CN100389051C

CN100389051C - Packaging structure for packaging semiconductor assembly

Info

Publication number: CN100389051C
Application number: CNB2006100877926A
Authority: CN
Inventors: 曾德海; 黄靖师
Original assignee: AU Optronics Corp
Current assignee: AUO Corp
Priority date: 2006-06-07
Filing date: 2006-06-07
Publication date: 2008-05-21
Anticipated expiration: 2026-06-07
Also published as: CN1861495A

Abstract

A package structure is used for packaging at least two semiconductor components. The packaging structure comprises a flexible film, and the flexible film is provided with a contact surface. The at least two semiconductor components are placed on the contact surface, and the contact surface has micro-viscosity, so that the relative positions of the at least two semiconductor components and the contact surface are fixed.

Description

Be used to pack the packaging structure of semiconductor subassembly

Technical field

The invention relates to a kind of packaging structure, and particularly relevant for a kind of can be in order to the packaging structure of display panel of packing various sizes.

Background technology

Along with the progress of telltale production technology, display panel that can the various size of stock production.The display panel of being produced needs a large amount of packing injury-free to guarantee panel in the process of transporting, so the selecting for use to transport in the integral body assembling and occupy cooresponding cost in the program of packing and manner of packing.

In order to pack the packaging structure of undersized display panel, mostly be with various plastics, at present as polystyrene (polystyrene, PS) or expandable polypropylene (be Styrofoam, expandablepolypropylene EPP) waits the storage tank that forms fixed measure, to put display panel.But when the display panel of producing has various different size, must the various packaging structure of corresponding production.Not only cause the waste of resource, do not meet environmental benefit, and need a large amount of storage spaces to hold packing.The relevant cost of required cost is very considerable.

Summary of the invention

In view of this, purpose of the present invention just provides a kind of packaging structure, with the fixing display panel of various sizes of simple adhesion system, and can ranked and stacked pile.Can save the production of a large amount of packing and deposit reduction relevant cost.

According to purpose of the present invention, a kind of packaging structure is proposed, in order at least two semiconductor subassemblies of packing.Packaging structure comprises a pliability film, and the pliability film has a contact surface.At least two semiconductor subassemblies are to be seated on the contact surface, and contact surface has microviscosity, and the relative position that makes at least two semiconductor subassemblies and contact surface is for fixing.

According to purpose of the present invention, another kind of packaging structure is proposed, in order to the packing semiconductor subassembly, comprise one first container, one second container, one first pliability film, a padded coaming and one second pliability film.First container and second container combination form an accommodation space, and the first pliability film is placed in the accommodation space.The first pliability film has one first contact surface, and at least two first semiconductor subassemblies are to be seated on first contact surface.First contact surface has microviscosity, and the relative position that makes at least two first semiconductor subassemblies and first contact surface is for fixing.Padded coaming is positioned on two first semiconductor subassemblies at least, and the second pliability film is positioned on the padded coaming.The second pliability film has one second contact surface, and at least two second semiconductor subassemblies are to be seated on second contact surface.Second contact surface has microviscosity, and the relative position that makes at least two second semiconductor subassemblies and second contact surface is for fixing.

For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:

Description of drawings

Fig. 1 illustrates the decomposition diagram of a kind of packaging structure of the present invention;

Fig. 2 illustrate packaging structure of the present invention in conjunction with scheme drawing; And

Fig. 3 illustrates the enlarged detail that packaging structure of the present invention combines with the semiconductor subassembly of packaging.

The primary clustering nomenclature

1: semiconductor subassembly

10: the first semiconductor subassemblies

20: the second semiconductor subassemblies

100: packaging structure

110: the first containers

120: the first pliability films

122: the first contact surfaces

130,150: padded coaming

140: the second pliability films

142: the second contact surfaces

160: the second containers

The specific embodiment

Please refer to Fig. 1, it illustrates the decomposition diagram of a kind of packaging structure of the present invention.Packaging structure 100 comprises first container 110, second container 160, the first pliability film 120, padded

coaming

130 and 150, and the second pliability film 140.First container 110 and second container 160 are combined to form an accommodation space, and the first pliability film 120 is placed in the accommodation space.First container 110 and second container 160 are to use the material that has bearing capacity, can not excessive deformation, for example Styrofoam, duroplasts or metal.But the binding site of first container 110 and second container 160 preferably is designed to the structure of socket, makes the combination that first container 110 and second container 160 can be firm.The first pliability film 120 has first contact surface 122, and a plurality of first semiconductor subassemblies 10 are to be seated on first contact surface 122.Because first contact surface 122 has microviscosity, first semiconductor subassembly 10 can be fixed on first contact surface 122, first semiconductor subassembly 10 can not collided each other mutually because of the displacement of horizontal direction.The present invention is so-called to be fixed on first semiconductor subassembly 10 on first contact surface 122, is meant that first semiconductor subassembly 10 is the viscosity by contact surface 122, and makes that the relative position of each other is fixing.Mainly be because the contact surface 122 of pliability film 120 has microviscosity, therefore, after in a single day first semiconductor subassembly 10 is placed in first contact surface 122 of pliability film 120, in general packaging process, specially apply external force in the absence of first semiconductor subassembly 10, first semiconductor subassembly 10 is fixing with the relative position of first contact surface 122 of pliability film 120.In apply external force or since the gravity directions of first semiconductor subassembly 10 itself change, and cause under the situation of breakaway force that between first contact surface 122 of first semiconductor subassembly 10 and pliability film 120 first semiconductor subassembly 10 can separate with first contact surface 122 of pliability film 120.Under a preferable case, the microviscosity that first contact surface 122 has, after can guaranteeing that preferably first semiconductor subassembly 10 is placed on first contact surface 122, when first contact surface 122 was the vertical ground direction, first semiconductor subassembly 10 attached to it can not come off from first contact surface 122 owing to own weight own.Padded coaming 130 is positioned on first semiconductor subassembly 10, and the second pliability film 140 is positioned on the padded coaming 130.Padded coaming 130 can evenly disperse the stress from the top, can not make stress concentration cause the damage of first semiconductor subassembly 10 in certain part, padded coaming can use expandability polyethylene (expandable polyethylene, EPE) material in the present embodiment.The second pliability film 140 has second contact surface 142, and a plurality of second semiconductor subassemblies 20 are to be seated on second contact surface 142, covers to go up cushion layer 150 again.Second contact surface 142 has microviscosity equally, and second semiconductor subassembly 20 is fixed on second contact surface 142 and can be because of the displacement collision mutually of horizontal direction.As the requirement of above-mentioned microviscosity for first contact surface 122, requiring of the requirement of the microviscosity of second contact surface 142 and first contact surface 122 is similar.In the present embodiment, first semiconductor subassembly 10 and second semiconductor subassembly 20 are display panel, particularly undersized display panels or Organic Light Emitting Diode (organic light emitting diode, OLED) display panel.In addition, also can be used for protecting other fragile structures, for example glass substrate, Silicon Wafer or chip.

Referring again to Fig. 2, its illustrate packaging structure of the present invention in conjunction with scheme drawing.As shown in Figure 2, pliability film 120, first semiconductor subassembly 10, padded coaming 130, the second pliability film 140, second semiconductor subassembly 20 and padded coaming 150 are placed in the accommodation space that first container 110 and second container 160 formed in regular turn.For simplicity, only list the stack architecture of two layers of semiconductor subassembly among Fig. 2, certainly, present embodiment is not limited to the stack architecture of two-layer semiconductor subassembly when practice, as long as meeting within the safe range of bearing vertical direction stress, can look the more multi-layered semiconductor subassembly of actual conditions storehouse.It can be by the size of adjusting the accommodation space of being formed between first container 110 and second container 160, or suitable padded coaming is provided, and designs the storehouse situation of adjusting semiconductor subassembly, improves the protection to semiconductor subassembly.

First semiconductor subassembly 10 and second semiconductor subassembly 20 are on being arranged in contact surface 122 and contact surface 142 time, in relative position perpendicular to the normal direction of contact surface 122 or contact surface 142, can be the corresponding position up and down of for example Fig. 1, or the position of staggering each other, or situation about overlapping each other.First semiconductor subassembly 10 can be identical size with the size of second semiconductor subassembly 20, can also be size inequality.

In like manner, be placed in the semiconductor subassembly on same contact surface surface, can be for having the semiconductor subassembly of same size size, can also be for having the semiconductor subassembly of different size size.And with one deck or the semiconductor subassembly of different layers packaging also can be for having the semiconductor subassembly of structure inequality.Alleged herein semiconductor subassembly can for example be display panel, glass substrate, Silicon Wafer or chip, certainly, can also be used for protecting other fragile structures.When the virtual package semiconductor subassembly, can adjust semiconductor subassembly opposite position to each other between levels according to first semiconductor subassembly 10 and the size of second semiconductor subassembly 20, weight own.

Referring again to Fig. 3, it illustrates the enlarged detail that packaging structure of the present invention combines with the semiconductor subassembly of packaging.As shown in Figure 3, semiconductor subassembly 1 is placed on the contact surface 122 of pliability film 120.Because contact surface 122 has microviscosity, and semiconductor subassembly 1 can be fixed on the contact surface 122, can not collide other semiconductor subassembly because of the displacement of horizontal direction.Because the weight of semiconductor subassembly 1 itself makes pliability film 120 produce a depression naturally, and with padded coaming 130 generations one clad structure, protected in semiconductor subassembly 1 is coated on.

In the present invention, when the thickness of semiconductor subassembly for example between between the 0.6mm to 1.2mm the time, the thickness of the pliability film that can be used is for example between between the 0.1mm to 0.5mm; The thickness of the padded coaming that use this moment then can be for greater than 0.5mm or for example between between the 0.5mm to 2.0mm, and the viscosity of the pliability film that uses is between between the 1N/20mm to 10N/20mm.In an alternate embodiment, the thickness of pliability film can also be thickeied to for example between between the 0.5mm to 2.0mm, in the case, can save the use of padded coaming.Certainly, above-mentioned thickness is just as the usefulness that lists, on reality is used, can be according to the variable of the fragility of packaging article itself, size, packing material self character or the like, and other consideration and being adjusted.In addition, if when not considering integral thickness, the upper thickness limit value of each packing can improve.

The disclosed packaging structure of the above embodiment of the present invention is to utilize pliability film and the padded coaming with microviscosity, forms clad structure and fixes and protect the multi-disc semiconductor subassembly, especially can utilize the packing at undersized display panel.Because packaging structure is the soft materials of no solid shape, go for the packing of the semiconductor subassembly of various sizes, do not need according to the different packing of different size design.In addition, its external container can repeated usage, meets environmental protection and economic benefit.

In sum, though the present invention with a preferred embodiment openly as above, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking claims person of defining.

Claims

1. A packaging structure for packaging at least two first semiconductor components, comprising a flexible film, the flexible film has a contact surface, and the at least two first semiconductor components are placed on the contact surface In addition, the contact surface is slightly viscous, so that the relative positions of the at least two first semiconductor components and the contact surface are fixed, wherein the viscosity of the flexible film is between 1N/20mm to 10N/20mm.

2. The packaging structure according to claim 1, further comprising a second flexible film, the second flexible film has a second contact surface, at least two second semiconductor components are placed on the second On the contact surface, the second contact surface has slight viscosity, so that the at least two second semiconductor components are fixed on the second contact surface, and the second flexible film is separated by a buffer material and placed on the on at least two first semiconductor components.

3. The packaging structure according to claim 2, further comprising a cushioning material, a first container and a second container, the first container and the second container are combined to form an accommodating space, the first flexible The film, the at least two first semiconductor components, the buffer material, the second flexible film and the at least two second semiconductor components are sequentially placed in the accommodating space.

4. The packaging structure according to claim 3, wherein the at least two first semiconductor components and the at least two second semiconductor components are staggered in the normal direction of the contact surface.

5. The packaging structure according to claim 2, wherein the cushioning material is expandable polyethylene material.

6. The packaging structure according to claim 1, the at least two semiconductor components are display panels.

7. A packaging structure for packaging semiconductor components, comprising:

A first container and a second container are combined to form an accommodating space;

A first flexible film is placed in the accommodating space, the first flexible film has a first contact surface, at least two first semiconductor components are placed on the first contact surface, the The first contact surface has slight viscosity, so that the relative positions of the at least two first semiconductor components and the first contact surface are fixed;

a buffer material on the at least two first semiconductor components; and

A second flexible film is located on the buffer material, the second flexible film has a second contact surface, at least two second semiconductor components are placed on the second contact surface, the second contact The surface is slightly sticky, so that the relative positions of the at least two second semiconductor components and the second contact surface are fixed.

8. The packaging structure according to claim 7, wherein the at least two first semiconductor components and the at least two second semiconductor components are staggered in the normal direction of the contact surface.

9. The packaging structure according to claim 7, wherein the cushioning material is expandable polyethylene material.

10. The packaging structure according to claim 7, wherein the at least two first semiconductor components and the at least two second semiconductor components are display panels.

11. A packaging structure for packaging at least two first semiconductor components, comprising a flexible film, the flexible film has a contact surface, and the at least two first semiconductor components are placed on the contact surface On the above, the contact surface is slightly viscous, so that the relative positions of the at least two first semiconductor components and the contact surface are fixed, wherein the packaging structure also includes a second flexible film, and the second flexible film has A second contact surface, at least two second semiconductor components are placed on the second contact surface, the second contact surface has slight viscosity, so that the at least two second semiconductor components are fixed on the second contact surface , the second flexible film is separated by a buffer material and placed on the at least two first semiconductor components.