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CA2247440A1 - Procede et bain d'etamage presentant un fonctionnement optimal dans une plage large de densites de courant - Google Patents

Procede et bain d'etamage presentant un fonctionnement optimal dans une plage large de densites de courant Download PDF

Info

Publication number
CA2247440A1
CA2247440A1 CA002247440A CA2247440A CA2247440A1 CA 2247440 A1 CA2247440 A1 CA 2247440A1 CA 002247440 A CA002247440 A CA 002247440A CA 2247440 A CA2247440 A CA 2247440A CA 2247440 A1 CA2247440 A1 CA 2247440A1
Authority
CA
Canada
Prior art keywords
tin
plating
ions
plating bath
current density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002247440A
Other languages
English (en)
Inventor
Shigeru Hirano
Ryoichi Yoshihara
Yashichi Oyagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2247440A1 publication Critical patent/CA2247440A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne un bain d'étamage contenant 40-100 g/l d'ions Sn et, de préférence, 20-400 g/l d'acide phénolsulfonique, servant à l'étamage de plaques d'acier, ces dernières se déplaçant avec une vitesse relative entre la plaque d'acier et le liquide d'étamage de 2-20 m/sec, ce qui permet un fonctionnement optimal dans une plage large de densités de courant, entre pas moins de 80 A/dm?2¿ et pas moins de 250 A/dm?2¿, pour obtenir un produit étamé.
CA002247440A 1996-02-29 1997-02-28 Procede et bain d'etamage presentant un fonctionnement optimal dans une plage large de densites de courant Abandoned CA2247440A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13562796 1996-02-29
JP8/135627 1996-02-29

Publications (1)

Publication Number Publication Date
CA2247440A1 true CA2247440A1 (fr) 1997-09-04

Family

ID=15156232

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002247440A Abandoned CA2247440A1 (fr) 1996-02-29 1997-02-28 Procede et bain d'etamage presentant un fonctionnement optimal dans une plage large de densites de courant

Country Status (8)

Country Link
EP (1) EP0889147A1 (fr)
KR (1) KR19990087386A (fr)
CN (1) CN1218520A (fr)
AU (1) AU718314B2 (fr)
BR (1) BR9707796A (fr)
CA (1) CA2247440A1 (fr)
TW (1) TW412602B (fr)
WO (1) WO1997032058A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19961052A1 (de) 1999-12-16 2001-07-26 Sauer Danfoss Gmbh Steuervorrichtung für die manuell- oder fußgeführte Steuerung von Arbeitsmaschinen
CN1993502B (zh) * 2004-08-05 2011-04-20 新日本制铁株式会社 电镀锡方法
JP4742677B2 (ja) * 2005-05-24 2011-08-10 Ｊｆｅスチール株式会社 錫めっき鋼帯の製造方法
JP4812365B2 (ja) * 2005-08-19 2011-11-09 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 錫電気めっき液および錫電気めっき方法
CN101388350B (zh) * 2008-10-30 2011-02-16 常州星海半导体器件有限公司 Smd贴片二极管的镀锡方法
CN102345146A (zh) * 2011-09-22 2012-02-08 无锡市创威冷轧有限公司 一种新型冷轧钢板
CN104562120A (zh) * 2015-01-23 2015-04-29 张家港市新港星科技有限公司 一种带钢镀锡的方法
CN105755513A (zh) * 2016-04-28 2016-07-13 四川昊吉科技有限公司 一种镀锡防腐剂
CN107723758A (zh) * 2016-08-12 2018-02-23 惠州大亚湾金盛科技有限公司 一种镀锡添加剂
CN111826690B (zh) * 2020-08-04 2021-07-13 烟台洛姆电子有限公司 一种立式高速连续镀锡的镀液配方及工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2667323B2 (ja) * 1991-04-01 1997-10-27 川崎製鉄株式会社 酸化防止剤、めっき浴用助剤およびこれを用いためっき浴
JPH05195283A (ja) * 1992-01-22 1993-08-03 Kawasaki Steel Corp 錫めっき浴および錫めっき方法
JPH06346272A (ja) * 1993-06-14 1994-12-20 Nippon Steel Corp 高電流密度による錫めっき用硫酸浴および錫めっき方法
JPH07157889A (ja) * 1993-12-03 1995-06-20 Nippon Steel Corp 耐食性に優れためっき鋼板の製造法

Also Published As

Publication number Publication date
AU718314B2 (en) 2000-04-13
EP0889147A1 (fr) 1999-01-07
CN1218520A (zh) 1999-06-02
BR9707796A (pt) 1999-07-27
AU2231197A (en) 1997-09-16
WO1997032058A1 (fr) 1997-09-04
KR19990087386A (ko) 1999-12-27
TW412602B (en) 2000-11-21

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