CN100426541C - 产生可见光的发光装置 - Google Patents
产生可见光的发光装置 Download PDFInfo
- Publication number
- CN100426541C CN100426541C CNB2005100984177A CN200510098417A CN100426541C CN 100426541 C CN100426541 C CN 100426541C CN B2005100984177 A CNB2005100984177 A CN B2005100984177A CN 200510098417 A CN200510098417 A CN 200510098417A CN 100426541 C CN100426541 C CN 100426541C
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- China
- Prior art keywords
- light
- organic fluorescent
- emitting
- layer
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000013078 crystal Substances 0.000 claims abstract description 15
- 235000000177 Indigofera tinctoria Nutrition 0.000 claims abstract description 8
- 229940097275 indigo Drugs 0.000 claims abstract description 8
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920000620 organic polymer Polymers 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000007650 screen-printing Methods 0.000 claims abstract description 4
- 238000004544 sputter deposition Methods 0.000 claims abstract description 4
- 238000007738 vacuum evaporation Methods 0.000 claims abstract description 4
- 238000007639 printing Methods 0.000 claims abstract 2
- 238000005538 encapsulation Methods 0.000 claims description 20
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 229940124530 sulfonamide Drugs 0.000 claims description 6
- 238000009877 rendering Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 230000000704 physical effect Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000005266 casting Methods 0.000 abstract description 4
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 239000011575 calcium Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910052788 barium Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100984177A CN100426541C (zh) | 2005-09-06 | 2005-09-06 | 产生可见光的发光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100984177A CN100426541C (zh) | 2005-09-06 | 2005-09-06 | 产生可见光的发光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1929155A CN1929155A (zh) | 2007-03-14 |
CN100426541C true CN100426541C (zh) | 2008-10-15 |
Family
ID=37859030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100984177A Expired - Fee Related CN100426541C (zh) | 2005-09-06 | 2005-09-06 | 产生可见光的发光装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100426541C (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8232563B2 (en) * | 2007-06-14 | 2012-07-31 | Epistar Corporation | Light-emitting device |
CN102563543B (zh) | 2011-05-09 | 2015-01-07 | 深圳市绎立锐光科技开发有限公司 | 基于光波长转换产生高亮度单色光的方法及光源 |
TWI448806B (zh) | 2011-09-22 | 2014-08-11 | Delta Electronics Inc | 螢光劑裝置及其所適用之光源系統及投影設備 |
US10310363B2 (en) | 2011-09-22 | 2019-06-04 | Delta Electronics, Inc. | Phosphor device with spectrum of converted light comprising at least a color light |
US10688527B2 (en) | 2011-09-22 | 2020-06-23 | Delta Electronics, Inc. | Phosphor device comprising plural phosphor agents for converting waveband light into plural color lights with different wavelength peaks |
CN110275380B (zh) * | 2016-04-19 | 2021-11-23 | 台达电子工业股份有限公司 | 荧光剂装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1053624A (zh) * | 1990-01-25 | 1991-08-07 | 北京工业大学特种颜料厂 | 三原色荧光颜料及其制备方法 |
CN1434521A (zh) * | 2002-01-21 | 2003-08-06 | 诠兴开发科技股份有限公司 | 白色发光二极管的制造方法 |
CN1549355A (zh) * | 2003-05-08 | 2004-11-24 | 连营科技股份有限公司 | 发光二极管及其制造方法 |
CN1755956A (zh) * | 2004-09-30 | 2006-04-05 | 李文清 | 白光发光装置 |
CN2785144Y (zh) * | 2004-09-30 | 2006-05-31 | 李文清 | 白光发光二极管 |
CN1929156A (zh) * | 2005-09-05 | 2007-03-14 | 亿镫光电科技股份有限公司 | 白光发光装置 |
-
2005
- 2005-09-06 CN CNB2005100984177A patent/CN100426541C/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1053624A (zh) * | 1990-01-25 | 1991-08-07 | 北京工业大学特种颜料厂 | 三原色荧光颜料及其制备方法 |
CN1434521A (zh) * | 2002-01-21 | 2003-08-06 | 诠兴开发科技股份有限公司 | 白色发光二极管的制造方法 |
CN1549355A (zh) * | 2003-05-08 | 2004-11-24 | 连营科技股份有限公司 | 发光二极管及其制造方法 |
CN1755956A (zh) * | 2004-09-30 | 2006-04-05 | 李文清 | 白光发光装置 |
CN2785144Y (zh) * | 2004-09-30 | 2006-05-31 | 李文清 | 白光发光二极管 |
CN1929156A (zh) * | 2005-09-05 | 2007-03-14 | 亿镫光电科技股份有限公司 | 白光发光装置 |
Also Published As
Publication number | Publication date |
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CN1929155A (zh) | 2007-03-14 |
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Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: YANFENG ENTERPRISE CO., LTD. Free format text: FORMER OWNER: PHOTOELECTRIC TECHNOLOGY CO., LTD. Effective date: 20120312 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120312 Address after: Hsinchu County, Taiwan, China Patentee after: Yan Feng Enterprise Limited by Share Ltd Address before: Taiwan County, Taipei, China Patentee before: Photoelectric Technology Co., Ltd. |
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ASS | Succession or assignment of patent right |
Owner name: BONLUMI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: YANFENG ENTERPRISE CO., LTD. Effective date: 20120808 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: FENGTAI, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20120808 Address after: 2A, building 26, No. 62, West Ring Road, Fengtai District, Beijing, China Patentee after: Bonlumi Technoloyg Co., Ltd. Address before: Hsinchu County, Taiwan, China Patentee before: Yan Feng Enterprise Limited by Share Ltd |
|
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20070314 Assignee: Hershey photoelectric (Putian) Co. Ltd. Assignor: Bonlumi Technoloyg Co., Ltd. Contract record no.: 2013350000069 Denomination of invention: Light-emitting device generating visible light Granted publication date: 20081015 License type: Common License Record date: 20130524 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20070314 Assignee: Guangdong Shunde Hershey Photoelectric Technology Co. Ltd. Assignor: Bonlumi Technoloyg Co., Ltd. Contract record no.: 2013990000771 Denomination of invention: Light-emitting device generating visible light Granted publication date: 20081015 License type: Common License Record date: 20131119 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081015 Termination date: 20170906 |
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CF01 | Termination of patent right due to non-payment of annual fee |