CN100457367C - A leadless solder - Google Patents
A leadless solder Download PDFInfo
- Publication number
- CN100457367C CN100457367C CNB2006101614218A CN200610161421A CN100457367C CN 100457367 C CN100457367 C CN 100457367C CN B2006101614218 A CNB2006101614218 A CN B2006101614218A CN 200610161421 A CN200610161421 A CN 200610161421A CN 100457367 C CN100457367 C CN 100457367C
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- China
- Prior art keywords
- tin
- antimony
- zinc
- copper
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The invention relates to a leadless solder, formed by 69. 5-71% tin, 0.6-1. 5% antimony, 0.03-0.08% copper and the left is zinc. The invention fuses and mixes said metals to form composite as the solder of electric element. The invention can avoid lead hurting people and pollution, with low cost.
Description
Technical field:
The present invention relates to the scolder of electronic building brick, being specifically related to a kind of is parent metal with tin, adds the scolder of several metal compositions.
Background technology:
One of conventional solder that has been widely used in electron trade is tin, plumbous series alloy, various mechanics of this welding alloy and physical property are all more superior, yet owing to contain more lead in the metal composites, heavy metal lead is bigger to human body harm, pollution on the environment is more and more serious, therefore, the use of this scolder will progressively be restricted, until the use that is under an embargo.In the last few years, released some lead-free solders on the market, replacing with metal materials such as indium or silver of having is plumbous, and the metal composites of making can satisfy instructions for use substantially, but these metal materials not only price is more expensive, and raw material is difficult for buying.
Summary of the invention:
The technical problem to be solved in the present invention provides a kind of scolder of electronic subassembly, and this scolder does not contain lead, and cost is low, and raw material are easy to get.
The present invention is achieved through the following technical solutions:
A kind of lead-free solder, form by following raw materials by weight percent: tin 69.5～71%, antimony 0.6～1.5%, copper 0.03～0.08%, surplus is a zinc.
The raw material of described heavy percentage is a tin 70%, antimony 1%, and copper 0.05%, surplus is a zinc.
Beneficial effect:
The present invention with metals such as antimony, copper, zinc and tin by the melt-blended metal composites of making, this kind composition is as the scolder of electronic subassembly, every performance indications all can satisfy instructions for use, what is more important has been stopped the plumbous harm that the operator is caused, pollution on the environment, the present invention has bigger social benefit.
Used metal material among the present invention, raw material is easy to get, and cost is low.
The specific embodiment:
Embodiment 1:
(1) by weight percentage: promptly copper 0.05%, antimony 1%, and tin 70%, surplus is a zinc, takes by weighing each metal object, then copper, antimony, zinc is placed the crucible fusion respectively, and tin is placed the fusion of melting still;
(2) copper that step (1) is obtained, antimony, zinc liquation add successively in the melting still and mix (under stirring) with tin melt, and under 250～350 ℃ of temperature, add thermal agitation 20--30 minute;
(3) under 200～250 ℃ of temperature conditions, the final solder alloy that forms of step (2) is put into mould cast cylinder;
(4) ingot casting that step (3) is obtained (being cylinder), extruding at ambient temperature, wire drawing becomes no lead-tin soldering silk.
Lead-free solder performance indications such as following table after testing:
| Fusing point (℃) | 177-218 | Density (g/cm 3) | 7.3 |
| Hot strength (N/mm 2) | 124 | Elongation after fracture (%) | 39 |
Embodiment 2:
By weight percentage: promptly copper 0.03%, antimony 0.6%, and tin 69.5%, surplus is a zinc, takes by weighing each metal object.All the other are implemented as embodiment 1.
Embodiment 3:
By weight percentage: promptly copper 0.08%, antimony 1.5%, and tin 71%, surplus is a zinc, takes by weighing each metal object.All the other are implemented as embodiment 1.
Claims (2)
1, a kind of lead-free solder is characterized in that: be made up of following raw materials by weight percent: tin 69.5～71%, and antimony 0.6～1.5%, copper 0.03～0.08%, surplus is a zinc.
2, a kind of lead-free solder as claimed in claim 1 is characterized in that: described heavy percentage is tin 70%, antimony 1%, and copper 0.05%, surplus is a zinc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101614218A CN100457367C (en) | 2006-12-12 | 2006-12-12 | A leadless solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101614218A CN100457367C (en) | 2006-12-12 | 2006-12-12 | A leadless solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1994657A CN1994657A (en) | 2007-07-11 |
| CN100457367C true CN100457367C (en) | 2009-02-04 |
Family
ID=38249904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101614218A Expired - Fee Related CN100457367C (en) | 2006-12-12 | 2006-12-12 | A leadless solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100457367C (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5851482A (en) * | 1996-03-22 | 1998-12-22 | Korea Institute Of Machinery & Metals | Tin-bismuth based lead-free solder for copper and copper alloys |
| JP2001259885A (en) * | 2000-03-17 | 2001-09-25 | Teikoku Metal Kogyo Kk | Solder alloy and metallized plastic film capacitor end face electrode |
| JP2002239780A (en) * | 2001-02-09 | 2002-08-28 | Nippon Steel Corp | Electronic member having solder alloy, solder ball and solder bump |
| CN1386887A (en) * | 2002-04-29 | 2002-12-25 | 戴国水 | Lead-free material for spraying gold and its preparing process |
| CN1443626A (en) * | 2003-04-16 | 2003-09-24 | 浙江大学 | Leadless welding flux with optimum informance and price ratio |
-
2006
- 2006-12-12 CN CNB2006101614218A patent/CN100457367C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5851482A (en) * | 1996-03-22 | 1998-12-22 | Korea Institute Of Machinery & Metals | Tin-bismuth based lead-free solder for copper and copper alloys |
| JP2001259885A (en) * | 2000-03-17 | 2001-09-25 | Teikoku Metal Kogyo Kk | Solder alloy and metallized plastic film capacitor end face electrode |
| JP2002239780A (en) * | 2001-02-09 | 2002-08-28 | Nippon Steel Corp | Electronic member having solder alloy, solder ball and solder bump |
| CN1386887A (en) * | 2002-04-29 | 2002-12-25 | 戴国水 | Lead-free material for spraying gold and its preparing process |
| CN1443626A (en) * | 2003-04-16 | 2003-09-24 | 浙江大学 | Leadless welding flux with optimum informance and price ratio |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1994657A (en) | 2007-07-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: TEACHING PRODUCTS FOR HUAIAN CITY, THE GREAT WALL CO., LTD. Assignor: Zhu Xiaoming Contract fulfillment period: 2009.6.20 to 2019.6.30 contract change Contract record no.: 2009320001616 Denomination of invention: Lead free solder alloy and its preparation method Granted publication date: 20090204 License type: Exclusive license Record date: 2009.8.27 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.6.20 TO 2019.6.30; CHANGE OF CONTRACT Name of requester: HUAIAN CHANGCHENG TEACHING TOOLS CO., LTD. Effective date: 20090827 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090204 Termination date: 20111212 |