CN100355327C - A printed circuit board and production method thereof - Google Patents
A printed circuit board and production method thereof Download PDFInfo
- Publication number
- CN100355327C CN100355327C CNB2005100568627A CN200510056862A CN100355327C CN 100355327 C CN100355327 C CN 100355327C CN B2005100568627 A CNB2005100568627 A CN B2005100568627A CN 200510056862 A CN200510056862 A CN 200510056862A CN 100355327 C CN100355327 C CN 100355327C
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- cabling
- circuit board
- printed circuit
- welding resistance
- scolder
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Abstract
The present invention relates to a circuit board, particularly to a printed circuit board and a manufacturing method thereof, which are used for enhancing the current carrying capacity of the running wires of the printed circuit board. The circuit board comprises running wires and a welding resisting layer covered on the running wires, wherein at least one welding resisting open window is arranged along the length direction of at least one running wire in the welding resisting layer, solders are filled in the welding resisting open windows, and the solders are electrically combined with the running wires. When a plurality of running wires are respectively arranged on both sides of the printed circuit board, the welding resisting open windows are arranged in both sides of the printed circuit board. When arranged in one running wire, a plurality of welding resisting windows are mutually parallel. The length of the welding resisting windows is the same as that of the running wires used for arranging the welding resisting windows. The manufacturing method comprises that at least one welding resisting window is arranged along the length direction of at least one running wire; the solders are filled in the welding resisting windows, and the solders are electrically combined with the running wires.
Description
Technical field
The present invention relates to circuit board, a kind of printed circuit board and manufacture method thereof that improves the cabling current capacity especially is provided.
Background technology
Cabling is the printed wiring on the PCB (Printed Circuit Board, printed circuit board), and the current capacity of cabling directly influences the power that pcb board can carry.The resistance value of conductor depends on length, cross-sectional area and the resistivity of conductor.Cabling on the printed circuit board also is so, is that rectangular cabling is an example with a cross section, when the length of cabling be L, thickness be T, width be W, when resistivity is ρ, its resistance determines that by formula 1 its power P that can carry is determined by formula 2:
P＝I
2R (2)
The current capacity of PCB cabling is relevant with the material behavior of the width of cabling, thickness and cabling, under the constant situation of cabling material, when ρ and L one timing, increase the resistance that W or T can reduce this section cabling, effectively reduce the power P of being carried, reduce the caloric value of cabling, thereby improve its current capacity.
Prior art promotes the current capacity of PCB cabling just by the method that increases trace width and thickness, but for device density, walk the higher PCB of line density, has not had enough spaces to increase the width and the thickness of cabling.And increase cabling thickness and just need to increase earlier the conductive layer thickness of PCB, no matter select for use thick conductive layer the PCB material, or the conductive layer on the PCB carried out aftertreatment, all can greatly promote the PCB cost.And when conductive layer was in certain thickness situation and makes the less thin cabling of width on the PCB, technology difficulty was very high, makes quality and is difficult to guarantee.
Summary of the invention
The invention provides a kind of printed circuit board and manufacture method thereof, with solve in the prior art by increase trace width and thickness improve PCB cabling current capacity the time restricted, problem that cost is high.
A kind of printed circuit board, comprise: cabling and cover solder mask on this cabling in the described solder mask, is provided with at least one welding resistance along the length direction of at least one cabling and windows, described welding resistance is filled with scolder in windowing, and described scolder combines with this cabling is electrical.
Described cabling is many and when being arranged in the two sides of described printed circuit board, the described welding resistance two sides of relative set at this printed circuit board of windowing.
When many described welding resistances being set on a cabling windowing, these many welding resistances are windowed and are parallel to each other.
The length that described welding resistance is windowed is identical with the length that the cabling that this welding resistance windows is set.
A kind of manufacture method of printed circuit board comprises the following steps:
A, along the length direction of at least one cabling, at least one welding resistance is set windows;
B, in described welding resistance is windowed, fill scolder, and make this scolder form electrical the combination with described cabling.
According to this method, in described step b:
In described welding resistance is windowed, fill described scolder by manual mode, and melt this scolder and form electrical the combination with described cabling;
Fill described scolder by mode of printing in described welding resistance is windowed, the fusing when described printed circuit board reflow soldering assembly device of this scolder forms electrical the combination with described cabling; Perhaps
Directly be filled into described welding resistance during the described printed circuit board wave soldering of described scolder assembly device and form electrical the combination with described cabling in windowing.
Use the beneficial effect of technical scheme of the present invention to be:
1, technical scheme of the present invention is utilized the conductivity of scolder under the situation that does not increase PCB trace width and thickness, and the current capacity of PCB cabling has been improved about 20%;
2, under the condition of equal current capacity, the width and the thickness of the PCB cabling of use the technical program are less, therefore can promote PCB and go up device layout, wiring density;
3, owing to use technical scheme of the present invention, only need make suitable modification, so simplicity of design, realization are convenient to the PCB solder mask;
4, use technical scheme of the present invention, under the situation of equal current capacity, reduced PCB manufacturing cost, shortened the manufacturing cycle, and guarantee that PCB goes up the making quality of thin cabling.
Description of drawings
Fig. 1 is the welding resistance of the PCB cabling top cross sectional representation of windowing;
Fig. 2 is the cross sectional representation behind the filling scolder in welding resistance is windowed;
Fig. 3 is provided with the cross sectional representation that three welding resistances are windowed on the cabling simultaneously;
When Fig. 4 is the PCB double-sided wiring, two-sidedly all design the structural representation that welding resistance is windowed.
Embodiment
The structure of pcb board of the present invention as shown in Figure 1, when PCB designs, to needing the PCB cabling of bearing great current, the welding resistance of design certain width is windowed above this section cabling, then on PCB during assembly device, and filling scolder in welding resistance is windowed, behind solder fusing, combine with cabling is electrical, as shown in Figure 2, be equivalent to increase the cross-sectional area of cabling, improved the current capacity of cabling.According to aspect requirements such as the characteristic of the structure of PCB, scolder and welding procedures, the design that welding resistance is windowed has following characteristics:
1, welding resistance shape, the quantity of windowing is not limit, by the quantity and the shape decision of the cabling of bearing great current on the pcb board;
2, the welding resistance trend of windowing and the trend of cabling are consistent, and uninterruptedly distribute along the length direction of this cabling, and effect was best when length was identical with cabling, was similar to a strip pad;
3, the welding resistance width of windowing is even, is generally less than or equals the width of cabling, and the technological requirement that cross section is generally rectangle structure is comparatively simple, and other also can satisfy purpose of the present invention as trapezium structure;
If 4 on the cabling of a broad design welding resistance window, as shown in Figure 3, can concurrent designing be many, between keeping parallelism as far as possible, the effect that so promptly can keep solder mask itself keeps smooth after scolder is solidified as far as possible;
5, when the PCB cabling is two-sided distribution, as shown in Figure 4, welding resistance is windowed and is distributed on the upper and lower surfaces as required.
Have in the process of assembly device on the pcb board that welding resistance windows in design, need be at the welding resistance filling scolder of windowing, and melting solder makes that itself and cabling are electrical to be combined, concrete grammar is relevant with the technology of pcb board assembly device, and commonly used have following three kinds of methods:
If 1 PCB adopts the mode assembly device of Reflow Soldering, can adopt the mode of automatic printing in welding resistance is windowed, to fill one deck scolder, scolder melts with cabling when PCB crosses reflow ovens and combines;
If 2 PCB adopt the mode assembly device of wave-soldering, scolder combines with cabling in welding resistance is windowed when PCB crosses the tin ripple;
If 3 PCB adopt the mode assembly device of manual welding, then can in windowing, welding resistance add the last layer scolder by hand, then solder fusing is combined with cabling.
In above-mentioned three kinds of methods, preceding two kinds is automated manner, the third is a manual mode, generally use separately, the use that also can cooperatively interact, as shown in Figure 3, when the two-sided cabling of pcb board, the two sides is respectively in different ways during assembly device, can need wherein the use that combines of two kinds of methods accordingly.
Solder thickness is set as required, generally is higher than solder mask, after scolder and the electrical combination of cabling, has been equivalent to increase the cross-sectional area of cabling, thereby has improved the current capacity of cabling.Select which kind of scolder relevant with the resistivity of concrete process and this scolder, the resistivity of scolder is more little, and it is many more that the current capacity of cabling improves, and the scolder kind does not influence the enforcement of technical solution of the present invention.
The technical scheme that scolder raising cabling current capacity is filled in utilization of the present invention can adopt separately, also can better reach the purpose that promotes PCB cabling current capacity in conjunction with any, two or three use simultaneously that increase in trace width, thickness or three kinds of methods of improvement cabling material.
In sum, the method for manufacturing printed circuit board of the present invention is divided into following two steps:
A, along the length direction of at least one cabling, at least one welding resistance is set windows;
B, in described welding resistance is windowed, fill scolder, and make this scolder form electrical the combination with described cabling.
Use the beneficial effect of technical scheme of the present invention to be:
1, technical scheme of the present invention is utilized the conductivity of scolder under the situation that does not increase PCB trace width and thickness, and the current capacity of PCB cabling has been improved about 20%;
2, under the condition of equal current capacity, the width and the thickness of the PCB cabling of use the technical program are less, therefore can promote PCB and go up device layout, wiring density;
3, owing to use technical scheme of the present invention, only need make suitable modification, so simplicity of design, realization are convenient to the PCB solder mask;
4, use technical scheme of the present invention, under the situation of equal current capacity, reduced PCB manufacturing cost, shortened the manufacturing cycle, and guarantee that PCB goes up the making quality of thin cabling.
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (9)
1, a kind of printed circuit board, comprise: cabling and cover solder mask on this cabling is characterized in that: in the described solder mask, be provided with at least one welding resistance along the length direction of cabling and window, described welding resistance is filled with scolder in windowing, and described scolder combines with this cabling is electrical.
2, printed circuit board as claimed in claim 1 is characterized in that: described cabling is many and when being arranged in the two sides of described printed circuit board, and described welding resistance is windowed relative set on the cabling on this printed circuit board two sides.
3, printed circuit board as claimed in claim 1 or 2 is characterized in that: when many described welding resistances being set on a cabling windowing, these many welding resistances are windowed parallel to each other.
4, printed circuit board as claimed in claim 1 is characterized in that: the length that described welding resistance is windowed is identical with the length that the cabling that this welding resistance windows is set.
5, a kind of manufacture method of printed circuit board is characterized in that, comprises the following steps:
A, along the length direction of at least one cabling, at least one welding resistance is set windows;
B, in described welding resistance is windowed, fill scolder, and make this scolder form electrical the combination with described cabling.
6, the manufacture method of printed circuit board as claimed in claim 5 is characterized in that, among the described step b:
In described welding resistance is windowed, fill described scolder by manual mode, and melt this scolder and form electrical the combination with described cabling;
Fill described scolder by mode of printing in described welding resistance is windowed, the fusing when described printed circuit board reflow soldering assembly device of this scolder forms electrical the combination with described cabling; Perhaps
Described scolder directly is filled into described welding resistance and forms electrical the combination with described cabling in windowing when described printed circuit board wave soldering assembly device.
7, as the manufacture method of claim 5 or 6 described printed circuit boards, it is characterized in that: described cabling is many and when being arranged in the two sides of described printed circuit board, and corresponding two sides at this printed circuit board is provided with described welding resistance and windows.
8, the manufacture method of printed circuit board as claimed in claim 7 is characterized in that: when many described welding resistances being set on a cabling windowing, these many welding resistances that are arranged in parallel are windowed.
9, the manufacture method of printed circuit board as claimed in claim 5 is characterized in that: the length that described welding resistance is windowed is identical with the length that the cabling that this welding resistance windows is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100568627A CN100355327C (en) | 2005-03-25 | 2005-03-25 | A printed circuit board and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100568627A CN100355327C (en) | 2005-03-25 | 2005-03-25 | A printed circuit board and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1838857A CN1838857A (en) | 2006-09-27 |
| CN100355327C true CN100355327C (en) | 2007-12-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100568627A Expired - Fee Related CN100355327C (en) | 2005-03-25 | 2005-03-25 | A printed circuit board and production method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN100355327C (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101682983B (en) * | 2007-05-18 | 2012-06-20 | 凸版印刷株式会社 | Wiring substrate, semiconductor package, and electronic device |
| CN102149248A (en) * | 2010-02-05 | 2011-08-10 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN103858525A (en) * | 2012-11-15 | 2014-06-11 | 华为技术有限公司 | Printed circuit board, component and circuit assembly |
| DE102015114522B4 (en) * | 2015-08-31 | 2017-07-13 | Infineon Technologies Ag | A method of soldering a first soldering partner to a second soldering partner using spacers |
| CN106161693A (en) * | 2016-06-28 | 2016-11-23 | 广东欧珀移动通信有限公司 | PCB board and mobile terminal with it |
| CN106793478A (en) * | 2017-03-31 | 2017-05-31 | 三禾电器(福建)有限公司 | A kind of circuit board with window |
| CN107613670A (en) * | 2017-09-26 | 2018-01-19 | 维沃移动通信有限公司 | A printed circuit board manufacturing method and printed circuit board structure |
| CN110099506A (en) * | 2019-05-09 | 2019-08-06 | 深圳市锐尔觅移动通信有限公司 | A kind of electronic equipment, printed circuit board and preparation method thereof |
| CN111212515B (en) * | 2019-12-28 | 2021-08-03 | 惠州Tcl移动通信有限公司 | PCB and terminal equipment adopting same |
| CN111885813A (en) * | 2020-07-30 | 2020-11-03 | 清能德创电气技术（北京）有限公司 | PCB and method for increasing through-flow capacity of PCB wire |
| CN113192721A (en) * | 2021-01-21 | 2021-07-30 | 龙腾 | Inductance structure based on printed circuit board, flexible multilayer printed circuit board comprising same and transformer structure comprising same |
| CN119133783B (en) * | 2024-11-12 | 2025-03-21 | 中创新航科技集团股份有限公司 | Battery Pack |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10190203A (en) * | 1996-12-24 | 1998-07-21 | Ibiden Co Ltd | Printed wiring board |
| US6284353B1 (en) * | 1997-01-10 | 2001-09-04 | Ibiden Co., Ltd. | Printed wiring board and method of manufacturing the same |
| CN1316175A (en) * | 1998-07-08 | 2001-10-03 | 伊比登株式会社 | Printed circuit board and method of manufacture thereof |
| JP2003031936A (en) * | 2001-07-19 | 2003-01-31 | Murata Mach Ltd | Printed board |
| CN1585589A (en) * | 2003-08-22 | 2005-02-23 | 索尼株式会社 | Electric circuit substrate |
-
2005
- 2005-03-25 CN CNB2005100568627A patent/CN100355327C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10190203A (en) * | 1996-12-24 | 1998-07-21 | Ibiden Co Ltd | Printed wiring board |
| US6284353B1 (en) * | 1997-01-10 | 2001-09-04 | Ibiden Co., Ltd. | Printed wiring board and method of manufacturing the same |
| CN1316175A (en) * | 1998-07-08 | 2001-10-03 | 伊比登株式会社 | Printed circuit board and method of manufacture thereof |
| JP2003031936A (en) * | 2001-07-19 | 2003-01-31 | Murata Mach Ltd | Printed board |
| CN1585589A (en) * | 2003-08-22 | 2005-02-23 | 索尼株式会社 | Electric circuit substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1838857A (en) | 2006-09-27 |
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