CN100338767C - 热管散热装置及其制造方法 - Google Patents
热管散热装置及其制造方法 Download PDFInfo
- Publication number
- CN100338767C CN100338767C CNB2004100274046A CN200410027404A CN100338767C CN 100338767 C CN100338767 C CN 100338767C CN B2004100274046 A CNB2004100274046 A CN B2004100274046A CN 200410027404 A CN200410027404 A CN 200410027404A CN 100338767 C CN100338767 C CN 100338767C
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- pipe
- substrate
- evaporation part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000001704 evaporation Methods 0.000 claims abstract description 47
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 230000008020 evaporation Effects 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 32
- 238000009833 condensation Methods 0.000 claims description 20
- 230000005494 condensation Effects 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 8
- 238000003754 machining Methods 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种热管散热装置及其制造方法,该热管散热装置包括基板、至少一热管及至少一散热鳍片组,该热管包括一蒸发部及至少一冷凝部,该基板下表面设有收容该热管蒸发部的沟槽,该散热鳍片组与热管冷凝部热性结合,该热管蒸发部具有一用于与热源发热面直接接触的平表面,该平表面的平面度与基板的下表面的平面度相同。制造时,将热管固接于基板沟槽中使其成为一体之后,同时对基板下表面及热管蒸发部进行机械加工,从而形成该平表面。该热管散热装置热管蒸发部与热源直接接触,能更加快速有效的吸收热量。
Description
【技术领域】
本发明是关于一种散热装置及其制造方法,特别是指一种利用热管的散热装置及其制造方法。
【背景技术】
随着大规模集成电路技术的不断进步及广泛应用,信息产业的发展突飞猛进,高频高速处理器不断推出。由于高频高速运行使得处理器单位时间产生大量的热,如果不及时排除这些热量将引起处理器自身温度的升高,对系统的安全及性能造成很大的影响,目前散热问题已经成为每个新一代高速处理器推出时必需要解决的问题。通常业界均在中央处理器等芯片上安装散热器辅助其散热。同时,在散热器上安装风扇,以提供强制气流使散热器的热量快速散发,从而能够对中央处理器进行更为有效的散热。
由于对散热需求的不断提高,新式散热装置不断出现。将热管应用于电子元件散热就是其中重要的一种,热管是在一密封低压管形壳体内盛装适量汽化热高、流动性好、化学性质稳定、沸点较低的液态物质,如水、乙醇、丙酮等,利用该液态物质受热和冷却而在气、液两态间转变时,吸收或放出大量的热而可使热量由管体一端迅速传到另一端。现有技术中,将一导热基座与热源接触,将热管一端接合于导热基座上,另一端结合于散热鳍片,从而组装成散热装置,由基座吸收热量再传导至热管,再进一步通过散热鳍片散发出去。
上述热管散热装置虽然较传统散热方式散热效率有所提高,但热管与热源之间是通过基座连接,热阻较大,不能充分发挥热管快速导热的性能,在热负荷较大时往往达不到所需散热效果。
【发明内容】
本发明的目的在于提供一种热阻小、散热性能好的热管散热装置及其制造方法。
本发明热管散热装置包括基板、至少一热管及至少一散热鳍片组,该热管包括一蒸发部及至少一冷凝部,该基板下表面设有收容该热管蒸发部的沟槽,该散热鳍片组与热管冷凝部热性结合,该热管蒸发部具有一用于与热源发热面直接接触的平表面,该平表面的平面度与基板下表面的平面度相同。
本发明热管散热装置的制造方法包括以下步骤:提供一表面设有沟槽的基板,将热管的蒸发部热性固接于该基板的沟槽内,使热管与基板成为一体,然后对热管的蒸发部及基板同时进行机械加工,使该热管蒸发部暴露于沟槽外的部分形成一平表面,该平表面与基板的下表面位于同一平面内,再将一散热鳍片组热性固接于热管的冷凝部。
本发明热管散热装置热管蒸发部与热源直接接触,能更加快速有效的吸收热量,同时该装置体积小,适用于日益薄型化的电子产品散热。
【附图说明】
图1是本发明热管散热装置各元件立体分解图。
图2是本发明热管散热装置立体组装图。
图3是本发明热管散热装置另一实施例各元件立体分解图。
【具体实施方式】
下面参照附图,结合实施例对本发明作进一步的描述。
参照图1至图2,本发明热管散热装置,包括二散热鳍片组1及2、一基板4及热管5。
该基板4具有上表面43及下表面42,该下表面42上开设有横直沟槽40,该基板4的一端对应沟槽40开设凹口41,该凹口41与沟槽40连通。
该热管5呈圆柱形,沿径向的内截面为圆形。该热管5包括一蒸发部51、一冷凝部52及一连接该蒸发部51及冷凝部52的弯折部53。该蒸发部51外圆面具有一与热源发热面直接接触的平表面510,该平表面510与基板4下表面42的平面度相同,最好要小于0.08mm,光洁度最好在3.2以内,这样可保证与热源的充分接触。该平表面510通过精密机械加工方法加工而成,如铣削。本说明书所指的直接接触是为区别于利用导热板将热源的热量传递至热管的连接方式,而在热管与热源发热面间设置热界面材料仍属于本说明书所述的直接接触。该冷凝部52的延伸方向平行于该平表面510,这样可使热管5在垂直于热源发热面方向上不至于占用太多空间。
该散热鳍片组1及2均包括若干平行的散热鳍片,在该散热鳍片组1下表面10一端的若干散热鳍片上开设有呈倒“U”形凹槽11,该凹槽11大小形状与热管5的弯折部53相配合。该散热鳍片组2具有圆形通孔20。
将散热鳍片组1贴设于基板4上表面43,并将该散热鳍片组1具有凹槽11的一端对应于该基板4具有凹口41的一端。热管蒸发部51热性固结于基板4的沟槽40内,热管5弯折部53穿过该基板4的凹口41并固定于散热鳍片组1的凹槽11内,蒸发部52热性结合于散热鳍片组2的通孔20内。该热管5蒸发部51、冷凝部52及弯折部53均可通过焊接或过盈配合等方式固定。
在制造本发明热管散热装置时,先将热管5的蒸发部51通过焊接或过盈配合热性固接于该基板4的沟槽40内,使热管5与基板4成为一体,热管蒸发部51一部分收容于沟槽40内,另一部分暴露于沟槽40外;然后对该热管蒸发部51及基板4同时进行机械加工,如前述提到的铣削加工,将热管蒸发部51暴露于沟槽40外的那一部分及基板4下表面42同时铣平,从而形成热管蒸发部的平表面510;然后将散热鳍片组1及2分别热性结合于基板4上表面43及热管5的冷凝部52。
将本发明热管散热装置安装于热源上后,热管5蒸发部51内的介质直接吸收热源热量并快速蒸发,将热量传导至热管5冷凝部52,热管5冷凝部52进一步通过散热鳍片组2将热源散发的热量散发到周围环境中,热管5冷凝部52中的介质由于释放出热量恢复至液态,回流至热管5蒸发部51,在蒸发部51内再次吸热蒸发,如此循环,达到散热的目的。同时热管5蒸发部51的热量通过基板4传导至散热鳍片组1,通过散热鳍片组1散发至周围环境中。为增强散热效果,可分别在散热鳍片组1及2上加设散热风扇。
可以理解的,本发明热管散热装置中热管5至少为一根,其数目可随热负荷而增加或减少,相应的基板4的沟槽40及散热鳍片组2上通孔20的数量与热管5的数量一致即可。热管5蒸发部51不限于上述的直线状,为增加与热源的接触面积,该热管5蒸发部51也可以为在同一平面内呈弯曲状或折弯状。
如图3所示为本发明另一实施例示意图。该热管45具有一蒸发部451、两冷凝部452及连接该蒸发部451与两冷凝部452的两弯折部453。与第一实施例相同,该蒸发部451具有一平表面450,该两冷凝部452分别热性结合于两散热鳍片组2中,基板4’上表面热性结合有一散热鳍片组1’,其中各元件组装及工作原理与第一实施例相同,此不赘述。
Claims (8)
1.一种热管散热装置,包括基板、至少一热管及至少一散热鳍片组,该热管包括一蒸发部及至少一冷凝部,该基板下表面设有收容该热管蒸发部的沟槽,该散热鳍片组与热管冷凝部热性结合,该热管蒸发部具有一用于与热源发热面直接接触的平表面,其特征在于:该平表面的平面度与基板的下表面的平面度相同。
2.根据权利要求1所述的热管散热装置,其特征在于:该热管蒸发部沿其径向的内截面为圆形,外圆面设一平表面。
3.根据权利要求1所述的热管散热装置,其特征在于:该热管冷凝部与蒸发部之间具有弯折部,在竖直方向上该冷凝部与该蒸发部具有高度差。
4.根据权利要求1所述的热管散热装置,其特征在于:该热管散热装置进一步包括一设置于基板上的散热鳍片组。
5.根据权利要求1所述的热管散热装置,其特征在于:该热管蒸发部的平表面的平面度小于0.08mm。
6.根据权利要求1所述的热管散热装置,其特征在于:该热管蒸发部的平表面的光洁度在3.2之内。
7.一种热管散热装置的制造方法,包括以下步骤:
提供一基板,该基板一表面设有沟槽;
提供至少一热管,该热管具有一蒸发部及至少一冷凝部,将热管蒸发部热性固接于该基板的沟槽内,使热管与基板成为一体;
对热管的蒸发部及基板同时进行机械加工,使该热管蒸发部暴露于沟槽外的部分形成一平表面,该平表面与基板的下表面位于同一平面内;
将一散热鳍片组热性固接于热管的冷凝部。
8.根据权利要求7所述的热管散热装置的制造方法,其特征在于:对热管的蒸发部及基板同时进行的机械加工为铣削加工。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100274046A CN100338767C (zh) | 2004-05-26 | 2004-05-26 | 热管散热装置及其制造方法 |
US11/019,340 US7028758B2 (en) | 2004-05-26 | 2004-12-21 | Heat dissipating device with heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100274046A CN100338767C (zh) | 2004-05-26 | 2004-05-26 | 热管散热装置及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1705112A CN1705112A (zh) | 2005-12-07 |
CN100338767C true CN100338767C (zh) | 2007-09-19 |
Family
ID=35423932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100274046A Ceased CN100338767C (zh) | 2004-05-26 | 2004-05-26 | 热管散热装置及其制造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7028758B2 (zh) |
CN (1) | CN100338767C (zh) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200530549A (en) * | 2004-03-11 | 2005-09-16 | Quanta Comp Inc | Heat dissipating module with heat pipes |
KR100564638B1 (ko) * | 2004-11-02 | 2006-03-29 | 삼성전자주식회사 | 유연한 히트 파이프 |
CN100517665C (zh) * | 2005-04-22 | 2009-07-22 | 富准精密工业(深圳)有限公司 | 热管散热装置 |
CN100499089C (zh) * | 2005-06-08 | 2009-06-10 | 富准精密工业(深圳)有限公司 | 散热装置 |
TWM282235U (en) * | 2005-06-24 | 2005-12-01 | Golden Sun News Tech Co Ltd | Improved structure of a heat dissipating device using heat pipes |
US7327576B2 (en) * | 2005-06-24 | 2008-02-05 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
US7457126B2 (en) * | 2005-06-27 | 2008-11-25 | Intel Corporation | Optical transponder with active heat transfer |
US20070095508A1 (en) * | 2005-11-02 | 2007-05-03 | Foxconn Technology Co., Ltd. | Heat dissipation device having louvered heat-dissipating fins |
CN1960615A (zh) * | 2005-11-03 | 2007-05-09 | 富准精密工业(深圳)有限公司 | 散热器 |
CN100464279C (zh) * | 2005-11-17 | 2009-02-25 | 富准精密工业(深圳)有限公司 | 散热装置 |
US20070268668A1 (en) * | 2006-05-19 | 2007-11-22 | I-Ming Lin | Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit) |
US7511958B2 (en) * | 2006-05-31 | 2009-03-31 | Cheng-Hsing Lin | Heat dissipating assembly of heat dissipating device |
CN101102655A (zh) * | 2006-07-07 | 2008-01-09 | 富准精密工业(深圳)有限公司 | 散热装置 |
US20080043425A1 (en) * | 2006-08-17 | 2008-02-21 | Justin Richard Hebert | Methods and systems for cooling a computing device |
CN101149234B (zh) * | 2006-09-22 | 2010-05-12 | 杜建军 | 热管散热器制造方法 |
US7694718B2 (en) * | 2006-10-02 | 2010-04-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink with heat pipes |
US20080105409A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
TWM312705U (en) * | 2006-11-09 | 2007-05-21 | Golden Sun News Tech Co Ltd | Assembly structure of fixing seat and heat pipe |
US20080117597A1 (en) * | 2006-11-17 | 2008-05-22 | Foxconn Technology Co., Ltd. | Light emitting diode module having a thermal management element |
US7970497B2 (en) * | 2007-03-02 | 2011-06-28 | Honeywell International Inc. | Smart hybrid electric and bleed architecture |
WO2008133594A2 (en) * | 2007-04-27 | 2008-11-06 | National University Of Singapore | Cooling device for electronic components |
US7764504B2 (en) * | 2007-05-16 | 2010-07-27 | Tyco Electronics Corporation | Heat transfer system for a receptacle assembly |
US20080289799A1 (en) * | 2007-05-23 | 2008-11-27 | Foxconn Technology Co., Ltd. | Heat dissipation device with a heat pipe |
US7637311B2 (en) * | 2007-06-27 | 2009-12-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7762316B2 (en) * | 2007-08-06 | 2010-07-27 | Man Zai Industrial Co., Ltd. | Heat-dissipating device with high heat-dissipating efficiency |
US20090080161A1 (en) * | 2007-09-26 | 2009-03-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device for computer add-on card |
CN101452897B (zh) * | 2007-12-05 | 2011-03-30 | 富准精密工业(深圳)有限公司 | 发光二极管散热装置 |
CN101451696A (zh) | 2007-12-07 | 2009-06-10 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
US8047270B2 (en) * | 2007-12-29 | 2011-11-01 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device having heat pipes for supporting heat sink thereon |
TWM334959U (en) * | 2008-01-07 | 2008-06-21 | Cooler Master Co Ltd | Lateral extension radiator of heat-pipe |
TW200821811A (en) * | 2008-01-11 | 2008-05-16 | Chung-Shian Huang | Heat dissipation device without a base |
US7744257B2 (en) | 2008-02-01 | 2010-06-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device for LED lamp |
TWM338973U (en) * | 2008-03-27 | 2008-08-21 | Celsia Technologies Taiwan Inc | The heat dissipation device with curve-shaped uniform-temperature plate |
US8286693B2 (en) * | 2008-04-17 | 2012-10-16 | Aavid Thermalloy, Llc | Heat sink base plate with heat pipe |
GB2459981A (en) * | 2008-05-16 | 2009-11-18 | yun-chang Liao | Light emitting diode module with direct contact heat pipe |
TW201005253A (en) | 2008-07-31 | 2010-02-01 | Golden Sun News Tech Co Ltd | Manufacturing method for levelly combining evaporation ends of aligned heat pipes to fastening seat and structure thereof |
TWM349179U (en) * | 2008-08-05 | 2009-01-11 | yi-ren Xie | Heat conduction module |
US20100065249A1 (en) * | 2008-09-17 | 2010-03-18 | Asia Vital Components Co., Ltd. | Heat sink |
US20110203773A1 (en) * | 2008-11-04 | 2011-08-25 | Daikin Industries, Ltd. | Cooling member, manufacturing method and apparatus thereof |
US20100175554A1 (en) * | 2009-01-15 | 2010-07-15 | Dell Products L.P. | Cooling system with debris filtering |
CN101808490A (zh) * | 2009-02-17 | 2010-08-18 | 富准精密工业(深圳)有限公司 | 散热装置 |
TWI421148B (zh) * | 2009-06-02 | 2014-01-01 | Cpumate Inc | 具研磨受熱平面之散熱器及其研磨方法與設備 |
CN101932221B (zh) * | 2009-06-23 | 2014-08-20 | 富准精密工业(深圳)有限公司 | 散热装置 |
US8322403B2 (en) * | 2009-09-04 | 2012-12-04 | Cpumate Inc. | Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having the same |
US20110085339A1 (en) * | 2009-10-13 | 2011-04-14 | Chang-Yao Lin | LED Lamp |
US20110290450A1 (en) * | 2010-05-31 | 2011-12-01 | Asia Vital Components Co., Ltd. | Heat Dissipation Module |
US20110315352A1 (en) * | 2010-06-29 | 2011-12-29 | Asia Vital Components Co., Ltd. | Thermal module |
US20120043057A1 (en) * | 2010-08-19 | 2012-02-23 | Chun-Ming Wu | Heat-dissipating module |
US8488312B2 (en) * | 2011-02-14 | 2013-07-16 | Adc Telecommunications, Inc. | Systems and methods for thermal management for telecommunications enclosures using heat pipes |
TWI531303B (zh) | 2011-11-16 | 2016-04-21 | 宏碁股份有限公司 | 散熱模組 |
CN103140117B (zh) * | 2011-11-30 | 2015-08-26 | 宏碁股份有限公司 | 散热模块 |
TWM450187U (zh) * | 2012-10-25 | 2013-04-01 | Cooling House Co Ltd | 循環式熱虹吸散熱裝置 |
US20140251577A1 (en) * | 2013-03-08 | 2014-09-11 | Thermal Corp. | Cooling frame with integrated heat pipes |
US9773718B2 (en) * | 2013-08-07 | 2017-09-26 | Oracle International Corporation | Winged heat sink |
US9390994B2 (en) * | 2013-08-07 | 2016-07-12 | Oracle International Corporation | Heat sinks with interdigitated heat pipes |
CN104519718A (zh) * | 2013-10-08 | 2015-04-15 | 英业达科技有限公司 | 散热模块 |
CN106686942B (zh) * | 2015-11-10 | 2023-03-24 | 奇鋐科技股份有限公司 | 散热装置组合结构 |
US9909815B2 (en) * | 2015-12-01 | 2018-03-06 | Asia Vital Components Co., Ltd. | Assembling structure of heat dissipation device |
CN107046792A (zh) * | 2016-02-05 | 2017-08-15 | 双鸿科技股份有限公司 | 散热装置及提升散热装置的热传导效能的方法 |
US10119759B2 (en) * | 2016-03-31 | 2018-11-06 | Hoya Candeo Optronics Corporation | Heat radiating apparatus and light illuminating apparatus with the same |
TWI612272B (zh) * | 2016-05-04 | 2018-01-21 | 技嘉科技股份有限公司 | 散熱模組及其組裝方法 |
CN107346741B (zh) * | 2016-05-04 | 2020-04-17 | 技嘉科技股份有限公司 | 散热模块及其组装方法 |
EP3513442A1 (en) * | 2016-09-16 | 2019-07-24 | Heraeus Noblelight America LLC | Heatsink including thick film layer for uv led arrays, and methods of forming uv led arrays |
EP3301999B1 (en) * | 2016-09-30 | 2020-06-17 | HP Scitex Ltd | Light emitting diode heatsink |
US20180372424A1 (en) * | 2017-06-21 | 2018-12-27 | Microsoft Technology Licensing, Llc | Vapor chamber that emits a non-uniform radiative heat flux |
DE112019001566B4 (de) * | 2018-03-27 | 2022-04-28 | Mitsubishi Electric Corporation | Kühleinrichtung, mit Deckel versehene Kühleinrichtung, Gehäuse mit Kühleinrichtung sowie Wechselrichter |
US10314203B1 (en) * | 2018-05-10 | 2019-06-04 | Juniper Networks, Inc | Apparatuses, systems, and methods for cooling electronic components |
CN110366351B (zh) * | 2019-06-18 | 2020-05-12 | 南京埃斯顿自动化股份有限公司 | 伺服驱动器传导散热结构的制造方法 |
CN110906293A (zh) * | 2019-11-27 | 2020-03-24 | 特能热交换科技(中山)有限公司 | 一种散热器 |
TWM628143U (zh) * | 2022-01-13 | 2022-06-11 | 華碩電腦股份有限公司 | 散熱裝置 |
CN217363595U (zh) * | 2022-01-17 | 2022-09-02 | 全亿大科技(佛山)有限公司 | 散热器 |
US20230247799A1 (en) * | 2022-02-01 | 2023-08-03 | Cisco Technology, Inc. | Heat pipe with localized heatsink |
CN115003122B (zh) * | 2022-06-16 | 2023-04-07 | 远峰科技股份有限公司 | 具有t型导热管的散热装置及域控制器主机 |
CN117529021A (zh) * | 2023-10-26 | 2024-02-06 | 安徽百信信息技术有限公司 | 一种高效率散热器结构及其加工方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06204368A (ja) * | 1992-12-28 | 1994-07-22 | Furukawa Electric Co Ltd:The | セラミック基板の冷却構造 |
US20030019610A1 (en) * | 2001-07-26 | 2003-01-30 | Jefferson Liu | Rapidly self - heat-conductive heat - dissipating module |
CN2578981Y (zh) * | 2002-09-26 | 2003-10-08 | 唐济海 | 散热装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2773941B1 (fr) * | 1998-01-19 | 2000-04-21 | Ferraz | Echangeur di-phasique pour au moins un composant electronique de puissance |
US6189601B1 (en) * | 1999-05-05 | 2001-02-20 | Intel Corporation | Heat sink with a heat pipe for spreading of heat |
US6226178B1 (en) * | 1999-10-12 | 2001-05-01 | Dell Usa, L.P. | Apparatus for cooling a heat generating component in a computer |
US6394175B1 (en) * | 2000-01-13 | 2002-05-28 | Lucent Technologies Inc. | Top mounted cooling device using heat pipes |
US7128131B2 (en) * | 2001-07-31 | 2006-10-31 | The Furukawa Electric Co., Ltd. | Heat sink for electronic devices and heat dissipating method |
US6830098B1 (en) * | 2002-06-14 | 2004-12-14 | Thermal Corp. | Heat pipe fin stack with extruded base |
TW537437U (en) * | 2002-06-28 | 2003-06-11 | Shuttle Inc | CPU heat dissipating fastener |
US6894900B2 (en) * | 2002-09-17 | 2005-05-17 | Hewlett-Packard Development Company, L.P. | Heat sink with heat pipe and base fins |
US7140422B2 (en) * | 2002-09-17 | 2006-11-28 | Hewlett-Packard Development Company, L.P. | Heat sink with heat pipe in direct contact with component |
TWM249090U (en) * | 2002-12-25 | 2004-11-01 | Jiun-Fu Liou | Improved device for heat sink module |
TW560835U (en) * | 2003-02-25 | 2003-11-01 | Datech Technology Co Ltd | Heat sink assembly with heat pipe |
-
2004
- 2004-05-26 CN CNB2004100274046A patent/CN100338767C/zh not_active Ceased
- 2004-12-21 US US11/019,340 patent/US7028758B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06204368A (ja) * | 1992-12-28 | 1994-07-22 | Furukawa Electric Co Ltd:The | セラミック基板の冷却構造 |
US20030019610A1 (en) * | 2001-07-26 | 2003-01-30 | Jefferson Liu | Rapidly self - heat-conductive heat - dissipating module |
CN2578981Y (zh) * | 2002-09-26 | 2003-10-08 | 唐济海 | 散热装置 |
Also Published As
Publication number | Publication date |
---|---|
US7028758B2 (en) | 2006-04-18 |
CN1705112A (zh) | 2005-12-07 |
US20050263265A1 (en) | 2005-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100338767C (zh) | 热管散热装置及其制造方法 | |
CN106802100B (zh) | 一种均热板及其制造、使用方法 | |
CN100377344C (zh) | 微型沟槽平板、热管及该热管的制造方法 | |
US8479805B2 (en) | Heat-dissipating assembly | |
TWI801696B (zh) | 相變散熱裝置 | |
US20040052051A1 (en) | Heat sink with heat pipe and base fins | |
US20040050534A1 (en) | Heat sink with heat pipe in direct contact with component | |
EP2129987A2 (en) | Low-profile heat-spreading liquid chamber using boiling | |
CN2777753Y (zh) | 散热装置 | |
CN101039566A (zh) | 散热装置及应用该散热装置的电子装置 | |
CN101004333A (zh) | 板型热管 | |
CN101312634A (zh) | 散热装置 | |
CN100584170C (zh) | 散热装置 | |
CN213545202U (zh) | 一种基于热电制冷的平板热管式cpu散热装置 | |
CN101754654A (zh) | 传热基板及具有该传热基板的散热装置 | |
CN101505579A (zh) | 散热模块及其支撑件 | |
CN209745070U (zh) | 相变散热装置 | |
CN103807835A (zh) | 板状热管插接式大功率led散热器 | |
CN109640581A (zh) | 一种内置热管的风冷冷板及其加工方法 | |
TWM647226U (zh) | 液冷均熱板散熱模組 | |
CN101384153B (zh) | 热管散热器及其制作方法 | |
TW200539788A (en) | Heat pipe cooling assembly and method of manufacturing the same | |
JP2010036251A (ja) | 並列に配置されたヒートパイプの蒸発部を固定部材に平坦に接合する方法およびその構造 | |
CN2681343Y (zh) | 热管散热装置 | |
CN2650333Y (zh) | 热管 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C35 | Partial or whole invalidation of patent or utility model | ||
IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20101214 Decision number of declaring invalidation: 15698 Granted publication date: 20070919 |