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CA2330426A1 - Material shaping device with a laser beam which is injected into a stream of liquid - Google Patents

Material shaping device with a laser beam which is injected into a stream of liquid Download PDF

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Publication number
CA2330426A1
CA2330426A1 CA002330426A CA2330426A CA2330426A1 CA 2330426 A1 CA2330426 A1 CA 2330426A1 CA 002330426 A CA002330426 A CA 002330426A CA 2330426 A CA2330426 A CA 2330426A CA 2330426 A1 CA2330426 A1 CA 2330426A1
Authority
CA
Canada
Prior art keywords
liquid
stream
injected
laser beam
shaping device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002330426A
Other languages
French (fr)
Other versions
CA2330426C (en
Inventor
Bernold Richerzhagen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Synova SA
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2330426A1 publication Critical patent/CA2330426A1/en
Application granted granted Critical
Publication of CA2330426C publication Critical patent/CA2330426C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention relates to a method and device for shaping material of work pieces using a laser beam which is injected into a stream of liquid. The liquid which is to be formed into a stream by a nozzle channel is fed to the nozzle channel opening such that the flow does not swirl, especially without flow components which are tangential to the nozzle channel axis. The laser irradiation is focussed on the channel entry plane and the liquid is fed to the channel opening in such a way that a liquid retention space is avoided in the beam focussing ball and in the immediate surroundings thereof.
CA002330426A 1998-04-30 1999-04-30 Material shaping device with a laser beam which is injected into a stream of liquid Expired - Lifetime CA2330426C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19819429.3 1998-04-30
DE19819429 1998-04-30
PCT/CH1999/000180 WO1999056907A1 (en) 1998-04-30 1999-04-30 Material shaping device with a laser beam which is injected into a stream of liquid

Publications (2)

Publication Number Publication Date
CA2330426A1 true CA2330426A1 (en) 1999-11-11
CA2330426C CA2330426C (en) 2007-11-13

Family

ID=7866347

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002330426A Expired - Lifetime CA2330426C (en) 1998-04-30 1999-04-30 Material shaping device with a laser beam which is injected into a stream of liquid

Country Status (4)

Country Link
KR (1) KR100584310B1 (en)
CN (1) CN1134322C (en)
CA (1) CA2330426C (en)
WO (1) WO1999056907A1 (en)

Cited By (7)

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US6737606B2 (en) 2001-09-10 2004-05-18 Micron Technology, Inc. Wafer dicing device and method
US6888098B1 (en) 2002-07-03 2005-05-03 Scimed Life Systems, Inc. Tubular cutting process and system
US7358154B2 (en) 2001-10-08 2008-04-15 Micron Technology, Inc. Method for fabricating packaged die
US7375009B2 (en) 2002-06-14 2008-05-20 Micron Technology, Inc. Method of forming a conductive via through a wafer
US10160059B2 (en) 2016-03-03 2018-12-25 General Electric Company Decoupled liquid-jet guided laser nozzle cap
US10335900B2 (en) 2016-03-03 2019-07-02 General Electric Company Protective shield for liquid guided laser cutting tools
US10453704B2 (en) 2003-05-06 2019-10-22 Micron Technology, Inc. Method for packaging circuits

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EP1132058A1 (en) * 2000-03-06 2001-09-12 Advanced Laser Applications Holding S.A. Intravascular prothesis
EP1269535B1 (en) 2000-04-04 2007-10-10 Synova S.A. Method for cutting an object and for further processing the cut material and a carrier for holding the object or the cut material
US6563080B2 (en) 2001-02-15 2003-05-13 Scimed Life Systems, Inc. Laser cutting of stents and other medical devices
US6777647B1 (en) * 2003-04-16 2004-08-17 Scimed Life Systems, Inc. Combination laser cutter and cleaner
US7476034B2 (en) 2003-08-28 2009-01-13 Boston Scientific Scimed, Inc. Dynamic bushing for medical device tubing
EP1657020A1 (en) * 2004-11-10 2006-05-17 Synova S.A. Process and device for optimising the coherence of a fluidjet used for materialworking and fluid flow nozzle for such a device
PL1940579T3 (en) * 2005-05-17 2010-11-30 Technikus Ag Method for material working by means of a laser guided in a water jet and device for carrying out said method
JP4844715B2 (en) * 2005-08-25 2011-12-28 澁谷工業株式会社 Hybrid laser processing equipment
JP2007144494A (en) * 2005-11-30 2007-06-14 Tokyo Electron Ltd Apparatus and method for laser processing
DE102006038001B3 (en) * 2006-08-14 2008-03-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Procedure for drying and/or dry holding of workpiece during fluid jet guidance processing of the workpiece, comprises supplying dry inert gas at a process head, which is conveyed nearly at the workpiece, whose processed area is dried
US20220096112A1 (en) 2007-01-02 2022-03-31 Aquabeam, Llc Tissue resection with pressure sensing
US8814921B2 (en) 2008-03-06 2014-08-26 Aquabeam Llc Tissue ablation and cautery with optical energy carried in fluid stream
US9232959B2 (en) 2007-01-02 2016-01-12 Aquabeam, Llc Multi fluid tissue resection methods and devices
US8134098B2 (en) * 2007-09-28 2012-03-13 Sugino Machine Limited Laser machining apparatus using laser beam introduced into jet liquid column
US7722661B2 (en) 2007-12-19 2010-05-25 Boston Scientific Scimed, Inc. Stent
EP2208568A1 (en) * 2009-01-20 2010-07-21 Synova S.A. Apparatus and method for processing material by means of laser
DE102009011305A1 (en) * 2009-03-02 2010-09-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Back contacting solar cells and methods of making same
US9848904B2 (en) 2009-03-06 2017-12-26 Procept Biorobotics Corporation Tissue resection and treatment with shedding pulses
US10524822B2 (en) 2009-03-06 2020-01-07 Procept Biorobotics Corporation Image-guided eye surgery apparatus
DE102010011580B4 (en) * 2010-03-16 2020-01-02 Vollmer Werke Maschinenfabrik Gmbh Device and method for measuring a liquid jet, in particular used as a light guide, and device for processing a workpiece
DE102011001322A1 (en) * 2011-03-16 2012-09-20 Ipg Laser Gmbh Machine and method for material processing of workpieces with a laser beam
CN102259236A (en) * 2011-07-01 2011-11-30 中国电子科技集团公司第四十五研究所 Alignment device for coupling of water-jet guided laser
CN102259237B (en) * 2011-07-01 2014-09-03 中国电子科技集团公司第四十五研究所 Regulator for coupling of laser beam and water jet
CN108606773B (en) 2012-02-29 2020-08-11 普罗赛普特生物机器人公司 Automated image-guided tissue ablation and treatment
JP5877432B2 (en) * 2012-02-29 2016-03-08 株式会社スギノマシン Laser processing equipment
US8969760B2 (en) 2012-09-14 2015-03-03 General Electric Company System and method for manufacturing an airfoil
US8993923B2 (en) 2012-09-14 2015-03-31 General Electric Company System and method for manufacturing an airfoil
EP2999568B1 (en) * 2013-05-23 2018-07-04 Trumpf Werkzeugmaschinen GmbH + Co. KG Nozzle for a laser machining device and said device
US11440135B2 (en) 2013-05-23 2022-09-13 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laser machining nozzle for a laser machining device, and laser machining device
EP2957378A1 (en) 2014-06-16 2015-12-23 Synova SA Machining head for coupling a laser beam and a fluid beam with an interface
GB201419809D0 (en) 2014-11-07 2014-12-24 Element Six Technologies Ltd A method of fabricating plates of super-hard material and cutting techniques suitable for such a method
US9770785B2 (en) 2014-11-18 2017-09-26 General Electric Company System and method for forming a cooling hole in an airfoil
DE102014223716A1 (en) 2014-11-20 2016-05-25 Siemens Aktiengesellschaft Device and method for processing a component by means of a propagating in a liquid jet laser beam
US9895755B2 (en) 2014-12-09 2018-02-20 Kennametal Inc. Cutting insert with internal coolant passages and method of making same
US9776284B2 (en) 2015-01-22 2017-10-03 General Electric Company System and method for cutting a passage in an airfoil
EP3718676B1 (en) 2015-07-28 2023-11-15 Synova SA Device and process of treating a workpiece using a liquid jet guided laser beam
DE102016116512A1 (en) 2016-09-03 2018-03-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for machining a workpiece
EP3300833B1 (en) 2016-10-03 2019-11-27 Synova SA Device for generating a jet of liquid
CN109803770B (en) * 2016-10-17 2020-02-21 Abb瑞士股份有限公司 Cleaning device and method for controlling the focus of a laser inside a fluid beam and system comprising a cleaning device
EP3572181B1 (en) * 2017-01-23 2022-06-22 Subaru Corporation Laser peening device and laser peening methods
DE102017112113A1 (en) 2017-06-01 2018-12-06 Lohmann-Koester Gmbh & Co. Kg Method for producing a sieve-shaped demolding tool and sieve-shaped demolding tool
EP3466597A1 (en) * 2017-10-05 2019-04-10 Synova S.A. Apparatus for machining a workpiece with a laser beam
EP3470165B1 (en) * 2017-10-13 2023-08-16 Synova S.A. Apparatus for machining a workpiece with a liquid jet guided laser beam and the assembly thereof
CN108132511A (en) * 2017-12-21 2018-06-08 暨南大学 A kind of compound camera lens for diamond laser cutting
CN108480842B (en) * 2018-06-12 2022-11-29 桂林电子科技大学 Water-conducting laser coupling shunting voltage stabilizer
WO2020225448A1 (en) * 2019-05-08 2020-11-12 Wsoptics Technologies Gmbh Method for the beam machining of a workpiece
CN113618232B (en) * 2021-07-28 2024-03-19 中国科学院宁波材料技术与工程研究所 Double-beam coupling water guide machining head device and machining method

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DE4418845C5 (en) * 1994-05-30 2012-01-05 Synova S.A. Method and device for material processing using a laser beam
US5773791A (en) * 1996-09-03 1998-06-30 Kuykendal; Robert Water laser machine tool

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6737606B2 (en) 2001-09-10 2004-05-18 Micron Technology, Inc. Wafer dicing device and method
US7358154B2 (en) 2001-10-08 2008-04-15 Micron Technology, Inc. Method for fabricating packaged die
US8138617B2 (en) 2001-10-08 2012-03-20 Round Rock Research, Llc Apparatus and method for packaging circuits
US7375009B2 (en) 2002-06-14 2008-05-20 Micron Technology, Inc. Method of forming a conductive via through a wafer
US6888098B1 (en) 2002-07-03 2005-05-03 Scimed Life Systems, Inc. Tubular cutting process and system
US9180032B2 (en) 2002-07-03 2015-11-10 Boston Scientific Scimed, Inc. Tubular cutting process and system
US10453704B2 (en) 2003-05-06 2019-10-22 Micron Technology, Inc. Method for packaging circuits
US10811278B2 (en) 2003-05-06 2020-10-20 Micron Technology, Inc. Method for packaging circuits
US10160059B2 (en) 2016-03-03 2018-12-25 General Electric Company Decoupled liquid-jet guided laser nozzle cap
US10335900B2 (en) 2016-03-03 2019-07-02 General Electric Company Protective shield for liquid guided laser cutting tools

Also Published As

Publication number Publication date
WO1999056907A1 (en) 1999-11-11
CN1134322C (en) 2004-01-14
CN1306467A (en) 2001-08-01
CA2330426C (en) 2007-11-13
KR100584310B1 (en) 2006-05-26
KR20010043171A (en) 2001-05-25

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Effective date: 20190430