Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
  • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
  • H01J5/20—Seals between parts of vessels
  • H01J5/22—Vacuum-tight joints between parts of vessel
  • H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J2893/00—Discharge tubes and lamps
  • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
  • H01J2893/0037—Solid sealing members other than lamp bases
  • H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49826—Assembling or joining
  • Y10T29/49908—Joining by deforming
  • Y10T29/49938—Radially expanding part in cavity, aperture, or hollow body

Landscapes

• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
• Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=19785356

Family Applications (1)

Country Status (6)

Families Citing this family (22)

Family Cites Families (12)

• 0
  • DE DENDAT1072323D patent/DE1072323B/de active Pending
  • BE BE566767D patent/BE566767A/xx unknown
• 1958
  • 1958-03-26 US US725774A patent/US3024299A/en not_active Expired - Lifetime
  • 1958-04-14 FR FR1194674D patent/FR1194674A/fr not_active Expired
  • 1958-04-14 CH CH359789D patent/CH359789A/de unknown
  • 1958-04-15 GB GB11944/58A patent/GB826823A/en not_active Expired

Also Published As

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