CN100536073C - Pattern forming method and pattern forming system - Google Patents
Pattern forming method and pattern forming system Download PDFInfo
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- CN100536073C CN100536073C CNB2007100022640A CN200710002264A CN100536073C CN 100536073 C CN100536073 C CN 100536073C CN B2007100022640 A CNB2007100022640 A CN B2007100022640A CN 200710002264 A CN200710002264 A CN 200710002264A CN 100536073 C CN100536073 C CN 100536073C
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/703—Gap setting, e.g. in proximity printer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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Abstract
本发明提供一种图形形成方法，使用了纳米压印，该纳米压印是通过将形成了凹凸形状图形的模具推压到涂覆了树脂膜的基板而形成图形；其特征在于包含：按一定周期的间隔用以激光器为光源的光束时形成于该模具上的、作为线和间隙图形的对准标记进行照明，使用从该对准标记产生的反射衍射光中的0次衍射光来测量上述模具与涂覆了上述树脂膜的基板的距离的工序；在上述模具与涂覆了上述树脂膜的基板将要接触之前停止的工序；通过检测对准标记的位置从而进行上述模具与涂覆了上述树脂膜的基板的相对对位的工序，其中该对准标记形成在涂覆了上述树脂膜的基板的背面；以及在保持上述相对位置的状态下将上述模具推压到涂覆了上述树脂膜的基板的工序。
The invention provides a pattern forming method, which uses nano-imprinting, and the nano-imprinting is to form a pattern by pushing a mold formed with a concave-convex shape pattern onto a substrate coated with a resin film; it is characterized in that it comprises: according to a certain The interval of the cycle is illuminated with an alignment mark formed on the mold as a line and space pattern when a laser beam is used as a light source, and the above-mentioned The process of the distance between the mold and the substrate coated with the above resin film; the process of stopping before the above mold and the substrate coated with the above resin film will come into contact; A process of relative alignment of the substrate of the resin film, wherein the alignment mark is formed on the back surface of the substrate coated with the above resin film; and pushing the mold to the coated resin film while maintaining the relative position The substrate process.
Description
Technical field
The present invention relates to a kind of pattern forming method of nanometer embossing and figure of using and form device.Particularly relate to a kind of mark position detection mode that helps improving the alignment precision of the figure formation that utilizes nanometer embossing and form device with the Micropicture that utilizes this method.
Background technology
In recent years, along with the miniaturization of semiconductor integrated circuit, integrated, as the graph transfer printing technology that is used to realize this microfabrication, the high precision int of lithographic equipment is developed.Yet along with the wavelength of processing dimension near the light source of exposure light, photoetching technique is also near the limit.For this reason,, use a kind of electron ray drawing apparatus, replace photoetching technique as the charged particle x-ray apparatus for further miniaturization, high precision int.
Use the figure of electron ray to form different with the single exposure method of the figure formation of using light sources such as i line, excimer laser, the method of mask graph is described in employing, and therefore, the figure of describing is many more, exposure (describing) time is long more, exists figure to form very time taking shortcoming.Therefore, along with integrated level increases by leaps and bounds by memory capacity 256M, 1G, 4G, the time that forms figure is also corresponding elongated by leaps and bounds, has the significantly reduced worry for the treatment of capacity.Therefore, in order to realize the high speed of electron beam lithography system, make up the mask of different shape, to its disposable irradiating electron beam, the exploitation of a figure irradiation of the electron beam of formation complicated shape obtains progress.As a result, the miniaturization of figure obtains progress, on the other hand, is necessary to make electron ray drawing apparatus maximization, complicated, has the high shortcoming of installation cost.
At these problems, the technology that is used for being undertaken by low cost fine figure formation is disclosed in following patent documentation 1 and 2 etc.This technology is formed at the photoresist rete that is transferred substrate surface and the predetermined figure of transfer printing by mould is pressed to, and this mould has the concavo-convex of the figure identical with being formed at figure on the substrate; Particularly, use silicon wafer, can form microstructure below 25 nanometers by transfer printing as mould according to the nanometer embossing of patent documentation 2.
5,259, No. 926 communiques of [patent documentation 1] United States Patent (USP)
5,772, No. 905 communiques of [patent documentation 2] United States Patent (USP)
In the occasion that forms Micropictures such as semiconductor integrated circuit, need correctly detect the graph position of the substrate of mounting on platform, on this basis for example with the graticule that forms the original painting pattern etc. between carry out accurate contraposition (aligning).For alignment precision,, need higher alignment precision according to being accompanied by the highly integrated figure miniaturization of semiconductor device.For example, in order to form the figure of 32nm node, require to carry out accurate aligning by the error below the 10nm.
In the figure that utilizes nanometer embossing forms, need behind the surface-coated resin of the substrate of transfer graphic, make mould and the substrate contacts that has formed the figure original painting, pushing is heated or irradiation ultraviolet radiation on this basis.In the lithographic equipment of prior art, the graticule that has formed the figure original painting and the substrate that will form figure are remaining under the non-contacting state with optical mode or the transfer printing by describing, so, the position error factor that punctual contact is caused not.Yet, in nano impression, owing to can not avoid contact on the principle, so, there is the problem that does not have before this.Can list following problem, promptly in the operation of contact, pushing, along with resin molding is out of shape astatically, the light that is used for position probing reflects unevenly and produces position detection error, or produces position deviation etc. in the directive effect external force different with press direction.
In addition, in contact, pushing operation, can not guarantee and be transferred under the situation of the depth of parallelism between substrate, the resin after transfer printing produces uneven thickness, and it is bad that the result produces the figure corrosion.
Summary of the invention
The problem to be solved in the present invention is to provide a kind of figure to form device, this figure forms device and can use nano impression to carry out correctly implementing to aim at when figure in the semiconductor device manufacturing process forms, make bit errors below 10nm, and, can carry out figure by uniform resin thickness and form.
Pattern forming method of the present invention has used nano impression, and this nano impression is to be pressed to the substrate that has applied resin molding by the mould that will form the concaveconvex shape figure to form figure; It is characterized in that comprising: by the interval of some cycles be in order to laser light source light beam to be formed on this mould, throw light on as the alignment mark of line and gap figure, use 0 diffraction light from the reflection diffracting light that this alignment mark produces to measure the operation of above-mentioned mould and the distance of the substrate that has applied above-mentioned resin molding; In above-mentioned mould and the operation that will stop before the substrate that has applied above-mentioned resin molding will contact; Thereby by the operation that above-mentioned mould and the relative contraposition of the substrate that has applied above-mentioned resin molding are carried out in the position of detecting alignment mark, this alignment mark is formed on the back side of the substrate that has applied above-mentioned resin molding; And the operation that under the state that keeps above-mentioned relative position, above-mentioned mould is pressed to the substrate that has applied above-mentioned resin molding.
In addition, figure of the present invention forms device, is pressed to the substrate that has applied resin molding by the mould that will form the concaveconvex shape figure and forms figure; It is characterized in that: be provided with and be used for substrate platform that the substrate that has applied resin molding is kept, can make the aforesaid substrate platform move to the platform driver element in precalculated position and the mould table that is used to keep mould, be provided with detection at the back position detector of the position of the alignment mark of the substrate back formation that has applied resin molding and the die location detector that detects the position of mold graph formation face, wherein, above-mentioned die location detector has the unit of position probing optical illumination to mould, contrast clear position probing light and from the diffraction light that the alignment mark that is formed at mould reflects, only select the spatial filter of ± 1 diffraction light, only select the spatial filter of 0 diffraction light and ± 1 diffraction light is guided to the optical element of different optical detecting units with 0 diffraction light, and have the unit of contraposition that carries out the relative position of substrate and mould according to the testing result of above-mentioned back position detector and above-mentioned die location detector.
The application of the invention can provide a kind of Micropicture of nano impression that utilizes to form method and apparatus, and this nano impression can be aimed at accurately, and can form figure by uniform resin thickness.
Description of drawings
Fig. 1 forms the figure of the summary formation of device for explanation figure of the present invention.
Fig. 2 uses nano impression for explanation and forms the figure of the method for figure.
Fig. 3 is the figure of explanation chip back surface alignment methods of the present invention.
Fig. 4 uses the figure of the bearing calibration of aligning of the present invention for explanation.
Fig. 5 uses the figure of pattern forming method of the present invention for explanation.
Fig. 6 is the figure of explanation mold alignment mark of the present invention.
Fig. 7 is the figure of the method for detecting position of explanation mold alignment mark of the present invention.
Fig. 8 is for illustrating the figure of the method that pressure differential according to the present invention is pressurizeed.
Fig. 9 is the figure of explanation die location detector of the present invention.
Figure 10 is the figure of the bearing calibration on the short transverse of explanation die location detector of the present invention.
Embodiment
At first, use Fig. 2 explanation to form the program of figure by nano impression.This figure is the figure that the wiring figure formation method of the occasion of using the light-cured type resin schematically is described.Form wiring figure 14 at wafer 1.Form the wiring membrane 15 on upper strata on its surface, and then, apply light-cured type resin 2 (I).Then, make the mould 12 that has formed figure approaching, before contact, carry out the contraposition (aligning) of mould 12 and wafer 1, then, relatively push both, form figure (II) from wafer 1 top.Mould 12 is formed by quartz, can see through light.Behind pushing mould 12,, make light-cured type resin molding 2 solidify (III) from mould 12 back side illuminaton ultraviolet rays.Remove mould 12, the basic unit that residues in the bottom of recessed figure is removed, form resin figure 16 (IV).This resin figure 16 as mask, is corroded the wiring membrane of substrate, then form wiring figure 17 (V).
Use Fig. 1 explanation can implement the embodiments of the invention of above program below.The figure that Fig. 1 illustrates the semiconductor device manufacturing usefulness of having used nano impression forms device, the i.e. basic comprising of lithographic equipment.Surface-coated resin at the wafer 1 of transfer graphic remains in platform 3.This 3 has except can carry out also can carrying out the mechanism of the location of the revolution (YAW) in the direction vertical with paper (Y), XY face the location of the direction of principal axis (X) of figure.The position of platform 3 is measured by laser length meter 4, moves to preposition by the platform driver element.
In addition, mould table 11 is set above platform 3, this mould table 11 has been carried mould 12, and this mould 12 is formed with the figure that is transferred to wafer 1.Mould table 11 is to go up the structure of location at above-below direction (Z), Z transducer 13 with the distance that can be measured to wafer substrate and the load transducer (not shown) that can measure with load after wafer 1 contacts.As Z transducer 13, can use laser length meter, capacitance type gap sensor etc.In addition, the Z transducer is set, thereby can in the depth of parallelism of guaranteeing mould and substrate, mould be pressed to substrate by a plurality of positions in mould table.
In addition, have mercury vapor lamp 10a up, see through 12 pairs of light-cured type resin moldings 2 of mould along the illumination light that is transformed to directional light by the transmission illumination of light path shown in dotted line optical system 10b and throw light on.This illumination can be controlled exposure, time for exposure by not shown shutter.
This 3 below, have back position detector 6a, the 6b of the position of detecting the back side alignment mark 7 be formed at wafer 1 back side.This back position detector 6 is fixed in the device reference position, and the absolute position of device benchmark is measured.On the other hand, above platform 3, have and detect die location detector 8a, the 8b that mold graph forms the position of face.Descend at mould, will with the position that for example stops at the 10 μ m sky before wafer 1 contact to the zone that contacts, can use the position of the mold alignment mark 12b that die location detector 8a, 8b measure in advance in mould 12 surperficial formation.Detectable position the direction, also can be detected in short transverse in die face.Formation and the function of this die location detector 8a, 8b illustrate in the back.In addition, this die location detector 8a, 8b are fixed on the reference position of device, measure the absolute position of the device benchmark of mould.In addition, wafer 1 is not limited to the Si substrate, also can be GaAs substrate, glass substrate or plastic base.
Back position detector 6 and die location detector 8 be owing to be position detector independently respectively, so, need the correction reference position.Proofread and correct with chip 9 to being used for the device of this correction.The formation of this chip, the detailed content of function illustrate in the back.
Below, describe major function in detail.At first, chip back surface position detector 6a, 6b are described.As shown in Figure 3, under the state that wafer 1 tilts with angle θ from the setting datum level, the physical location of the back side alignment mark 7 of being located at chip back surface (from the reference position apart from δ) and the wafer surface corresponding with this back side alignment mark 7 on actual location (from the reference position apart from ω) between, when the thickness of establishing wafer 1 is d, produce the skew that becomes dsin θ.Therefore, in the physical location that detects this back side alignment mark 7 (apart from δ), with the direct occasion of this detected value, produce position detection error ∈ certainly as the actual location on wafer surface (apart from ω).For example, be the inclination angle [theta] of 600 μ m, wafer when being 5 seconds when establishing wafer thickness d, margin of error ∈ is about 15nm.This value can not be ignored requiring 10nm such occasion of strict alignment precision like this.Therefore, use comprises back position detector 6a, the 6b that is used to offset the such departure Δ E of this margin of error ∈ in the detected value of position, the apparent location (δ+Δ E) of the back side alignment mark 7 of chip back surface is located in detection, and the actual location (ω) of wafer surface is represented in the position on this is apparent.That is, by back position detector 6a, 6b obtain apparent on mark position testing result (δ+Δ E) with equate corresponding to the actual location on the wafer surface of back side alignment mark 7 (ω), that is, make
Relation become the on the spot various parameters of the above-mentioned back position detector of chosen in advance 6a, 6b.The 2nd the Δ E on formula (1) the right is the departure that is contained in the position probing value of back position detector 6a, 6b, this departure changes (promptly corresponding to the variation of wafer inclination angle [theta], press Δ E=-∈=-relationship change of dsin θ), no matter therefore the inclination angle of wafer how, often offset the error ∈ that tilts to produce by wafer, as a result, can be located at the mark position of chip back surface, correctly obtain the actual location on the wafer surface corresponding with this mark position by detection.
At the downside of Fig. 3, a configuration example of position detector is shown, its position probing principle is described, this position detector comprises the departure Δ E that is used to offset the position detection error ∈ that the inclination owing to above-mentioned wafer produces in detected value.In Fig. 3,2 light beam 18a, 18b by wavelength X throw light on to the back side alignment mark 7 on the chip back surface, the phase place of the diffraction light that obtain this moment along with the position δ of back side alignment mark 7 with between lighting position A, the B of two illumination light, change along the interval h of the orientation measurement vertical with datum level.When establish between two illumination light be spaced apart L, when wafer thickness is d, between the inclination angle [theta] of above-mentioned lighting position interbody spacer h and wafer, according to Fig. 3,
Relational expression set up.In addition, phase difference a great deal of φ (∈) exists with ... the position δ of the back side alignment mark 7 that is tilted to produce by wafer and the side-play amount ∈ between wafer surface actual location ω, and this phase difference a great deal of φ (∈) becomes when the pitch of establishing back side alignment mark 7 is P
φ(ε)＝4πε/P ………(3)
On the other hand, the phase difference a great deal of φ (Δ E) that is caused by the lighting position interbody spacer h as the function of wafer inclination angle [theta] concerns according to geometry shown in Figure 3, detects light wavelength λ and lighting position interbody spacer h relatively, represents by following formula.
φ(ΔE)＝4πh/λ ………(4)
That is, as make equally the pitch P and the two interval L that detect between light of chosen in advance back side alignment mark 7, then can make the phase deviation counteracting at any wafer inclination angle by the phase changing capacity φ (Δ E) of the phase changing capacity φ (∈) of formula (3) expression and formula (4) expression.Therefore, it is upright about the such detection light interval L that satisfies above-mentioned relation formula (1)～formula (4) to be connected, and finds the solution and can obtain
L＝λ·d/P ………(5)
Separating like this.For example, when the pitch P of bidding note be 6 μ m, wafer thickness d be 600 μ m, when detecting light wavelength lambda and being 633nm, establishing beam spacing L is that 63.3 μ m get final product.In addition, this beam spacing L is according to the focal distance f decision of the beam separation angle ξ and the object lens 19 of wollaston prism 20.That is be known occasion at the beam spacing L of necessity,, according to following formula decision beam separation angle ξ.
ξ＝1/(2f) ………(6)
That is, use wollaston prism to get final product with such separation angle ξ.
In addition, in order to obtain position ω, the phase difference that detects the light that A, B are thrown light at 2 gets final product.Below this detection method is described.
Use laser light source 23, this laser light source 23 is pressed two different slightly frequency (v of form outgoing wavelength of rectilinearly polarized light
1, v
2) light.Light beam 45 from this light source is divided into two bundles by beam splitter 22.Light beam by a side of beam splitting incides polarizer 25, produces heterodyne (ヘ テ ロ ダ イ Application) at this place and interferes.By detecting these interference lights, thereby obtain to become the contrast signal Sr of benchmark by photodetector 26.Incided wollaston prism 20 by the opposing party's of beam splitting light beam,, be separated into P polarised light (frequency v at this place
1) light beam 18a and S polarised light (frequency v
2) light beam 18b.The light beam 18a, the 18b that have separated are transformed into collimated light beam by object lens 19, shine A, B on the sample back side respectively at 2.Be spaced apart L between point of irradiation A, the B of two light beams.At this moment, as only be conceived to from the diffraction light that point of irradiation A, B produce-1 light 30a, 31a and+1 diffraction light 30b, 31b, then the phase place of this 1 diffraction light is such as already described, changes according to the position of back side alignment mark 7 and the inclination angle of sample 1.This phase changing capacity φ shown in the below of this figure like that, can be used as from the contrast signal Sr of photodetector 26 and come self-detector 29 detection signal Sd phase difference and obtain.+ 1 diffraction light 30a, 30b and-1 diffraction light 30a, 31b are transformed into collimated light beam by object lens 19, by using polarising beam splitter 21 at the fourier transform face, thus choose My World point of irradiation+1 diffraction light (for example from point of irradiation B+1 diffraction light 31b) with from-1 diffraction light of the opposing party's point of irradiation (for example from point of irradiation A-1 diffraction light 30a).Carry out optically focused by 24 couples of these light beam 31b that choose of collector lens and 30a, place wollaston prism 27, make to produce difference interference, detect this interference light by photodetector 29 by polarizer 28 at the point that two light beams intersect.The signal that obtains is detection signal Sd and contrast signal Sr shown in Fig. 3 lower-left like that, and the phase difference between them becomes
Even, as detect this phase difference in the occasion of wafer inclination, on one side then also can detect the position of chip back surface, Yi Bian detect the tram of wafer surface.
Like this, be not provided for detecting the angle detection at the inclination angle of wafer 1,, can form the position by the desired figure that good accuracy is obtained on the wafer surface as long as detect the position of being located at the mark on the chip back surface.
In addition, as the formation method of above-mentioned back side alignment mark 7, can use common corrosion to form step, but also have the short-cut method that utilizes laser marker.
Below, the function of die location detector 8a, 8b is described.As shown in Figure 5, die location detector 8a, 8b can detect the position of direction in the die face when mould table 11 is come near the graph transfer printing position.Use Fig. 6 explanation to be useful in the focus example of such detection optical system of this position below.Part on the surface of the formation transfer graphic 12a of mould forms mold alignment mark 12b.Be pre-formed this mould collimating marks 12b with the mode evaporation chromium film that can obtain higher optical contrast.Shape is preferably line and gap figure as shown in Figure 6.Illumination light is used the light of HeNe laser (wavelength 633nm).As shown in Figure 10, only reflection ± 1 time the diffraction light that produces from mold alignment mark 12b is carried out optically focused selectively by spatial filter 44, the optical image 32 that is subjected to this mold alignment mark of imaging 12b on the image planes of the image sensor (with reference to Fig. 7) that has at die location detector 8a, 8b.In addition, have datum level 33 at this image sensor, by detect from this face to optical image 32 apart from x, thereby can detect the absolute position of mold alignment mark 12b.For example, as the line of establishing the mold alignment mark is 1 μ m, and the gap is 1 μ m (pitch 2 μ m), and line is 5, then can carry out detecting the design of absolute position of the resolution of several nm.In addition, in this die location detected, the transfer graphic 12a of transfer printing and mold alignment mark 12b were present on the same plane, so, can as the chip back surface position probing, not be subjected to the influence of mould 12 thickness.
Below, the method for detecting position of mold height direction is described according to Fig. 9, Figure 10.Position probing light uses the light of HeNe optical maser wavelength 633nm.This light is as the collimated light beam outgoing, and mold alignment mark 12b throws light on with falling to penetrating.Use is from 0 diffraction light 42 in the diffraction light of this mark, regular reflection.This 0 diffraction light is selected by spatial filter 44.0 diffraction light of this reflection is detected the height and position of mold alignment mark 12b by interferometer 41 and with reference to the interference of light by the reference position of photodetector 40 relative position detector 8a.
Form reflectance coating with not transmission position probing light at mold alignment mark 12b, get rid of catoptrical influence from the wafer substrate that is in the below etc.By forming such formation, thereby has the effect that obtains two information of the position of direction in the die face and short transverse position by a die location detector 8a.The material of reflectance coating can be the chromium identical with mark, also can be other metal.
This die location detector 8 is minimum on mould to be arranged at 3 positions, according to elevation information at the mould of three diverse locations, and the inclination of control mould, wafer substrate moves up and down abreast relatively.Like this, the resin influence ground that can not be subjected to being coated on the wafer substrate is pressed to wafer with mould, so, can reduce the uneven figure that causes of pushing and form inequality to resin molding.
Below, the correction that is in above the platform 3 function of chip 9 is described.The chip of this chip for being provided with for the relative position that constitutes back position detector 6a, 6b and die location detector 8a, 8b.The thickness of this chip is identical with wafer 1 in fact, forms mold alignment mark 9a on the surface, forms back side alignment mark 9b overleaf.In addition, the precalculated position of platform 3 is fixed in this correction as described in Fig. 1, Fig. 4, Fig. 5 with chip 9.
At first, according to Fig. 4 the using method of this correction with chip 9 is described.Before loading mould 12, stop after making platform 3 move to the zone that back position detector 6a, 6b and die location detector 8a, 8b can locate.Under this state, use each position detector 6a, 8a to be formed to proofread and correct with two mark 9a, 9b conducts up and down of chip to locate from the distance of reference position.So that each measured value for example the detection position C of die location detector 8a proofread and correct with the mode that the detection position D of back position detector 6a equates, thereby carry out the correction of die location detector 8a and back position detector 6a.The appearance of the position detector in means for correcting shown in Figure 4 left side, but other position detector are relatively also proofreaied and correct by same method corresponding to the zone of right positions detector as long as proofread and correct the back at this.
Below, the bearing calibration of the short transverse position probing value of die location detector 8a is described.Form vacation (the ダ ミ-) substrate 43 of device loading and wafer substrate same thickness at figure, use height and position detector 13 to detect the position of mold height directions while mould is descended.In case mould and false substrate contacts then detect the value of the short transverse of die location detector 8a, store this position as contact position, thereby can proofread and correct.When actual transfer printing, coated with resins on wafer substrate, height and position detector 13 can not detect correct position, becomes problem, but according to the present invention, is not subjected to the influence of resin, but the height and position of accuracy of detection is more satisfactory.
Explanation each function of utilizing the pattern forming method and being used to of the semiconductor device of above-mentioned nano impression to implement the lithographic equipment of this method program of carrying out figure formation in more detail below.
At first, connect the power supply that the figure that has used nano impression forms device, starting drive.As shown in Figure 4, before will loading mould 12, carrying out each position detector is the correction of die location detector 8a, 8b, back position detector 6a, 6b.This bearing calibration is such as already described.
Then, as shown in Figure 1, load mould 12 and reach the wafer 1 that on wiring figure 14, has applied wiring membrane 15 and light-cured type resin by predetermined thickness.At the back side of this wafer 1, be pre-formed the back side alignment mark 7 that position probing is used.The shape of mark is preferably as already described like that for having the line and the gap of reservation shape.This back side alignment mark 7 forms with predetermined space, with the position of the opening 46 of the wafer clamp of the being located at platform ground mounting of coincideing.
Then, after making wafer station 3 move to the precalculated position, mould 12 is contacted from wafer 1 top, use the height and position measuring ability of die location detector 8, mould 12 will touch be formed at the uppermost light-cured type resin molding 2 of wafer before, for example the sky temporarily stops about 10 μ m.Under this state, use die location detector 8a, 8b and back position detector 6a, 6b that the relative position of mould 12 and wafer 1 is aligned to predetermined relationship.Under the state that keeps this relative position, utilize the output of not shown load transducer under the state of the pushing force that keeps being scheduled to, mould 12 to be pressed to wafer 1.
After this, the open shutter that is in the mercury vapor lamp 10 of topmost behind the exposure figure, is lifted to top with mould 12 by mould 12 with predetermined degree of exposure, forms resin figure 16.
About pressure method, also can use the following method different here, with the method that above-mentioned a plurality of Z transducers are set.As shown in Figure 8, the mould upper chambers 34 that mould table 11 is set, separates by the glass inspection hole 39 of transmitting UV, and as the platform chamber 35 that is disposed at the zone of mould table 11 below parts, by use the device of the vacuum pipeline 36 that is connected with vacuum pump 38 has been installed in these zones, thereby has been realized utilizing the pressurization of pressure differential.Specifically, at first at shut off valve 37a, open under the state of valve 37b the mould upper chambers 34 and 35 degassings of platform chamber after, carry out contraposition, mould table 11 is descended.Shut off valve 37b then, relief valve 37a, thus produce pressure differential in the upper chambers 34 and 35 of the platform chambers on mould top, apply atmospheric pressure in the mould upper front.Like this, the mould upper front is exerted pressure equably, eliminate the deflection etc. of mould and the uneven thickness of the transfer printing resin that produces.Though be to apply atmospheric pressure, also can import gases at high pressure here, as its alternative.
In mould 12 occasion littler than wafer 1, platform 3 is moved towards next position stepping, make mould 12 approaching, use Z transducer 13 from wafer 1 top, will be at mould 12 with before the light-cured type resin molding 2 that topmost forms at wafer contact, for example the sky temporarily stops about 10 μ m.Under this state, use die location detector 8a, 8b and back position detector 6a, 6b that the relative position of mould 12 and wafer 1 is aligned to predetermined relationship.Under the state that keeps this relative position, utilize the output of not shown load transducer, under the state that keeps predetermined pushing force, mould 12 is pressed to wafer 1.Graph transfer printing was being carried out above action repeatedly before 1 whole of wafer.
After this, as this resin figure 16 is corroded as the wiring membrane of mask to substrate, then form wiring figure 17.
As described above nano impression is applicable to the alignment error that becomes problem as time in the photoetching of a manufacturing process of semiconductor device, inhomogeneous offset that the main cause of its generation is the position detection error that causes of the inhomogeneous refraction index profile of resin, caused by the power of direction in the face etc., wherein the inhomogeneous refraction index profile of this resin is accompanied by the resin molding that is formed at wafer 1 surface and produces with contacting of mould, and the power of direction is pushed and takes place when spreading out in face at resin in this face.Aim at and the relative aligning of mold alignment mode by the use chip back surface that illustrates in the present embodiment, under the state that keeps relative position, push both, the formation figure, thus can solve the problem of above-mentioned alignment error.
In addition, can not learn that opaque occasion on mould 12 optics is provided with to tilt to eliminate function with the same substrate of back position detector 6 and get final product at die location detector 8 even do not describe in detail yet.
Use the figure of present embodiment to form the device of device manufacturing also applicable to the occasion beyond the semiconductor.For example, discuss to such an extent that 3 very many dimensional photonic crystals make its disorderly arteface by containing recently in the structure in cycle, thereby can have the characteristic that to control the characteristics of luminescence (Applied Physics association will, the 74th volume, February number, p147～p159).Can be used as the technology of making 3 such dimension structures.And, because the photoetching technique in comparable use past is more cheap, so the effect of using on the industry be we can say bigger.
Claims (9)
1. a pattern forming method has used nano impression, and this nano impression is to be pressed to the substrate that has applied resin molding by the mould that will form the concaveconvex shape figure to form figure; It is characterized in that comprising:
By the interval of some cycles be in order to laser light source light beam to be formed on this mould, throw light on as the alignment mark of line and gap figure, use 0 diffraction light from the reflection diffracting light that this alignment mark produces to measure the operation of above-mentioned mould and the distance of the substrate that has applied above-mentioned resin molding;
In above-mentioned mould and the operation that will stop before the substrate that has applied above-mentioned resin molding will contact;
Thereby by the operation that above-mentioned mould and the relative contraposition of the substrate that has applied above-mentioned resin molding are carried out in the position of detecting alignment mark, wherein this alignment mark is formed on the back side of the substrate that has applied above-mentioned resin molding; And
Under the state that keeps above-mentioned relative position, above-mentioned mould is pressed to the operation of the substrate that has applied above-mentioned resin molding.
2. pattern forming method according to claim 1 is characterized in that: by mould pressure differential up and down, substrate pressurizes to mould relatively.
3. pattern forming method according to claim 1 is characterized in that: by obtaining 2 phase differences that carried out the light of illumination to the alignment mark that is formed at substrate back, detect the surface location of the substrate corresponding with the back position of substrate.
4. a figure forms device, is pressed to the substrate that has applied resin molding by the mould that will form the concaveconvex shape figure and forms figure; It is characterized in that having:
Be used for substrate platform that the substrate that has applied resin molding is kept;
Can make the aforesaid substrate platform move to the platform driver element in precalculated position;
Be used to keep the mould table of mould;
The back position detector of the position of the alignment mark that detection forms at the back side of the substrate that has applied resin molding; And
Detect the die location detector that mold graph forms the position of face,
Wherein, above-mentioned die location detector has: with the position probing optical illumination to the unit of mould, contrast clear position probing light from the diffraction light of the alignment mark reflection that is formed at mould, only select the spatial filter of ± 1 diffraction light, only select 0 diffraction light spatial filter and will ± 1 time diffraction light and 0 diffraction light guide to the optical element of different optical detecting units
And has a unit of contraposition that carries out the relative position of substrate and mould according to the testing result of above-mentioned back position detector and above-mentioned die location detector.
5. figure according to claim 4 forms device, it is characterized in that: above-mentioned die location detector has the function of the position on the short transverse that detects mould.
6. figure according to claim 5 forms device, and it is characterized in that: the alignment mark that is formed at mould is line and gap figure.
7. figure according to claim 4 forms device, it is characterized in that: be formed with reflectance coating being formed on the alignment mark of mould.
8. figure according to claim 4 forms device, it is characterized in that: the correction chip with the reference position that is used to proofread and correct above-mentioned back position detector and above-mentioned die location detector.
9. figure according to claim 4 forms device, it is characterized in that: have and be disposed at mould mould upper chambers and platform chamber up and down, have and utilize the pressure differential between the chamber up and down mould to be pressed to the unit of substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006014525 | 2006-01-24 | ||
| JP2006014525A JP4736821B2 (en) | 2006-01-24 | 2006-01-24 | Pattern forming method and pattern forming apparatus |
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| CN101009218A CN101009218A (en) | 2007-08-01 |
| CN100536073C true CN100536073C (en) | 2009-09-02 |
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| CNB2007100022640A Expired - Fee Related CN100536073C (en) | 2006-01-24 | 2007-01-17 | Pattern forming method and pattern forming system |
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| US (1) | US7745237B2 (en) |
| EP (1) | EP1811337A3 (en) |
| JP (1) | JP4736821B2 (en) |
| CN (1) | CN100536073C (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| US7745237B2 (en) | 2010-06-29 |
| EP1811337A3 (en) | 2007-11-07 |
| US20070172967A1 (en) | 2007-07-26 |
| EP1811337A2 (en) | 2007-07-25 |
| JP2007200953A (en) | 2007-08-09 |
| JP4736821B2 (en) | 2011-07-27 |
| CN101009218A (en) | 2007-08-01 |
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