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GB902129A - Apparatus for use in applying laminar electrodes to semi-conductor members - Google Patents

Apparatus for use in applying laminar electrodes to semi-conductor members

Info

Publication number
GB902129A
GB902129A GB3217760A GB3217760A GB902129A GB 902129 A GB902129 A GB 902129A GB 3217760 A GB3217760 A GB 3217760A GB 3217760 A GB3217760 A GB 3217760A GB 902129 A GB902129 A GB 902129A
Authority
GB
United Kingdom
Prior art keywords
semi
alloying
frame
layers
metal layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3217760A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB902129A publication Critical patent/GB902129A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05D—HINGES OR SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS
    • E05D13/00—Accessories for sliding or lifting wings, e.g. pulleys, safety catches
    • E05D13/10—Counterbalance devices
    • E05D13/12—Counterbalance devices with springs
    • E05D13/1253—Counterbalance devices with springs with canted-coil torsion springs
    • E05D13/1261—Counterbalance devices with springs with canted-coil torsion springs specially adapted for overhead wings
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2900/00—Application of doors, windows, wings or fittings thereof
    • E05Y2900/10—Application of doors, windows, wings or fittings thereof for buildings or parts thereof
    • E05Y2900/106—Application of doors, windows, wings or fittings thereof for buildings or parts thereof for garages
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2900/00—Application of doors, windows, wings or fittings thereof
    • E05Y2900/50—Application of doors, windows, wings or fittings thereof for vehicles
    • E05Y2900/53—Type of wing
    • E05Y2900/531—Doors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Furnace Details (AREA)
  • Farming Of Fish And Shellfish (AREA)
  • Silicon Compounds (AREA)

Abstract

902,129. Electric furnaces. SIEMENSSCHUCKERTWERKE A.G. Sept. 19, 1960 [Oct. 10, 1959], No. 32177/60. Class 39 (3). [Also in Group XXXVI] Apparatus for providing electrodes by alloying metal layers to semi-conductor members comprises a plurality of moulds for receiving the members and layers, mounted in a freely suspended frame in a heating device, and means for pressing the alloying surfaces together, the arrangement being such that the layers and surfaces assume horizontal positions. Fig. 1 shows alloying moulds 3 containing the semi-conductor members and their associated metal layers the surfaces of which are to be alloyed together, held in a frame 2 freely suspended from ball joint 2b. The frame is enclosed in a quartz tube 4, which lies inside a ring of heating coils 22 held in an aluminium oxide tube 21, the cross-section of which is shown in Fig. 2. A jacket 29 of kieselguhr is provided around the heating chamber. A pump head 5 connected to vacuum pumps 14 and 17 is attached to quartz tube 4, watercooling means 8, 8a being provided around the top of tube 4. Even temperature is ensured by having the heating coils 22 extending beyond each end of the mould frame. Pressure means (not shown) such as a screw or clamping device or a sliding weight are provided to press together the alloying surfaces of the semi-conductor and metal layers.
GB3217760A 1959-10-10 1960-09-19 Apparatus for use in applying laminar electrodes to semi-conductor members Expired GB902129A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES65390A DE1104073B (en) 1959-10-10 1959-10-10 Device for alloying surface electrodes on semiconductor bodies
DES65944A DE1108332B (en) 1959-10-10 1959-11-24 Alloy device for attaching surface electrodes to semiconductor bodies

Publications (1)

Publication Number Publication Date
GB902129A true GB902129A (en) 1962-07-25

Family

ID=25995874

Family Applications (2)

Application Number Title Priority Date Filing Date
GB3217760A Expired GB902129A (en) 1959-10-10 1960-09-19 Apparatus for use in applying laminar electrodes to semi-conductor members
GB3737460A Expired GB902130A (en) 1959-10-10 1960-10-31 Apparatus for use in applying laminar electrodes to semi-conductor members

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB3737460A Expired GB902130A (en) 1959-10-10 1960-10-31 Apparatus for use in applying laminar electrodes to semi-conductor members

Country Status (4)

Country Link
CH (2) CH379002A (en)
DE (2) DE1104073B (en)
GB (2) GB902129A (en)
NL (2) NL255713A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107543411A (en) * 2017-05-04 2018-01-05 山东中琦环保设备制造有限公司 A kind of superelevation enamel pipe tunnel cave

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1201492B (en) * 1962-05-04 1965-09-23 Siemens Ag Process for the production of alloy electrodes for semiconductor components according to the type of press powder alloy process
NL302915A (en) * 1963-01-16

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1044617A (en) * 1951-03-09 1953-11-19 Materiel Telephonique Improvements in the preparation of semiconductor pellets intended for the manufacture of elements with asymmetric conductivity

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107543411A (en) * 2017-05-04 2018-01-05 山东中琦环保设备制造有限公司 A kind of superelevation enamel pipe tunnel cave
CN107543411B (en) * 2017-05-04 2019-05-10 山东中琦环保设备制造有限公司 An ultra-high enamel tube tunnel kiln

Also Published As

Publication number Publication date
NL255713A (en)
CH388457A (en) 1965-02-28
DE1104073B (en) 1961-04-06
DE1108332B (en) 1961-06-08
CH379002A (en) 1964-06-30
GB902130A (en) 1962-07-25
NL256703A (en)

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