CN100505986C - Substrate processing equipment - Google Patents
Substrate processing equipment Download PDFInfo
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- CN100505986C CN100505986C CNB2006101277036A CN200610127703A CN100505986C CN 100505986 C CN100505986 C CN 100505986C CN B2006101277036 A CNB2006101277036 A CN B2006101277036A CN 200610127703 A CN200610127703 A CN 200610127703A CN 100505986 C CN100505986 C CN 100505986C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/38—Exhausting, degassing, filling, or cleaning vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2209/00—Apparatus and processes for manufacture of discharge tubes
- H01J2209/01—Generalised techniques
- H01J2209/017—Cleaning
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Abstract
Description
技术领域 technical field
本发明涉及一种基板处理装置,具体地说,将用于进行显像、蚀刻、剥离工序的处理部和储存部构成一体结构,并在内部设置用于循环药液的抽吸装置,从而提高处理效率的基板处理装置。The present invention relates to a substrate processing device, specifically, a processing part and a storage part for developing, etching and stripping processes are formed into an integrated structure, and a suction device for circulating chemical liquid is arranged inside, thereby improving Substrate processing equipment with high processing efficiency.
背景技术 Background technique
通常,显示器装置制作工序中,在玻璃基板上形成电路图的工序由以下工序组成:在基板表面涂敷感光树脂(photosensitive-polymer),形成感光膜的工序;通过一定的电路图案将感光膜曝光、显像的工序;蚀刻基板表面的工序;蚀刻工序之后利用有机溶剂等进行剥离的工序。Usually, in the manufacturing process of a display device, the process of forming a circuit pattern on a glass substrate consists of the following processes: a process of coating a photosensitive resin (photosensitive-polymer) on the surface of the substrate to form a photosensitive film; exposing the photosensitive film through a certain circuit pattern, The process of image development; the process of etching the surface of the substrate; the process of peeling off with an organic solvent after the etching process.
这些显示器装置制作工序中,上述蚀刻工序分为湿法蚀刻和干式蚀刻工序。In these display device manufacturing processes, the above-mentioned etching process is divided into wet etching and dry etching.
即,湿法蚀刻是利用化学溶液进行蚀刻的工序,而干式蚀刻是利用等离子体等气体进行蚀刻的工序。That is, wet etching is a process of etching with a chemical solution, and dry etching is a process of etching with gas such as plasma.
这种湿法蚀刻及剥离装置,通常由以下部分组成:进行蚀刻及剥离工序的处理部;独立于上述处理部设置,且储存药液的储存部;连接储存部,并向处理部供应药液的泵。This wet etching and stripping device usually consists of the following parts: a processing part for etching and stripping; a storage part that is independent from the processing part and stores the chemical solution; connected to the storage part, and supplies the chemical solution to the processing part pump.
因此,对基板进行蚀刻及剥离工序时,通过泵将储存在储存部的药液供应至处理部,并进行处理工序。Therefore, when the etching and peeling processes are performed on the substrate, the chemical liquid stored in the storage unit is supplied to the processing unit by a pump, and the processing process is performed.
但是,这种基板处理装置中,泵和处理部分开设置,以此来循环药液,因此在药液循环过程中易发生热损失,在蚀刻工序中药液难以维持适当的温度。However, in this substrate processing apparatus, the pump and the processing section are separately provided to circulate the chemical solution, so heat loss easily occurs during the circulation process of the chemical solution, and it is difficult to maintain an appropriate temperature of the chemical solution during the etching process.
而且,泵与处理部的分开设置,会导致药液循环过程中药液泄漏的问题。Moreover, the separate arrangement of the pump and the processing part will lead to the problem of leakage of the liquid medicine during the circulation of the liquid medicine.
另外,储存部与处理部的分开设置,需要增加用于设置储存部的空间,因此增加了设备的体积。In addition, the separate arrangement of the storage unit and the processing unit requires an increase in the space for the storage unit, thus increasing the volume of the device.
发明内容 Contents of the invention
本发明鉴于上述问题而作,其目的在于提供一种将用于抽吸药液的泵设置在与处理部构成一体结构的储存部内部,从而使药液循环过程中发生的热损失达到最少而可维持蚀刻工序中所需温度的基板处理装置。The present invention is made in view of the above-mentioned problems, and its object is to provide a pump for pumping the liquid medicine inside the storage unit that is integrally structured with the treatment unit, thereby minimizing the heat loss during the circulation of the liquid medicine. Substrate processing equipment that can maintain the temperature required in the etching process.
本发明的另一个目的是提供一种使泵与储存部成为一体结构,从而可防止药液在循环过程中泄漏的基板处理装置。Another object of the present invention is to provide a substrate processing apparatus in which a pump and a storage unit are integrated so as to prevent leakage of a chemical solution during circulation.
本发明的另一个目的是提供一种通过缩小储存部的占有空间而提高空间利用率,并使各个浴槽成为模块化,从而可迅速对应工序变化的基板处理装置。Another object of the present invention is to provide a substrate processing apparatus that improves space utilization by reducing the occupied space of a storage unit, and makes each bath modularized so as to quickly respond to process changes.
本发明的另一个目的是提供一种可减少电机驱动时的震动,从而可提高工艺稳定性的基板处理装置。Another object of the present invention is to provide a substrate processing apparatus that can reduce vibration when driven by a motor, thereby improving process stability.
为了实现上述目的,本发明提供一种基板处理装置,其包括:In order to achieve the above object, the present invention provides a substrate processing device, which includes:
供应基板的箱体;与上述箱体的上部构成一体结构,并对上述基板进行药液处理工序的处理部;与上述箱体的下部构成一体结构,并储存上述药液处理工艺所需药液的储存部;位于上述储存部的内部,并将药液循环至上述处理部的抽吸装置;以及连接于上述抽吸装置,并将抽吸到的药液喷射至上述处理部中基板的喷射部。上述箱体内部由分隔板分为上下部分,上部为处理部,下部为储存部,而且上述分隔板的一部分上设有开口部,从而使药液从处理部供应至储存部。A box for supplying substrates; a processing unit that forms an integral structure with the upper part of the above-mentioned box and performs a chemical liquid treatment process on the above-mentioned substrate; forms an integral structure with the lower part of the above-mentioned box and stores the chemical liquid required for the above-mentioned chemical liquid treatment process a storage part; a suction device located inside the storage part and circulating the chemical solution to the processing part; and a spraying device connected to the suction device and spraying the pumped chemical solution to the substrate in the processing part department. The inside of the box is divided into upper and lower parts by a partition plate, the upper part is a processing part, and the lower part is a storage part, and a part of the partition board is provided with an opening to allow the liquid medicine to be supplied from the processing part to the storage part.
本发明具有如下优点。The present invention has the following advantages.
第一,由于在储存部的内部一体形成用于抽出药液的抽吸装置,因此可使药液循环时所发生的热损失及压力下降,以此维持适合进行蚀刻工序的药液温度和压力,从而具有可防止产生污垢、提高反应性的优点。First, since the suction device for pumping out the chemical solution is integrally formed inside the storage unit, the heat loss and pressure drop that occur when the chemical solution circulates can be maintained to maintain the temperature and pressure of the chemical solution suitable for the etching process. , which has the advantages of preventing fouling and improving reactivity.
第二,由于抽吸装置设置在储存部内部,因此可防止药液在循环过程中的泄漏。Second, since the suction device is provided inside the storage part, leakage of the medical solution during circulation can be prevented.
第三,由于储存部和处理部一体形成,因此缩小了储存部的占有空间,随此提高了空间利用率,而且由于每个浴槽成为模块化,因此可迅速对应工序变化。Third, since the storage unit and the treatment unit are integrally formed, the occupied space of the storage unit is reduced, thereby improving the space utilization rate, and since each bath is modularized, it is possible to quickly respond to process changes.
第四,降低了因电机驱动而产生的震动,从而可增加工艺稳定性。Fourth, the vibration generated by the motor drive is reduced, thereby increasing process stability.
第五,通过将处理部、储存部、抽吸装置构成一体结构,可缩小设备体积而节省制作费用。Fifth, by integrating the processing unit, the storage unit, and the suction device, the volume of the equipment can be reduced and the production cost can be saved.
附图说明 Description of drawings
图1是表示本发明的优选实施例的用于湿法蚀刻及剥离工序的基板处理装置内部结构的立体图。FIG. 1 is a perspective view showing the internal structure of a substrate processing apparatus used in wet etching and peeling steps according to a preferred embodiment of the present invention.
图2是图1的侧面剖视图。FIG. 2 is a side sectional view of FIG. 1 .
图3是图2中抽吸装置的放大图。Fig. 3 is an enlarged view of the suction device in Fig. 2 .
具体实施方式 Detailed ways
下面,参照附图详细说明本发明的优选实施例所涉及的基板处理装置。Hereinafter, a substrate processing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the drawings.
图1是表示本发明的优选实施例的用于湿法蚀刻及剥离工序的基板处理装置的内部结构立体图,图2是图1的侧面剖视图。1 is a perspective view showing the internal structure of a substrate processing apparatus used in wet etching and peeling steps according to a preferred embodiment of the present invention, and FIG. 2 is a side sectional view of FIG. 1 .
如图所示,本发明所提供的基板处理装置可适用于各种不同的基板处理工序,但是常用于进行显像工序、湿法蚀刻工序及剥离工序的装置,因此,下面按照适用于显像、蚀刻及剥离工序的实施例来进行说明。As shown in the figure, the substrate processing device provided by the present invention can be applied to various substrate processing processes, but it is commonly used in devices for developing processes, wet etching processes, and stripping processes. Therefore, the following is applicable to developing processes , etching and stripping process examples will be described.
本发明提供的基板处理装置,包括:箱体3,其内部分为上下部分;处理部5,其位于所述箱体3的上部,进行药液处理工序;储存部7,其与所述箱体3的下部构成一体,并储存药液;抽吸装置15,其位于所述储存部7的内部,将药液抽吸至上述处理部5;喷射部11,其连接于上述抽吸装置15,并将抽吸到的药液喷射到处理部5中的基板G上。The substrate processing device provided by the present invention includes: a
具有上述结构的基板处理装置中,上述箱体3在其内部具有一定的空间,并且其内部由分隔板9分成上下部分。In the substrate processing apparatus having the above structure, the
即,分隔板9的上部设置有处理部5,分隔板9的下部设置有储存部7。That is, the
而且,在上述处理部5的内部设置有支撑并传送基板G的传送滚轮R。因此,通过箱体3的一侧上具备的进料口14,基板G可以传送至处理部5内部。Furthermore, the transfer roller R which supports and transfers the board|substrate G is provided inside the said
另外,上述储存部7与处理部5的下部为一体结构,用以储存由处理部5供应的药液。In addition, the above-mentioned
此时,区分上述处理部5和储存部7的分隔板9上,具备形成有若干个贯通孔的开口部13,因此可使处理部5中的药液滴落到储存部7中。At this time, the
如此,处理部5与储存部7成为一体的结构,可减少处理部和储存部独立设置的现有技术中,用来设置储存部7的另外空间。In this way, the integrated structure of the
而且,通过把处理部5和储存部7形成一体,使处理生产线的浴槽成为模块化,由此可灵活地对应工艺变化。Furthermore, by integrating the
上述内容中,箱体内部分为上下部分,但是本发明并不局限于此,还可以采用将箱体内部分为左右部分,或省略分隔板的实施方式。In the above content, the inner part of the box is divided into upper and lower parts, but the present invention is not limited thereto, and an embodiment in which the inner part of the box is divided into left and right parts, or the partition plate is omitted, may also be adopted.
所述储存部7中具有药液循环管,因此可适当更换被污染的药液。所述药液循环管包括位于储存部7的两侧的流入管27和流出管25,所述流入管27和流出管25分别连接有阀门26a、26b,因此可进行开闭操作。The
因此,当更换因长时间的使用而被污染的药液时,可通过该流入管27和流出管25更换新的药液。Therefore, when replacing the contaminated medical solution due to long-term use, new medical solution can be replaced through the
此时,可同时具备上述流入管27和流出管25,或具备其中之一。In this case, the above-mentioned
如上所述,储存部7所储存的药液可通过上述抽吸装置15供应至处理部5。As described above, the medical solution stored in the
上述抽吸装置15由安装在储存部7内部的泵17和,位于上述箱体3的外部、并通过磁力以非接触方式向泵17传递旋转力的磁性驱动部构成。The
更详细地说,如图3所示,上述的泵17通常包括外部经过耐化学性涂敷处理的特氟隆泵或FRP泵等化工泵。More specifically, as shown in FIG. 3 , the above-mentioned
上述泵17包括:壳体31,其位于储存部7的内底部;转轴37,可转动地设置在上述壳体31的内部;叶轮35,其安装于上述转轴37上,并且在上述磁性驱动部19传递磁力的情况下,进行转动而产生吸力;第1磁板42,位于上述转轴37上,并从磁性驱动部19接受磁力。Above-mentioned
具有上述结构的泵中,上述壳体31,在其入口处具有吸入药液的吸入口21,且在出口处具有将壳体31内部的药液排出到外部的排出口33。In the pump having the above-mentioned structure, the casing 31 has a
因此,储存部7的药液可通过上述壳体31的吸入口21吸入后,通过排出口33排出到上述喷射部11。Therefore, the liquid medicine in the
另外,上述转轴37的上端部分,由轴承39可旋转地固定在位于壳体31顶部的肋条38的内部。而且,上述转轴37的下端部分,由肋条40和轴承41可旋转地固定在壳体31的底部。In addition, the upper end portion of the rotating shaft 37 is rotatably fixed inside a rib 38 at the top of the casing 31 by a bearing 39 . Furthermore, the lower end portion of the above-mentioned rotary shaft 37 is rotatably fixed to the bottom of the casing 31 by ribs 40 and bearings 41 .
因此,上述转轴37可在壳体31内部旋转。Therefore, the above-mentioned rotating shaft 37 can rotate inside the casing 31 .
另外,上述转轴37的中间部分具有与其构成一体的上述叶轮35,且下端部分具有上述第1磁板42。In addition, the middle portion of the rotating shaft 37 has the above-mentioned impeller 35 integrally formed therewith, and the lower end portion has the above-mentioned first magnetic plate 42 .
此时,上述第1磁板42配置成与在后叙述的第2磁板43隔着箱体3互相对应的结构。At this time, the first magnetic plate 42 and the second magnetic plate 43 to be described later are arranged to correspond to each other via the
因此,磁性驱动部19的第2磁板产生的磁力穿过箱体3,以非接触方式传递给第1磁板42时,叶轮35会转动。Therefore, when the magnetic force generated by the second magnetic plate of the
如上所述,当叶轮35转动时,叶轮35将会推开壳体31内部的药液而产生一定压力的吸力,以此经过吸入口21吸入储存部7中的药液,而吸入的药液通过排出口33排出到上述喷射部11。As mentioned above, when the impeller 35 rotates, the impeller 35 will push away the liquid medicine inside the housing 31 to generate a certain pressure of suction, so as to suck the medicine liquid in the
另外,上述磁性驱动部19连接于产生旋转力的电机组20和上述电机组20的转轴,并且包括产生磁力且传递给上述叶轮35的第2磁板43。In addition, the
上述的第1磁板42及第2磁板43最好包括磁铁等磁性体,并且如上所述,两磁板呈以箱体3为中心,在箱体3的外部及内部相隔一定距离互相对应的非接触结构。The above-mentioned first magnetic plate 42 and the second magnetic plate 43 preferably include magnetic bodies such as magnets, and as mentioned above, the two magnetic plates are centered on the
另外,上述第1磁板42及第2磁板43,两个都可以是磁性体,或者也可以是只有第2磁板43为磁性体。此时,磁性体可以是永久磁铁或电磁铁。In addition, both the first magnetic plate 42 and the second magnetic plate 43 may be magnetic bodies, or only the second magnetic plate 43 may be a magnetic body. In this case, the magnetic body may be a permanent magnet or an electromagnet.
因此,当第2磁板43由电机组19进行转动时,磁力将穿过箱体3,以非接触方式传递到第1磁板42上。Therefore, when the second magnetic plate 43 is rotated by the
结果,向叶轮35传递动力的过程中可防止因接触而产生的噪音,而且无需在箱体3上形成连接口等,因此还可防止药液泄漏。As a result, noise due to contact can be prevented during power transmission to the impeller 35, and there is no need to form a connection port or the like on the
以上,针对适用磁性驱动部而以非接触方式驱动泵的实施例进行了说明,但是本发明并不局限于此,本发明也可采用在箱体内部安装通常的电机组,并将此电机组直接连接泵,并以此来驱动泵的方式。当然,这种情况下所述的电机组应具备防水功能。Above, the embodiment in which the magnetic drive unit is used to drive the pump in a non-contact manner has been described, but the present invention is not limited thereto. The present invention can also adopt a common motor unit installed inside the box, and the motor unit Connect the pump directly and use it to drive the pump. Of course, the motor unit described in this case should be waterproof.
另外,从上述泵17的排出口33排出的药液通过上述喷射部11供应至处理部5。In addition, the chemical solution discharged from the discharge port 33 of the
上述喷射部11包括通常的公知结构喷射装置。The above-mentioned
即,其结构由连接于泵17的排出口33的输送管23、供应药液的喷射管45、形成在喷射管45上的多个喷嘴47构成。That is, its structure is constituted by the
因此,经由喷射管45供应的药液通过喷嘴47喷射,从而供应到基板G的表面,以进行处理。Accordingly, the chemical liquid supplied via the
下面,参照附图,进一步详细说明本发明的优选实施例所涉及的基板处理装置的工作过程。Hereinafter, referring to the accompanying drawings, the working process of the substrate processing apparatus involved in the preferred embodiment of the present invention will be further described in detail.
如图1至图3所示,利用本发明提供的基板处理装置对基板G进行显像、蚀刻及剥离工序时,首先利用传送滚轮R将基板G移送至箱体3的内部。As shown in FIG. 1 to FIG. 3 , when using the substrate processing apparatus provided by the present invention to perform developing, etching and stripping processes on the substrate G, the substrate G is first transferred to the inside of the
之后,驱动抽吸装置15抽出存储在储存部7内的一定水位的药液,并将其喷射到处理部5的基板G上。Thereafter, the
即,当驱动上述抽吸装置15的磁性驱动部19时,第2磁板43就会转动,而磁力穿过箱体3,以非接触方式传递给第1磁板42,以此使叶轮35转动。That is, when the magnetic driving
如上所述,当叶轮35在壳体31内部,以一定速度转动时,因壳体31内部处于存有药液的状态,因此叶轮35就会推开这些药液,使壳体31内部产生负压。As mentioned above, when the impeller 35 is inside the casing 31 and rotates at a certain speed, since the inside of the casing 31 is in a state of storing medical solution, the impeller 35 will push away the medical solution, causing a negative pressure to be generated inside the casing 31. pressure.
随此,通过壳体31的吸入口21,药液被吸入到壳体31内部,而被吸入的药液可排出到壳体31外部。Along with this, through the
被排出的药液通过喷射部11的输送管23供应至喷射管45,而供应至喷射管45的药液通过多个喷嘴47喷射在基板G的表面,以此对基板G可进行蚀刻及剥离处理。The discharged chemical solution is supplied to the
如此,喷射在处理部5内部的药液对基板进行处理之后,便通过分隔板9的开口部13滴落而重新回到下部的储存部7。之后,再重复进行通过抽吸装置15被抽吸,并供应至处理部5的上述过程。In this way, after the chemical solution sprayed inside the
只要是在本发明所属技术领域中具有普通技术水平的人,都可以在本发明技术思想的基础上,对本发明进行各种变更及修改,因此本发明所要求保护的范围并不局限于上述较佳实施例。As long as there is a person with an ordinary technical level in the technical field to which the present invention belongs, various changes and modifications can be made to the present invention on the basis of the technical idea of the present invention, so the scope of protection claimed in the present invention is not limited to the above-mentioned comparison. good example.
Claims (11)
Applications Claiming Priority (2)
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KR1020050080857A KR100767005B1 (en) | 2005-08-31 | 2005-08-31 | Substrate Processing Equipment |
KR1020050080857 | 2005-08-31 |
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CN1925723A CN1925723A (en) | 2007-03-07 |
CN100505986C true CN100505986C (en) | 2009-06-24 |
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CNB2006101277036A Expired - Fee Related CN100505986C (en) | 2005-08-31 | 2006-08-30 | Substrate processing equipment |
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CN (1) | CN100505986C (en) |
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CN103794428A (en) * | 2011-12-31 | 2014-05-14 | 四川虹欧显示器件有限公司 | Etching device and etching method |
CN103805998B (en) * | 2014-03-03 | 2016-07-13 | 常州天合光能有限公司 | Silicon wafer wet etching equipment and etching method thereof |
KR102634034B1 (en) * | 2019-04-05 | 2024-02-08 | 주식회사 디엠에스 | Substrate processing apparatus |
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