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CH388457A - Legierungsvorrichtung zum Anbringen von Flächenelektroden an Halbleiterkörpern - Google Patents

Legierungsvorrichtung zum Anbringen von Flächenelektroden an Halbleiterkörpern

Info

Publication number
CH388457A
CH388457A CH1076660A CH1076660A CH388457A CH 388457 A CH388457 A CH 388457A CH 1076660 A CH1076660 A CH 1076660A CH 1076660 A CH1076660 A CH 1076660A CH 388457 A CH388457 A CH 388457A
Authority
CH
Switzerland
Prior art keywords
surface electrodes
attaching surface
semiconductor bodies
alloy device
alloy
Prior art date
Application number
CH1076660A
Other languages
English (en)
Inventor
Emeis Reimer
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH388457A publication Critical patent/CH388457A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • EFIXED CONSTRUCTIONS
    • E05LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05DHINGES OR SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS
    • E05D13/00Accessories for sliding or lifting wings, e.g. pulleys, safety catches
    • E05D13/10Counterbalance devices
    • E05D13/12Counterbalance devices with springs
    • E05D13/1253Counterbalance devices with springs with canted-coil torsion springs
    • E05D13/1261Counterbalance devices with springs with canted-coil torsion springs specially adapted for overhead wings
    • EFIXED CONSTRUCTIONS
    • E05LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2900/00Application of doors, windows, wings or fittings thereof
    • E05Y2900/10Application of doors, windows, wings or fittings thereof for buildings or parts thereof
    • E05Y2900/106Application of doors, windows, wings or fittings thereof for buildings or parts thereof for garages
    • EFIXED CONSTRUCTIONS
    • E05LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2900/00Application of doors, windows, wings or fittings thereof
    • E05Y2900/50Application of doors, windows, wings or fittings thereof for vehicles
    • E05Y2900/53Type of wing
    • E05Y2900/531Doors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Furnace Details (AREA)
  • Farming Of Fish And Shellfish (AREA)
  • Silicon Compounds (AREA)
CH1076660A 1959-10-10 1960-09-23 Legierungsvorrichtung zum Anbringen von Flächenelektroden an Halbleiterkörpern CH388457A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES65390A DE1104073B (de) 1959-10-10 1959-10-10 Vorrichtung zum Einlegieren von Flaechenelektroden an Halbleiterkoerpern
DES65944A DE1108332B (de) 1959-10-10 1959-11-24 Legierungsvorrichtung zum Anbringen von Flaechenelektroden an Halbleiterkoerpern

Publications (1)

Publication Number Publication Date
CH388457A true CH388457A (de) 1965-02-28

Family

ID=25995874

Family Applications (2)

Application Number Title Priority Date Filing Date
CH955660A CH379002A (de) 1959-10-10 1960-08-24 Legierungsvorrichtung zum Anbringen von Flächenelektroden an Halbleiterkörpern
CH1076660A CH388457A (de) 1959-10-10 1960-09-23 Legierungsvorrichtung zum Anbringen von Flächenelektroden an Halbleiterkörpern

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CH955660A CH379002A (de) 1959-10-10 1960-08-24 Legierungsvorrichtung zum Anbringen von Flächenelektroden an Halbleiterkörpern

Country Status (4)

Country Link
CH (2) CH379002A (de)
DE (2) DE1104073B (de)
GB (2) GB902129A (de)
NL (2) NL255713A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1201492B (de) * 1962-05-04 1965-09-23 Siemens Ag Verfahren zum Herstellen von Legierungselektroden fuer Halbleiterbauelemente nach Art des Presspulver-Legierungsverfahrens
NL302915A (de) * 1963-01-16
CN107543411B (zh) * 2017-05-04 2019-05-10 山东中琦环保设备制造有限公司 一种超高搪瓷管隧道窑

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1044617A (fr) * 1951-03-09 1953-11-19 Materiel Telephonique Perfectionnements à la préparation de pastilles semi-conductrices destinées à la fabrication des éléments à conductibilité asymétrique

Also Published As

Publication number Publication date
NL255713A (de)
DE1104073B (de) 1961-04-06
DE1108332B (de) 1961-06-08
CH379002A (de) 1964-06-30
GB902129A (en) 1962-07-25
GB902130A (en) 1962-07-25
NL256703A (de)

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