CH485323A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- CH485323A CH485323A CH91269A CH91269A CH485323A CH 485323 A CH485323 A CH 485323A CH 91269 A CH91269 A CH 91269A CH 91269 A CH91269 A CH 91269A CH 485323 A CH485323 A CH 485323A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H01L2924/01079—Gold [Au]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
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- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP386668 | 1968-01-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH485323A true CH485323A (en) | 1970-01-31 |
Family
ID=11569101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH91269A CH485323A (en) | 1968-01-23 | 1969-01-22 | Semiconductor device |
Country Status (5)
Country | Link |
---|---|
CH (1) | CH485323A (en) |
DE (1) | DE1903082B2 (en) |
FR (1) | FR2000604A1 (en) |
GB (1) | GB1246858A (en) |
SE (1) | SE354379B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2559837C2 (en) * | 1974-07-13 | 1985-01-17 | Olympus Optical Co., Ltd., Tokio/Tokyo | DC motor |
FR2328286A1 (en) * | 1975-10-14 | 1977-05-13 | Thomson Csf | PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICES WITH VERY LOW THERMAL RESISTANCE, AND DEVICES OBTAINED BY THIS PROCEDURE |
JPS5678130A (en) * | 1979-11-30 | 1981-06-26 | Hitachi Ltd | Semiconductor device and its manufacture |
EP1286393A3 (en) * | 2001-06-28 | 2004-03-03 | F & K Delvotec Bondtechnik GmbH | Circuit housing |
-
1969
- 1969-01-22 CH CH91269A patent/CH485323A/en not_active IP Right Cessation
- 1969-01-22 FR FR6901160A patent/FR2000604A1/fr active Pending
- 1969-01-22 SE SE84069A patent/SE354379B/xx unknown
- 1969-01-22 DE DE19691903082 patent/DE1903082B2/en not_active Ceased
- 1969-01-23 GB GB376369A patent/GB1246858A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
SE354379B (en) | 1973-03-05 |
GB1246858A (en) | 1971-09-22 |
FR2000604A1 (en) | 1969-09-12 |
DE1903082B2 (en) | 1971-09-30 |
DE1903082A1 (en) | 1969-07-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |