CH632299A5 - Process for producing metallophobic surfaces on objects - Google Patents

Process for producing metallophobic surfaces on objects Download PDF

Info

Publication number: CH632299A5
Authority: CH; Switzerland
Prior art keywords: weight; metallophobic; objects; antimony compounds; soluble
Prior art date: 1976-06-24

Application number

CH773777A

Other languages

German (de)

English (en)

Inventor

Peter Dipl Ing Virsik

Dieter Fischer

Rainer Burger

Original Assignee

Felten & Guilleaume Carlswerk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1976-06-24

Filing date

1977-06-23

Publication date

1982-09-30

1977-06-23 Application filed by Felten & Guilleaume Carlswerk filed Critical Felten & Guilleaume Carlswerk

1982-09-30 Publication of CH632299A5 publication Critical patent/CH632299A5/de

Links

238000000034 method Methods 0.000 title claims description 23
238000004519 manufacturing process Methods 0.000 claims description 30
150000001463 antimony compounds Chemical class 0.000 claims description 13
229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 claims description 11
239000004922 lacquer Substances 0.000 claims description 10
239000000463 material Substances 0.000 claims description 9
239000011248 coating agent Substances 0.000 claims description 7
238000000576 coating method Methods 0.000 claims description 7
239000000126 substance Substances 0.000 claims description 7
239000003960 organic solvent Substances 0.000 claims description 5
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
239000000654 additive Substances 0.000 claims description 4
150000001875 compounds Chemical class 0.000 claims description 4
230000000996 additive effect Effects 0.000 claims description 3
239000012876 carrier material Substances 0.000 claims description 3
239000000203 mixture Substances 0.000 claims 1
239000002243 precursor Substances 0.000 claims 1
238000002791 soaking Methods 0.000 claims 1
239000007787 solid Substances 0.000 description 16
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 15
238000005470 impregnation Methods 0.000 description 14
238000001465 metallisation Methods 0.000 description 11
FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 10
229940095064 tartrate Drugs 0.000 description 10
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 8
229910052751 metal Inorganic materials 0.000 description 8
239000002184 metal Substances 0.000 description 8
239000005011 phenolic resin Substances 0.000 description 8
229920001568 phenolic resin Polymers 0.000 description 8
229910052787 antimony Inorganic materials 0.000 description 7
230000005855 radiation Effects 0.000 description 6
WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 5
DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 4
ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 4
239000004020 conductor Substances 0.000 description 4
229910052802 copper Inorganic materials 0.000 description 4
239000010949 copper Substances 0.000 description 4
238000000454 electroless metal deposition Methods 0.000 description 4
230000000694 effects Effects 0.000 description 3
229940049920 malate Drugs 0.000 description 3
BJEPYKJPYRNKOW-UHFFFAOYSA-N malic acid Chemical compound OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 3
239000005871 repellent Substances 0.000 description 3
AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 2
YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 2
AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 description 2
JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 2
OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
230000007797 corrosion Effects 0.000 description 2
238000005260 corrosion Methods 0.000 description 2
239000004744 fabric Substances 0.000 description 2
229910052736 halogen Inorganic materials 0.000 description 2
-1 halogen ion Chemical class 0.000 description 2
238000003825 pressing Methods 0.000 description 2
229920005989 resin Polymers 0.000 description 2
239000011347 resin Substances 0.000 description 2
150000003839 salts Chemical class 0.000 description 2
238000007650 screen-printing Methods 0.000 description 2
239000000758 substrate Substances 0.000 description 2
GNWBLLYJQXKPIP-ZOGIJGBBSA-N (1s,3as,3bs,5ar,9ar,9bs,11as)-n,n-diethyl-6,9a,11a-trimethyl-7-oxo-2,3,3a,3b,4,5,5a,8,9,9b,10,11-dodecahydro-1h-indeno[5,4-f]quinoline-1-carboxamide Chemical compound CN([C@@H]1CC2)C(=O)CC[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@H](C(=O)N(CC)CC)[C@@]2(C)CC1 GNWBLLYJQXKPIP-ZOGIJGBBSA-N 0.000 description 1
WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
NRGHRGHIMYYGGE-UHFFFAOYSA-K C(C(O)CO)(=O)[O-].[Sb+3].C(C(O)CO)(=O)[O-].C(C(O)CO)(=O)[O-] Chemical compound C(C(O)CO)(=O)[O-].[Sb+3].C(C(O)CO)(=O)[O-].C(C(O)CO)(=O)[O-] NRGHRGHIMYYGGE-UHFFFAOYSA-K 0.000 description 1
ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
229920000742 Cotton Polymers 0.000 description 1
FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical class [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
WYOFTXWVYIGTCT-UHFFFAOYSA-K [OH-].[Sb+3].OCC([O-])=O.OCC([O-])=O Chemical compound [OH-].[Sb+3].OCC([O-])=O.OCC([O-])=O WYOFTXWVYIGTCT-UHFFFAOYSA-K 0.000 description 1
230000001464 adherent effect Effects 0.000 description 1
SZXAQBAUDGBVLT-UHFFFAOYSA-H antimony(3+);2,3-dihydroxybutanedioate Chemical compound [Sb+3].[Sb+3].[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O SZXAQBAUDGBVLT-UHFFFAOYSA-H 0.000 description 1
OMBMSYHTUZQOEY-UHFFFAOYSA-K antimony(3+);2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Sb+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O OMBMSYHTUZQOEY-UHFFFAOYSA-K 0.000 description 1
229910052785 arsenic Inorganic materials 0.000 description 1
RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical class [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
XCSAHPBBCIBIQD-UHFFFAOYSA-K bis(2-hydroxypropanoyloxy)stibanyl 2-hydroxypropanoate Chemical compound [Sb+3].CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O XCSAHPBBCIBIQD-UHFFFAOYSA-K 0.000 description 1
GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
229910052794 bromium Inorganic materials 0.000 description 1
238000005266 casting Methods 0.000 description 1
230000003197 catalytic effect Effects 0.000 description 1
239000003638 chemical reducing agent Substances 0.000 description 1
229910052801 chlorine Inorganic materials 0.000 description 1
239000000460 chlorine Substances 0.000 description 1
230000007547 defect Effects 0.000 description 1
238000000151 deposition Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
230000018109 developmental process Effects 0.000 description 1
238000001035 drying Methods 0.000 description 1
238000003912 environmental pollution Methods 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
239000003365 glass fiber Substances 0.000 description 1
150000002367 halogens Chemical class 0.000 description 1
PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
238000011031 large-scale manufacturing process Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
229910000510 noble metal Inorganic materials 0.000 description 1
239000002985 plastic film Substances 0.000 description 1
229920006255 plastic film Polymers 0.000 description 1
229910052699 polonium Inorganic materials 0.000 description 1
HZEBHPIOVYHPMT-UHFFFAOYSA-N polonium atom Chemical class [Po] HZEBHPIOVYHPMT-UHFFFAOYSA-N 0.000 description 1
230000002285 radioactive effect Effects 0.000 description 1
230000000717 retained effect Effects 0.000 description 1
229910052711 selenium Inorganic materials 0.000 description 1
239000011669 selenium Chemical class 0.000 description 1
239000002904 solvent Substances 0.000 description 1
150000003463 sulfur Chemical class 0.000 description 1
229910052717 sulfur Inorganic materials 0.000 description 1
239000011593 sulfur Substances 0.000 description 1
229910052714 tellurium Inorganic materials 0.000 description 1
PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical class [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
239000004753 textile Substances 0.000 description 1
231100000331 toxic Toxicity 0.000 description 1
230000002588 toxic effect Effects 0.000 description 1
238000007740 vapor deposition Methods 0.000 description 1
239000000080 wetting agent Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Metallurgy (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Manufacturing & Machinery (AREA)
Mechanical Engineering (AREA)
Inorganic Chemistry (AREA)
General Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Electrochemistry (AREA)
Laminated Bodies (AREA)
Electroplating Methods And Accessories (AREA)
Application Of Or Painting With Fluid Materials (AREA)
Chemically Coating (AREA)

CH773777A 1976-06-24 1977-06-23 Process for producing metallophobic surfaces on objects CH632299A5 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE2628350A DE2628350C3 (de)	1976-06-24	1976-06-24	Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Schichtstoffen unter Verwendung eines gelösten Antimonkomplexes und Anwendung des Verfahrens

Publications (1)

Publication Number	Publication Date
CH632299A5 true CH632299A5 (en)	1982-09-30

Family

ID=5981334

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CH773777A CH632299A5 (en)	1976-06-24	1977-06-23	Process for producing metallophobic surfaces on objects

Country Status (9)

Country	Link
JP (1)	JPS537538A (sv)
AT (1)	AT351885B (sv)
CA (1)	CA1104010A (sv)
CH (1)	CH632299A5 (sv)
DE (1)	DE2628350C3 (sv)
FR (1)	FR2355923A1 (sv)
GB (1)	GB1547079A (sv)
IT (1)	IT1077233B (sv)
SE (1)	SE424005B (sv)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4151313A (en) *	1977-03-11	1979-04-24	Hitachi, Ltd.	Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material
JPS60185818A (ja) *	1984-03-01	1985-09-21	Nikkiso Co Ltd	気相法炭素繊維の製造方法
JPS6054998A (ja) *	1983-09-06	1985-03-29	Nikkiso Co Ltd	気相成長炭素繊維の製造方法
JPS6074599A (ja) *	1983-09-30	1985-04-26	株式会社日立製作所	プリント配線板及びその製造方法
JPS60224816A (ja) *	1984-04-20	1985-11-09	Nikkiso Co Ltd	気相成長による炭素繊維の製造方法
FR2564110B1 (fr) *	1984-05-10	1986-09-05	Lorraine Carbone	Procede de production de fibres de carbone vapo-deposees a partir de methane
US4861539A (en) *	1986-11-20	1989-08-29	Allied Colloids Ltd.	Process of making water-absorbent, water-insoluble, cross linked fiber or film
JP4794248B2 (ja) *	2005-09-14	2011-10-19	卓新井	亜鉛もしくは亜鉛合金製品用表面処理剤

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3775121A (en) *	1972-08-09	1973-11-27	Western Electric Co	Method of selectively depositing a metal on a surface of a substrate

1976
- 1976-06-24 DE DE2628350A patent/DE2628350C3/de not_active Expired
1977
- 1977-05-27 AT AT380177A patent/AT351885B/de not_active IP Right Cessation
- 1977-06-08 IT IT24504/77A patent/IT1077233B/it active
- 1977-06-10 GB GB24333/77A patent/GB1547079A/en not_active Expired
- 1977-06-17 SE SE7707077A patent/SE424005B/sv unknown
- 1977-06-23 CH CH773777A patent/CH632299A5/de not_active IP Right Cessation
- 1977-06-23 CA CA281,246A patent/CA1104010A/en not_active Expired
- 1977-06-24 FR FR7719444A patent/FR2355923A1/fr active Granted
- 1977-06-24 JP JP7536177A patent/JPS537538A/ja active Pending

Also Published As

Publication number	Publication date
ATA380177A (de)	1979-01-15
AT351885B (de)	1979-08-27
SE7707077L (sv)	1977-12-25
GB1547079A (en)	1979-06-06
DE2628350A1 (de)	1977-12-29
FR2355923B1 (sv)	1981-10-16
IT1077233B (it)	1985-05-04
CA1104010A (en)	1981-06-30
DE2628350C3 (de)	1978-12-07
SE424005B (sv)	1982-06-21
DE2628350B2 (de)	1978-04-20
FR2355923A1 (fr)	1978-01-20
JPS537538A (en)	1978-01-24

Publication	Publication Date	Title
DE2238004C3 (de)	1978-03-30	Verfahren zur Vorbehandlung für das nachfolgende Metallisieren von Kunststoffen, insbesondere zur Herstellung von gedruckten Leiterplatten
DE2166971C3 (de)	1982-02-18	Verfahren zur Herstellung von gedruckten Leiterplatten
DE69408189T2 (de)	1998-09-03	Kupferfolie für Leiterplatten und Verfahren zu ihrer Herstellung
EP0807190B1 (de)	2002-02-06	Verfahren zur herstellung von metallisierten werkstoffen
DE1091433B (de)	1960-10-20	Vorsensibilisierte Flachdruckplatte
DE2249796B2 (de)	1980-06-26	Oberflächenrauhe Kupferfolie fur die Herstellung gedruckter Schaltkreisplatten und Verfahren zu ihrer Herstellung
EP0082438A1 (de)	1983-06-29	Verfahren zur Aktivierung von Substratoberflächen für die stromlose Metallisierung
DE2728465A1 (de)	1979-01-11	Verfahren zur herstellung von elektrisch leitenden und loetbaren anordnungen
EP0012333A1 (de)	1980-06-25	Verfahren zur Herstellung stromloser metallisierbarer Isolierstoff-Körper
DE102004030930A1 (de)	2006-02-23	Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung
DE2610470B2 (de)	1978-02-16	Verfahren zur stromlosen abscheidung von kupferschichten
DE3323476A1 (de)	1984-01-05	Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
DE3140082C2 (de)	1984-02-09	Verfahren zur Herstellung gedruckter Schaltungen
DE3417563C2 (de)	1986-12-04	Verfahren zur Herstellung von Metallmustern auf isolierenden Trägern, insbesondere gedruckte Schaltungen
DE3025307A1 (de)	1982-01-28	Verfahren zur aktivierung von oberflaechen fuer die stromlose metallisierung
CH632299A5 (en)	1982-09-30	Process for producing metallophobic surfaces on objects
DE1621372B2 (de)	1976-02-12	Verfahren zur herstellung von metallbeschichteten kunststoffen
DE2362382C3 (de)	1982-10-07	Verfahren zur Herstellung von Basismaterial
DE2635457A1 (de)	1978-02-09	Katalytischer lack zur herstellung von gedruckten schaltungen
DE2335497A1 (de)	1974-02-07	Verfahren und produkt fuer die sensibilisierung von nichtmetallischen stoffen fuer die stromlose metallabscheidung
DE3134502A1 (de)	1982-04-15	Verfahren zum herstellen einer gedruckten schaltungsplatte
WO1999055935A1 (de)	1999-11-04	Verfahren zum überziehen von oberflächen auf kupfer oder einer kupferlegierung mit einer zinn- oder zinnlegierungsschicht
DE2530415C3 (de)	1980-01-17	Verfahren zum Vorbereiten von Trägermaterialien für die Herstellung von Metallmustern
DE2659963C2 (de)	1979-03-01	Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Gegenständen durch Aufbringen eines gelösten Antimonkomplexes
DE202005010364U1 (de)	2005-09-08	Zinnbeschichtete flexible Leiterplatten mit geringer Neigung zur Whiskerbildung

Legal Events

Date	Code	Title	Description
1984-02-29	PL	Patent ceased
2024-10-31	PL	Patent ceased