CN103094461B - Optical wavelength transition components, its preparation method and white light emitting device - Google Patents
Optical wavelength transition components, its preparation method and white light emitting device Download PDFInfo
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Abstract
The invention provides a kind of optical wavelength transition components, its preparation method and white light emitting device.Wherein optical wavelength transition components, comprise resin substrate, and on the surface of resin substrate, there is the mixed coating containing resin, fluorescent material, in its preparation process, the mass ratio of toner and phosphor powder is 100:1-20:150, the mass ratio of solvent and binding agent is 100:1-100:100, the volume ratio that phosphor powder adds the cumulative volume of toner mixture and the cumulative volume of solvent adding additives mixture is 1:100-300:100, and the particle diameter of the powder of the powder of resin and fluorescent material is between 1 micron to 60 microns.The present invention effectively can solve and above-mentionedly utilize the device light efficiency that occurs in traditional light-emitting device manufactured by LED technique to decline and the problem such as light-emitting phosphor deterioration in characteristics.
Description
Technical field
The present invention relates to LED illumination field, and relate to a kind of optical wavelength transition components, its preparation method and white light emitting device especially.
Background technology
White light LEDs is as novel illumination light source, and its operation principle utilizes blue chip to obtain white light with yellow phosphor combination (or other compound mode).Traditional LED is directly coated in blue chip surface after silica gel or resin being mixed with fluorescent material, but the shortcoming that this packaged type has it intrinsic.The heat radiation of LED component freely can not cause device operating temperature to raise, and the emission wavelength of fluorescent material is drifted about, and luminous intensity declines.On the other hand, the fluorescent material of larger particles can make light fully mix, and also can enter blue chip by antireflection part light simultaneously, have impact on the light efficiency of luminescent device.
Summary of the invention
The resin substrate that the object of the invention is to provide a kind of optical wavelength transition components, manufacture method and utilization to comprise fluorescence resin coating manufactures White LED light-emitting device, and this device effectively can solve and above-mentionedly utilize the device light efficiency occurred in traditional light-emitting device manufactured by LED technique to decline and the problem such as light-emitting phosphor deterioration in characteristics.
For reaching above-mentioned purpose, the present invention proposes a kind of optical wavelength transition components, it is characterized in that, comprise resin substrate, and on the surface of resin substrate, there is the mixed coating containing resin and fluorescent material, the preparation of coating is characterized as, be coated on resin substrate by toner, fluorescent material after mixing with solvent and binding agent, drying and heated baking, after solvent evaporates, toner softens rear coating fluorescent powder and inter-adhesive formation one deck resinous coat, and is integrated with resin substrate; Wherein the material of resin substrate is PMMA or the MS resin that PMMA, PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC strengthen; The material of toner is PMMA or the MS resin that PMMA, PMMA alloy resin, Merlon, PC alloy resin, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, nylon or PC strengthen; Resin substrate and toner are material of the same race or dissimilar substances.
Further, resin substrate A also can be designed to other shape, and its effect is printing opacity and light is directed to different directions, support fixing fluorescence resin coating.Resin substrate A is plane, sphere, hyperboloid, ellipsoid, oraloid or paraboloidal convex-surface type sheet material or is cylindrical sheet material.
Further, wherein fluorescent material is the mixture of LED yellow fluorescent powder, LED green emitting phosphor and LED red fluorescence powder or the mixture of LED yellow fluorescent powder and a small amount of LED red fluorescence powder.
For reaching above-mentioned purpose, the present invention separately proposes a kind of preparation method of optical wavelength transition components, comprises the following steps:
(1) toner, phosphor powder, binding agent and solvent are blended into uniform slurry, wherein the mass ratio of toner, phosphor powder is 100:1-20:150, the mass ratio of solvent and binding agent is 100:1-100:100, the volume ratio that phosphor powder adds the cumulative volume of resin B mixture of powders and the cumulative volume of solvent adding additives mixture is 1:100-300:100, and the particle diameter of the powder of the powder of resin and fluorescent material is between 1 micron to 60 microns; Wherein solvent is alcohol, ether, ketone, ester, the hydro carbons of liquid, and binding agent is the polymer (as water-soluble polyvinyl alcohol, carboxycellulose), acrylic resin, styrene resin, butyral resin, the ethyl cellulose that are dissolved in solvent.
(2) be evenly coated on resin substrate by above-mentioned slurry, then by dry for the resin substrate of coating slurry, baking temperature is 40 DEG C-130 DEG C, and drying time is 5 minutes-10 hours;
(3) by the dried resin substrate baking scribbling slurry, baking temperature is 100 DEG C-260 DEG C, heating rate is 1-10 DEG C/min, baking time is 5 minutes-20 hours, temperature fall time is 20 minutes-10 hours, obtains the mixed coating containing fluorescent material and resin on resin substrate A surface.
Further, wherein in step (2), dry run can be carried out in atmosphere, also can carry out in a vacuum.
Further, wherein in step (3), bake process can carry out in atmosphere, and also can carry out roasting mode is in a vacuum utilize infrared ray direct baking or utilize electric-heating-wire-heating to toast;
Further, wherein step (2) and (3) can be merged into a step heating step and carry out.
For reaching above-mentioned purpose, the present invention separately proposes a kind of white light emitting device, comprise base, blue-light LED chip, reflection shield and wavelength conversion component, the two ends of reflection shield connect heat sink and wavelength conversion component respectively, blue-light LED chip is arranged on the one side of seating plane to wavelength conversion component, and the contact conductor of blue-light LED chip passes base, optical wavelength transition components comprises resin substrate, and has the mixed coating containing resin and fluorescent material on the surface of resin substrate; Wherein base can be metallic plate, or LED support.
In order to prevent resinous coat aging, a small amount of ultra-violet absorber (as UV-327, UV326, UV328, UV531, UV-9 etc.) or antioxidant (as antioxidant 1076, antioxidant 2246, antioxidant 245, antioxidant 1010 and auxiliary antioxidant 168 etc.) can also be added in the mixed-powder of phosphor powder and toner; The mass ratio of toner and ultra-violet absorber and toner and antioxidant is 100:0.01 ~ 100:0.7.
In order to strengthen the mixed effect of light, appropriate SiO can also be added in the mixed-powder of phosphor powder and toner
2, ZrO
2, Al
2o
3deng ceramic particle, play mixed light; Wherein the volume ratio of phosphor powder and ceramic particle is 100:1 ~ 100:150.
Further, wherein keyset or adapter ring is provided with between reflection shield and resin substrate A.
The invention has the beneficial effects as follows, in luminescent device constructed in accordance, directly be not bonded on LED blue chip by the mixture of silica gel or resin and fluorescent material and encapsulate, LED blue chip 4 radiating effect strengthens greatly, and the heat dissipation problem of chip is alleviated greatly; Simultaneously because the resin B in fluorescence resin coating is operated in lower temperature, can avoid using in the LED of conventional art encapsulation due to silica gel or the resin rotten device light efficiency decline problem caused of turning to be yellow in illumination and under working in higher temperature.In luminescent device constructed in accordance, chip cooling problem is effectively solved, and the ambient temperature of fluorescent material is low, and therefore the problems such as the luminescent properties deterioration caused because of the elevated operating temperature of device can not occur.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment of the present invention optical wavelength transition components.
Fig. 2 is the flow chart of the preparation method of optical wavelength transition components in Fig. 1.
Fig. 3 is for utilizing the structural representation of the white light emitting device of the optical wavelength transition components shown in Fig. 1.
Embodiment
In order to more understand technology contents of the present invention, institute's accompanying drawings is coordinated to be described as follows especially exemplified by specific embodiment.
Fig. 1 is the structural representation of embodiment of the present invention optical wavelength transition components.Optical wavelength transition components, comprises resin substrate 11, and has the mixed coating 12 containing resin and fluorescent material 13 on the surface of resin substrate.
Wherein the material of resin substrate 11 is PMMA or MS resins that PMMA, PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC strengthen; The material of toner is PMMA or the MS resin that PMMA, PMMA alloy resin, Merlon, PC alloy resin, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, nylon or PC strengthen; Resin substrate and toner can be materials of the same race, also can be different materials.
Resin substrate also can be designed to other shape, and its effect is printing opacity and light is directed to different directions, support fixing fluorescence resin coating.Resin substrate A is plane, sphere, hyperboloid, ellipsoid, oraloid or paraboloidal convex-surface type sheet material or is cylindrical sheet material.
The wherein mixture of fluorescent material LED yellow fluorescent powder, LED green emitting phosphor and LED red fluorescence powder or the mixture of LED yellow fluorescent powder and a small amount of LED red fluorescence powder.
Fig. 2 is the flow chart of the preparation method of optical wavelength transition components in Fig. 1, and the preparation method of optical wavelength transition components comprises the following steps:
Toner, phosphor powder, binding agent and solvent are blended into uniform slurry by S201, wherein the mass ratio of toner, phosphor powder is 100:1-20:150, the mass ratio of solvent and binding agent is 100:1-100:100, the volume ratio that phosphor powder adds the cumulative volume of resin B mixture of powders and the cumulative volume of solvent adding additives mixture is 1:100-300:100, and the particle diameter of the powder of the powder of resin and fluorescent material is between 1 micron to 60 microns; Wherein solvent is alcohol, ether, ketone, ester, the hydro carbons of liquid, and binding agent is the polymer (as water-soluble polyvinyl alcohol, carboxycellulose), acrylic resin, styrene resin, butyral resin, the ethyl cellulose that are dissolved in solvent.
Above-mentioned slurry is evenly coated on resin substrate by S203, and by the resin substrate freeze-day with constant temperature of coating slurry, baking temperature is 40 DEG C-130 DEG C, and drying time is 5 minutes-10 hours;
S205 is by the dried resin substrate baking scribbling slurry, baking temperature is 100 DEG C-260 DEG C, and heating rate is 1-10 DEG C/min, and baking time is 5 minutes-20 hours, temperature fall time is 20 minutes-10 hours, obtains the mixed coating containing fluorescent material and resin on resin substrate A surface.Baking is to make organic solvent volatilize completely or decompose, and the powder of resin B is softened and fluorescent powder grain adhesion, final coating fluorescent powder particle, and is integrated with resin substrate A; For this reason, preferably at the binding agent that this temperature range can be decomposed; Preferred resin substrate A and resin B are material of the same race, and both are more closely bonding; Bake process can carry out in atmosphere, also can carry out in a vacuum; In order to make resin substrate A indeformable in bake process, mould can also be utilized in bake process to keep its physical form; Roasting mode can be utilize infrared ray direct baking, and electric-heating-wire-heating also can be utilized to toast; Also S203 and S205 can be merged into a step heating step to carry out.
Fig. 3 is for utilizing the structural representation of the white light emitting device of the optical wavelength transition components shown in Fig. 1.White light emitting device comprises base 1, blue-light LED chip 2, reflection shield 3 and wavelength conversion component, the two ends of reflection shield 3 connect base 1 and wavelength conversion component respectively, blue-light LED chip 2 is arranged on the one side of base 1 in the face of wavelength conversion component, and the contact conductor 21,22 of blue-light LED chip 2 passes base, optical wavelength transition components comprises resin substrate 11, and has the mixed coating 12 containing resin and fluorescent material 13 on the surface of resin substrate.
As shown in Figure 3, wherein base can be metallic plate, or LED support.
As shown in Figure 3, described blue-light LED chip can be jewel (Al
2o
3) blue chip of Grown, also can be the blue chip that SiC substrate grows, or the blue chip of Si Grown, or any one in above-mentioned three kinds of substrates is transferred on other substrates after growth.The effect that described light reflection (collection) covers be light collection that blue chip 4 is sent to above containing on the transparent resin substrate A of fluorescence resin coating.Within the scope without prejudice to the object of the present invention, the light reflection cover of luminescent device also can be designed to other shape, its effect be exactly light collection that blue chip 4 is sent to above containing on the resin substrate A of fluorescence resin coating.
Switch on power to blue chip 2 by electrode 10, have electric current I to pass through, now blue chip 2 just can send blue light, as shown in the L in Fig. 3.Phosphor powder 13 in the blue-light excited mixed coating that blue chip 2 sends, fluorescent material sends gold-tinted, or green glow, or ruddiness, or the mixing light of certain two kinds of light in above-mentioned three kinds of light.Concrete fluorescent material sends the component which kind of light depends on fluorescent material 13.The component of fluorescent material 13 is determined by the formula of fluorescent material 13 grade.The blue light that blue chip 4 sends and fluorescent material 13 light sent that is stimulated mixes and can send white light, as shown in the W in Fig. 3.The one side back to blue chip that white light W is comprising resin substrate 11 appears; The luminescence of reflection shield 3 pairs of LED blue chips or chipset is reflected or collects.
In order to prevent resinous coat aging, a small amount of ultra-violet absorber (as UV-327, UV326, UV328, UV531, UV-9 etc.) or antioxidant (as antioxidant 1076, antioxidant 2246, antioxidant 245, antioxidant 1010 and auxiliary antioxidant 168 etc.) can also be added in the mixed-powder of phosphor powder and toner; The mass ratio of toner and ultra-violet absorber and toner and antioxidant is 100:0.01 ~ 100:0.7.
In order to strengthen the mixed effect of light, appropriate SiO can also be added in the mixed-powder of phosphor powder and toner
2, ZrO
2, Al
2o
3deng ceramic particle, play mixed light; Wherein the volume ratio of phosphor powder and ceramic particle is 100:1 ~ 100:150.
Further, wherein keyset or adapter ring is provided with between reflection shield and resin substrate A.
The invention has the beneficial effects as follows, in luminescent device constructed in accordance, directly be not bonded on LED blue chip by the mixture of silica gel or resin and fluorescent material and encapsulate, LED blue chip 4 radiating effect strengthens greatly, and the heat dissipation problem of chip is alleviated greatly; Simultaneously because the resin B in fluorescence resin coating is operated in lower temperature, can avoid using in the LED of conventional art encapsulation due to silica gel or the resin rotten device light efficiency decline problem caused of turning to be yellow in illumination and under working in higher temperature.In luminescent device constructed in accordance, chip cooling problem is effectively solved, and the ambient temperature of fluorescent material is low, and therefore the problems such as the luminescent properties deterioration caused because of the elevated operating temperature of device can not occur.
Although the present invention with preferred embodiment disclose as above, so itself and be not used to limit the present invention.Persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is when being as the criterion depending on those as defined in claim.
Claims (1)
1. a preparation method for optical wavelength transition components, is characterized in that, comprises the following steps:
(1) toner, phosphor powder, binding agent and solvent are blended into uniform slurry, wherein the mass ratio of toner, phosphor powder is 100:1-20:150, the mass ratio of solvent and binding agent is 100:1-100:100, the volume ratio that phosphor powder adds the cumulative volume of toner mixture and the cumulative volume of solvent adding additives mixture is 1:100-300:100, and the particle diameter of the powder of the powder of resin and fluorescent material is between 1 micron to 60 microns; Wherein solvent is alcohol, ether, ketone, ester, the hydro carbons of liquid, and binding agent is the polymer, acrylic resin, styrene resin, butyral resin, the ethyl cellulose that are dissolved in solvent;
Wherein in the mixed-powder of phosphor powder and toner, be also added with SiO
2, ZrO
2, or Al
2o
3ceramic particle, wherein the volume ratio of phosphor powder and ceramic particle is 100:1 ~ 100:150;
(2) be evenly coated on resin substrate by above-mentioned slurry, then by dry for the resin substrate of coating slurry, baking temperature is 40 DEG C-130 DEG C, and drying time is 5 minutes-10 hours;
(3) by the dried resin substrate baking scribbling slurry, baking temperature is 100 DEG C-260 DEG C, and heating rate is 1-10 DEG C/min, and baking time is 5 minutes-20 hours, temperature fall time is 20 minutes-10 hours, obtains the mixed coating containing fluorescent material and resin on resin substrate surface;
Wherein in step (2) dry run at air or carry out in a vacuum; Or step (2) and (3) are merged into a step heating step carry out;
Wherein in step (3), bake process can carry out in atmosphere or in a vacuum, and roasting mode utilizes infrared ray direct baking or utilizes electric-heating-wire-heating to toast.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310005784.2A CN103094461B (en) | 2013-01-08 | 2013-01-08 | Optical wavelength transition components, its preparation method and white light emitting device |
| PCT/CN2013/074279 WO2014026486A1 (en) | 2012-08-17 | 2013-04-16 | Led light-emitting device for white light |
| US14/376,413 US9490402B2 (en) | 2012-08-17 | 2013-04-16 | LED light-emitting device for white light |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310005784.2A CN103094461B (en) | 2013-01-08 | 2013-01-08 | Optical wavelength transition components, its preparation method and white light emitting device |
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| CN103094461A CN103094461A (en) | 2013-05-08 |
| CN103094461B true CN103094461B (en) | 2016-03-30 |
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| CN104485411A (en) * | 2014-11-14 | 2015-04-01 | 江苏脉锐光电科技有限公司 | A remote phosphor lens and manufacturing method and application thereof |
| CN105674214B (en) * | 2014-11-21 | 2018-10-09 | 深圳市光峰光电技术有限公司 | A kind of preparation method and relevant wavelength transformational structure of Wavelength transformational structure |
| WO2016194351A1 (en) * | 2015-05-29 | 2016-12-08 | 富士フイルム株式会社 | Wavelength conversion member and backlight unit provided with same, and liquid crystal display device |
| CN106684231B (en) * | 2016-12-30 | 2018-08-21 | 江苏稳润光电有限公司 | A kind of CSP chip scale packages and packaging method |
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| CN102810537A (en) * | 2012-08-17 | 2012-12-05 | 南通脉锐光电科技有限公司 | White-light LED lighting device |
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| US20120281387A1 (en) * | 2011-05-04 | 2012-11-08 | Ligitek Electronics Co., Ltd. | Structure of light-emitting diode |
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|---|---|---|---|---|
| CN102800795A (en) * | 2012-08-17 | 2012-11-28 | 南通脉锐光电科技有限公司 | White light LED light emitting device based on fluorescent resin |
| CN102800794A (en) * | 2012-08-17 | 2012-11-28 | 南通脉锐光电科技有限公司 | Optical wavelength conversion device and application thereof in white light emitting device |
| CN102810537A (en) * | 2012-08-17 | 2012-12-05 | 南通脉锐光电科技有限公司 | White-light LED lighting device |
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