CN118091372A - A chip testing mechanism - Google Patents

Abstract

The present invention relates to a chip testing mechanism, and belongs to the field of chip testing technology. In order to solve the problem that the existing testing mechanism has large contact impedance changes and signal distortion when testing chips. The present application includes a test socket and a plurality of test probes. The test socket is provided with a groove for placing the chip, and the inside of the test socket is provided with a mounting groove for installing the test probe. One end of the mounting groove is connected to the groove to form a first outlet, and the other end passes through the test socket to form a second outlet; the needle body of the test probe is installed in the mounting groove, and one end thereof extends outside the first outlet to form an elastic test end, and the other end extends outside the second outlet to form a connection end; the test socket is installed on a test board, and the connection end of the test probe contacts the test board. The present application can ensure the stability of the contact resistance value during testing, reduce the path length of signal transmission, and can ensure that the interference to the signal is minimized. The test probe adopts an integrated structure and can carry large current transmission.

Description

A chip testing mechanism

Technical Field

The present application relates to a chip testing mechanism, and belongs to the technical field of chip testing.

Background technique

With the rapid development of artificial intelligence technology, the image processor market has exploded, and the requirements for image clarity are getting higher and higher. However, the number of bits of ADDC conversion required by chips for processing high-definition images is also increasing. These chips have higher and higher requirements for signal stability during the testing process, so higher-level testing institutions are needed to meet the testing requirements of such chips.

In recent years, the demand for new energy vehicles, smart homes, and energy storage markets has grown rapidly, and my country's power management chips have maintained strong growth. Automotive power management chips are the fastest growing application area of power management chips. There is a large supply gap for automotive power management chips, and domestic substitution is gaining momentum. During the testing process of power chips, due to the high power consumption of the chip itself, the chip is prone to heat up, which causes the solder on the chip pins to stick to the probes of the test organization, resulting in unstable test parameters and easy judgment of good products as unqualified products.

For chip testing in these fields, traditional probes move up and down. During the test, the probe tips are prone to sticking to the solder on the chip pins, which increases the resistance of the probes after sticking, resulting in a decrease in the test yield of the customer's chips and an increase in the frequency of cleaning during use. Ultimately, the customer's test costs and cycles are lengthened, resulting in an increase in the cost of the chip, and thus a loss of market share. Therefore, a chip testing mechanism is urgently needed to solve the problem that the existing chip testing mechanism, during testing, the probes are prone to sticking to the solder on the chip pins, which affects the accuracy of the test results and causes an increase in chip costs.

Summary of the invention

In view of the problems and shortcomings in the prior art, the present application provides a chip testing mechanism to solve the above-mentioned technical problems.

To achieve the above-mentioned purpose, the present application provides the following technical solutions: a chip testing mechanism, including a test socket and a plurality of test probes, the test socket is provided with a groove for placing the chip, the inside of the test socket is provided with a mounting groove for installing the test probe, and one end of the mounting groove is connected with the groove to form a first outlet, and the other end passes through the test socket to form a second outlet; the needle body of the test probe is installed in the mounting groove, and one end thereof extends toward the first outlet to the outside of the first outlet, forming an elastic test end, and the other end extends toward the second outlet to the outside of the second outlet, forming a connecting end; the test socket is installed on a test board, and the connecting end of the test probe contacts the test board, the chip is placed from above the groove, and the chip pin pushes the elastic test end of the test probe to deform and store energy, and the elastic test end presses against the chip pin under the action of deformation energy storage to perform chip testing.

Specifically, the test socket includes an upper cover and a base; the upper cover is provided with a through hole with upper and lower openings; the base is provided with a mounting groove; the upper cover is fixedly mounted on the base, and a groove is formed between the through hole and the base; one end of the mounting groove on the base extends horizontally toward the groove and is connected to the groove, forming a mounting cavity for the elastic test end of the test probe, and the other end radially penetrates the base downward, forming a mounting cavity for the connection end of the test probe. This arrangement enables the test mechanism and the test board to be quickly installed and connected. During testing, the chip is directly placed in the groove to improve test efficiency.

Specifically, a probe mounting seat is fixedly installed in the mounting groove of the base, and the probe mounting seat is provided with two mounting layers in the radial direction, and each mounting layer is provided with a plurality of sub-mounting grooves at intervals, and the sub-mounting grooves of the two mounting layers form a plurality of groups of test probe mounting grooves in the radial direction. This arrangement enables the test probe to be installed on the probe mounting seat, and ensures that during the test process, the signal transmission between the test probes is separated from each other, and no mutual interference occurs, thereby improving the accuracy of the test data.

Specifically, each test probe includes two sub-test probes, and the two sub-test probes constitute a group of sub-test probes; several groups of sub-test probes constituted by several test probes are installed one by one in several groups of test probe installation slots, and the sub-test probes located in the upper installation layer are defined as the first sub-test probes, and the sub-test probes in the lower installation layer are defined as the second sub-test probes. The present application adopts a double needle to constitute a test probe, so as to achieve more accurate test results through sense detection compensation technology during chip testing.

Specifically, a mounting slot is provided in the sub-mounting slot, and the mounting slots of several sub-mounting slots are interconnected to form a connecting slot; the middle needle body of the sub-test probe protrudes outward at a position corresponding to the mounting slot to form a mounting protrusion; the sub-test probe is installed in the sub-mounting slot by installing the mounting protrusion in the mounting slot. This arrangement enables the sub-test probe to be fixedly installed in the sub-mounting slot through the middle needle body, while the elastic test ends and the connection ends at both ends are located in the sub-mounting slot, ensuring that when the chip is tested, the probe itself will not be displaced in the sub-mounting slot due to deformation of the elastic test end, so as to improve the test accuracy.

Specifically, the needle body of the first sub-test probe located on the first outlet side is provided with a first bending portion that is bent radially downward, and the first bending portion is provided with a second bending portion that is bent horizontally toward the first outlet; the first bending portion, the second bending portion, and the needle body between the first bending portion and the second bending portion constitute a first elastic deformation portion; the needle body of the second sub-test probe located on the first outlet side is provided with an inclined bending portion that is inclined upward toward the first outlet; the inclined bending portion constitutes a second elastic deformation portion. The present application uses simulation to achieve that during the test process, when the chip is installed into the groove, the chip presses down the elastic test end of the test probe, so that the first elastic deformation portion and the second elastic deformation portion of the sub-test probe undergo a certain displacement deformation, so that the elastic test end is deformed and generates an elastic force, so that the test probe can be tightly attached to the chip pin under the reaction force of the elastic force, ensuring that the probe is in full contact with the chip pin during the test process, thereby improving the test accuracy. At the same time, the displacement caused by the deformation of the elastic test end drives the needle-shaped probe head to scrape the chip surface, which can scrape off the surface oxide layer of the chip pins and also scrape off the residual contamination on the surface of the probe needle head, thereby further ensuring the stable contact between the probe needle head and the chip pins.

Specifically, the ends of the elastic test ends of the first sub-test probe and the second sub-test probe are respectively bent upward radially to form radial test ends, and the ends of the radial test ends are set as needle-like structures; the ends of the connecting ends of the first sub-test probe and the second sub-test probe are set as arc-shaped bending structures.

Specifically, the radial heights of the radial test ends of the first sub-test probe and the second sub-test probe are the same, and the radial heights of the ends of the connection ends of the first sub-test probe and the second sub-test probe are the same. This arrangement enables the ends of the elastic test ends of the first sub-test probe and the second sub-test probe to contact the chip pins at the same time, ensuring a stable contact, and the connection ends of the first sub-test probe and the second sub-test probe to stably contact the test board.

Specifically, the test probe is an integrally formed structure, which is configured to change the combination of multiple components of the test probe so that it has a greater current resistance capability.

Specifically, the test probe is made of beryllium copper material, and a gold-plated layer is provided on the outer side of the needle body. This arrangement is to ensure the elastic force of the elastic bending portion and the signal conductivity of the special-shaped test probe. The special-shaped test probe is made of beryllium copper material, and is heat-treated to generate sufficient hardness to ensure the elastic force, and the surface is gold-plated to ensure signal conductivity.

Compared with the prior art, the beneficial effects of this application are:

1. In the present application, the test probe is installed in the sub-mounting groove, and one end of the test probe serves as an elastic test end to be pressed against the chip pin to be tested. The elastic test end is pushed by the chip pin to produce a downward pressure deformation movement in the sub-mounting groove, and the deformation produces an elastic force to store energy. Under the action of the reaction force, the test end of the probe can be tightly attached to the chip pin. At the same time, during the movement of the test probe, the probe needle scrapes the oxide layer of the solder of the chip pin, and scrapes and removes the remaining tin and oxide layer of the needle itself. The effective contact between the test probe and the chip pin ensures the stability of the contact impedance of the test signal and ensures that the signal transmission is not distorted.

2. The present application adopts an integrated structure for the probe, which does not require the combination of several layouts of traditional probes. Therefore, the shape can be made smaller, and the path of the signal when passing through the special-shaped probe is very short, which minimizes the impact on the signal. At the same time, it can carry a larger test current and improve the product's applicability. In addition, the integrated molding structure can also enable the probe to be used in high and low temperature environments, improving the practicality of the product.

3. The present application uses the elastic deformation characteristics of the test probe material itself, so that the elastic force generated by its deformation replaces the traditional probe spring force, thereby reducing the cost of the probe.

4. This application adopts a double-needle structure to form a test probe, so as to achieve more accurate test results through sense detection compensation technology during chip testing.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the structure of a chip testing mechanism according to the present embodiment;

FIG2 is a top schematic diagram of a chip testing mechanism of this embodiment;

FIG3 is a bottom schematic diagram of the chip testing mechanism of this embodiment;

FIG4 is a cross-sectional view of the structure of the chip testing mechanism of this embodiment;

FIG5 is an exploded schematic diagram of components of a chip testing mechanism of this embodiment;

FIG6 is a schematic diagram of the installation of a test probe and a probe mounting seat of a chip testing mechanism of this embodiment;

FIG7 is an exploded schematic diagram of components of a probe mounting base of a chip testing mechanism of the present embodiment;

FIG. 8 is a schematic diagram of the structure of a single test probe of the chip testing mechanism of this embodiment.

In the figure: 1. test socket; 2. test probe; 3. groove; 4. mounting groove; 5. elastic test end; 6. connecting end; 7. upper cover; 8. base; 9. probe mounting seat; 10. mounting layer; 11. sub-mounting groove; 12. first sub-test probe; 13. second sub-test probe; 14. connecting card slot; 15. mounting protrusion; 16. first bending portion; 17. second bending portion; 18. inclined bending portion.

Detailed ways

The present application will be further described below in conjunction with the accompanying drawings in the embodiments of the present application.

Please refer to Figures 1 to 8. This embodiment discloses a chip testing mechanism, including a test socket 1 and a plurality of test probes 2. The test socket 1 is provided with a groove 3 for placing the chip. The inside of the test socket 1 is provided with a mounting groove 4 for mounting the test probe, and one end of the mounting groove is connected with the groove to form a first outlet, and the other end penetrates the test socket to form a second outlet. The test probe 2 of this embodiment is an integrated structure, and its needle body is made of beryllium copper material, and a gold-plated layer is provided on the outer side of the needle body. The needle body of the test probe is installed in the mounting groove, and one end of the needle body extends toward the first outlet to the outside of the first outlet to form an elastic test end 5, and the other end extends toward the second outlet to the outside of the second outlet to form a connection end 6. The test socket 1 is installed on a test board (not shown), and the connection end of the test probe contacts the test board. The chip (not shown) is placed from the top of the groove, and the chip pin pushes the elastic test end 5 of the test probe to deform and store energy. Under the action of deformation energy storage, the elastic test end abuts against the chip pin to perform chip testing.

Furthermore, the test socket 1 includes an upper cover 7 and a base 8; the upper cover 7 is provided with a through hole with upper and lower openings; the base 8 is provided with a mounting groove 4; the upper cover is fixedly mounted on the base, and a groove is formed between the through hole and the base; one end of the mounting groove on the base extends horizontally toward the groove and is connected to the groove, forming a mounting cavity for the elastic test end of the test probe, and the other end radially penetrates the base downward, forming a mounting cavity for the connection end of the test probe. Among them, a probe mounting seat 9 is fixedly mounted in the mounting groove of the base of this embodiment, and the probe mounting seat is provided with two mounting layers 10 in the radial direction, and each mounting layer is provided with a plurality of sub-mounting grooves 11 at intervals, and the sub-mounting grooves of the two mounting layers form a plurality of groups of test probe mounting grooves in the radial direction.

Furthermore, each test probe includes two sub-test probes, and the two sub-test probes constitute a group of sub-test probes; several groups of sub-test probes consisting of several test probes are installed one by one in several groups of test probe mounting slots, and the sub-test probe located on the upper mounting layer is defined as the first sub-test probe 12, and the sub-test probe located on the lower mounting layer is defined as the second sub-test probe 13.

In addition, a mounting slot is provided in the sub-mounting slot of the present embodiment, and the mounting slots of several sub-mounting slots are interconnected to form a connecting slot 14; the middle needle body of the sub-test probe protrudes outward at a position corresponding to the mounting slot to form a mounting protrusion 15; the sub-test probe is installed in the sub-mounting slot by installing the mounting protrusion in the mounting slot. The ends of the elastic test ends of the first sub-test probe 12 and the second sub-test probe 13 of the present embodiment are respectively bent upward in the radial direction to form a radial test end, and the end of the radial test end is set to a needle-like structure; the end of the connecting end of the first sub-test probe and the second sub-test probe is set to an arc-shaped bending structure. At the same time, the radial heights of the radial test ends of the first sub-test probe and the second sub-test probe of the present embodiment are the same, and the radial heights of the ends of the connecting ends of the first sub-test probe and the second sub-test probe are the same.

In this embodiment, the first sub-test probe 12 is provided with a first bending portion 16 bent radially downward on the needle body located on the first outlet side, and a second bending portion 17 bent horizontally toward the first outlet is provided on the first bending portion; the first bending portion, the second bending portion and the needle body between the first bending portion and the second bending portion constitute a first elastic deformation portion; the second sub-test probe 13 is provided with an inclined bending portion 18 inclined upward toward the first outlet on the needle body located on the first outlet side; the inclined bending portion constitutes a second elastic deformation portion.

Working principle: The chip testing mechanism provided in this embodiment includes an upper cover and a base. The groove formed between the upper cover and the base is used to install the chip. The pins of the chip enter from the groove and abut against the elastic test end of the test probe. The integrated test probe is installed in the installation groove of the base, and its elastic test end extends from the groove, and the connection end at the other end extends from the lower opening of the base to contact the test board. When the test mechanism of this embodiment is used for testing, the chip is placed and installed into the groove manually or by a feeding mechanism. During installation, the pin to be tested of the chip first abuts against the elastic test end of the test probe and is pressed down along the groove, pushing the elastic test end to deform, so that the first elastic deformation part and the second elastic deformation part of the elastic test end are respectively deformed to generate elastic energy storage, and the elastic test end can be tightly attached to the pin to be tested under the reaction force of the elastic potential energy, and in the process of pressing the chip down, the needle tip of the radial test end of the elastic test end slides and scrapes on the chip pin due to deformation, so as to scrape the tin oxide layer on the chip pin, and at the same time, the needle tip of the radial test end can also remove the tin and oxide layer and other debris existing in itself by scraping, so as to ensure that the contact resistance between the chip pin and the elastic test end is in a stable state when testing after the chip is installed, so that the test signal can be effectively transmitted to the connection end through the integrated needle body, and then transmitted to the test board for chip pin testing.

The implementation methods of the present application are described in detail above in conjunction with the embodiments, but the present application is not limited to the above-mentioned implementation methods. For ordinary technicians in this technical field, after knowing the contents recorded in the present application, they can make several equivalent changes and substitutions thereto without departing from the principles of the present application, and these equivalent changes and substitutions should also be regarded as belonging to the protection scope of the present application.

Claims (10)

1. A chip testing mechanism, comprising a test socket and a plurality of test probes, characterized in that: the test socket is provided with a groove for placing the chip, the interior of the test socket is provided with a mounting groove for mounting the test probe, and one end of the mounting groove is connected with the groove to form a first outlet, and the other end passes through the test socket to form a second outlet; the needle body of the test probe is installed in the mounting groove, and one end thereof extends toward the first outlet to the outside of the first outlet to form an elastic test end, and the other end extends toward the second outlet to the outside of the second outlet to form a connecting end; the test socket is installed on a test board, the connecting end of the test probe contacts the test board, the chip is placed from above the groove, the chip pin pushes the elastic test end of the test probe to deform and store energy, and the elastic test end abuts against the chip pin under the action of deformation energy storage to perform chip testing. 2. A chip testing mechanism according to claim 1, characterized in that: the test socket includes an upper cover and a base; the upper cover is provided with a through hole with upper and lower openings; the base is provided with the mounting groove; the upper cover is fixedly mounted on the base, and the groove is formed between the through hole and the base; one end of the mounting groove on the base extends horizontally toward the groove direction and is connected with the groove, forming a mounting cavity for the elastic testing end of the test probe, and the other end radially penetrates the base downward, forming a mounting cavity for the connecting end of the test probe. 3. A chip testing mechanism according to claim 2, characterized in that: a probe mounting seat is fixedly installed in the mounting groove of the base, and the probe mounting seat is provided with two mounting layers in the radial direction, each mounting layer is provided with a plurality of sub-mounting grooves at intervals, and the sub-mounting grooves of the two mounting layers constitute a plurality of groups of test probe mounting grooves in the radial direction. 4. A chip testing mechanism according to claim 3, characterized in that: each of the test probes includes two sub-test probes, and the two sub-test probes constitute a group of sub-test probes; several groups of sub-test probes consisting of several test probes are installed in several groups of test probe mounting grooves in a one-to-one correspondence, and the sub-test probe located on the upper mounting layer is defined as the first sub-test probe, and the sub-test probe located on the lower mounting layer is defined as the second sub-test probe. 5. A chip testing mechanism according to claim 4, characterized in that: a mounting slot is provided in the sub-mounting slot, and the mounting slots of several sub-mounting slots are interconnected to form a connecting slot; the middle needle body of the sub-test probe protrudes outward at a position corresponding to the mounting slot to form a mounting protrusion; the sub-test probe is installed in the sub-mounting slot by installing the mounting protrusion in the mounting slot. 6. A chip testing mechanism according to claim 4, characterized in that: a first bending portion bent radially downward is provided on the needle body of the first sub-test probe located on the first outlet side, and a second bending portion bent horizontally toward the first outlet is provided on the first bending portion; the first bending portion, the second bending portion and the needle body between the first bending portion and the second bending portion constitute a first elastic deformation portion; the needle body of the second sub-test probe located on the first outlet side is provided with an inclined bending portion inclined upward toward the first outlet; the inclined bending portion constitutes a second elastic deformation portion. 7. A chip testing mechanism according to claim 4, characterized in that: the ends of the elastic testing ends of the first sub-test probe and the second sub-test probe are respectively bent upward in the radial direction to form radial testing ends, and the ends of the radial testing ends are set to be needle-like structures; the ends of the connecting ends of the first sub-test probe and the second sub-test probe are set to be arc-shaped bending structures. 8. A chip testing mechanism according to claim 7, characterized in that the radial heights of the radial test ends of the first sub-test probe and the second sub-test probe are the same, and the radial heights of the ends of the connecting ends of the first sub-test probe and the second sub-test probe are the same. 9 . The chip testing mechanism according to claim 1 , wherein the testing probe is an integrally formed structure. 10. A chip testing mechanism according to claim 1, characterized in that: the test probe is made of beryllium copper material, and the outer side of the needle body is provided with a gold-plated layer.