CN100539109C - Semiconductor packaging film and packaging structure for preventing pin bending part from being broken - Google Patents
Semiconductor packaging film and packaging structure for preventing pin bending part from being broken Download PDFInfo
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- CN100539109C CN100539109C CN 200710000295 CN200710000295A CN100539109C CN 100539109 C CN100539109 C CN 100539109C CN 200710000295 CN200710000295 CN 200710000295 CN 200710000295 A CN200710000295 A CN 200710000295A CN 100539109 C CN100539109 C CN 100539109C
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- pin
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- flexible dielectric
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 73
- 238000004806 packaging method and process Methods 0.000 title claims description 22
- 229920006280 packaging film Polymers 0.000 title claims 7
- 239000012785 packaging film Substances 0.000 title claims 7
- 238000005452 bending Methods 0.000 title description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 239000012528 membrane Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 description 27
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 206010007247 Carbuncle Diseases 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明是有关于一种防止引脚弯折处断裂的半导体封装载膜，其主要包含一可挠性介电层、复数个形成于该可挠性介电层上的引脚以及一局部覆盖这些引脚的防焊层。每一引脚是具有一内接线与一外引脚，该内接线与该外引脚的最小夹角是介于90度至180度。其中至少一引脚是具有一缓冲垫，其是连接该内接线与该外引脚且被该防焊层所覆盖。借此可防止这些引脚受应力拉扯而在弯折处造成断裂的问题。另揭示使用该载膜的半导体封装构造，其包含一载膜以及一晶片。
The present invention relates to a semiconductor package carrier film for preventing pins from breaking at the bend, which mainly comprises a flexible dielectric layer, a plurality of pins formed on the flexible dielectric layer, and a solder mask layer partially covering the pins. Each pin has an inner wire and an outer pin, and the minimum angle between the inner wire and the outer pin is between 90 degrees and 180 degrees. At least one of the pins has a buffer pad, which connects the inner wire and the outer pin and is covered by the solder mask layer. This can prevent the pins from being pulled by stress and causing fracture at the bend. A semiconductor package structure using the carrier film is also disclosed, which comprises a carrier film and a chip.
Description
Technical field
The present invention relates to a kind of semiconductor packages film carrier, particularly relate to a kind of semiconductor packages film carrier and packaging structure that prevents rupture of pin.
Background technology
Purposes according to semiconductor product changes, and its chip carrier can be selected printed circuit board (PCB), lead frame and circuit film for use, and wherein circuit film has the advantage of flexibility and thinning.For example, (Tape Carrier Package, TCP) (Chip-On-Filmpackage, COF) encapsulation all is to adopt circuit film as chip carrier with membrane of flip chip in encapsulation in present coil type carrying.Before encapsulation, circuit film is the unit in the winding, and can carry out the semiconductor packages operation with the winding transmission means.
As shown in Figure 1, existing known semiconductor packages film carrier 100 comprises a pliability dielectric layer 110, a plurality of pin 120 and a welding resisting layer 130.These pins 120 are to be formed on this pliability dielectric layer 110, and this welding resisting layer 130 is local these pins 120 that cover.Each most pin 120 is to divide into pin 121, one an outer pin 122 and an oblique fan-out line 123 in one, these fan-out lines 123 are to connect pin 121 and these outer pins 122 in these, and these outer pins 122 can be disperseed more, for being engaged to an external printed circuit board or a face glass.This welding resisting layer 130 is to have an opening 131, and it is the interior pin 121 that appears these pins 120, for joint wafer.Yet in the user mode of semiconductor package product, this semiconductor packages film carrier 100 includes crooked curved can the use of position needs of fan-out line 123, and the bending place of these pins 120 is subjected to stress to pull or bend easily.Particularly the deflection crooked position when this film carrier 100 is the junction that comprises these outer pins 122 and these fan-out lines 123, crooked this film carrier 100 causes the external carbuncle of these pins 120 can be concentrated to the bending place of these pins 120, cause these pins 120 of minority to have the problem (pin breakage place 124 as shown in Figure 1) of fracture, but make whole encapsulating products to operate.
This shows that above-mentioned conventional semiconductor packages film carrier obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of novel the semiconductor packages film carrier and the packaging structure that prevent rupture of pin, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned conventional semiconductor packages film carrier exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of novel the semiconductor packages film carrier and the packaging structure that prevent rupture of pin, can improve general conventional semiconductor packages film carrier, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective that the conventional semiconductor packages film carrier exists, and provide a kind of semiconductor packages film carrier and packaging structure that prevents rupture of pin, the present invention utilizes cushion pad to be arranged at the bending pins place, and technical problem to be solved is to prevent that pin is pullled by stress and caused fracture.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to the present invention, a kind of semiconductor packages film carrier of rupture of pin that prevents mainly comprises a pliability dielectric layer, a plurality of pin and a welding resisting layer.These pins are to be formed on this pliability dielectric layer.This welding resisting layer is to be formed on this pliability dielectric layer, covers these pins with the part.Wherein, each pin is to have an internal wiring and an outer pin, this internal wiring and minimum angle that should outer pin be between 90 degree to 180 degree, wherein at least one pin is to have a cushion pad, this cushion pad is positioned at bending pins to be sentenced and connects this internal wiring and be somebody's turn to do outer pin.In addition, the present invention discloses the semiconductor packaging structure that uses this semiconductor packages film carrier in addition.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid semiconductor packages film carrier, wherein said cushion pad are the width of general rounded and its diameter greater than this internal wiring.
Aforesaid semiconductor packages film carrier, wherein said cushion pad is covered by this welding resisting layer.
Aforesaid semiconductor packages film carrier, wherein said internal wiring are an oblique fan-out line.
Aforesaid semiconductor packages film carrier, wherein said internal wiring are pin in.
Aforesaid semiconductor packages film carrier, wherein said cushion pad have an outer arc limit.
In the aforesaid semiconductor packages film carrier, wherein these pins have more a plurality of first cushion pads and a plurality of second cushion pad, and these first cushion pads are the same sides that are arranged on the different straight lines and are positioned at this pliability dielectric layer with these second cushion pads.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of semiconductor packaging structure according to the present invention proposes comprises: a film carrier and a wafer, and this film carrier is to comprise: a pliability dielectric layer; A plurality of pins, it is to be formed on this pliability dielectric layer; And a welding resisting layer, it is to be formed on this pliability dielectric layer, covers these pins with the part; Wherein, each pin is to have an internal wiring and an outer pin, this internal wiring and minimum angle that should outer pin be between 90 degree to 180 degree, wherein at least one pin is to have a cushion pad, this cushion pad is positioned at bending pins to be sentenced and connects this internal wiring and be somebody's turn to do outer pin; Wafer is to be arranged at this film carrier and to be electrically connected to these pins, and this cushion pad is between this wafer and the deflection position between the pin outside these on this film carrier.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid semiconductor packaging structure, wherein said cushion pad are the width of general rounded and its diameter greater than this internal wiring.
Aforesaid semiconductor packaging structure, wherein said internal wiring are an oblique fan-out line.
Aforesaid semiconductor packaging structure, wherein said internal wiring are pin in.
Aforesaid semiconductor packaging structure, wherein said cushion pad are to have an outer arc limit.
Aforesaid semiconductor packaging structure, wherein these pins are to have more a plurality of first cushion pads and a plurality of second cushion pad, these first cushion pads are the same sides that are arranged on the different straight lines and are positioned at this pliability dielectric layer with these second cushion pads.
By technique scheme, the present invention prevents that the semiconductor packages film carrier of rupture of pin and packaging structure have following advantage at least: the present invention utilizes cushion pad to be arranged at the bending pins place, can prevent that pin is pullled by stress and caused the problem of fracture.
In sum, the semiconductor packages film carrier and the packaging structure that prevent rupture of pin of novelty of the present invention, semiconductor packages film carrier mainly comprise a pliability dielectric layer, an a plurality of pin and local welding resisting layer that covers these pins that is formed on this pliability dielectric layer.Each pin is to have an internal wiring and an outer pin, and this internal wiring is to 180 degree between 90 degree with the minimum angle that is somebody's turn to do outer pin.Wherein at least one pin is to have a cushion pad, and it is to connect this internal wiring and be somebody's turn to do outer pin and covered by this welding resisting layer.Can prevent that whereby these pins are pullled by stress and caused the problem of fracture in the bending place.Disclose the semiconductor packaging structure that uses this film carrier in addition, it comprises a film carrier and a wafer.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and the outstanding effect that has enhancement than the conventional semiconductor packages film carrier, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1: the end face schematic diagram of existing known semiconductor packages film carrier.
Fig. 2: according to first specific embodiment of the present invention, a kind of end face schematic diagram that prevents the semiconductor packages film carrier of rupture of pin.
Fig. 3: according to first specific embodiment of the present invention, this semiconductor packages film carrier is applied to the schematic cross-section of semiconductor packaging structure.
Fig. 4: according to second specific embodiment of the present invention, another kind prevents the end face schematic diagram of the semiconductor packages film carrier of rupture of pin.
Fig. 5: according to the 3rd specific embodiment of the present invention, another kind prevents the end face schematic diagram of the semiconductor packages film carrier of rupture of pin.
100: semiconductor packages film carrier 110: the pliability dielectric layer
120: pin 121: interior pin
122: outer pin 123: fan-out line
124: fracture place 130: welding resisting layer
131: opening 200: the semiconductor packages film carrier
210: pliability dielectric layer 220: pin
221: internal wiring 222: outer pin
223: cushion pad 224: interior pin
225: outer arc limit 230: welding resisting layer
231: opening 310: wafer
311: projection 320: adhesive body
400: semiconductor packages film carrier 410: the pliability dielectric layer
420: pin 421: internal wiring
422: outer pin 423: cushion pad
424: interior pin 425: outer arc limit
426: internal wiring 430: welding resisting layer
431: opening 500: the semiconductor packages film carrier
510: pliability dielectric layer 520: pin
521: internal wiring 522: outer pin
523: interior pin 530: welding resisting layer
531: 541: the first cushion pads of opening
542: the second cushion pads
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to the semiconductor packages film carrier that prevents rupture of pin and its embodiment of packaging structure, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
According to first specific embodiment of the present invention, disclose a kind of semiconductor packages film carrier that prevents rupture of pin.See also shown in Figure 2 and cooperate and consult Fig. 3, this semiconductor packages film carrier 200 mainly comprises a pliability dielectric layer 210, a plurality of pin 220 and a welding resisting layer 230.These pins 220 are to be formed on this pliability dielectric layer 210, and this welding resisting layer 230 is local these pins 220 that cover.Usually the material of this pliability dielectric layer 210 can be polyimides (polyimide, PI) or polyesters (PET) etc.Before encapsulation, a plurality of film carriers 200 can be integrally formed at a winding, for coil type transmission carrying out semiconductor packages operation.
These pins 220 are the high-conductivity metal material, copper for example, and should considerably approach so that suitable flexibility to be provided, its thickness is far below the pin thickness of conventional wires frame.Each pin 220 has an internal wiring 221 and an outer pin 222, and these internal wirings 221 are to 180 degree between 90 degree with the minimum angle of these outer pins 222.In the present embodiment, these internal wirings 221 are oblique fan-out line, in order to connect outer pin 222 than coarse pitch to the interior pin 224 than fine pith.
Wherein at least one pin 220 has a cushion pad 223, and it is to connect this internal wiring 221 and be somebody's turn to do outer pin 222.In the present embodiment, most pin 220 all has a cushion pad 223.Preferably, as shown in Figure 2, this cushion pad 223 is to have an outer arc limit 225, in order to disperse the former stress that concentrates on bending pins point, can be to lead the arbitrary shape of diffusing stress.In the present embodiment, this cushion pad 223 is general rounded and its diameter width greater than this internal wiring 221.
This welding resisting layer 230 is to be formed on this pliability dielectric layer 210, covers these pins 220 with the part, can prevent that these pins 220 from exposing contaminated and short circuit.This welding resisting layer 230 is to have an opening 231, and it is the inner that appears the interior pin 224 of these pins 220, for plurality of bump 311 joints (as shown in Figure 3) of a wafer 310.Usually this welding resisting layer 230 can be liquid photosensitive welding cover layer (liquid photoimagable solder mask, LPI), photosensitive cover lay (photoimagable coverlayer, PIC) or can be the non-conductive printing ink or the cover layer (coverlayer) of general non-photosensitive dielectric material.In the present embodiment, this cushion pad 223 is covered by this welding resisting layer 230, with stress buffer ability that strengthens this cushion pad 223 and the electrical short circuit of pin 220 generations of avoiding and being close to.
According to first specific embodiment of the present invention, this semiconductor packages film carrier 200 can further be applied to the semiconductor packaging structure.See also Fig. 3, a kind of semiconductor packaging structure mainly comprises this film carrier 200 and a wafer 310.This wafer 310 is to be arranged at this film carrier 200 and to be electrically connected to these pins 220.In the present embodiment, this wafer 310 is to be provided with plurality of bump 311, and it is the interior pin 224 that is engaged to these pins 220.This packaging structure can include an adhesive body 320 in addition, for example a kind of before curing the spot printing colloid of tool high fluidity, it is these projections 311 of sealing.Wherein, this cushion pad 223 is between this wafer 310 and the deflection position between the pin 222 outside these on this film carrier 200, concentrate on the bending place that connects pin 222 outside these to avoid this film carrier 200 at case of bending to have stress, prevent to produce fracture near the bending tie point between outer pin and the internal wiring.
In second specific embodiment, disclose the another kind of semiconductor packages film carrier that prevents rupture of pin.See also shown in Figure 4ly, this semiconductor packages film carrier 400 mainly comprises a pliability dielectric layer 410, a plurality of pin 420 and a welding resisting layer 430.These pins 420 are to be formed on this pliability dielectric layer 410.In the present embodiment, each pin 420 all has an internal wiring 421,426 and one outer pin 422.Wherein, the internal wiring 421 of part pin 420 is directly to form pin 424 in, and these internal wirings 421 are to 180 degree between 90 degree with the minimum angle of corresponding these outer pins 422, preferable, these internal wirings 421 and the minimum angle of corresponding these outer pins 422 are being example near 180 degree, but in fact not as limit.And be to have a cushion pad 423 respectively on above-mentioned these part pins 420, it is to connect corresponding internal wiring 421 and outer pin 422.Wherein, this cushion pad 423 is to have an outer arc limit 425.
In the present embodiment, the internal wiring 426 of remaining each pin 420 is to form an oblique fan-out line, and connects the interior pin 424 and outer pin 422 that corresponds to each other.Wherein, this cushion pad 423 is visual required and suitably be arranged on these pins 420.When the tie point of pin 422 was enough to bear the stress of deflection when the internal wiring 426 of these fan-outs and outside these, these pins 420 can not need be provided with this cushion pad 423.
This welding resisting layer 430 is to be formed on this pliability dielectric layer 410, covers these pins 420 with the part, more covers these cushion pads 423.Therefore, this semiconductor packages film carrier 400 can prevent that outer pin 422 from rupturing with internal wiring 421 bending places.In addition, this welding resisting layer 430 is to have an opening 431, and the inner with the interior pin 424 that appears these pins 420 engages for wafer.
In the 3rd specific embodiment, disclose the another kind of semiconductor packages film carrier that prevents rupture of pin.See also shown in Figure 5ly, this semiconductor packages film carrier 500 mainly comprises a pliability dielectric layer 510, a plurality of pin 520 and a welding resisting layer 530.Roughly identical with first specific embodiment so, these pins 520 are to be formed on this pliability dielectric layer 510.This welding resisting layer 530 is to be formed on this pliability dielectric layer 510, covers these pins 520 with the part.Wherein, each pin 520 is internal wiring 521 and the outer pins 522 with pin 523, at least one oblique fan-out in, and wherein this internal wiring 521 is to 180 degree between 90 degree with the minimum angle that is somebody's turn to do outer pin 522.Wherein the pin 520 that ruptures easily in part is to have more one first cushion pad 541 or one second cushion pad 542, it is to connect corresponding internal wiring 521 and outer pin 522, and this welding resisting layer 530 can cover these first cushion pads 541 and these second cushion pads 542, with prevent this semiconductor packages film carrier 500 when bending is used, cause outside pin 522 and internal wiring 521 bending places rupture.In addition, this welding resisting layer 530 is to have an opening 531, to appear the inner of pin 523 in these, engages for wafer.
In the present embodiment, these first cushion pads 541 are the same sides that are arranged on the different straight lines and are positioned at this pliability dielectric layer 510 with these second cushion pads 542, it is the lateral margin that these first cushion pads 541 are arranged in a straight line and close this pliability dielectric layer 510, these second cushion pads 542 are arranged in another straight line and away from the lateral margin of this pliability dielectric layer 510, the dislocation of this kind cushion pad is arranged framework and can be avoided external carbuncle to concentrate on specific cushion pad 541 or 542, further reduces the probability that these outer pins 522 and the generation of corresponding internal wiring 521 bending places are ruptured.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710000295 CN100539109C (en) | 2007-01-23 | 2007-01-23 | Semiconductor packaging film and packaging structure for preventing pin bending part from being broken |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710000295 CN100539109C (en) | 2007-01-23 | 2007-01-23 | Semiconductor packaging film and packaging structure for preventing pin bending part from being broken |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101231984A CN101231984A (en) | 2008-07-30 |
| CN100539109C true CN100539109C (en) | 2009-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710000295 Expired - Fee Related CN100539109C (en) | 2007-01-23 | 2007-01-23 | Semiconductor packaging film and packaging structure for preventing pin bending part from being broken |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111315130B (en) * | 2020-01-18 | 2021-06-18 | 张杰铭 | Installation structure of micro resistor on surface of computer host controller |
| CN114664777B (en) * | 2022-03-11 | 2025-03-28 | 江苏长电科技股份有限公司 | QFN packaging structure and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284747A (en) * | 2000-04-04 | 2001-10-12 | Matsushita Electric Ind Co Ltd | Flexible wiring board |
| CN2494561Y (en) * | 2001-07-17 | 2002-06-05 | 中山市怡和电子有限公司 | A New Packaging Structure for IC Chips |
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2007
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284747A (en) * | 2000-04-04 | 2001-10-12 | Matsushita Electric Ind Co Ltd | Flexible wiring board |
| CN2494561Y (en) * | 2001-07-17 | 2002-06-05 | 中山市怡和电子有限公司 | A New Packaging Structure for IC Chips |
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| CN101231984A (en) | 2008-07-30 |
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