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AT351885B - Verfahren zum herstellen von metallophoben (metallabweisenden) oberflaechen auf gegen- staenden, insbesondere fuer die herstellung von basismaterial fuer gedruckte schaltungen - Google Patents

Verfahren zum herstellen von metallophoben (metallabweisenden) oberflaechen auf gegen- staenden, insbesondere fuer die herstellung von basismaterial fuer gedruckte schaltungen

Info

Publication number
AT351885B
AT351885B AT380177A AT380177A AT351885B AT 351885 B AT351885 B AT 351885B AT 380177 A AT380177 A AT 380177A AT 380177 A AT380177 A AT 380177A AT 351885 B AT351885 B AT 351885B
Authority
AT
Austria
Prior art keywords
production
metallophobe
repellent
objects
metal
Prior art date
Application number
AT380177A
Other languages
English (en)
Other versions
ATA380177A (de
Original Assignee
Felten & Guilleaume Carlswerk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Felten & Guilleaume Carlswerk filed Critical Felten & Guilleaume Carlswerk
Publication of ATA380177A publication Critical patent/ATA380177A/de
Application granted granted Critical
Publication of AT351885B publication Critical patent/AT351885B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Chemically Coating (AREA)
AT380177A 1976-06-24 1977-05-27 Verfahren zum herstellen von metallophoben (metallabweisenden) oberflaechen auf gegen- staenden, insbesondere fuer die herstellung von basismaterial fuer gedruckte schaltungen AT351885B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2628350A DE2628350C3 (de) 1976-06-24 1976-06-24 Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Schichtstoffen unter Verwendung eines gelösten Antimonkomplexes und Anwendung des Verfahrens

Publications (2)

Publication Number Publication Date
ATA380177A ATA380177A (de) 1979-01-15
AT351885B true AT351885B (de) 1979-08-27

Family

ID=5981334

Family Applications (1)

Application Number Title Priority Date Filing Date
AT380177A AT351885B (de) 1976-06-24 1977-05-27 Verfahren zum herstellen von metallophoben (metallabweisenden) oberflaechen auf gegen- staenden, insbesondere fuer die herstellung von basismaterial fuer gedruckte schaltungen

Country Status (9)

Country Link
JP (1) JPS537538A (de)
AT (1) AT351885B (de)
CA (1) CA1104010A (de)
CH (1) CH632299A5 (de)
DE (1) DE2628350C3 (de)
FR (1) FR2355923A1 (de)
GB (1) GB1547079A (de)
IT (1) IT1077233B (de)
SE (1) SE424005B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151313A (en) * 1977-03-11 1979-04-24 Hitachi, Ltd. Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material
JPS60185818A (ja) * 1984-03-01 1985-09-21 Nikkiso Co Ltd 気相法炭素繊維の製造方法
JPS6054998A (ja) * 1983-09-06 1985-03-29 Nikkiso Co Ltd 気相成長炭素繊維の製造方法
JPS6074599A (ja) * 1983-09-30 1985-04-26 株式会社日立製作所 プリント配線板及びその製造方法
JPS60224816A (ja) * 1984-04-20 1985-11-09 Nikkiso Co Ltd 気相成長による炭素繊維の製造方法
FR2564110B1 (fr) * 1984-05-10 1986-09-05 Lorraine Carbone Procede de production de fibres de carbone vapo-deposees a partir de methane
US4861539A (en) * 1986-11-20 1989-08-29 Allied Colloids Ltd. Process of making water-absorbent, water-insoluble, cross linked fiber or film
JP4794248B2 (ja) * 2005-09-14 2011-10-19 卓 新井 亜鉛もしくは亜鉛合金製品用表面処理剤

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3775121A (en) * 1972-08-09 1973-11-27 Western Electric Co Method of selectively depositing a metal on a surface of a substrate

Also Published As

Publication number Publication date
ATA380177A (de) 1979-01-15
CH632299A5 (en) 1982-09-30
SE7707077L (sv) 1977-12-25
GB1547079A (en) 1979-06-06
DE2628350A1 (de) 1977-12-29
FR2355923B1 (de) 1981-10-16
IT1077233B (it) 1985-05-04
CA1104010A (en) 1981-06-30
DE2628350C3 (de) 1978-12-07
SE424005B (sv) 1982-06-21
DE2628350B2 (de) 1978-04-20
FR2355923A1 (fr) 1978-01-20
JPS537538A (en) 1978-01-24

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Legal Events

Date Code Title Description
EFA Change in the company name
ELJ Ceased due to non-payment of the annual fee
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties