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CN100414727C - A method for controlling the coating thickness of white light LED phosphor powder - Google Patents

A method for controlling the coating thickness of white light LED phosphor powder Download PDF

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Publication number
CN100414727C
CN100414727C CNB2005100952852A CN200510095285A CN100414727C CN 100414727 C CN100414727 C CN 100414727C CN B2005100952852 A CNB2005100952852 A CN B2005100952852A CN 200510095285 A CN200510095285 A CN 200510095285A CN 100414727 C CN100414727 C CN 100414727C
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coating
white light
coating thickness
fluorescent powder
controlling
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CN1960008A (en
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徐向阳
唐建华
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RIYUE ILLUMINATION APPLIANCES CO Ltd JIANGSE
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RIYUE ILLUMINATION APPLIANCES CO Ltd JIANGSE
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Abstract

本发明涉及一种白光LED荧光粉涂覆厚度控制方法。当前,人们使用的LED荧光粉涂覆都存在厚度不均的问题,造成白光LED角向色温差异的主要原因。本发明通过将荧光粉的粒度控制在3-8μm,胶粉混合物的比重和粘度分别控制在1.25-1.60g/cm3、20-60S,并且将芯片在涂覆前进行30-90℃的温度下热风预热,涂覆后在30-90℃的温度下烘干一定时间等技术处理,实现了LED荧光粉涂覆厚度的均匀。本发明具有收率高、粉层均匀等特点。The invention relates to a method for controlling the coating thickness of white light LED fluorescent powder. At present, the coating of LED phosphors used by people has the problem of uneven thickness, which is the main reason for the difference in angular color temperature of white light LEDs. In the present invention, the particle size of the fluorescent powder is controlled at 3-8 μm, the specific gravity and viscosity of the rubber powder mixture are respectively controlled at 1.25-1.60 g/cm 3 , 20-60S, and the chip is subjected to a temperature of 30-90 ° C before coating. Preheating with hot air, drying at a temperature of 30-90°C for a certain period of time after coating, and other technical treatments have achieved uniform coating thickness of LED phosphors. The invention has the characteristics of high yield, uniform powder layer and the like.

Description

一种白光LED荧光粉涂覆厚度控制方法 A method for controlling the coating thickness of white light LED phosphor powder

所属技术领域Technical field

本发明涉及一种白光LED荧光粉涂覆厚度控制方法,属于光电子发光技术领域。The invention relates to a method for controlling the coating thickness of white LED fluorescent powder, and belongs to the technical field of optoelectronic luminescence.

背景技术 Background technique

LED(发光二极管,Light-Emitting Diode)是一类可直接将电能转化为可见光和辐射能的发光器件,具有工作电压低,耗电量小,发光效率高,发光响应时间极短,光色纯,结构牢固,抗冲击,耐振动,性能稳定可靠,重量轻,体积小,成本低等一系列特性,发展突飞猛进。其中,基于氮化镓GaN蓝光芯片的白光LED是化合物半导体乃至于整个光电子和半导体产业界的研发热点。白光LED是一种新型半导体全固态照明光源。与传统照明技术相比,这种新型光源具有高效节能、长寿命、小体积、易维护、绿色环保、使用安全、耐候性好等领先优势,被公认为是未来照明光源之首选。传统的荧光粉壁涂的厚度不均是造成白光LED角向色温差异的主要原因。因此,人们希望有一种新的控制荧光粉涂覆厚度的方法问世,它能够克服上述缺点。LED (Light-Emitting Diode) is a type of light-emitting device that can directly convert electrical energy into visible light and radiant energy. It has low operating voltage, low power consumption, high luminous efficiency, extremely short luminous response time, and pure light color. , Strong structure, shock resistance, vibration resistance, stable and reliable performance, light weight, small size, low cost and a series of characteristics, the development is advancing by leaps and bounds. Among them, white LEDs based on gallium nitride GaN blue chips are a research and development hotspot for compound semiconductors and even the entire optoelectronics and semiconductor industry. White LED is a new type of semiconductor all-solid-state lighting source. Compared with traditional lighting technology, this new type of light source has leading advantages such as high efficiency and energy saving, long life, small size, easy maintenance, green environmental protection, safe use, and good weather resistance. It is recognized as the first choice for future lighting sources. The uneven thickness of the traditional phosphor wall coating is the main reason for the difference in angular color temperature of white LEDs. Therefore, it is hoped that a new method for controlling the coating thickness of phosphor powder will be available, which can overcome the above-mentioned shortcomings.

发明内容 Contents of the invention

本发明的目的在于提供一种荧光粉涂覆厚度的控制方法,它能够解决因荧光粉厚度不均造成角向色温差异的问题。The object of the present invention is to provide a method for controlling the coating thickness of fluorescent powder, which can solve the problem of angular color temperature difference caused by uneven thickness of fluorescent powder.

本发明是通过以下技术方案实现的,它是将含有YAG荧光粉和胶体经过特定的球磨、过滤、调节比重、粘度、涂覆、烘干技术处理过程,具体步骤如下,The present invention is achieved through the following technical scheme, which is to process the YAG fluorescent powder and colloid through specific ball milling, filtering, adjusting specific gravity, viscosity, coating and drying technology, the specific steps are as follows,

1、YAG荧光粉的粒度,通过球磨来达到3-8um,1. The particle size of YAG phosphor is 3-8um by ball milling.

2、用200目和500目的网把偏细或偏粗的荧光粉颗粒去除,2. Use 200-mesh and 500-mesh nets to remove the finer or thicker phosphor particles,

3、将环氧树脂胶与荧光粉混合成比重为1.25-1.60g/cm3,粘度为20-60S的胶体,3. Mix epoxy resin glue and fluorescent powder to form a colloid with a specific gravity of 1.25-1.60g/cm 3 and a viscosity of 20-60S.

4、涂覆前将芯片进行热风预热,达到30-90℃,4. Before coating, preheat the chip with hot air to 30-90°C.

5、将涂覆胶体后的芯片在30-90℃的环境下,烘干45秒钟。5. Dry the colloid-coated chip for 45 seconds at 30-90°C.

本发明具有收率高、粉层均匀等优点。The invention has the advantages of high yield, uniform powder layer and the like.

具体实施例specific embodiment

本发明的白光LED荧光粉涂覆厚度的方法,The method for coating the thickness of the white light LED fluorescent powder of the present invention,

1、取YAG荧光粉进行球磨,使其粒度在3-8um。1. Take YAG fluorescent powder for ball milling to make the particle size 3-8um.

2、用250目和300目的尼龙网将经过球磨的YAG荧光粉中偏细或偏粗的荧光粉颗粒去除。2. Use 250-mesh and 300-mesh nylon nets to remove the finer or coarser phosphor particles in the ball-milled YAG phosphor.

3、将环氧树酯胶与荧光粉混合,混合后的胶体比重为1.50-1.55g/cm3,粘度为43S。3. Mix the epoxy resin glue with the fluorescent powder, the specific gravity of the mixed colloid is 1.50-1.55g/cm 3 , and the viscosity is 43S.

4、涂覆前将芯片在40-45℃的条件下热风预热。4. Preheat the chip with hot air at 40-45°C before coating.

5、涂覆胶体后的芯片在40-45℃的环境下烘干5秒。5. Dry the colloid-coated chip for 5 seconds at 40-45°C.

用本发明的方法制作的大尺寸LED色坐标为(0.3192,0.3361),非常接近理想白光点(0.33,0.33),显色指数为80左右,色温在5000-10000K范围。The color coordinates of the large-sized LED produced by the method of the invention are (0.3192, 0.3361), very close to the ideal white light point (0.33, 0.33), the color rendering index is about 80, and the color temperature is in the range of 5000-10000K.

Claims (1)

1. 一种白光LED荧光粉的涂覆厚度控制方法,其特征在于,1. A coating thickness control method of white light LED fluorescent powder, is characterized in that, (1)YAG荧光粉的粒度,通过球磨来达到3-8um,(1) The particle size of YAG phosphor is 3-8um by ball milling, (2)用200目和500目的网把偏细或偏粗的荧光粉颗粒去除,(2) Use 200-mesh and 500-mesh nets to remove the finer or thicker phosphor particles, (3)将环氧树脂胶与荧光粉混合成比重为1.25-1.60g/cm3,粘度为20-60S的胶体,(3) Mix epoxy resin glue and fluorescent powder into a colloid with a specific gravity of 1.25-1.60g/cm 3 and a viscosity of 20-60S, (4)涂覆前将芯片进行热风预热,达到30-90℃,(4) Before coating, preheat the chip with hot air to 30-90°C, (5)将涂覆胶体后的芯片在30-90℃的环境下,烘干45秒钟。(5) Dry the colloid-coated chip for 45 seconds in an environment of 30-90°C.
CNB2005100952852A 2005-11-04 2005-11-04 A method for controlling the coating thickness of white light LED phosphor powder Expired - Fee Related CN100414727C (en)

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CN1960008A CN1960008A (en) 2007-05-09
CN100414727C true CN100414727C (en) 2008-08-27

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1146015A (en) * 1997-07-28 1999-02-16 Nichia Chem Ind Ltd Light emitting diode and method of forming the same
US6501100B1 (en) * 2000-05-15 2002-12-31 General Electric Company White light emitting phosphor blend for LED devices
WO2004021461A2 (en) * 2002-08-30 2004-03-11 Gelcore Llc Phosphor-coated led with improved efficiency
WO2004074400A1 (en) * 2003-02-20 2004-09-02 Patent-Treuhand-Gesell Schaft Für Elektrische Glü Hlampen Mbh Coated fluorescent substance, light emitting device comprising said substance and a method for producing said substance

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1146015A (en) * 1997-07-28 1999-02-16 Nichia Chem Ind Ltd Light emitting diode and method of forming the same
US6501100B1 (en) * 2000-05-15 2002-12-31 General Electric Company White light emitting phosphor blend for LED devices
WO2004021461A2 (en) * 2002-08-30 2004-03-11 Gelcore Llc Phosphor-coated led with improved efficiency
WO2004074400A1 (en) * 2003-02-20 2004-09-02 Patent-Treuhand-Gesell Schaft Für Elektrische Glü Hlampen Mbh Coated fluorescent substance, light emitting device comprising said substance and a method for producing said substance

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