CN101130220A - Solder without cadmium and silver - Google Patents
Solder without cadmium and silver Download PDFInfo
- Publication number
- CN101130220A CN101130220A CNA200710071443XA CN200710071443A CN101130220A CN 101130220 A CN101130220 A CN 101130220A CN A200710071443X A CNA200710071443X A CN A200710071443XA CN 200710071443 A CN200710071443 A CN 200710071443A CN 101130220 A CN101130220 A CN 101130220A
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- CN
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- Prior art keywords
- cadmium
- alloy
- copper
- silver
- free silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 53
- 239000004332 silver Substances 0.000 title claims abstract description 53
- 229910000679 solder Inorganic materials 0.000 title abstract description 16
- 229910052793 cadmium Inorganic materials 0.000 title description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 title description 4
- 239000000956 alloy Substances 0.000 claims abstract description 56
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 55
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 52
- 239000010949 copper Substances 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 19
- 239000010703 silicon Substances 0.000 claims abstract description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 13
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011701 zinc Substances 0.000 claims abstract description 10
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 7
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 7
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 5
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 5
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 238000005219 brazing Methods 0.000 claims description 51
- 239000000203 mixture Substances 0.000 claims description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 3
- NZWXMOTXTNDNLK-UHFFFAOYSA-N [Cu].[Zn].[Ag] Chemical compound [Cu].[Zn].[Ag] NZWXMOTXTNDNLK-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 241001062472 Stokellia anisodon Species 0.000 claims description 2
- 229910000676 Si alloy Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 abstract description 15
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 13
- 239000010935 stainless steel Substances 0.000 abstract description 13
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 13
- NSAODVHAXBZWGW-UHFFFAOYSA-N cadmium silver Chemical compound [Ag].[Cd] NSAODVHAXBZWGW-UHFFFAOYSA-N 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 230000006698 induction Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 14
- 230000004907 flux Effects 0.000 description 9
- 238000009472 formulation Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 229910000510 noble metal Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000005662 electromechanics Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
The invention discloses a non-cadmium-silver solder with tin, silicon and composite rare earth element, which comprises the following parts: 28%-32% copper, 30%-34% zinc, 0. 5%-5% tin, 0. 01%-1% silicon, 29%-41% silver, 0. 001%-0. 1% rare earth element lanthanum and cerium and less than 0. 01% impurity. The making method comprises the following steps: setting the fusing temperature of the solder at 600-745 deg. c; adopting intermediate frequency induction furnace to fuse and cast; squeezing; drawing; moulding; obtaining the product to satisfy the request of RoHS order; eliminating the pollution for environment. The invention can replace silver solder such as BAg50CuZnCd, BAg45CuZnCd and BAg45CuZn completely to use with FB102, which can be applied to weld the copper and copper alloy, hard alloy, stainless steel pipe with good wetness and fluidity and mechanic strength.
Description
Technical field:
The present invention relates to the cadmium-free silver brazing alloy of a kind of stanniferous, silicon and mixed rare-earth elements, belong to the middle temperature brazing material, be applicable to the soldering of workpiece such as copper and copper alloy, carbide alloy, stainless steel pipe, belong to the brazing material of class of metal materials and field of metallurgy.
Background technology:
The soldering of industries such as at present used silver-containing solder BAg50CuZnCd, BAg45CuZnCd and BAg45CuZn etc. are widely used in freezing, machinery, electromechanics, electrical equipment, instrument and meter, valve pipe fitting.But all contain a certain amount of harmful element cadmium (Cd) in these silver solders, do not meet the requirement of the RoHS of European Union instruction, and all contain higher noble metal silver in these solders, because noble metal silver resource-constrained, price is more and more expensive.Therefore develop a kind of brazing material that had both met the RoHS command request, it is suitable and contain the lower novel solder of noble metal silver and have important economic value and social benefit to satisfy silver solders such as brazing property and BAg50CuZnCd, BAg45CuZnCd and BAg45CuZn again.
Summary of the invention:
Technical problem to be solved in the utility model is to overcome existing above-mentioned deficiency in the prior art, and provide a kind of can be in brazing process and soldering after do not have fully at the soldering position poisonous element cadmium, brazing property is good, and equate that with traditional BAg45CuZnCd and BAg50CuZnCd silver solder combination property silver content is lower than the brazing material of 45% (about 37%) again.
The present invention mainly solves following two key technical problems: 1) develop no cadmium, combination property is suitable with the BAg50CuZnCd silver solder with BAg45CuZnCd, the silver solder of alternative BAg45CuZnCd and BAg50CuZnCd, by optimization, obtained mother metal wetability, good, the weld properties (σ of spreadability to " cadmium-free silver brazing alloy of stanniferous (Sn), silicon (Si) and mixed rare-earth elements " chemical composition
b, τ) good solder; 2) in cadmium-free silver brazing alloy, add an amount of tin (Sn), be mainly used to reduce the fusing point of principal component alloy (Ag-Cu-Zn), improve wetability, the spreadability of solder on copper, copper alloy, carbide alloy and stainless steel simultaneously, add silicon (Si) and mishmetal (main component is lanthanum (La) and cerium (Ce)) simultaneously, be mainly used to the crystal grain and the tissue of refinement cadmium-free silver brazing alloy, remove gas and impurity in the cadmium-free silver brazing alloy simultaneously, improve the plasticity and the comprehensive mechanical property of silver solder, the mishmetal cost is low, and can buy and realize above-mentioned purpose on market.
The present invention solves the problems of the technologies described above the technical scheme that is adopted: the cadmium-free silver brazing alloy of a kind of stanniferous, silicon and mixed rare-earth elements, its chemical composition (each composition weight accounts for the percentage of cadmium-free silver brazing alloy gross weight) is: copper (Cu): 28%～32%, zinc (Zn): 30%～34%, tin (Sn): 0.5%～5%, silicon (Si): 0.01%～1%, silver (Ag): 29%～41%, mishmetal: 0.001%～0.1%, the essential element of mishmetal is lanthanum and cerium, all the other are impurity, and impurity is less than 0.01% of the cadmium-free silver brazing alloy gross weight.The fusion temperature of cadmium-free silver brazing alloy is 600 ℃～745 ℃ (reference value), cooperates the FB102 brazing flux to use, and can be used for the soldering of workpiece such as copper and copper alloy, carbide alloy, stainless steel pipe, the mechanical strength σ of soldered fitting
b=200～400MPa, τ=180～350MPa.
The present invention can be smelted into intermediate alloy with silicon and mishmetal in advance according to producing needs, adds silver-copper-zinc alloy then and carries out melting, obtains brazing material by cast, cooling, extruding, drawing, moulding again.
The present invention has following technical characterstic: 1) neoteric " cadmium-free silver brazing alloy " compares the consumption about 8% that has reduced noble metal silver with traditional brazing material BAg45CuZnCd with BAg50CuZnCd, save limited noble metal silver resource, greatly reduced production cost simultaneously; 2) removed harmful element Cd, and with copper alloy, the soldering of stainless steel device after joint mechanical intensity height, weld seam densification, any surface finish can replace BAg45CuZnCd and BAg50CuZnCd silver solder fully.
The specific embodiment:
The formulation by weight of " cadmium-free silver brazing alloy " is specifically narrated the present invention than embodiment and manufacture method embodiment according to the present invention below.The present invention is not subjected to the restriction of specific embodiment, can slightly adjust according to actual conditions during application.
Embodiment 1:
Press the formulation by weight ratio of alloy (cadmium-free silver brazing alloy, down with), its composition consists of: copper: 28.5%, and zinc: 30.5%, tin: 0.6%, silicon: 0.01%, mishmetal (rare-earth elements of lanthanum and cerium are main mixture, down with): 0.1%, all the other be silver-colored.
" cadmium-free silver brazing alloy " solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 730 ℃ (reference value) about 625 ℃, cooperate the FB102 brazing flux, the strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=230 ± 20MPa, τ=195 ± 15MPa), red copper or copper alloy-stainless steel (σ
b=340 ± 20MPa, τ=250 ± 15MPa), stainless steel-carbide alloy (σ
b=380 ± 20MPa, τ=280 ± 15MPa).
Embodiment 2:
Press the formulation by weight ratio of alloy, its composition consists of: copper: 30%, and zinc: 32%, tin: 2%, silicon: 0.5%, mishmetal: 0.05%, all the other are silver.
" cadmium-free silver brazing alloy " solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 710 ℃ (reference value) about 610 ℃, cooperate the FB102 brazing flux, the strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=235 ± 20MPa, τ=200 ± 15MPa), red copper or copper alloy-stainless steel (σ
b=330 ± 20MPa, τ=250 ± 15MPa), stainless steel-carbide alloy (σ
b=360 ± 20MPa, τ=270 ± 15MPa).
Embodiment 3:
Press the formulation by weight ratio of alloy, its composition consists of: copper: 32%, and zinc: 33.5%, tin: 1%, silicon: 0.9%, mishmetal: 0.1%, all the other are silver.
" cadmium-free silver brazing alloy " solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 730 ℃ (reference value) about 630 ℃, cooperate the FB102 brazing flux, the strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=230 ± 20MPa, τ=200 ± 15MPa), red copper or copper alloy-stainless steel (σ
b=320 ± 20MPa, τ=260 ± 15MPa), stainless steel-carbide alloy (σ
b=370 ± 20MPa, τ=270 ± 15MPa).
Embodiment 4:
Press the formulation by weight ratio of alloy, its composition consists of: copper: 31%, and zinc: 33%, tin: 0.8%, silicon: 0.5%, mishmetal: 0.03%, all the other are silver.
" cadmium-free silver brazing alloy " solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 735 ℃ (reference value) about 640 ℃, cooperate the FB102 brazing flux, the strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=240 ± 20MPa, τ=210 ± 15MPa), red copper or copper alloy-stainless steel (σ
b=350 ± 20MPa, τ=260 ± 15MPa), stainless steel-carbide alloy (σ
b=370 ± 20MPa, τ=270 ± 15MPa).
Embodiment 5:
Press the formulation by weight ratio of alloy, its composition consists of: copper: 29.5%, and zinc: 33%, tin: 1.2%, silicon: 0.3%, mishmetal: 0.05%, all the other are silver.
" cadmium-free silver brazing alloy " solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 705 ℃ (reference value) about 605 ℃, cooperate the FB102 brazing flux, the strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=245 ± 20MPa, τ=210 ± 15MPa), red copper or copper alloy-stainless steel (σ
b=340 ± 20MPa, τ=255 ± 15MPa), stainless steel-carbide alloy (σ
b=390 ± 20MPa, τ=275 ± 15MPa).
Embodiment 6:
Press the formulation by weight ratio of alloy, its composition consists of: copper: 32%, and zinc: 33%, tin: 4.9%, silicon: 0.8%, mishmetal: 0.01%, all the other are silver.
" cadmium-free silver brazing alloy " solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 730 ℃ (reference value) about 600 ℃, cooperate the FB102 brazing flux, the strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=230 ± 20MPa, τ=200 ± 15MPa), red copper or copper alloy-stainless steel (σ
b=340 ± 20MPa, τ=230 ± 15MPa), stainless steel-carbide alloy (σ
b=380 ± 20MPa, τ=260 ± 15MPa).
Embodiment 7:
Press the formulation by weight ratio of alloy, its composition consists of: copper: 31%, and zinc: 33%, tin: 0.8%, silicon: 0.3%, mishmetal: 0.005%, all the other are silver.
" cadmium-free silver brazing alloy " solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 740 ℃ (reference value) about 645 ℃, cooperate the FB102 brazing flux, the strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=230 ± 20MPa, τ=200 ± 15MPa), red copper or copper alloy-stainless steel (σ
b=330 ± 20MPa, τ=245 ± 15MPa), stainless steel-carbide alloy (σ
b=375 ± 20MPa, τ=270 ± 15MPa).
Embodiment 8:
Press the formulation by weight ratio of alloy, its composition consists of: copper: 31%, and zinc: 33%, tin: 0.5%, silicon: 0.1%, mishmetal: 0.002%, all the other are silver.
" cadmium-free silver brazing alloy " solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 745 ℃ (reference value) about 650 ℃, cooperate the FB102 brazing flux, the strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=235 ± 20MPa, τ=200 ± 15MPa), red copper or copper alloy-stainless steel (σ
b=350 ± 20MPa, τ=245 ± 15MPa), stainless steel-carbide alloy (σ
b=390 ± 20MPa, τ=275 ± 15MPa).
Impurity in the embodiment of the invention is controlled at usually less than 0.01% of cadmium-free silver brazing alloy gross weight.
The preparation method of the embodiment of the invention is:
Silicon and mishmetal place intermediate frequency furnace respectively, and intermediate alloy is smelt in fritting, again silver-copper-zinc alloy are added intermediate frequency furnace and carry out melting, obtain required cadmium-free silver brazing alloy by cast, cooling, extruding, drawing, molding procedure then.
Claims (2)
1. stanniferous, the cadmium-free silver brazing alloy of silicon and mixed rare-earth elements, it is characterized in that: chemical composition by weight percentage is respectively: copper accounts for 28%～32% of cadmium-free silver brazing alloy gross weight, zinc accounts for 30%～34% of cadmium-free silver brazing alloy gross weight, tin accounts for 0.5%～5% of cadmium-free silver brazing alloy gross weight, silicon accounts for 0.01%～1% of cadmium-free silver brazing alloy gross weight, silver accounts for 29%～41% of cadmium-free silver brazing alloy gross weight, mishmetal accounts for 0.001%～0.1% of cadmium-free silver brazing alloy gross weight, the essential element of mishmetal is lanthanum and cerium, all the other are impurity, and impurity is less than 0.01% of the cadmium-free silver brazing alloy gross weight.
2. the manufacture method of a cadmium-free silver brazing alloy as claimed in claim 1, it is characterized in that may further comprise the steps: intermediate alloy is smelt in silicon and mishmetal fritting, add silver-copper-zinc alloy then and carry out melting, obtain cadmium-free silver brazing alloy by cast, cooling, extruding, drawing, moulding again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710071443XA CN100558499C (en) | 2007-09-26 | 2007-09-26 | A kind of manufacture method of cadmium-free silver solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710071443XA CN100558499C (en) | 2007-09-26 | 2007-09-26 | A kind of manufacture method of cadmium-free silver solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101130220A true CN101130220A (en) | 2008-02-27 |
| CN100558499C CN100558499C (en) | 2009-11-11 |
Family
ID=39127714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200710071443XA Active CN100558499C (en) | 2007-09-26 | 2007-09-26 | A kind of manufacture method of cadmium-free silver solder |
Country Status (1)
| Country | Link |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102009282A (en) * | 2009-09-08 | 2011-04-13 | 韩国邦迪株式会社 | Filler metal alloy compositions |
| CN101716705B (en) * | 2009-11-26 | 2012-01-25 | 金华市三环焊接材料有限公司 | Multi-alloy cadmium-free phosphor-free copper-based solder |
| CN101733581B (en) * | 2009-11-12 | 2012-01-25 | 蒋汝智 | Cadmium-free silver brazing alloy containing calcium, silicon and erbium |
| CN104439753A (en) * | 2014-11-13 | 2015-03-25 | 杭州华光焊接新材料股份有限公司 | Multi-element silver soldering material containing indium and tin and preparation method of multi-element silver soldering material |
| CN106001991A (en) * | 2016-06-30 | 2016-10-12 | 杭州华光焊接新材料股份有限公司 | Indium containing low-silver multi-element brazing filler metal and preparation method thereof |
| CN106077995A (en) * | 2016-06-30 | 2016-11-09 | 杭州华光焊接新材料股份有限公司 | A kind of containing manganese, the cadmium-free low-silver solder and preparation method thereof of stannum |
| CN108857138A (en) * | 2018-07-17 | 2018-11-23 | 浙江亚通焊材有限公司 | A kind of dissimilar metal connection low silver-colored cadmium-free silver-base solder and preparation method thereof |
| CN110125570A (en) * | 2019-06-18 | 2019-08-16 | 东莞理工学院 | A kind of tin silver copper silicon high-entropy alloy solder and preparation method thereof |
| CN114161026A (en) * | 2021-12-29 | 2022-03-11 | 杭州华光焊接新材料股份有限公司 | Silver-saving brazing filler metal special for hard alloy brazing and preparation method thereof |
-
2007
- 2007-09-26 CN CNB200710071443XA patent/CN100558499C/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102009282A (en) * | 2009-09-08 | 2011-04-13 | 韩国邦迪株式会社 | Filler metal alloy compositions |
| CN101733581B (en) * | 2009-11-12 | 2012-01-25 | 蒋汝智 | Cadmium-free silver brazing alloy containing calcium, silicon and erbium |
| CN101716705B (en) * | 2009-11-26 | 2012-01-25 | 金华市三环焊接材料有限公司 | Multi-alloy cadmium-free phosphor-free copper-based solder |
| CN104439753A (en) * | 2014-11-13 | 2015-03-25 | 杭州华光焊接新材料股份有限公司 | Multi-element silver soldering material containing indium and tin and preparation method of multi-element silver soldering material |
| CN106001991A (en) * | 2016-06-30 | 2016-10-12 | 杭州华光焊接新材料股份有限公司 | Indium containing low-silver multi-element brazing filler metal and preparation method thereof |
| CN106077995A (en) * | 2016-06-30 | 2016-11-09 | 杭州华光焊接新材料股份有限公司 | A kind of containing manganese, the cadmium-free low-silver solder and preparation method thereof of stannum |
| CN108857138A (en) * | 2018-07-17 | 2018-11-23 | 浙江亚通焊材有限公司 | A kind of dissimilar metal connection low silver-colored cadmium-free silver-base solder and preparation method thereof |
| CN110125570A (en) * | 2019-06-18 | 2019-08-16 | 东莞理工学院 | A kind of tin silver copper silicon high-entropy alloy solder and preparation method thereof |
| CN114161026A (en) * | 2021-12-29 | 2022-03-11 | 杭州华光焊接新材料股份有限公司 | Silver-saving brazing filler metal special for hard alloy brazing and preparation method thereof |
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|---|---|
| CN100558499C (en) | 2009-11-11 |
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| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20080227 Assignee: Hangzhou Huaguang Welding Materials Co., Ltd. Assignor: Jin Limei Contract record no.: 2010330000466 Denomination of invention: Solder without cadmium and silver Granted publication date: 20091111 License type: Exclusive License Record date: 20100412 |
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Owner name: HANGZHOU HUANGUANG WELDING MATERIALS CO., LTD. Free format text: FORMER OWNER: JIN LIMEI Effective date: 20110524 |
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Effective date of registration: 20110524 Address after: 311112 small dam road, Liangzhu Industrial Park, Yuhang District, Hangzhou, Zhejiang Patentee after: Hangzhou Huaguang Advanced Welding Materials Co., Ltd. Address before: 310014 No. 44-2, Xinshi street, Xiacheng District, Zhejiang, Hangzhou Patentee before: Jin Limei |
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Denomination of invention: Solder without cadmium and silver Effective date of registration: 20110805 Granted publication date: 20091111 Pledgee: Societe Generale Bank, Limited by Share Ltd, Hangzhou branch Pledgor: Hangzhou Huaguang Advanced Welding Materials Co., Ltd. Registration number: 2011990000299 |
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Date of cancellation: 20111207 Granted publication date: 20091111 Pledgee: Societe Generale Bank, Limited by Share Ltd, Hangzhou branch Pledgor: Hangzhou Huaguang Advanced Welding Materials Co., Ltd. Registration number: 2011990000299 |