CN100492019C - Electrical contact device of probe card - Google Patents
Electrical contact device of probe card Download PDFInfo
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- CN100492019C CN100492019C CNB2005101134964A CN200510113496A CN100492019C CN 100492019 C CN100492019 C CN 100492019C CN B2005101134964 A CNB2005101134964 A CN B2005101134964A CN 200510113496 A CN200510113496 A CN 200510113496A CN 100492019 C CN100492019 C CN 100492019C
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Abstract
一种探针卡的电性接触装置,包含有一基座以及至少一探针,基座具有一表面,以及一凹陷于表面的容槽,容槽成形出一邻接于表面的壁面,且于壁面设有至少一定位部,各探针包含有一第一端以及一第二端,各第一端是设于基座的各定位部,使各第二端朝容槽延伸。
An electrical contact device for a probe card includes a base and at least one probe. The base has a surface and a groove recessed in the surface. The groove forms a wall adjacent to the surface and at least one positioning portion is provided on the wall. Each probe includes a first end and a second end. Each first end is provided on each positioning portion of the base so that each second end extends toward the groove.
Description
技术领域 technical field
本发明是与探针卡的电性接触装置有关,特别是指一种结构强度较佳的电性接触装置。The present invention relates to an electrical contact device of a probe card, in particular to an electrical contact device with better structural strength.
背景技术 Background technique
在半导体芯片的制造过程中,当芯片制造完成但尚未进行封装制程的前,通常必须先经过一检测程序测试芯片的电路功能;检测程序是利用一探针卡的电性接触装置设于测试机台与芯片之间,电性接触装置具有若干探针,由各探针分别抵接于芯片的焊垫,使测试机的测试信号可来回传送于芯片与测试机之间。In the manufacturing process of semiconductor chips, when the chip is manufactured but before the packaging process, it is usually necessary to go through a test program to test the circuit function of the chip; Between the stage and the chip, the electrical contact device has a plurality of probes, and each probe is respectively abutted against the bonding pad of the chip, so that the test signal of the testing machine can be transmitted back and forth between the chip and the testing machine.
一种现有的电性接触装置80,如图28所示,包含有一基座81,以及若干设于基座81的探针82,各探针82的第一端83是以接合的方式焊设于基座81的表面,而探针82的第二端84则朝基座81的一沟槽85上方延伸,第二端84是用以接触芯片的焊垫,由探针82与基座81之间的结构,使得探针82本身具有弹性,当芯片的各焊垫抵压于各第二端84时,各探针82可较为确实地抵接于各焊垫。A kind of existing
再如另一种已知的电性接触装置90,如图29所示,其亦包含有一基座91以及若干探针92,探针92的第一端93是直接成形于基座91表面,而第二端94位于基座91的一沟槽95上方,藉以使各探针92的结构同样具有弹性,可利用各第二端94用以接触芯片的焊垫。Another known
然而,由于半导体芯片的结构尺寸越来越小,芯片具有的焊垫数量越来越多,相对地使得电性接触装置必须在单位面积内所具有的探针数量也越来越多,进而使探针与基座之间可用于相互结合的区域越来越小,在长期反复地进行芯片的测试工作时,探针与基座的结合处容易产生破坏现象,造成探针分离于基座,使电性接触装置发生故障的情形。However, since the structural size of the semiconductor chip is getting smaller and smaller, the number of pads on the chip is increasing, and the number of probes that the electrical contact device must have in a unit area is relatively increasing, so that The area that can be used for mutual bonding between the probe and the base is getting smaller and smaller. When the chip is tested repeatedly for a long time, the joint between the probe and the base is prone to damage, causing the probe to separate from the base. Circumstances that cause failure of electrical contact devices.
发明内容 Contents of the invention
因此,本发明的主要目的乃在于提供一种探针卡的电性接触装置,其所具有的各探针的结构强度较佳,在长期反复地进行测试工作时,各探针较不易产生破坏现象,使电性接触装置不易故障。Therefore, the main purpose of the present invention is to provide an electrical contact device for a probe card, in which the structural strength of each probe is better, and each probe is less likely to be damaged during long-term repeated testing work. Phenomenon, so that the electrical contact device is not easy to fail.
为达成前揭目的,本发明所提供一种探针卡的电性接触装置,其特征在于,包含有:In order to achieve the purpose disclosed above, the present invention provides an electrical contact device for a probe card, which is characterized in that it includes:
一基座,该基座具有一表面,以及一凹陷于该表面的容槽,该容槽成形出至少一邻接于该表面的壁面,且于该等壁面设有至少一定位部;以及A base, the base has a surface, and a receptacle recessed in the surface, the receptacle forms at least one wall adjacent to the surface, and at least one positioning portion is provided on the walls; and
至少一探针,各该探针包含有一第一端以及一第二端,各该第一端是设于该基座的各定位部,使各该第二端朝该容槽延伸。At least one probe, each of the probes includes a first end and a second end, each of the first ends is arranged on each positioning portion of the base, and each of the second ends extends toward the container.
其中该定位部是凹陷于该壁面以及该顶面。Wherein the positioning portion is recessed on the wall surface and the top surface.
其中该基座于对应各该定位部的侧面分别形成出至少一凸部,而各该探针的第一端则具有至少一凹部,该探针是以各凹部对应于该基座的各凸部地嵌设于该定位部。Wherein the base forms at least one protrusion on the side corresponding to each of the positioning parts, and the first end of each of the probes has at least one recess, and each of the recesses of the probe corresponds to each protrusion of the base Partially embedded in the positioning part.
其中各该探针的第一端的截面形状对应于各该定位部的截面形状。Wherein the cross-sectional shape of the first end of each probe corresponds to the cross-sectional shape of each positioning portion.
其中该基座于对应各该定位部的侧面成形出至少一沟槽,各该沟槽的延伸方向平行于该顶面,而各该探针外周则具有至少一嵌条,各该探针可利用各该嵌条嵌入各该沟槽,使得各该探针设于该基座。Wherein the base forms at least one groove on the side corresponding to each of the positioning parts, the extending direction of each of the grooves is parallel to the top surface, and each of the probes has at least one fillet on the outer periphery, and each of the probes can Each of the fillets is used to embed each of the grooves, so that each of the probes is arranged on the base.
其中各该探针的顶面或底面设有一凸垣,该凸垣的延伸方向与各该嵌条相同,该凸垣是嵌设于该基座的沟槽。Wherein the top or bottom surface of each of the probes is provided with a convex wall, the extending direction of the convex wall is the same as that of each fillet, and the convex wall is embedded in the groove of the base.
其中该定位部的截面形状是呈不规则状,而各该探针的截面形状则对应于该定位部的截面形状。The cross-sectional shape of the positioning part is irregular, and the cross-sectional shape of each probe corresponds to the cross-sectional shape of the positioning part.
其中该容槽是自该顶面贯穿于该基座。Wherein the container runs through the base from the top surface.
其中该基座的容槽成形出一第一壁面以及一第二壁面,该第二壁面凸伸于该第一壁面。Wherein the cavity of the base forms a first wall and a second wall, and the second wall protrudes from the first wall.
其中该基座另具有至少一延伸部,各该延伸部是自各该定位部朝该容槽方向延伸,各该探针是设于各该定位部与各该延伸部。Wherein the base further has at least one extension portion, each extension portion extends from each positioning portion toward the storage tank, and each probe is arranged on each positioning portion and each extension portion.
其中各该延伸部具有二相互间隔的侧壁,各该探针是设于该二侧壁之间。Each of the extensions has two sidewalls spaced apart from each other, and each of the probes is disposed between the two sidewalls.
其中各该延伸部是设于各该定位部内,且朝该容槽方向延伸,各该探针设于各该延伸部的顶面或底面。Wherein each of the extension parts is arranged in each of the positioning parts and extends towards the direction of the container, and each of the probes is arranged on the top surface or the bottom surface of each of the extension parts.
其中各该探针的顶侧或底侧另设有一凸垣。Wherein the top side or the bottom side of each of the probes is additionally provided with a convex wall.
其中各该延伸部与各该定位部之间另设有一导电部,各该导电部是用以作为接地。A conductive part is further provided between each of the extension parts and each of the positioning parts, and each of the conductive parts is used as a ground.
本发明一种探针卡的电性接触装置,其特征在于,包含有:An electrical contact device for a probe card of the present invention is characterized in that it includes:
一基座,该基座具有一表面,以及一凹陷于该表面的容槽,该表面设有至少一定位部,该定位部亦凹陷于该表面;以及a base, the base has a surface, and a receptacle recessed in the surface, the surface is provided with at least one positioning portion, and the positioning portion is also recessed in the surface; and
至少一探针,各该探针包含有一第一端以及一第二端,各该第一端是设于该基座的各定位部,使各该第二端朝该容槽延伸。At least one probe, each of the probes includes a first end and a second end, each of the first ends is arranged on each positioning portion of the base, and each of the second ends extends toward the container.
其中该基座于对应各该定位部的侧面分别形成出至少一凸部,而各该探针的第一端则具有至少一凹部,该探针是以各凹部对应于该基座的各凸部地嵌设于该定位部。Wherein the base forms at least one protrusion on the side corresponding to each of the positioning parts, and the first end of each of the probes has at least one recess, and each of the recesses of the probe corresponds to each protrusion of the base Partially embedded in the positioning part.
其中各该探针的第一端的截面形状对应于各该定位部的截面形状。Wherein the cross-sectional shape of the first end of each probe corresponds to the cross-sectional shape of each positioning portion.
其中该基座于对应各该定位部的侧面成形出至少一沟槽,各该沟槽的延伸方向平行于该顶面,而各该探针外周则具有至少一嵌条,各该探针可利用各该嵌条嵌入各该沟槽,使得各该探针设于该基座。Wherein the base forms at least one groove on the side corresponding to each of the positioning parts, the extending direction of each of the grooves is parallel to the top surface, and each of the probes has at least one fillet on the outer periphery, and each of the probes can Each of the fillets is used to embed each of the grooves, so that each of the probes is arranged on the base.
其中各该探针的顶面或底面设有一凸垣,该凸垣的延伸方向与各该嵌条相同,该凸垣是嵌设于该基座的沟槽。Wherein the top or bottom surface of each of the probes is provided with a convex wall, the extending direction of the convex wall is the same as that of each fillet, and the convex wall is embedded in the groove of the base.
其中该定位部的截面形状是呈不规则状,而各该探针的截面形状则对应于该定位部的截面形状。The cross-sectional shape of the positioning part is irregular, and the cross-sectional shape of each probe corresponds to the cross-sectional shape of the positioning part.
其中该容槽是自该顶面贯穿于该基座。Wherein the container runs through the base from the top surface.
本发明一种电性接触装置的制法,其特征在于,包含有下列步骤:A method for making an electrical contact device of the present invention is characterized in that it comprises the following steps:
a.制备一基座,该基座具有一顶面以及一底面;a. preparing a base, the base has a top surface and a bottom surface;
b.自该基座的顶面蚀刻出一呈凹陷状的第一空间;b. etching a recessed first space from the top surface of the base;
c.于该基座的第一空间与顶面施行光阻成形以及微电铸制程,使该基座成形出多数探针与多层牺牲层,各该探针具有一第一端与一第二端,该第二端具有一接触部;c. Perform photoresist forming and micro-electroforming processes on the first space and the top surface of the base, so that the base is formed with a plurality of probes and multi-layer sacrificial layers, each probe has a first end and a first end two ends, the second end has a contact portion;
d.于该基座的底面蚀刻出一容槽,该容槽的位置对应于该等探针的第二端下方;以及d. Etching a cavity on the bottom surface of the base, the position of the cavity corresponds to the bottom of the second ends of the probes; and
e.移除各该牺牲层,即可于该基座形成出各该探针,各该探针的第一端是设于该基座,各该探针的第二端则朝该容槽延伸。e. removing each of the sacrificial layers, each of the probes can be formed on the base, the first end of each of the probes is located on the base, and the second end of each of the probes is facing the cavity extend.
其中该基座是可利用硅材质、SOI基座、介电基座,或是表面具有介电材质的基座所制成。The pedestal can be made of silicon material, SOI pedestal, dielectric pedestal, or a pedestal with dielectric material on its surface.
其中于该步骤b之后,是可于该基座与各该探针相互结合的表面预先铺设介电材质,使各该探针保持绝缘状态。Wherein after the step b, a dielectric material can be pre-laid on the surface where the base and each of the probes are combined to keep each of the probes in an insulating state.
其中于该步骤d时,是利用一第一蚀刻制程自该基座顶面蚀刻出一第一壁面,再利用一第二蚀刻制程自该基座的底面蚀刻出一第二壁面,并使该基座成形出该容槽,而该第一壁面是凸伸于该第二壁面。Wherein in the step d, a first wall surface is etched from the top surface of the base by using a first etching process, and a second wall surface is etched from the bottom surface of the base by a second etching process, and the The base forms the cavity, and the first wall protrudes from the second wall.
其中该步骤b的蚀刻制程亦可以激光加工方式取代。The etching process in step b can also be replaced by laser processing.
由此,本发明即可利用探针与基座相互结合的构造,使整体电性接触装置的结构强度较佳,达到在进行长期反复的测试工作,各探针较不易产生破坏现象,而且电性接触装置不易故障的目的。Thus, the present invention can utilize the structure that the probes and the base are combined with each other, so that the structural strength of the overall electrical contact device is better, so that the probes are less likely to be damaged during long-term repeated test work, and the electrical contacts The purpose of making sexual contact devices less prone to failure.
附图说明 Description of drawings
以下,配合附图列举若干较佳实施例,用以对本发明的结构与功效做详细说明,其中所用各图式的简要说明如下,其中:Below, a number of preferred embodiments are listed in conjunction with the accompanying drawings, in order to describe the structure and effect of the present invention in detail, wherein the brief description of each drawing used is as follows, wherein:
图1是本发明第一较佳实施例的立体图;Fig. 1 is the perspective view of the first preferred embodiment of the present invention;
图2是图1中2-2剖线的剖视图;Fig. 2 is the sectional view of 2-2 section line in Fig. 1;
图3是本发明第一较佳实施例的制法示意图;Fig. 3 is the method schematic diagram of the first preferred embodiment of the present invention;
图4是本发明第一较佳实施例的制法示意图;Fig. 4 is the method schematic diagram of the first preferred embodiment of the present invention;
图5是本发明第一较佳实施例的制法示意图;Fig. 5 is the method schematic diagram of the first preferred embodiment of the present invention;
图6是本发明第一较佳实施例的制法示意图;Fig. 6 is the method schematic diagram of the first preferred embodiment of the present invention;
图7是本发明第一较佳实施例的制法示意图;Fig. 7 is the method schematic diagram of the first preferred embodiment of the present invention;
图8是本发明第一较佳实施例的制法示意图;Fig. 8 is the method schematic diagram of the first preferred embodiment of the present invention;
图9是本发明第一较佳实施例的另一实施态样;Fig. 9 is another implementation aspect of the first preferred embodiment of the present invention;
图10是本发明第二较佳实施例的局部剖面示意图,主要是显示探针与基座相互结合的状态;Fig. 10 is a schematic partial cross-sectional view of the second preferred embodiment of the present invention, mainly showing the state that the probe and the base are combined with each other;
图11是本发明第三较佳实施例的局部剖面示意图,主要是显示探针与基座相互结合的状态;Fig. 11 is a partial cross-sectional schematic view of the third preferred embodiment of the present invention, mainly showing the state of the probe and the base combined with each other;
图12是本发明第四较佳实施例的局部剖面示意图,主要是显示探针与基座相互结合的状态;Fig. 12 is a partial cross-sectional schematic view of the fourth preferred embodiment of the present invention, mainly showing the state that the probe and the base are combined with each other;
图13是本发明第四较佳实施例的另一实施态样;Fig. 13 is another implementation aspect of the fourth preferred embodiment of the present invention;
图14是本发明第四较佳实施例的又一实施态样;Fig. 14 is another implementation aspect of the fourth preferred embodiment of the present invention;
图15是本发明第五较佳实施例的局部剖面示意图,主要是显示探针与基座相互结合的状态;Fig. 15 is a partial cross-sectional schematic view of the fifth preferred embodiment of the present invention, mainly showing the state of the probe and the base combined with each other;
图16是本发明第六较佳实施例的局部剖面示意图,主要是显示探针与基座相互结合的状态;Fig. 16 is a partial cross-sectional schematic view of the sixth preferred embodiment of the present invention, mainly showing the state of the probe and the base combined with each other;
图17是本发明第六较佳实施例的另一实施态样;Fig. 17 is another implementation aspect of the sixth preferred embodiment of the present invention;
图18是本发明第七较佳实施例的局部立体图;Fig. 18 is a partial perspective view of a seventh preferred embodiment of the present invention;
19图是图18中19-19剖线的剖视图;Figure 19 is a cross-sectional view of line 19-19 in Figure 18;
图20是本发明第八较佳实施例的局部立体图;Fig. 20 is a partial perspective view of an eighth preferred embodiment of the present invention;
图21是图20中21-21剖线的剖视图;Fig. 21 is a sectional view of section line 21-21 in Fig. 20;
图22是本发明第八较佳实施例的一实施态样;Fig. 22 is an implementation aspect of the eighth preferred embodiment of the present invention;
图23是本发明第八较佳实施例的另一实施态样;Fig. 23 is another implementation aspect of the eighth preferred embodiment of the present invention;
图24是本发明第九较佳实施例的局部立体图;Fig. 24 is a partial perspective view of a ninth preferred embodiment of the present invention;
图25是图24中25-25剖线的剖视图;Fig. 25 is a cross-sectional view of line 25-25 in Fig. 24;
图26是本发明第十较佳实施例的局部立体图;Fig. 26 is a partial perspective view of a tenth preferred embodiment of the present invention;
图27是图26中27-27剖线的剖视图。Fig. 27 is a sectional view taken along line 27-27 in Fig. 26 .
图28是为一现有电性接触装置的示意图;以及Figure 28 is a schematic diagram of a conventional electrical contact device; and
图29是为另一现有电性接触装置的示意图。FIG. 29 is a schematic diagram of another conventional electrical contact device.
具体实施方式 Detailed ways
请参阅图1及图2所示,是为本发明第一较佳实施例所提供探针卡的电性接触装置10,电性接触装置10包含有一基座20以及多数探针30;基座20是以硅制成,基座20具有一顶面21,顶面21中央具有一呈凹陷状的容槽22,容槽22成形出四邻接于顶面21的壁面23,二相对的壁面23分设有多数定位部24,各定位部24是凹陷于各壁面23以及顶面21;基座20内另设有多数导电线路25。Please refer to Fig. 1 and shown in Fig. 2, it is the
各该探针30是为利用导电材质所制成的杆体,各探针30具有一第一端31以及一第二端32,第一端31的截面形状概同于基座20的定位部24的截面形状,第二端32具有一概呈垂直状的接触部33,各探针30的第一端31是嵌固于各定位部24,探针30与顶面21相互齐平,并且与导电线路25相互电性连通,而各第二端32朝容槽22延伸,各接触部33朝向顶面21的上方。Each of the
如图3至图8所示,是为本发明一较佳实施例的电性接触装置10的制造方法,其包含有下列步骤:As shown in FIGS. 3 to 8 , it is a manufacturing method of an
步骤一:如图3所示,制备一材质为硅的基座20,使基座20具有一顶面21以及一底面26。Step 1: As shown in FIG. 3 , prepare a base 20 made of silicon, so that the
步骤二:如图4所示,以蚀刻或是激光加工的方式,自基座20的顶面21成形出一呈凹陷状的第一空间27。Step 2: As shown in FIG. 4 , form a concave
步骤三:如图5至图6所示,于基座20的第一空间27与顶面21施行光阻成形以及微电铸制程,使基座20成形出多数探针30与多层牺牲层28,各探针30具有一第一端31与一第二端32,第二端32具有一接触部33;若希望更精确控制探针30的厚度尺寸,可于微电铸制程后,进一步以精密研磨探针30表面,使探针30表面呈平坦化并研磨至所希望的厚度。Step 3: As shown in FIG. 5 to FIG. 6 , perform photoresist forming and micro-electroforming processes on the
步骤四:如图7所示,利用等向性干蚀刻或是湿蚀刻方式自基座20的底面26蚀刻出一容槽22,容槽22的位置对应于探针30的第二端32下方。Step 4: As shown in FIG. 7 , etch a
步骤五:如图8所示,移除各牺牲层28,即可于基座20形成出各探针30的结构,各探针30的第一端31是设于基座20,探针30的第二端32则朝容槽22延伸。Step 5: As shown in FIG. 8 , remove each
基座20除了可利用硅材质制成以外,还可使用SOI(Silicon onInsulator)基座、介电基座,或是表面具有介电材质的基座;而在电铸各探针30之前,亦可于基座20与探针30相互结合的表面预先铺设介电材质,使各探针30确实保持绝缘状态;介电材质的铺设方式可为化学沉积方式,或者是高温炉管生成如氧化硅、氮化硅等材质。In addition to being made of silicon material, the
如图7与图8所示,由于自基座20的底面30蚀刻出容槽22时,容槽22的开口尺寸不易控制,若是在移除牺牲层28之后,各探针30悬空于容槽22壁面23的距离皆不相同,就会直接影响到各探针30的弹性、刚性与探针30的阻抗的一致性;为了能较为容易且精确地控制各探针30凸伸于容槽22的长度,使各探针30可弹性变形的长度一致,进而提升探针30的接触阻抗的一致性,如图9所示,可使容槽22’形成出一开口尺寸大于探针30’悬空范围的第一壁面36’,此时探针30’将由定位部24’的侧壁所夹持固定,而探针30’悬空于容槽22’的长度是自一第二壁面37’开始,由于制作定位部24’时的尺寸精度与探针30’的精度一致,因此可较为容易地控制各探针30’凸伸于容槽22’的长度。As shown in FIGS. 7 and 8 , since the opening size of the
经由上述结构与制法的说明,当电性接触装置10应用于一探针卡(图中未示)时,各探针30的接触部33是抵接于一芯片的各焊垫,芯片所下压的力量会推动各探针30的第二端32,使各探针30的第二端32朝容槽22方向移动,探针30身部则呈弯曲状,由各探针30的第一端31嵌固于基座20的各定位部24,各探针30可具有预定弹性,芯片的各焊垫与各探针30之间即可确实地相互抵接;同时,利用定位部24结合于探针30的结构,增加了探针30与基座20相互之间的接触面积,以及可承受应力的部位,各探针30在经过长时间以及多次地与各焊垫相互抵接之后,各第一端31仍可稳固地与各定位部24相互结合,进而发生探针30与基座20相互分离的状况。Through the description of the above structure and manufacturing method, when the
由此,本发明即可利用探针与基座相互之间的结构,使整体电性接触装置的结构强度较佳,达到在进行长期反复的测试工作,各探针较不易产生破坏现象,而且电性接触装置不易故障的目的。Thus, the present invention can utilize the structure between the probe and the base to make the structural strength of the overall electrical contact device better, so that the probes are less likely to be damaged during long-term repeated test work, and The purpose of the electrical contact device is not easy to fail.
上揭实施例中的定位部与各探针相互结合的结构,亦可改为其它形状,同样可达到本发明的目的;如图10所示,是为本发明第二较佳实施例所提供的电性接触装置40,其主要组成构件与第一较佳实施例相同,特点在于:基座41于各定位部42的二侧面分别具有一凸部43,各凸部43是呈凸起状,而各探针44的第一端45二外周面则分别具有一凹部46,各探针44是以各凹部46对应于基座41的各凸部43的方式嵌设于定位部42,使探针44与基座41相互结合。The structure in which the positioning part and the probes in the above embodiment are combined with each other can also be changed to other shapes, which can also achieve the purpose of the present invention; as shown in Figure 10, it is provided for the second preferred embodiment of the present invention The
如图11所示,是为本发明第三较佳实施例所提供的电性接触装置50,其特点在于:基座51于各定位部52的二侧面56是分别自壁面53呈渐扩状地向内延伸,而各探针54的第一端55的截面形状则对应于定位部52的截面形状,使探针54的第一端55可沿二侧面56嵌入定位部52,并使探针54的身部自壁面53向外侧延伸。As shown in Figure 11, it is the
如图12所示,是为本发明第四较佳实施例所提供的电性接触装置60,其特点在于:基座61于定位部62的二侧面分别成形出多数沟槽63,各沟槽63的延伸方向概略平行于顶面64,而各探针65外周则具有多数嵌条66,各探针65可利用各嵌条66嵌入各沟槽63的方式,使得探针65设于基座61的定位部62;再如图13及图14所示,探针65’的顶面或底面皆可增设一凸垣67’,而探针65’嵌入基座61’的定位部62’,即可再增加探针65’与基座61’之间的结合强度;而探针65’底面的凸垣67’可先以等向性蚀刻方式形成凸垣67’的外型空间后,再以电铸方式成形,而顶面的凸垣67’则可利用光阻成形与微电铸制程堆栈成形。As shown in Figure 12, it is the electrical contact device 60 provided for the fourth preferred embodiment of the present invention, and its characteristic is that: the base 61 forms a plurality of grooves 63 respectively on the two sides of the
另如图15所示,是为本发明第五较佳实施例所提供的电性接触装置66,特点在于定位部67的截面形状是呈不规则形状,而探针68的截面形状则对应于定位部67的截面形状,由此,探针68仍可与基座69相互结合(唯各探针的不规则形状彼此差异不可过大,以不影响电性规格为原则)。As shown in Figure 15, it is the
再如图16所示,是为本发明第六较佳实施例所提供的电性接触装置70,特点在于各探针71的第一端72具有一呈垂直状的嵌合部73,而各定位部74则是凹陷于顶面75,各探针71的嵌合部73嵌固于各定位部74,可使探针71结合于基座76;而同样地,如图17所示,探针71’的嵌合部73’的截面形状亦可改为概呈梯型,而定位部74’的截面形状概同于嵌合部73’的截面形状,亦可使探针71’与基座76’相互嵌合。在本发明所提供的各探针结构中,由于是利用接触部接合于芯片的各焊垫,在整体探针的尺寸精度为可容许范围以内,可另于一基板上一样以微电铸制程独立制作出针尖部,再使针尖部与接触部相互连接,其电铸方式可为压模铸造、以光阻图形化开口做为模具加以电铸成形、在基板上蚀刻出针尖型态的开口加以电铸成形,或者是利用化学蚀刻方式、精密机械加工、激光加工、放电加工等等加工方式,使接触部顶端呈尖形。As shown in Figure 16 again, it is the
为了要增加各探针与基座的接合面积,以及探针的结构强度,如图18及图19所示,是为本发明第七较佳实施例所提供探针卡的电性接触装置400,其结构同样包含有一基座402与至少一探针403,特点在于:基座402另具有至少一延伸部404,各延伸部404是以蚀刻方式一体成形于基座402的壁面405,各延伸部404具有二相互间隔的侧壁406,且自各定位部407朝容槽408方向延伸,各探针403则以微电铸制程设于各定位部407与二侧壁406之间,以增加探针403与基座402的结合面积,同时,利用延伸部404的材质结构,使整体悬空于容槽408上的探针403结构较强;而若是基座402为非绝缘体材质制成时,探针403与基座402、延伸部404之间则应设一介电层(如二氧化硅),用以使探针403绝缘于基座402。In order to increase the bonding area between each probe and the base, and the structural strength of the probe, as shown in Figure 18 and Figure 19, an
再如图20及图21所示,是本发明第八较佳实施例的电性接触装置500,其结构与第七较佳实施例大致相同,特点在于:延伸部501是呈长条状地自定位部502朝容槽503方向延伸,探针504则电铸于延伸部501的顶面与底面,各探针504的顶侧及底侧另分别设有一凸垣部505,以同样可增加探针504的结构强度;而如图22及图23所示,各探针504的凸垣505亦可仅设于探针504的顶侧或是底侧。As shown in Figure 20 and Figure 21, it is the
另如图24及图25所示,是为本发明第九较佳实施例的电性接触装置600,其结构与第七较佳实施例大致相同,特点在于:延伸部601是自定位部602的底侧朝容槽603延伸,探针604则设于延伸部601的顶面。As shown in Figure 24 and Figure 25, it is the electrical contact device 600 of the ninth preferred embodiment of the present invention, its structure is roughly the same as that of the seventh preferred embodiment, and the feature is that the
如图26及图27所示,是为本发明第十较佳实施例的电性接触装置700,其结构与第七较佳实施例大致相同,探针701是设于延伸部702的二侧壁703间,特点则在于:二侧壁703外周与定位部704之间另设有一导电部705,由此,除了探针701可用于传输信号以外,导电部705则可作为接地的用途,由此隔绝噪声、增加信号传输频宽。As shown in Fig. 26 and Fig. 27, it is the electrical contact device 700 of the tenth preferred embodiment of the present invention, its structure is roughly the same as that of the seventh preferred embodiment, and the probes 701 are located on both sides of the extension part 702 Between the walls 703, the characteristic is that a conductive part 705 is provided between the outer circumference of the two side walls 703 and the positioning part 704. Therefore, in addition to the probe 701 can be used for signal transmission, the conductive part 705 can be used as a grounding purpose. This isolates noise and increases the bandwidth of signal transmission.
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