多个散热鳍片设置于热管的盖体上与冷凝腔对应的一端。
与现有技术相比,上述热管具有以下优点:该热管工作过程中的蒸汽与冷凝液在不同的通道中流动,即,蒸发腔产生的蒸汽通过蒸发道扩散到冷凝腔,冷凝腔产生的冷凝液通过回流道回流到蒸发腔,使得蒸发腔产生的蒸汽与冷凝腔产生的冷凝液在热管内成一回路流动,避免现有技术中蒸汽与冷凝液形成交界面而产生相互作用的剪切力影响工作流体循环,从而提高热管的热传效率。所述散热模组具有上述热管结构,用于热传时,可结合该热管的优点更好发挥热传作用。
【附图说明】
图1为现有技术热管的轴向剖视图。
图2为图1中沿II-II向剖视图。
图3为本发明第一实施例的热管示意图。
图4为图3的分解图。
图5为本发明第二实施例的散热模组示意图。
【具体实施方式】
下面将结合附图及实施例对一种热管及散热模组作进一步详细说明。
如图3及图4所示,本发明第一实施例的热管20包括一本体200、一与之相配合的盖体300以及分散于本体200中的工作流体400,该本体200的形状可为矩形、正方形或其它规则或不规则形状;盖体300的形状或与本体相同,或不相同,只要两者配合后可将工作流体密封便可;工作流体400可选用汽化热高、流动性好、化学性质稳定、沸点较低的液态物质,如水、乙醇、丙酮等,且可于工作流体中400加入纳米粒子如纳米铜粒子以提升其热传导性质。
该本体200包括一蒸发腔210,一冷凝腔220,一蒸发道230及一回流道240,该蒸发腔210包括一蒸汽输出侧212及一液体输入侧213,该冷凝腔220具有一蒸汽输入侧222及一液体输出侧223。该蒸发道230设置于蒸汽输出侧212与蒸汽输入侧222之间,并将蒸发腔210与冷凝腔220连通,该回流道240设置于液体输出侧223与液体输入侧213之间,并将蒸发腔210与冷凝腔220连通。该热管的容积大小约为5cm×5cm×5cm至10cm×10cm×15cm之间,其材质为铜或其它高导热金属。蒸发道230与回流道240可为直通道或弯曲通道。本实施例中,蒸发腔210与冷凝腔220均为矩形体,蒸发道230与回流道240为直通道。
蒸发腔210中可设置有多个第一隔板211,相邻第一隔板211可相互平行,且可间隔排布,冷凝腔220中可设置多个第二隔板221,相邻第二隔板221可相互平行,且可间隔排布。第一隔板211、第二隔板221的材质均为铜或其它高导热金属,以使工作流体400于蒸发腔210及冷凝腔220中迂回流动,增大工作流体与散热金属的接触面积以利于散热。为增大散热面积,使热管20的热量能更快散去,可将第一隔板211或第二隔板221设置为弯板,或于隔板上开设凹槽、凸起或孔等,此外,蒸发腔210及冷凝腔220的外壁也可设置多个凹槽或凸起结构。
优选地,冷凝腔220的各第二隔板221进一步分别设置一空腔224,其与外界空气连通,或与一风扇配合,使得风扇吹进的冷气流将第二隔板221上的热量带走。设置有空腔224的第二隔板221最好与冷凝腔的高度相同。空腔224的形状可为矩形、圆形等其它所需形状通孔,本实施例中,多个第二隔板221平行间隔排布,因而空腔224为平行间隔排布的矩形通孔。
回流道240的内壁上可设置毛细结构如沟槽等。冷凝腔220中经冷凝的工作流体400可通过回流道240上毛细结构的毛细作用回流至蒸发腔210中。也可于冷凝腔220中设置泵浦,将冷凝后的工作流体400从回流道240强制送回至蒸发腔210中。
该盖体300的材料可选用铜或其它高散热性金属,其形状可为长方形或其它所需形状,只要能与本体200相配合便可。盖体300与冷凝腔220对应一端开设有多个通孔301,该多个通孔301于盖体300上的排布方式与第二隔板221的空腔224排布方式相对应,即,多个通孔301为平行间隔排布的矩形通孔,且通孔301的形状及尺寸与空腔224的形状及尺寸相同,以使本体200与盖体300结合后,空腔224与通孔301完全配合形成一与外界空气相通的通道,使得热管20工作时,风扇(图未示)所吹送的空气可于空腔224与通孔301所形成的通道中流动,将第二隔板221上的热量迅速分散。设置有空腔224的第二隔板221与冷凝腔的高度相同,当本体200与盖体300结合后,可避免工作流体从空腔224中泄漏。本实施例中,空腔224与通孔301均为大小相同的矩形通孔。
如图5所示,本发明第二实施例的散热模组30是在第一实施例热管20的基础上设置风扇及散热鳍片形成。该散热模组30包括一本体200,一盖体500,多个散热鳍片520及一风扇530。盖体500具有一底面510,该底面510上开设有多个平行间隔排布的矩形通孔511,该多个通孔511的排布方式与第二隔板221的空腔224排布方式相对应,且通孔511的形状及尺寸与空腔224的形状及尺寸相同。多个散热鳍片520设置于盖体500与冷凝腔220对应的一端的底面510上,该多个散热鳍片520可垂直设置于底面510,也可倾斜设置于底面510。该多个散热鳍片520与多个平行矩形通孔511的长度方向垂直,也可与多个平行通孔511的长度方向平行或成适当夹角,具体如何设置可根据需要设定,本实施例中,多个散热鳍片520与多个平行通孔511的长度方向垂直。
该风扇530可设置在盖体500的多个散热鳍片520的附近或与多个散热鳍片520相连接;也可将风扇530设置于冷凝腔220的底部225或该底部225的附近,当然,该风扇530的位置可根据所需设置,只要使其所吹送的气流尽可能迅速将多个散热鳍片520及热管冷凝腔的热量带走便可。
本发明第一实施例的热管20的制作流程可为:制作本体200,其具有一蒸发腔210,一冷凝腔220,一蒸发道230及一回流道240,该蒸发道230与回流道240将蒸发腔210与冷凝腔220连通;制作盖体300;向本体200中填入适量工作流体后,将盖体300结合于本体200上。
以下将对各步骤进行详细说明。
首先,制作本体200。
该本体200包括一蒸发腔210,一冷凝腔220,一蒸发道230及一回流道240,该蒸发道230与回流道240将蒸发腔210与冷凝腔220连通。该热管的容积大小约为5cm×5cm×5cm至10cm×10cm×15cm之间,其材质为铜或其它高导热金属。本体200的形状可为矩形、正方形或其它规则或不规则形状,蒸发腔210与冷凝腔220的形状可为球体、椭球体、多面体或不规则体等,蒸发道230与回流道240可为直通道或弯曲通道。
本实施例中,本体200制作为矩形体,蒸发腔210与冷凝腔220均为矩形体,蒸发道230与回流道240为相互平行的矩形通道,且回流道240的内壁制作有毛细结构(图未标示)。蒸发腔210中设置多个第一隔板211,冷凝腔220中设置多个第二隔板221,该第二隔板221上开设有孔腔222,空腔224为矩形通孔。第一隔板211与第二隔板221均为相互平行的矩形板,多个第一隔板211的排布方向与多个第二隔板221相同,并同时与蒸发道230及回流道240平行。
本体200的制作方法包括模具成型法、焊接法、热压法等其它适当加工方法;也可将上述方法相结合使用。本实施例采用模具成型法与焊接法相结合的方法制作本体200,例如,首先采用冲压模具成型出本体200的蒸发腔210、冷凝腔220、蒸发道230及回流道240;然后选用焊接法于蒸发腔210、冷凝腔220中分别制作第一隔板211、第二隔板221。
其次,制作盖体300。
待制作的盖体300的形状可为矩形、正方形或其它所需形状,只要能与本体200相配合便可。盖体300上与冷凝腔220对应一端开设有多个通孔301,该通孔301的形状与本体200上第二隔板221的空腔224形状及尺寸相同,多个通孔301在盖体300上的排布与空腔224的排布相对应,以使该两者相通或完全吻合。本实施例中通孔301为矩形孔。
盖体300的制作方法可采用冲压模具成型出,首先利用模具冲出所需盖体300的外形,然后在其上冲出通孔301。
再次,向本体200中填入适量工作流体400后,将盖体300结合于本体200上。
工作流体400可选用汽化热高、流动性好、化学性质稳定、沸点较低的液态物质,如水、乙醇、丙酮等,且可于工作流体400中加入纳米粒子如纳米铜粒子以提升其热传导性质。本实施例的工作流体400选用乙醇与纳米铜粒子的混合液。
将适量工作流体400填充入本体200中,将盖体300结合于本体200上,盖体300与本体200之间可形成活动配合,例如于盖体300与本体200上设置可相互配合的结构,如卡槽或卡钩等;盖体300与本体200之间也可形成固定配合,例如将该两者采用焊接法、热压法、螺钉或螺栓固定法或其它可行的方法配合于一起。本实施例中,选用热压法,在真空室内将盖体300与本体200的周边接合于一起,形成如图3所示的热管20。
另外,本发明第二实施例的散热模组30的制作方法在制作热管20的基础上,设置多个散热鳍片520及风扇530即可。
与现有技术相比,本实施例的热管具有以下优点:该热管工作过程中的蒸汽与冷凝液在不同的通道中流动,即,蒸发腔产生的蒸汽通过蒸发道扩散至冷凝腔,冷凝腔产生的冷凝液通过回流道回流至蒸发腔,使得蒸发腔产生的蒸汽与冷凝腔产生的冷凝液于热管内成一回路流动,避免现有技术中蒸汽与冷凝液形成交界面而产生相互作用的剪切力影响工作流体循环,从而提高热管的热传效率。所述散热模组具有上述热管结构,用于热传时,可结合该热管的优点更好发挥热传作用。
Claims (11)
1.一种热管,其包括一盖体及一本体,该本体包括一蒸发腔,一冷凝腔,一蒸发道及一回流道,该冷凝腔内设置有多个隔板,至少一个隔板具有一与外界相通的空腔,该蒸发腔具有一蒸汽输出侧及一液体输入侧,该冷凝腔具有一蒸汽输入侧及一液体输出侧,该蒸发道设置于蒸汽输出侧与蒸汽输入侧之间并将蒸发腔与冷凝腔连通,该回流道设置于液体输出侧与液体输入侧之间并将冷凝腔与蒸发腔连通,一工作流体填充于蒸发腔、冷凝腔、回流道及蒸发道所形成的通道中。
2.如权利要求1所述的热管,其特征在于,该蒸发腔内设置有多个隔板。
3.如权利要求2所述的热管,其特征在于,该冷凝腔内的多个隔板和蒸发腔内的多个隔板上开设有凹槽、凸起或孔结构。
4.如权利要求2所述的热管,其特征在于,该冷凝腔内的多个隔板相互平行且间隔排布,该蒸发腔内的多个隔板也相互平行且间隔排布。
5.如权利要求1所述的热管,其特征在于,该冷凝腔内多个隔板的高度与冷凝腔的高度相同。
6.如权利要求1所述的热管,其特征在于,该盖体上与冷凝腔对应的一端开设有多个通孔,该多个通孔与冷凝腔内多个隔板的空腔相连通。
7.如权利要求1所述的热管,其特征在于,该回流道内壁设置有毛细结构。
8.如权利要求1所述的热管,其特征在于,该热管还包括一泵浦,其设于冷凝腔内,用以将冷凝端的工作流体送回至蒸发腔。
9.一种散热模组,其包括:一热管,多个散热鳍片及一风扇,该热管包括一盖体及一本体,该本体包括一蒸发腔,一冷凝腔,一蒸发道及一回流道,该冷凝腔内设置有多个隔板,至少一个隔板具有一与外界相通的空腔,该蒸发腔具有一蒸汽输出侧及一液体输入侧,该冷凝腔具有一蒸汽输入侧及一液体输出侧,该蒸发道设置于蒸汽输出侧与蒸汽输入侧之间并将蒸发腔与冷凝腔连通,该回流道设置于液体输出侧与液体输入侧之间并将冷凝腔与蒸发腔连通,一工作流体填充于蒸发腔、冷凝腔、回流道及蒸发道所形成之通道中;该多个散热鳍片设置于热管的盖体上与冷凝腔对应的一端。
10.如权利要求9所述的散热模组,其特征在于,该风扇设置于热管盖体的一侧,其与散热鳍片相连。
11.如权利要求9所述的散热模组,其特征在于,该热管的冷凝腔具有一底部,风扇设置于该底部。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100375022A CN100554852C (zh) | 2005-09-23 | 2005-09-23 | 热管及散热模组 |
US11/433,656 US7694725B2 (en) | 2005-09-23 | 2006-05-12 | Heat dissipation system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100375022A CN100554852C (zh) | 2005-09-23 | 2005-09-23 | 热管及散热模组 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1936481A CN1936481A (zh) | 2007-03-28 |
CN100554852C true CN100554852C (zh) | 2009-10-28 |
Family
ID=37892449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100375022A Expired - Fee Related CN100554852C (zh) | 2005-09-23 | 2005-09-23 | 热管及散热模组 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7694725B2 (zh) |
CN (1) | CN100554852C (zh) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI263472B (en) * | 2004-04-07 | 2006-10-01 | Delta Electronics Inc | Heat dissipation module |
US9086229B1 (en) | 2006-10-13 | 2015-07-21 | Hrl Laboratories, Llc | Optical components from micro-architected trusses |
US9229162B1 (en) | 2006-10-13 | 2016-01-05 | Hrl Laboratories, Llc | Three-dimensional ordered diamond cellular structures and method of making the same |
US20080225489A1 (en) * | 2006-10-23 | 2008-09-18 | Teledyne Licensing, Llc | Heat spreader with high heat flux and high thermal conductivity |
US8482921B2 (en) | 2006-10-23 | 2013-07-09 | Teledyne Scientific & Imaging, Llc. | Heat spreader with high heat flux and high thermal conductivity |
CN101232794B (zh) * | 2007-01-24 | 2011-11-30 | 富准精密工业(深圳)有限公司 | 均热板及散热装置 |
US8356657B2 (en) * | 2007-12-19 | 2013-01-22 | Teledyne Scientific & Imaging, Llc | Heat pipe system |
US20120087088A1 (en) * | 2008-08-05 | 2012-04-12 | Pipeline Micro, Inc. | Microscale heat transfer systems |
CN101742892B (zh) * | 2008-11-20 | 2013-02-20 | 富准精密工业(深圳)有限公司 | 热管散热器 |
US8579018B1 (en) | 2009-03-23 | 2013-11-12 | Hrl Laboratories, Llc | Lightweight sandwich panel heat pipe |
EP2433480B1 (en) * | 2009-05-18 | 2013-05-01 | Huawei Technologies Co., Ltd. | Heat spreading device and method therefore |
US8122946B2 (en) * | 2009-06-16 | 2012-02-28 | Uop Llc | Heat exchanger with multiple channels and insulating channels |
US7768783B1 (en) * | 2009-06-16 | 2010-08-03 | Microsoft Corporation | Electronic module cooling |
US8573289B1 (en) | 2009-07-20 | 2013-11-05 | Hrl Laboratories, Llc | Micro-architected materials for heat exchanger applications |
US8453717B1 (en) | 2009-07-20 | 2013-06-04 | Hrl Laboratories, Llc | Micro-architected materials for heat sink applications |
JP5568289B2 (ja) * | 2009-11-30 | 2014-08-06 | 新光電気工業株式会社 | 放熱部品及びその製造方法 |
US8921702B1 (en) * | 2010-01-21 | 2014-12-30 | Hrl Laboratories, Llc | Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments |
US9546826B1 (en) | 2010-01-21 | 2017-01-17 | Hrl Laboratories, Llc | Microtruss based thermal heat spreading structures |
US8771330B1 (en) | 2010-05-19 | 2014-07-08 | Hrl Laboratories, Llc | Personal artificial transpiration cooling system |
US8857182B1 (en) | 2010-05-19 | 2014-10-14 | Hrl Laboratories, Llc | Power generation through artificial transpiration |
CN102338583B (zh) * | 2010-07-23 | 2014-05-07 | 奇鋐科技股份有限公司 | 一种压力差驱动热板 |
CN102338581B (zh) * | 2010-07-23 | 2013-10-30 | 奇鋐科技股份有限公司 | 热虹吸板结构 |
US9758382B1 (en) | 2011-01-31 | 2017-09-12 | Hrl Laboratories, Llc | Three-dimensional ordered diamond cellular structures and method of making the same |
CN102790025B (zh) * | 2012-08-27 | 2016-03-30 | 无锡市福曼科技有限公司 | 计算机cpu的多流道水冷结构 |
TWM446226U (zh) * | 2012-09-04 | 2013-02-01 | Tan Xin Technology Dev Inc | 渦輪增壓器之殼體 |
US9405067B2 (en) | 2013-03-13 | 2016-08-02 | Hrl Laboratories, Llc | Micro-truss materials having in-plane material property variations |
JP6276959B2 (ja) * | 2013-10-11 | 2018-02-07 | 株式会社日立製作所 | 相変化モジュール及びそれを搭載した電子機器装置 |
US9910459B2 (en) * | 2015-03-20 | 2018-03-06 | Dell Products L.P. | Thermal insulator and radiation shield |
EP3113590B1 (en) | 2015-06-30 | 2020-11-18 | ABB Schweiz AG | Cooling apparatus |
US10588234B2 (en) * | 2016-01-26 | 2020-03-10 | Hewlett Packard Enterprise Development Lp | Semiconductor assembly |
US10746474B2 (en) * | 2016-04-11 | 2020-08-18 | Qualcomm Incorporated | Multi-phase heat dissipating device comprising piezo structures |
US10353445B2 (en) * | 2016-04-11 | 2019-07-16 | Qualcomm Incorporated | Multi-phase heat dissipating device for an electronic device |
TWM532046U (zh) * | 2016-06-02 | 2016-11-11 | Tai Sol Electronics Co Ltd | 具有液汽分離結構的均溫板 |
US10211125B2 (en) * | 2017-07-19 | 2019-02-19 | Heatscape.Com, Inc. | Configurable mounting hole structure for flush mount integration with vapor chamber forming plates |
TWI695569B (zh) * | 2018-06-19 | 2020-06-01 | 友永股份有限公司 | 熱交換器 |
US11209215B2 (en) * | 2018-07-27 | 2021-12-28 | Qualcomm Incorporated | Enhanced cooling of an electronic device using micropumps in thermosiphons |
CN109874268B (zh) * | 2018-11-27 | 2020-11-10 | 奇鋐科技股份有限公司 | 散热单元制造方法 |
US11181323B2 (en) | 2019-02-21 | 2021-11-23 | Qualcomm Incorporated | Heat-dissipating device with interfacial enhancements |
EP3963625B1 (en) * | 2019-04-29 | 2025-01-29 | Qualcomm Incorporated | Multi-phase heat dissipating device comprising piezo structures |
CN110345786A (zh) * | 2019-08-12 | 2019-10-18 | 广东工业大学 | 一种三维热管散热模组 |
CN110926244B (zh) * | 2019-12-06 | 2024-11-19 | 南方科技大学 | 一种磁流体换热装置 |
CN111023323B (zh) * | 2019-12-18 | 2024-09-24 | 珠海格力电器股份有限公司 | 散热结构及具有其的空调室外机 |
CN112105223B (zh) * | 2020-09-02 | 2023-08-15 | Oppo(重庆)智能科技有限公司 | 用于电子设备的散热装置及电子设备 |
CN118633358A (zh) * | 2022-02-18 | 2024-09-10 | 雷蛇(亚太)私人有限公司 | 均热板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001336888A (ja) * | 2000-05-29 | 2001-12-07 | Fujikura Ltd | 積層式平板型ヒートパイプ |
CN1403777A (zh) * | 2001-09-06 | 2003-03-19 | 李嘉豪 | 平板式环路型热管(一) |
CN2594507Y (zh) * | 2002-12-13 | 2003-12-24 | 神基科技股份有限公司 | 散热结构 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3183967A (en) * | 1961-12-29 | 1965-05-18 | Michael W Mettenleiter | Heat exchange unit |
FI52147C (fi) * | 1971-08-19 | 1977-06-10 | Ahlstroem Oy | Menetelmä ja laite höyrykattilan putkiston ulkopuolista puhdistusta va rten |
US4004441A (en) | 1975-08-28 | 1977-01-25 | Grumman Aerospace Corporation | Process for modifying capillary grooves |
US4741292A (en) * | 1986-12-22 | 1988-05-03 | The Babcock & Wilcox Company | Electro-impulse rapper system for boilers |
US4993098A (en) * | 1988-02-19 | 1991-02-19 | Kharitonov Vladimir D | Apparatus for vibratory cleaning the surface of an article from foreign matter |
US5238055A (en) * | 1992-05-13 | 1993-08-24 | The Babcock & Wilcox Company | Field adjustable rapper tie bar |
CA2087518C (fr) * | 1993-01-18 | 1995-11-21 | Serge Gamache | Systeme de martelage pour chaudiere a tube |
US5540275A (en) * | 1995-03-17 | 1996-07-30 | Foster Wheeler Energy Corporation | Single impact rapping hammer system and method for cleaning tube units |
FR2747938B1 (fr) * | 1996-04-24 | 1998-10-02 | Naphtachimie Sa | Procede et dispositif de traitement thermique de produits circulant dans un conduit |
US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
KR100294317B1 (ko) * | 1999-06-04 | 2001-06-15 | 이정현 | 초소형 냉각 장치 |
US6460628B1 (en) * | 2000-02-28 | 2002-10-08 | Kennecott Utah Copper Corporation | Rapper assembly |
US6437981B1 (en) * | 2000-11-30 | 2002-08-20 | Harris Corporation | Thermally enhanced microcircuit package and method of forming same |
TW543828U (en) | 2001-07-12 | 2003-07-21 | Foxconn Prec Components Co Ltd | Assembly of heating-tube heat sink |
US6976527B2 (en) * | 2001-07-17 | 2005-12-20 | The Regents Of The University Of California | MEMS microcapillary pumped loop for chip-level temperature control |
US6529377B1 (en) * | 2001-09-05 | 2003-03-04 | Microelectronic & Computer Technology Corporation | Integrated cooling system |
JP3896840B2 (ja) * | 2001-12-13 | 2007-03-22 | ソニー株式会社 | 冷却装置、電子機器装置及び冷却装置の製造方法 |
JP2004190976A (ja) * | 2002-12-12 | 2004-07-08 | Sony Corp | 熱輸送装置及び電子デバイス |
JP3896961B2 (ja) * | 2002-12-12 | 2007-03-22 | ソニー株式会社 | 熱輸送装置および熱輸送装置の製造方法 |
TW557124U (en) * | 2003-02-20 | 2003-10-01 | Delta Electronics Inc | Circulative cooler apparatus |
US7184265B2 (en) * | 2003-05-29 | 2007-02-27 | Lg Electronics Inc. | Cooling system for a portable computer |
US7218519B2 (en) * | 2004-06-15 | 2007-05-15 | Intel Corporation | Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels |
-
2005
- 2005-09-23 CN CNB2005100375022A patent/CN100554852C/zh not_active Expired - Fee Related
-
2006
- 2006-05-12 US US11/433,656 patent/US7694725B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001336888A (ja) * | 2000-05-29 | 2001-12-07 | Fujikura Ltd | 積層式平板型ヒートパイプ |
CN1403777A (zh) * | 2001-09-06 | 2003-03-19 | 李嘉豪 | 平板式环路型热管(一) |
CN2594507Y (zh) * | 2002-12-13 | 2003-12-24 | 神基科技股份有限公司 | 散热结构 |
Also Published As
Publication number | Publication date |
---|---|
US7694725B2 (en) | 2010-04-13 |
US20070068654A1 (en) | 2007-03-29 |
CN1936481A (zh) | 2007-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100554852C (zh) | 热管及散热模组 | |
ES2306434T3 (es) | Refrigerador microestructurado y su utilizacion. | |
CN100480611C (zh) | 热管 | |
CN100573416C (zh) | 电脑系统及其散热模组 | |
CN100445685C (zh) | 复合型换热器 | |
CN106304805B (zh) | 一种板翅式微循环散热器及微循环换热系统 | |
TWI846739B (zh) | 流動沸騰之兩相冷卻系統 | |
KR101184368B1 (ko) | 방열효과가 개선된 수냉식 냉각핀 | |
WO2009072703A1 (en) | Flat plate type micro heat transport device | |
CN110243217A (zh) | 一种带有包围式储液室的平板型环路热管蒸发器 | |
CN103813695A (zh) | 虹吸式散热装置 | |
WO2023134141A1 (zh) | 一种计算设备及其冷板 | |
CN107306486B (zh) | 整合式散热装置 | |
CN213426736U (zh) | 均温板 | |
CN213991458U (zh) | 液冷散热装置及具有该液冷散热装置的液冷散热系统 | |
JP5300394B2 (ja) | マイクロループヒートパイプ用蒸発器 | |
JP3165057U (ja) | 冷媒の蒸発と凝縮に伴う圧力勾配により駆動される放熱装置 | |
CN110678038A (zh) | 一种散热装置及空调变频模块结构 | |
CN109699164A (zh) | 板式热管散热壳体 | |
TWM267825U (en) | Improved heat sink structure of liquid-cooling type heat sink device | |
CN205980891U (zh) | 均温板及其上壳构件 | |
CN214177905U (zh) | 基于自湿润流体为工作液的超薄均热板 | |
CN2665927Y (zh) | 相变化散热装置 | |
JP3163996U (ja) | 熱対流ヒートシンク板構造 | |
KR100685483B1 (ko) | 루버핀이 구비된 히트파이프 구조 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091028 Termination date: 20150923 |
|
EXPY | Termination of patent right or utility model |