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CN100492019C - Electrical contact device of probe card - Google Patents

Electrical contact device of probe card Download PDF

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Publication number
CN100492019C
CN100492019C CNB2005101134964A CN200510113496A CN100492019C CN 100492019 C CN100492019 C CN 100492019C CN B2005101134964 A CNB2005101134964 A CN B2005101134964A CN 200510113496 A CN200510113496 A CN 200510113496A CN 100492019 C CN100492019 C CN 100492019C
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base
electrical contact
contact device
probes
probe
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CN1948971A (en
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陈志忠
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MJC Probe Inc
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Abstract

一种探针卡的电性接触装置,包含有一基座以及至少一探针,基座具有一表面,以及一凹陷于表面的容槽,容槽成形出一邻接于表面的壁面,且于壁面设有至少一定位部,各探针包含有一第一端以及一第二端,各第一端是设于基座的各定位部,使各第二端朝容槽延伸。

Figure 200510113496

An electrical contact device for a probe card includes a base and at least one probe. The base has a surface and a groove recessed in the surface. The groove forms a wall adjacent to the surface and at least one positioning portion is provided on the wall. Each probe includes a first end and a second end. Each first end is provided on each positioning portion of the base so that each second end extends toward the groove.

Figure 200510113496

Description

探针卡的电性接触装置 Electrical Contact Device for Probe Cards

技术领域 technical field

本发明是与探针卡的电性接触装置有关,特别是指一种结构强度较佳的电性接触装置。The present invention relates to an electrical contact device of a probe card, in particular to an electrical contact device with better structural strength.

背景技术 Background technique

在半导体芯片的制造过程中,当芯片制造完成但尚未进行封装制程的前,通常必须先经过一检测程序测试芯片的电路功能;检测程序是利用一探针卡的电性接触装置设于测试机台与芯片之间,电性接触装置具有若干探针,由各探针分别抵接于芯片的焊垫,使测试机的测试信号可来回传送于芯片与测试机之间。In the manufacturing process of semiconductor chips, when the chip is manufactured but before the packaging process, it is usually necessary to go through a test program to test the circuit function of the chip; Between the stage and the chip, the electrical contact device has a plurality of probes, and each probe is respectively abutted against the bonding pad of the chip, so that the test signal of the testing machine can be transmitted back and forth between the chip and the testing machine.

一种现有的电性接触装置80,如图28所示,包含有一基座81,以及若干设于基座81的探针82,各探针82的第一端83是以接合的方式焊设于基座81的表面,而探针82的第二端84则朝基座81的一沟槽85上方延伸,第二端84是用以接触芯片的焊垫,由探针82与基座81之间的结构,使得探针82本身具有弹性,当芯片的各焊垫抵压于各第二端84时,各探针82可较为确实地抵接于各焊垫。A kind of existing electrical contact device 80, as shown in Figure 28, comprises a base 81, and a plurality of probes 82 that are arranged on the base 81, the first end 83 of each probe 82 is welded in the mode of joining. It is arranged on the surface of the base 81, and the second end 84 of the probe 82 extends toward the top of a groove 85 of the base 81. The second end 84 is used to contact the pad of the chip, and the probe 82 and the base The structure between 81 makes the probes 82 themselves elastic, and when the solder pads of the chip are pressed against the second ends 84, the probes 82 can more reliably touch the solder pads.

再如另一种已知的电性接触装置90,如图29所示,其亦包含有一基座91以及若干探针92,探针92的第一端93是直接成形于基座91表面,而第二端94位于基座91的一沟槽95上方,藉以使各探针92的结构同样具有弹性,可利用各第二端94用以接触芯片的焊垫。Another known electrical contact device 90, as shown in Figure 29, also includes a base 91 and a plurality of probes 92, the first end 93 of the probes 92 is directly formed on the surface of the base 91, The second end 94 is located above a groove 95 of the base 91 , so that the structure of each probe 92 is also elastic, and each second end 94 can be used to contact the bonding pad of the chip.

然而,由于半导体芯片的结构尺寸越来越小,芯片具有的焊垫数量越来越多,相对地使得电性接触装置必须在单位面积内所具有的探针数量也越来越多,进而使探针与基座之间可用于相互结合的区域越来越小,在长期反复地进行芯片的测试工作时,探针与基座的结合处容易产生破坏现象,造成探针分离于基座,使电性接触装置发生故障的情形。However, since the structural size of the semiconductor chip is getting smaller and smaller, the number of pads on the chip is increasing, and the number of probes that the electrical contact device must have in a unit area is relatively increasing, so that The area that can be used for mutual bonding between the probe and the base is getting smaller and smaller. When the chip is tested repeatedly for a long time, the joint between the probe and the base is prone to damage, causing the probe to separate from the base. Circumstances that cause failure of electrical contact devices.

发明内容 Contents of the invention

因此,本发明的主要目的乃在于提供一种探针卡的电性接触装置,其所具有的各探针的结构强度较佳,在长期反复地进行测试工作时,各探针较不易产生破坏现象,使电性接触装置不易故障。Therefore, the main purpose of the present invention is to provide an electrical contact device for a probe card, in which the structural strength of each probe is better, and each probe is less likely to be damaged during long-term repeated testing work. Phenomenon, so that the electrical contact device is not easy to fail.

为达成前揭目的,本发明所提供一种探针卡的电性接触装置,其特征在于,包含有:In order to achieve the purpose disclosed above, the present invention provides an electrical contact device for a probe card, which is characterized in that it includes:

一基座,该基座具有一表面,以及一凹陷于该表面的容槽,该容槽成形出至少一邻接于该表面的壁面,且于该等壁面设有至少一定位部;以及A base, the base has a surface, and a receptacle recessed in the surface, the receptacle forms at least one wall adjacent to the surface, and at least one positioning portion is provided on the walls; and

至少一探针,各该探针包含有一第一端以及一第二端,各该第一端是设于该基座的各定位部,使各该第二端朝该容槽延伸。At least one probe, each of the probes includes a first end and a second end, each of the first ends is arranged on each positioning portion of the base, and each of the second ends extends toward the container.

其中该定位部是凹陷于该壁面以及该顶面。Wherein the positioning portion is recessed on the wall surface and the top surface.

其中该基座于对应各该定位部的侧面分别形成出至少一凸部,而各该探针的第一端则具有至少一凹部,该探针是以各凹部对应于该基座的各凸部地嵌设于该定位部。Wherein the base forms at least one protrusion on the side corresponding to each of the positioning parts, and the first end of each of the probes has at least one recess, and each of the recesses of the probe corresponds to each protrusion of the base Partially embedded in the positioning part.

其中各该探针的第一端的截面形状对应于各该定位部的截面形状。Wherein the cross-sectional shape of the first end of each probe corresponds to the cross-sectional shape of each positioning portion.

其中该基座于对应各该定位部的侧面成形出至少一沟槽,各该沟槽的延伸方向平行于该顶面,而各该探针外周则具有至少一嵌条,各该探针可利用各该嵌条嵌入各该沟槽,使得各该探针设于该基座。Wherein the base forms at least one groove on the side corresponding to each of the positioning parts, the extending direction of each of the grooves is parallel to the top surface, and each of the probes has at least one fillet on the outer periphery, and each of the probes can Each of the fillets is used to embed each of the grooves, so that each of the probes is arranged on the base.

其中各该探针的顶面或底面设有一凸垣,该凸垣的延伸方向与各该嵌条相同,该凸垣是嵌设于该基座的沟槽。Wherein the top or bottom surface of each of the probes is provided with a convex wall, the extending direction of the convex wall is the same as that of each fillet, and the convex wall is embedded in the groove of the base.

其中该定位部的截面形状是呈不规则状,而各该探针的截面形状则对应于该定位部的截面形状。The cross-sectional shape of the positioning part is irregular, and the cross-sectional shape of each probe corresponds to the cross-sectional shape of the positioning part.

其中该容槽是自该顶面贯穿于该基座。Wherein the container runs through the base from the top surface.

其中该基座的容槽成形出一第一壁面以及一第二壁面,该第二壁面凸伸于该第一壁面。Wherein the cavity of the base forms a first wall and a second wall, and the second wall protrudes from the first wall.

其中该基座另具有至少一延伸部,各该延伸部是自各该定位部朝该容槽方向延伸,各该探针是设于各该定位部与各该延伸部。Wherein the base further has at least one extension portion, each extension portion extends from each positioning portion toward the storage tank, and each probe is arranged on each positioning portion and each extension portion.

其中各该延伸部具有二相互间隔的侧壁,各该探针是设于该二侧壁之间。Each of the extensions has two sidewalls spaced apart from each other, and each of the probes is disposed between the two sidewalls.

其中各该延伸部是设于各该定位部内,且朝该容槽方向延伸,各该探针设于各该延伸部的顶面或底面。Wherein each of the extension parts is arranged in each of the positioning parts and extends towards the direction of the container, and each of the probes is arranged on the top surface or the bottom surface of each of the extension parts.

其中各该探针的顶侧或底侧另设有一凸垣。Wherein the top side or the bottom side of each of the probes is additionally provided with a convex wall.

其中各该延伸部与各该定位部之间另设有一导电部,各该导电部是用以作为接地。A conductive part is further provided between each of the extension parts and each of the positioning parts, and each of the conductive parts is used as a ground.

本发明一种探针卡的电性接触装置,其特征在于,包含有:An electrical contact device for a probe card of the present invention is characterized in that it includes:

一基座,该基座具有一表面,以及一凹陷于该表面的容槽,该表面设有至少一定位部,该定位部亦凹陷于该表面;以及a base, the base has a surface, and a receptacle recessed in the surface, the surface is provided with at least one positioning portion, and the positioning portion is also recessed in the surface; and

至少一探针,各该探针包含有一第一端以及一第二端,各该第一端是设于该基座的各定位部,使各该第二端朝该容槽延伸。At least one probe, each of the probes includes a first end and a second end, each of the first ends is arranged on each positioning portion of the base, and each of the second ends extends toward the container.

其中该基座于对应各该定位部的侧面分别形成出至少一凸部,而各该探针的第一端则具有至少一凹部,该探针是以各凹部对应于该基座的各凸部地嵌设于该定位部。Wherein the base forms at least one protrusion on the side corresponding to each of the positioning parts, and the first end of each of the probes has at least one recess, and each of the recesses of the probe corresponds to each protrusion of the base Partially embedded in the positioning part.

其中各该探针的第一端的截面形状对应于各该定位部的截面形状。Wherein the cross-sectional shape of the first end of each probe corresponds to the cross-sectional shape of each positioning portion.

其中该基座于对应各该定位部的侧面成形出至少一沟槽,各该沟槽的延伸方向平行于该顶面,而各该探针外周则具有至少一嵌条,各该探针可利用各该嵌条嵌入各该沟槽,使得各该探针设于该基座。Wherein the base forms at least one groove on the side corresponding to each of the positioning parts, the extending direction of each of the grooves is parallel to the top surface, and each of the probes has at least one fillet on the outer periphery, and each of the probes can Each of the fillets is used to embed each of the grooves, so that each of the probes is arranged on the base.

其中各该探针的顶面或底面设有一凸垣,该凸垣的延伸方向与各该嵌条相同,该凸垣是嵌设于该基座的沟槽。Wherein the top or bottom surface of each of the probes is provided with a convex wall, the extending direction of the convex wall is the same as that of each fillet, and the convex wall is embedded in the groove of the base.

其中该定位部的截面形状是呈不规则状,而各该探针的截面形状则对应于该定位部的截面形状。The cross-sectional shape of the positioning part is irregular, and the cross-sectional shape of each probe corresponds to the cross-sectional shape of the positioning part.

其中该容槽是自该顶面贯穿于该基座。Wherein the container runs through the base from the top surface.

本发明一种电性接触装置的制法,其特征在于,包含有下列步骤:A method for making an electrical contact device of the present invention is characterized in that it comprises the following steps:

a.制备一基座,该基座具有一顶面以及一底面;a. preparing a base, the base has a top surface and a bottom surface;

b.自该基座的顶面蚀刻出一呈凹陷状的第一空间;b. etching a recessed first space from the top surface of the base;

c.于该基座的第一空间与顶面施行光阻成形以及微电铸制程,使该基座成形出多数探针与多层牺牲层,各该探针具有一第一端与一第二端,该第二端具有一接触部;c. Perform photoresist forming and micro-electroforming processes on the first space and the top surface of the base, so that the base is formed with a plurality of probes and multi-layer sacrificial layers, each probe has a first end and a first end two ends, the second end has a contact portion;

d.于该基座的底面蚀刻出一容槽,该容槽的位置对应于该等探针的第二端下方;以及d. Etching a cavity on the bottom surface of the base, the position of the cavity corresponds to the bottom of the second ends of the probes; and

e.移除各该牺牲层,即可于该基座形成出各该探针,各该探针的第一端是设于该基座,各该探针的第二端则朝该容槽延伸。e. removing each of the sacrificial layers, each of the probes can be formed on the base, the first end of each of the probes is located on the base, and the second end of each of the probes is facing the cavity extend.

其中该基座是可利用硅材质、SOI基座、介电基座,或是表面具有介电材质的基座所制成。The pedestal can be made of silicon material, SOI pedestal, dielectric pedestal, or a pedestal with dielectric material on its surface.

其中于该步骤b之后,是可于该基座与各该探针相互结合的表面预先铺设介电材质,使各该探针保持绝缘状态。Wherein after the step b, a dielectric material can be pre-laid on the surface where the base and each of the probes are combined to keep each of the probes in an insulating state.

其中于该步骤d时,是利用一第一蚀刻制程自该基座顶面蚀刻出一第一壁面,再利用一第二蚀刻制程自该基座的底面蚀刻出一第二壁面,并使该基座成形出该容槽,而该第一壁面是凸伸于该第二壁面。Wherein in the step d, a first wall surface is etched from the top surface of the base by using a first etching process, and a second wall surface is etched from the bottom surface of the base by a second etching process, and the The base forms the cavity, and the first wall protrudes from the second wall.

其中该步骤b的蚀刻制程亦可以激光加工方式取代。The etching process in step b can also be replaced by laser processing.

由此,本发明即可利用探针与基座相互结合的构造,使整体电性接触装置的结构强度较佳,达到在进行长期反复的测试工作,各探针较不易产生破坏现象,而且电性接触装置不易故障的目的。Thus, the present invention can utilize the structure that the probes and the base are combined with each other, so that the structural strength of the overall electrical contact device is better, so that the probes are less likely to be damaged during long-term repeated test work, and the electrical contacts The purpose of making sexual contact devices less prone to failure.

附图说明 Description of drawings

以下,配合附图列举若干较佳实施例,用以对本发明的结构与功效做详细说明,其中所用各图式的简要说明如下,其中:Below, a number of preferred embodiments are listed in conjunction with the accompanying drawings, in order to describe the structure and effect of the present invention in detail, wherein the brief description of each drawing used is as follows, wherein:

图1是本发明第一较佳实施例的立体图;Fig. 1 is the perspective view of the first preferred embodiment of the present invention;

图2是图1中2-2剖线的剖视图;Fig. 2 is the sectional view of 2-2 section line in Fig. 1;

图3是本发明第一较佳实施例的制法示意图;Fig. 3 is the method schematic diagram of the first preferred embodiment of the present invention;

图4是本发明第一较佳实施例的制法示意图;Fig. 4 is the method schematic diagram of the first preferred embodiment of the present invention;

图5是本发明第一较佳实施例的制法示意图;Fig. 5 is the method schematic diagram of the first preferred embodiment of the present invention;

图6是本发明第一较佳实施例的制法示意图;Fig. 6 is the method schematic diagram of the first preferred embodiment of the present invention;

图7是本发明第一较佳实施例的制法示意图;Fig. 7 is the method schematic diagram of the first preferred embodiment of the present invention;

图8是本发明第一较佳实施例的制法示意图;Fig. 8 is the method schematic diagram of the first preferred embodiment of the present invention;

图9是本发明第一较佳实施例的另一实施态样;Fig. 9 is another implementation aspect of the first preferred embodiment of the present invention;

图10是本发明第二较佳实施例的局部剖面示意图,主要是显示探针与基座相互结合的状态;Fig. 10 is a schematic partial cross-sectional view of the second preferred embodiment of the present invention, mainly showing the state that the probe and the base are combined with each other;

图11是本发明第三较佳实施例的局部剖面示意图,主要是显示探针与基座相互结合的状态;Fig. 11 is a partial cross-sectional schematic view of the third preferred embodiment of the present invention, mainly showing the state of the probe and the base combined with each other;

图12是本发明第四较佳实施例的局部剖面示意图,主要是显示探针与基座相互结合的状态;Fig. 12 is a partial cross-sectional schematic view of the fourth preferred embodiment of the present invention, mainly showing the state that the probe and the base are combined with each other;

图13是本发明第四较佳实施例的另一实施态样;Fig. 13 is another implementation aspect of the fourth preferred embodiment of the present invention;

图14是本发明第四较佳实施例的又一实施态样;Fig. 14 is another implementation aspect of the fourth preferred embodiment of the present invention;

图15是本发明第五较佳实施例的局部剖面示意图,主要是显示探针与基座相互结合的状态;Fig. 15 is a partial cross-sectional schematic view of the fifth preferred embodiment of the present invention, mainly showing the state of the probe and the base combined with each other;

图16是本发明第六较佳实施例的局部剖面示意图,主要是显示探针与基座相互结合的状态;Fig. 16 is a partial cross-sectional schematic view of the sixth preferred embodiment of the present invention, mainly showing the state of the probe and the base combined with each other;

图17是本发明第六较佳实施例的另一实施态样;Fig. 17 is another implementation aspect of the sixth preferred embodiment of the present invention;

图18是本发明第七较佳实施例的局部立体图;Fig. 18 is a partial perspective view of a seventh preferred embodiment of the present invention;

19图是图18中19-19剖线的剖视图;Figure 19 is a cross-sectional view of line 19-19 in Figure 18;

图20是本发明第八较佳实施例的局部立体图;Fig. 20 is a partial perspective view of an eighth preferred embodiment of the present invention;

图21是图20中21-21剖线的剖视图;Fig. 21 is a sectional view of section line 21-21 in Fig. 20;

图22是本发明第八较佳实施例的一实施态样;Fig. 22 is an implementation aspect of the eighth preferred embodiment of the present invention;

图23是本发明第八较佳实施例的另一实施态样;Fig. 23 is another implementation aspect of the eighth preferred embodiment of the present invention;

图24是本发明第九较佳实施例的局部立体图;Fig. 24 is a partial perspective view of a ninth preferred embodiment of the present invention;

图25是图24中25-25剖线的剖视图;Fig. 25 is a cross-sectional view of line 25-25 in Fig. 24;

图26是本发明第十较佳实施例的局部立体图;Fig. 26 is a partial perspective view of a tenth preferred embodiment of the present invention;

图27是图26中27-27剖线的剖视图。Fig. 27 is a sectional view taken along line 27-27 in Fig. 26 .

图28是为一现有电性接触装置的示意图;以及Figure 28 is a schematic diagram of a conventional electrical contact device; and

图29是为另一现有电性接触装置的示意图。FIG. 29 is a schematic diagram of another conventional electrical contact device.

具体实施方式 Detailed ways

请参阅图1及图2所示,是为本发明第一较佳实施例所提供探针卡的电性接触装置10,电性接触装置10包含有一基座20以及多数探针30;基座20是以硅制成,基座20具有一顶面21,顶面21中央具有一呈凹陷状的容槽22,容槽22成形出四邻接于顶面21的壁面23,二相对的壁面23分设有多数定位部24,各定位部24是凹陷于各壁面23以及顶面21;基座20内另设有多数导电线路25。Please refer to Fig. 1 and shown in Fig. 2, it is the electrical contact device 10 of the probe card provided by the first preferred embodiment of the present invention, the electrical contact device 10 comprises a base 20 and a plurality of probes 30; 20 is made of silicon, the base 20 has a top surface 21, the center of the top surface 21 has a recessed container 22, the container 22 forms four walls 23 adjacent to the top surface 21, two opposite wall surfaces 23 A plurality of positioning portions 24 are respectively provided, and each positioning portion 24 is recessed in each wall surface 23 and the top surface 21 ; a plurality of conductive circuits 25 are also provided in the base 20 .

各该探针30是为利用导电材质所制成的杆体,各探针30具有一第一端31以及一第二端32,第一端31的截面形状概同于基座20的定位部24的截面形状,第二端32具有一概呈垂直状的接触部33,各探针30的第一端31是嵌固于各定位部24,探针30与顶面21相互齐平,并且与导电线路25相互电性连通,而各第二端32朝容槽22延伸,各接触部33朝向顶面21的上方。Each of the probes 30 is a rod made of conductive material. Each probe 30 has a first end 31 and a second end 32. The cross-sectional shape of the first end 31 is similar to that of the positioning portion 24 of the base 20. The cross-sectional shape, the second end 32 has a generally vertical contact portion 33, the first end 31 of each probe 30 is embedded in each positioning portion 24, the probe 30 and the top surface 21 are flush with each other, and are connected to the conductive The lines 25 are electrically connected to each other, and each second end 32 extends toward the container 22 , and each contact portion 33 faces upward of the top surface 21 .

如图3至图8所示,是为本发明一较佳实施例的电性接触装置10的制造方法,其包含有下列步骤:As shown in FIGS. 3 to 8 , it is a manufacturing method of an electrical contact device 10 according to a preferred embodiment of the present invention, which includes the following steps:

步骤一:如图3所示,制备一材质为硅的基座20,使基座20具有一顶面21以及一底面26。Step 1: As shown in FIG. 3 , prepare a base 20 made of silicon, so that the base 20 has a top surface 21 and a bottom surface 26 .

步骤二:如图4所示,以蚀刻或是激光加工的方式,自基座20的顶面21成形出一呈凹陷状的第一空间27。Step 2: As shown in FIG. 4 , form a concave first space 27 from the top surface 21 of the base 20 by etching or laser processing.

步骤三:如图5至图6所示,于基座20的第一空间27与顶面21施行光阻成形以及微电铸制程,使基座20成形出多数探针30与多层牺牲层28,各探针30具有一第一端31与一第二端32,第二端32具有一接触部33;若希望更精确控制探针30的厚度尺寸,可于微电铸制程后,进一步以精密研磨探针30表面,使探针30表面呈平坦化并研磨至所希望的厚度。Step 3: As shown in FIG. 5 to FIG. 6 , perform photoresist forming and micro-electroforming processes on the first space 27 and the top surface 21 of the base 20 to form a plurality of probes 30 and multi-layer sacrificial layers on the base 20 28. Each probe 30 has a first end 31 and a second end 32, and the second end 32 has a contact portion 33; if you want to control the thickness of the probe 30 more precisely, you can further The surface of the probe 30 is precisely ground to make the surface of the probe 30 flat and ground to a desired thickness.

步骤四:如图7所示,利用等向性干蚀刻或是湿蚀刻方式自基座20的底面26蚀刻出一容槽22,容槽22的位置对应于探针30的第二端32下方。Step 4: As shown in FIG. 7 , etch a cavity 22 from the bottom surface 26 of the base 20 by isotropic dry etching or wet etching, the position of the cavity 22 corresponds to the position below the second end 32 of the probe 30 .

步骤五:如图8所示,移除各牺牲层28,即可于基座20形成出各探针30的结构,各探针30的第一端31是设于基座20,探针30的第二端32则朝容槽22延伸。Step 5: As shown in FIG. 8 , remove each sacrificial layer 28 to form the structure of each probe 30 on the base 20 , the first end 31 of each probe 30 is arranged on the base 20 , and the probe 30 The second end 32 extends toward the tank 22 .

基座20除了可利用硅材质制成以外,还可使用SOI(Silicon onInsulator)基座、介电基座,或是表面具有介电材质的基座;而在电铸各探针30之前,亦可于基座20与探针30相互结合的表面预先铺设介电材质,使各探针30确实保持绝缘状态;介电材质的铺设方式可为化学沉积方式,或者是高温炉管生成如氧化硅、氮化硅等材质。In addition to being made of silicon material, the base 20 can also use an SOI (Silicon on Insulator) base, a dielectric base, or a base with a dielectric material on the surface; and before electroforming each probe 30, also A dielectric material can be pre-laid on the surface where the base 20 and the probes 30 are combined to keep each probe 30 in an insulating state; the laying method of the dielectric material can be chemical deposition, or high-temperature furnace tubes such as silicon oxide , silicon nitride and other materials.

如图7与图8所示,由于自基座20的底面30蚀刻出容槽22时,容槽22的开口尺寸不易控制,若是在移除牺牲层28之后,各探针30悬空于容槽22壁面23的距离皆不相同,就会直接影响到各探针30的弹性、刚性与探针30的阻抗的一致性;为了能较为容易且精确地控制各探针30凸伸于容槽22的长度,使各探针30可弹性变形的长度一致,进而提升探针30的接触阻抗的一致性,如图9所示,可使容槽22’形成出一开口尺寸大于探针30’悬空范围的第一壁面36’,此时探针30’将由定位部24’的侧壁所夹持固定,而探针30’悬空于容槽22’的长度是自一第二壁面37’开始,由于制作定位部24’时的尺寸精度与探针30’的精度一致,因此可较为容易地控制各探针30’凸伸于容槽22’的长度。As shown in FIGS. 7 and 8 , since the opening size of the cavity 22 is not easy to control when the cavity 22 is etched from the bottom surface 30 of the base 20 , if the probes 30 are suspended in the cavity after the sacrificial layer 28 is removed 22 The distances between the walls 23 are all different, which will directly affect the consistency of the elasticity and rigidity of the probes 30 and the impedance of the probes 30; length, so that the elastically deformable lengths of the probes 30 are the same, thereby improving the consistency of the contact impedance of the probes 30. As shown in FIG. The first wall surface 36' of the range, at this time, the probe 30' will be clamped and fixed by the side wall of the positioning part 24', and the length of the probe 30' hanging in the cavity 22' starts from a second wall surface 37', Since the dimensional accuracy of the positioning portion 24 ′ is consistent with that of the probes 30 ′, it is relatively easy to control the length of each probe 30 ′ protruding from the cavity 22 ′.

经由上述结构与制法的说明,当电性接触装置10应用于一探针卡(图中未示)时,各探针30的接触部33是抵接于一芯片的各焊垫,芯片所下压的力量会推动各探针30的第二端32,使各探针30的第二端32朝容槽22方向移动,探针30身部则呈弯曲状,由各探针30的第一端31嵌固于基座20的各定位部24,各探针30可具有预定弹性,芯片的各焊垫与各探针30之间即可确实地相互抵接;同时,利用定位部24结合于探针30的结构,增加了探针30与基座20相互之间的接触面积,以及可承受应力的部位,各探针30在经过长时间以及多次地与各焊垫相互抵接之后,各第一端31仍可稳固地与各定位部24相互结合,进而发生探针30与基座20相互分离的状况。Through the description of the above structure and manufacturing method, when the electrical contact device 10 is applied to a probe card (not shown in the figure), the contact portions 33 of each probe 30 are in contact with each pad of a chip, and the chip is The force of pressing down will push the second end 32 of each probe 30, so that the second end 32 of each probe 30 will move towards the direction of the reservoir 22, and the body of the probe 30 will be curved, and the second end 32 of each probe 30 will be bent. One end 31 is embedded in each positioning part 24 of the base 20, and each probe 30 can have a predetermined elasticity, and each solder pad of the chip and each probe 30 can abut against each other reliably; at the same time, using the positioning part 24 Combined with the structure of the probe 30, the contact area between the probe 30 and the base 20 is increased, and the parts that can withstand stress are increased. After a long time and multiple times, each probe 30 is in contact with each pad. Afterwards, each first end 31 can still be firmly combined with each positioning portion 24 , and then the probe 30 and the base 20 are separated from each other.

由此,本发明即可利用探针与基座相互之间的结构,使整体电性接触装置的结构强度较佳,达到在进行长期反复的测试工作,各探针较不易产生破坏现象,而且电性接触装置不易故障的目的。Thus, the present invention can utilize the structure between the probe and the base to make the structural strength of the overall electrical contact device better, so that the probes are less likely to be damaged during long-term repeated test work, and The purpose of the electrical contact device is not easy to fail.

上揭实施例中的定位部与各探针相互结合的结构,亦可改为其它形状,同样可达到本发明的目的;如图10所示,是为本发明第二较佳实施例所提供的电性接触装置40,其主要组成构件与第一较佳实施例相同,特点在于:基座41于各定位部42的二侧面分别具有一凸部43,各凸部43是呈凸起状,而各探针44的第一端45二外周面则分别具有一凹部46,各探针44是以各凹部46对应于基座41的各凸部43的方式嵌设于定位部42,使探针44与基座41相互结合。The structure in which the positioning part and the probes in the above embodiment are combined with each other can also be changed to other shapes, which can also achieve the purpose of the present invention; as shown in Figure 10, it is provided for the second preferred embodiment of the present invention The electrical contact device 40 of the present invention has the same main components as those of the first preferred embodiment, and is characterized in that: the base 41 has a convex portion 43 on the two sides of each positioning portion 42, and each convex portion 43 is in a convex shape. , and the two outer peripheral surfaces of the first end 45 of each probe 44 respectively have a concave portion 46, and each probe 44 is embedded in the positioning portion 42 in such a way that each concave portion 46 corresponds to each convex portion 43 of the base 41, so that The probe 44 is combined with the base 41 .

如图11所示,是为本发明第三较佳实施例所提供的电性接触装置50,其特点在于:基座51于各定位部52的二侧面56是分别自壁面53呈渐扩状地向内延伸,而各探针54的第一端55的截面形状则对应于定位部52的截面形状,使探针54的第一端55可沿二侧面56嵌入定位部52,并使探针54的身部自壁面53向外侧延伸。As shown in Figure 11, it is the electrical contact device 50 provided for the third preferred embodiment of the present invention, and its characteristic is that: the two side surfaces 56 of each positioning part 52 of the base 51 are respectively gradually expanding from the wall surface 53 Extend inwardly, and the cross-sectional shape of the first end 55 of each probe 54 corresponds to the cross-sectional shape of the positioning part 52, so that the first end 55 of the probe 54 can be embedded in the positioning part 52 along the two sides 56, and the probe The body of the needle 54 extends outward from the wall 53 .

如图12所示,是为本发明第四较佳实施例所提供的电性接触装置60,其特点在于:基座61于定位部62的二侧面分别成形出多数沟槽63,各沟槽63的延伸方向概略平行于顶面64,而各探针65外周则具有多数嵌条66,各探针65可利用各嵌条66嵌入各沟槽63的方式,使得探针65设于基座61的定位部62;再如图13及图14所示,探针65’的顶面或底面皆可增设一凸垣67’,而探针65’嵌入基座61’的定位部62’,即可再增加探针65’与基座61’之间的结合强度;而探针65’底面的凸垣67’可先以等向性蚀刻方式形成凸垣67’的外型空间后,再以电铸方式成形,而顶面的凸垣67’则可利用光阻成形与微电铸制程堆栈成形。As shown in Figure 12, it is the electrical contact device 60 provided for the fourth preferred embodiment of the present invention, and its characteristic is that: the base 61 forms a plurality of grooves 63 respectively on the two sides of the positioning part 62, and each groove The extending direction of 63 is roughly parallel to the top surface 64, and the outer periphery of each probe 65 has a plurality of fillets 66, and each probe 65 can be embedded in each groove 63 by each fillet 66, so that the probes 65 are arranged on the base 61 of the positioning portion 62; as shown in Figure 13 and Figure 14, the probe 65 'top or bottom surface can be added a convex wall 67', and the probe 65' embedded in the base 61 'positioning portion 62', That is to say, the bonding strength between the probe 65' and the base 61' can be increased; and the convex wall 67' on the bottom surface of the probe 65' can be formed by isotropic etching to form the outer space of the convex wall 67', and then It is formed by electroforming, and the convex wall 67' on the top surface can be formed by stacking photoresist forming and micro-electroforming process.

另如图15所示,是为本发明第五较佳实施例所提供的电性接触装置66,特点在于定位部67的截面形状是呈不规则形状,而探针68的截面形状则对应于定位部67的截面形状,由此,探针68仍可与基座69相互结合(唯各探针的不规则形状彼此差异不可过大,以不影响电性规格为原则)。As shown in Figure 15, it is the electrical contact device 66 provided by the fifth preferred embodiment of the present invention. The cross-sectional shape of the positioning portion 67, so that the probe 68 can still be combined with the base 69 (provided that the irregular shapes of the probes cannot be too different from each other, so as not to affect the electrical specifications).

再如图16所示,是为本发明第六较佳实施例所提供的电性接触装置70,特点在于各探针71的第一端72具有一呈垂直状的嵌合部73,而各定位部74则是凹陷于顶面75,各探针71的嵌合部73嵌固于各定位部74,可使探针71结合于基座76;而同样地,如图17所示,探针71’的嵌合部73’的截面形状亦可改为概呈梯型,而定位部74’的截面形状概同于嵌合部73’的截面形状,亦可使探针71’与基座76’相互嵌合。在本发明所提供的各探针结构中,由于是利用接触部接合于芯片的各焊垫,在整体探针的尺寸精度为可容许范围以内,可另于一基板上一样以微电铸制程独立制作出针尖部,再使针尖部与接触部相互连接,其电铸方式可为压模铸造、以光阻图形化开口做为模具加以电铸成形、在基板上蚀刻出针尖型态的开口加以电铸成形,或者是利用化学蚀刻方式、精密机械加工、激光加工、放电加工等等加工方式,使接触部顶端呈尖形。As shown in Figure 16 again, it is the electrical contact device 70 provided for the sixth preferred embodiment of the present invention, which is characterized in that the first end 72 of each probe 71 has a vertical fitting portion 73, and each The positioning portion 74 is recessed in the top surface 75, and the fitting portion 73 of each probe 71 is embedded in each positioning portion 74, so that the probe 71 can be combined with the base 76; and similarly, as shown in Figure 17, the probe The cross-sectional shape of the fitting part 73' of the needle 71' can also be substantially trapezoidal, and the cross-sectional shape of the positioning part 74' is roughly the same as the cross-sectional shape of the fitting part 73', and the probe 71' can also be connected to the base. Seats 76' fit into each other. In each probe structure provided by the present invention, since the contact parts are used to bond to the pads of the chip, the dimensional accuracy of the overall probe is within the allowable range, and the same micro-electroforming process can be used on a substrate. Independently manufacture the tip part, and then connect the tip part and the contact part. The electroforming method can be die casting, using the photoresist patterned opening as a mold for electroforming, and etching the tip-shaped opening on the substrate. Electroforming is performed, or chemical etching, precision machining, laser machining, electrical discharge machining and other processing methods are used to make the top of the contact part in a pointed shape.

为了要增加各探针与基座的接合面积,以及探针的结构强度,如图18及图19所示,是为本发明第七较佳实施例所提供探针卡的电性接触装置400,其结构同样包含有一基座402与至少一探针403,特点在于:基座402另具有至少一延伸部404,各延伸部404是以蚀刻方式一体成形于基座402的壁面405,各延伸部404具有二相互间隔的侧壁406,且自各定位部407朝容槽408方向延伸,各探针403则以微电铸制程设于各定位部407与二侧壁406之间,以增加探针403与基座402的结合面积,同时,利用延伸部404的材质结构,使整体悬空于容槽408上的探针403结构较强;而若是基座402为非绝缘体材质制成时,探针403与基座402、延伸部404之间则应设一介电层(如二氧化硅),用以使探针403绝缘于基座402。In order to increase the bonding area between each probe and the base, and the structural strength of the probe, as shown in Figure 18 and Figure 19, an electrical contact device 400 for the probe card is provided for the seventh preferred embodiment of the present invention , its structure also includes a base 402 and at least one probe 403, characterized in that: the base 402 has at least one extension 404, each extension 404 is integrally formed on the wall 405 of the base 402 by etching, and each extension The part 404 has two sidewalls 406 spaced apart from each other, and extends from each positioning part 407 toward the direction of the container 408, and each probe 403 is arranged between each positioning part 407 and the two sidewalls 406 by a micro-electroforming process to increase the probe. The combined area of the needle 403 and the base 402, at the same time, utilize the material structure of the extension part 404 to make the structure of the probe 403 suspended on the tank 408 as a whole stronger; and if the base 402 is made of non-insulator material, the probe A dielectric layer (such as silicon dioxide) should be provided between the needle 403 and the base 402 and the extension 404 to insulate the probe 403 from the base 402 .

再如图20及图21所示,是本发明第八较佳实施例的电性接触装置500,其结构与第七较佳实施例大致相同,特点在于:延伸部501是呈长条状地自定位部502朝容槽503方向延伸,探针504则电铸于延伸部501的顶面与底面,各探针504的顶侧及底侧另分别设有一凸垣部505,以同样可增加探针504的结构强度;而如图22及图23所示,各探针504的凸垣505亦可仅设于探针504的顶侧或是底侧。As shown in Figure 20 and Figure 21, it is the electrical contact device 500 of the eighth preferred embodiment of the present invention, its structure is roughly the same as that of the seventh preferred embodiment, and the feature is that the extension part 501 is elongated Extending from the positioning portion 502 toward the container 503, the probes 504 are electroformed on the top and bottom surfaces of the extension portion 501, and the top and bottom sides of each probe 504 are respectively provided with a raised wall portion 505, which can also be increased. structural strength of the probe 504; and as shown in FIG. 22 and FIG.

另如图24及图25所示,是为本发明第九较佳实施例的电性接触装置600,其结构与第七较佳实施例大致相同,特点在于:延伸部601是自定位部602的底侧朝容槽603延伸,探针604则设于延伸部601的顶面。As shown in Figure 24 and Figure 25, it is the electrical contact device 600 of the ninth preferred embodiment of the present invention, its structure is roughly the same as that of the seventh preferred embodiment, and the feature is that the extension part 601 is a self-positioning part 602 The bottom side of the extension portion 601 extends toward the container 603 , and the probe 604 is disposed on the top surface of the extension portion 601 .

如图26及图27所示,是为本发明第十较佳实施例的电性接触装置700,其结构与第七较佳实施例大致相同,探针701是设于延伸部702的二侧壁703间,特点则在于:二侧壁703外周与定位部704之间另设有一导电部705,由此,除了探针701可用于传输信号以外,导电部705则可作为接地的用途,由此隔绝噪声、增加信号传输频宽。As shown in Fig. 26 and Fig. 27, it is the electrical contact device 700 of the tenth preferred embodiment of the present invention, its structure is roughly the same as that of the seventh preferred embodiment, and the probes 701 are located on both sides of the extension part 702 Between the walls 703, the characteristic is that a conductive part 705 is provided between the outer circumference of the two side walls 703 and the positioning part 704. Therefore, in addition to the probe 701 can be used for signal transmission, the conductive part 705 can be used as a grounding purpose. This isolates noise and increases the bandwidth of signal transmission.

Claims (26)

1.一种探针卡的电性接触装置,其特征在于,包含有:1. An electrical contact device for a probe card, characterized in that it comprises: 一基座,该基座具有一表面,以及一凹陷于该表面的容槽,该容槽成形出至少一邻接于该表面的壁面,且于该等壁面设有至少一定位部;以及A base, the base has a surface, and a receptacle recessed in the surface, the receptacle forms at least one wall adjacent to the surface, and at least one positioning portion is provided on the walls; and 至少一探针,各该探针包含有一第一端以及一第二端,各该第一端是设于该基座的各定位部,使各该第二端朝该容槽延伸。At least one probe, each of the probes includes a first end and a second end, each of the first ends is arranged on each positioning portion of the base, and each of the second ends extends toward the container. 2.依据权利要求1所述的探针卡的电性接触装置,其特征在于,其中该定位部是凹陷于该壁面以及该顶面。2 . The electrical contact device for a probe card according to claim 1 , wherein the positioning portion is recessed in the wall surface and the top surface. 3 . 3.依据权利要求2所述的探针卡的电性接触装置,其特征在于,其中该基座于对应各该定位部的侧面分别形成出至少一凸部,而各该探针的第一端则具有至少一凹部,该探针是以各凹部对应于该基座的各凸部地嵌设于该定位部。3. The electrical contact device for a probe card according to claim 2, wherein at least one convex portion is formed on the side of the base corresponding to each of the positioning portions, and the first of each of the probes The end has at least one concave portion, and the probe is embedded in the positioning portion with each concave portion corresponding to each convex portion of the base. 4.依据权利要求2所述的探针卡的电性接触装置,其特征在于,其中各该探针的第一端的截面形状对应于各该定位部的截面形状。4 . The electrical contact device for a probe card according to claim 2 , wherein the cross-sectional shape of the first end of each probe corresponds to the cross-sectional shape of each positioning portion. 5.依据权利要求2所述的探针卡的电性接触装置,其特征在于,其中该基座于对应各该定位部的侧面成形出至少一沟槽,各该沟槽的延伸方向平行于该顶面,而各该探针外周则具有至少一嵌条,各该探针可利用各该嵌条嵌入各该沟槽,使得各该探针设于该基座。5. The electrical contact device for a probe card according to claim 2, wherein at least one groove is formed on the side of the base corresponding to each positioning portion, and the extending direction of each groove is parallel to The top surface and the periphery of each of the probes have at least one fillet, and each of the probes can be inserted into each of the grooves by using each of the fillets, so that each of the probes is arranged on the base. 6.依据权利要求5所述的探针卡的电性接触装置,其特征在于,其中各该探针的顶面或底面设有一凸垣,该凸垣的延伸方向与各该嵌条相同,该凸垣嵌设于该基座的沟槽。6. The electrical contact device for a probe card according to claim 5, wherein a convex wall is provided on the top or bottom surface of each of the probes, and the extending direction of the convex wall is the same as that of each of the molding strips, The convex wall is embedded in the groove of the base. 7.依据权利要求2所述的探针卡的电性接触装置,其特征在于,其中该定位部的截面形状是呈不规则状,而各该探针的截面形状则对应于该定位部的截面形状。7. The electrical contact device for a probe card according to claim 2, wherein the cross-sectional shape of the positioning portion is irregular, and the cross-sectional shape of each probe corresponds to that of the positioning portion Section shape. 8.依据权利要求1所述的探针卡的电性接触装置,其特征在于,其中该容槽是自该顶面贯穿于该基座。8 . The electrical contact device of a probe card according to claim 1 , wherein the cavity penetrates the base from the top surface. 9.依据权利要求1所述的探针卡的电性接触装置,其特征在于,其中该基座的容槽成形出一第一壁面以及一第二壁面,该第二壁面凸伸于该第一壁面。9. The electrical contact device for a probe card according to claim 1, wherein the cavity of the base forms a first wall and a second wall, and the second wall protrudes from the first wall a wall. 10.依据权利要求1所述的探针卡的电性接触装置,其特征在于,其中该基座另具有至少一延伸部,各该延伸部是自各该定位部朝该容槽方向延伸,各该探针是设于各该定位部与各该延伸部。10. The electrical contact device for a probe card according to claim 1, wherein the base further has at least one extension portion, each of the extension portions extends from each of the positioning portions toward the direction of the cavity, each The probes are arranged on each of the positioning parts and each of the extension parts. 11.依据权利要求10所述的探针卡的电性接触装置,其特征在于,其中各该延伸部具有二相互间隔的侧壁,各该探针是设于该二侧壁之间。11 . The electrical contact device for a probe card according to claim 10 , wherein each of the extensions has two side walls spaced apart from each other, and each of the probes is disposed between the two side walls. 12.依据权利要求10所述的探针卡的电性接触装置,其特征在于,其中各该延伸部是设于各该定位部内,且朝该容槽方向延伸,各该探针设于各该延伸部的顶面或底面。12. The electrical contact device for a probe card according to claim 10, wherein each of the extension parts is arranged in each of the positioning parts and extends toward the direction of the cavity, and each of the probes is arranged in each of the positioning parts. The top or bottom surface of the extension. 13.依据权利要求12所述的探针卡的电性接触装置,其特征在于,其中各该探针的顶侧或底侧另设有一凸垣。13. The electrical contact device for a probe card according to claim 12, wherein a protrusion is further provided on the top side or the bottom side of each of the probes. 14.依据权利要求10所述的探针卡的电性接触装置,其特征在于,其中各该延伸部与各该定位部之间另设有一导电部,各该导电部是用以作为接地。14 . The electrical contact device for a probe card according to claim 10 , wherein a conductive part is further provided between each of the extension parts and each of the positioning parts, and each of the conductive parts is used as a ground. 15.一种探针卡的电性接触装置,其特征在于,包含有:15. An electrical contact device for a probe card, characterized in that it comprises: 一基座,该基座具有一表面,以及一凹陷于该表面的容槽,该表面设有至少一定位部,该定位部亦凹陷于该表面;以及a base, the base has a surface, and a receptacle recessed in the surface, the surface is provided with at least one positioning portion, and the positioning portion is also recessed in the surface; and 至少一探针,各该探针包含有一第一端以及一第二端,各该第一端是设于该基座的各定位部,使各该第二端朝该容槽延伸。At least one probe, each of the probes includes a first end and a second end, each of the first ends is arranged on each positioning portion of the base, and each of the second ends extends toward the container. 16.依据权利要求15所述的探针卡的电性接触装置,其特征在于,其中该基座于对应各该定位部的侧面分别形成出至少一凸部,而各该探针的第一端则具有至少一凹部,该探针是以各凹部对应于该基座的各凸部地嵌设于该定位部。16. The electrical contact device for a probe card according to claim 15, wherein at least one convex portion is formed on the side of the base corresponding to each of the positioning portions, and the first of each of the probes The end has at least one concave portion, and the probe is embedded in the positioning portion with each concave portion corresponding to each convex portion of the base. 17.依据权利要求15所述的探针卡的电性接触装置,其特征在于,其中各该探针的第一端的截面形状对应于各该定位部的截面形状。17. The electrical contact device of a probe card according to claim 15, wherein the cross-sectional shape of the first end of each probe corresponds to the cross-sectional shape of each positioning portion. 18.依据权利要求15所述的探针卡的电性接触装置,其特征在于,其中该基座于对应各该定位部的侧面成形出至少一沟槽,各该沟槽的延伸方向平行于该顶面,而各该探针外周则具有至少一嵌条,各该探针可利用各该嵌条嵌入各该沟槽,使得各该探针设于该基座。18. The electrical contact device for a probe card according to claim 15, wherein at least one groove is formed on the side of the base corresponding to each positioning portion, and the extending direction of each groove is parallel to The top surface and the periphery of each of the probes have at least one fillet, and each of the probes can be inserted into each of the grooves by using each of the fillets, so that each of the probes is arranged on the base. 19.依据权利要求18所述的探针卡的电性接触装置,其特征在于,其中各该探针的顶面或底面设有一凸垣,该凸垣的延伸方向与各该嵌条相同,该凸垣是嵌设于该基座的沟槽。19. The electrical contact device for a probe card according to claim 18, wherein a convex wall is provided on the top surface or bottom surface of each probe, and the extending direction of the convex wall is the same as that of each molding strip, The convex wall is embedded in the groove of the base. 20.依据权利要求15所述的探针卡的电性接触装置,其特征在于,其中该定位部的截面形状是呈不规则状,而各该探针的截面形状则对应于该定位部的截面形状。20. The electrical contact device for a probe card according to claim 15, wherein the cross-sectional shape of the positioning portion is irregular, and the cross-sectional shape of each probe corresponds to that of the positioning portion Section shape. 21.依据权利要求15所述的探针卡的电性接触装置,其特征在于,其中该容槽是自该顶面贯穿于该基座。21. The electrical contact device for a probe card according to claim 15, wherein the cavity penetrates the base from the top surface. 22.一种电性接触装置的制法,其特征在于,包含有下列步骤:22. A method for making an electrical contact device, comprising the following steps: a.制备一基座,该基座具有一顶面以及一底面;a. preparing a base, the base has a top surface and a bottom surface; b.自该基座的顶面蚀刻出一呈凹陷状的第一空间;b. etching a recessed first space from the top surface of the base; c.于该基座的第一空间与顶面施行光阻成形以及微电铸制程,使该基座成形出多数探针与多层牺牲层,各该探针具有一第一端与一第二端,该第二端具有一接触部;c. Perform photoresist forming and micro-electroforming processes on the first space and the top surface of the base, so that the base is formed with a plurality of probes and multi-layer sacrificial layers, each probe has a first end and a first end two ends, the second end has a contact portion; d.于该基座的底面蚀刻出一容槽,该容槽的位置对应于该等探针的第二端下方;以及d. Etching a cavity on the bottom surface of the base, the position of the cavity corresponds to the bottom of the second ends of the probes; and e.移除各该牺牲层,即可于该基座形成出各该探针,各该探针的第一端是设于该基座,各该探针的第二端则朝该容槽延伸。e. removing each of the sacrificial layers, each of the probes can be formed on the base, the first end of each of the probes is located on the base, and the second end of each of the probes is facing the cavity extend. 23.依据权利要求22所述的电性接触装置的制法,其特征在于,其中该基座是可利用硅材质、SOI基座、介电基座,或是表面具有介电材质的基座所制成。23. The manufacturing method of an electrical contact device according to claim 22, wherein the base is made of available silicon material, SOI base, dielectric base, or a base with a dielectric material on the surface made by. 24.依据权利要求22所述的电性接触装置的制法,其特征在于,其中于该步骤b之后,是可于该基座与各该探针相互结合的表面预先铺设介电材质,使各该探针保持绝缘状态。24. The manufacturing method of the electrical contact device according to claim 22, wherein after the step b, a dielectric material can be pre-laid on the surface where the base and each of the probes are combined, so that Each of the probes remains insulated. 25.依据权利要求22所述的电性接触装置的制法,其特征在于,其中于该步骤d时,是利用一第一蚀刻制程自该基座底面蚀刻出一第一壁面,再利用一第二蚀刻制程自该基座的顶面蚀刻出一第二壁面,并使该基座成形出该容槽,该第二壁面凸伸于该第一壁面,该探针的第二端是自该第二壁面开始。25. The manufacturing method of an electrical contact device according to claim 22, wherein in the step d, a first wall is etched from the bottom surface of the base by a first etching process, and then a first wall is etched out by a first etching process. The second etching process etches a second wall surface from the top surface of the base, and makes the base form the cavity, the second wall protrudes from the first wall surface, and the second end of the probe is from the The second wall begins. 26.依据权利要求22所述的电性接触装置的制法,其特征在于,其中该步骤b的蚀刻制程亦可以激光加工方式取代。26. The method for manufacturing an electrical contact device according to claim 22, wherein the etching process in step b can also be replaced by laser processing.
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CN1409119A (en) * 2001-09-20 2003-04-09 雅马哈株式会社 Probe parts and tis production
CN1554119A (en) * 2001-07-26 2004-12-08 ����ŵ����ѧ���й���ίԱ�� Parallel, individually addressable probes for nanolithography

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