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CA2081045A1 - Boitier de microcircuit a mecanisme de refroidissement - Google Patents

Boitier de microcircuit a mecanisme de refroidissement

Info

Publication number
CA2081045A1
CA2081045A1 CA2081045A CA2081045A CA2081045A1 CA 2081045 A1 CA2081045 A1 CA 2081045A1 CA 2081045 A CA2081045 A CA 2081045A CA 2081045 A CA2081045 A CA 2081045A CA 2081045 A1 CA2081045 A1 CA 2081045A1
Authority
CA
Canada
Prior art keywords
integrated circuit
coolers
liquid coolant
manifold
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2081045A
Other languages
English (en)
Other versions
CA2081045C (fr
Inventor
Kazuhiko Umezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2081045A1 publication Critical patent/CA2081045A1/fr
Application granted granted Critical
Publication of CA2081045C publication Critical patent/CA2081045C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CA002081045A 1991-10-21 1992-10-21 Boitier de microcircuit a mecanisme de refroidissement Expired - Fee Related CA2081045C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3272631A JP2852148B2 (ja) 1991-10-21 1991-10-21 集積回路パッケージの冷却構造
JP3-272631 1991-10-21

Publications (2)

Publication Number Publication Date
CA2081045A1 true CA2081045A1 (fr) 1993-04-22
CA2081045C CA2081045C (fr) 1997-05-27

Family

ID=17516625

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002081045A Expired - Fee Related CA2081045C (fr) 1991-10-21 1992-10-21 Boitier de microcircuit a mecanisme de refroidissement

Country Status (5)

Country Link
US (1) US5329419A (fr)
EP (1) EP0538833B1 (fr)
JP (1) JP2852148B2 (fr)
CA (1) CA2081045C (fr)
DE (1) DE69230630T2 (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2500757B2 (ja) * 1993-06-21 1996-05-29 日本電気株式会社 集積回路の冷却構造
US5831824A (en) * 1996-01-31 1998-11-03 Motorola, Inc. Apparatus for spray-cooling multiple electronic modules
US5675473A (en) * 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5718117A (en) * 1996-04-10 1998-02-17 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5687577A (en) * 1996-04-10 1997-11-18 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5731542A (en) * 1996-05-23 1998-03-24 Motorola, Inc. Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
US5920457A (en) * 1996-09-25 1999-07-06 International Business Machines Corporation Apparatus for cooling electronic devices using a flexible coolant conduit
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
US6222264B1 (en) 1999-10-15 2001-04-24 Dell Usa, L.P. Cooling apparatus for an electronic package
US6519151B2 (en) 2001-06-27 2003-02-11 International Business Machines Corporation Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof
DE10132874A1 (de) * 2001-07-06 2003-01-23 Zdenko Knezevic Emissionsarme Kühlvorrichtung und Verfahren zum emissionsarmen Kühlen
US6980450B2 (en) * 2002-01-24 2005-12-27 Inverters Unlimited, Inc. High power density inverter and components thereof
US7167366B2 (en) * 2002-09-11 2007-01-23 Kioan Cheon Soft cooling jacket for electronic device
TWM248227U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Liquid cooling apparatus
JP2006190707A (ja) * 2004-12-28 2006-07-20 Toshiba Corp 電子機器とこの電子機器が適用されるテレビジョン受像装置
US7605581B2 (en) 2005-06-16 2009-10-20 Delta Design, Inc. Apparatus and method for controlling die force in a semiconductor device testing assembly
US7298618B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
US7537047B2 (en) * 2006-03-23 2009-05-26 Foxconn Technology Co., Ltd. Liquid-cooling heat sink
US20080047694A1 (en) * 2006-08-27 2008-02-28 Delano Andrew D Heat transfer apparatus and methods
US7480142B2 (en) * 2006-12-12 2009-01-20 Cummins Power Generation Ip, Inc. Boost spring holder for securing a power device to a heatsink
WO2009009516A2 (fr) * 2007-07-12 2009-01-15 Honeywell International Inc. Nano-douche destinée au refroidissement d'une puce
US7508676B1 (en) * 2008-04-11 2009-03-24 International Business Machines Corporation Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability
ATE528713T1 (de) 2009-06-18 2011-10-15 Software Ag Brokersystem für mehrere broker, clients und server in einem heterogenen netzwerk
US8368208B2 (en) 2010-10-01 2013-02-05 Raytheon Company Semiconductor cooling apparatus
US9553038B2 (en) 2012-04-02 2017-01-24 Raytheon Company Semiconductor cooling apparatus
US9472487B2 (en) 2012-04-02 2016-10-18 Raytheon Company Flexible electronic package integrated heat exchanger with cold plate and risers
DE102016112279A1 (de) * 2016-07-05 2018-01-11 Te Connectivity Germany Gmbh Kontakteinrichtung zur Hochstromübertragung
US10575438B1 (en) 2018-12-14 2020-02-25 Juniper Networks, Inc Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates
KR102497950B1 (ko) * 2021-02-04 2023-02-10 제엠제코(주) 반도체 부품 쿨링 시스템, 반도체 부품 쿨링 시스템 제조방법, 및 반도체 부품 쿨링 시스템이 적용된 반도체 패키지
US11641727B2 (en) 2021-03-23 2023-05-02 Hewlett Packard Enterprise Development Lp Cooling system for an electronic circuit module
US11582866B1 (en) * 2021-07-22 2023-02-14 Toyota Motor Engineering & Manufacturing North America, Inc. Systems including a power device-embedded PCB directly joined with a cooling assembly and method of forming the same
TW202308076A (zh) 2021-08-13 2023-02-16 美商史密斯英特康美國公司 用於半導體積體電路之具有液體冷卻框架的測試座總成

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586101A (en) * 1969-12-22 1971-06-22 Ibm Cooling system for data processing equipment
US3774677A (en) * 1971-02-26 1973-11-27 Ibm Cooling system providing spray type condensation
US3908188A (en) * 1974-08-14 1975-09-23 Us Air Force Heat sink for microstrip circuit
US4226281A (en) * 1979-06-11 1980-10-07 International Business Machines Corporation Thermal conduction module
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
JPS60160150A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路の冷却装置
JPH06101523B2 (ja) * 1985-03-04 1994-12-12 株式会社日立製作所 集積回路チツプ冷却装置
JPS61222242A (ja) * 1985-03-28 1986-10-02 Fujitsu Ltd 冷却装置
JPS61226946A (ja) * 1985-04-01 1986-10-08 Hitachi Ltd 集積回路チツプ冷却装置
JPS61276242A (ja) * 1985-05-30 1986-12-06 Hitachi Ltd 半導体モジユ−ル
US4748495A (en) * 1985-08-08 1988-05-31 Dypax Systems Corporation High density multi-chip interconnection and cooling package
EP0217676B1 (fr) * 1985-10-04 1993-09-01 Fujitsu Limited Système de refroidissement pour un dispositif de circuit électronique
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
US4759403A (en) * 1986-04-30 1988-07-26 International Business Machines Corp. Hydraulic manifold for water cooling of multi-chip electric modules
JPS6381959A (ja) * 1986-09-26 1988-04-12 Hitachi Ltd 半導体装置
JPH07112033B2 (ja) * 1987-03-16 1995-11-29 富士通株式会社 冷却モジユ−ル構造
JPH065700B2 (ja) * 1987-07-22 1994-01-19 株式会社日立製作所 電子回路デバイスの冷却装置
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US4791983A (en) * 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly
CA1283225C (fr) * 1987-11-09 1991-04-16 Shinji Mine Systeme de refroidissement pour bloc de circuit integre tridimensionnel
US4809134A (en) * 1988-04-18 1989-02-28 Unisys Corporation Low stress liquid cooling assembly
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nippon Electric Co Flache Kühlungsstruktur für integrierte Schaltung.

Also Published As

Publication number Publication date
DE69230630T2 (de) 2000-09-28
EP0538833B1 (fr) 2000-02-02
DE69230630D1 (de) 2000-03-09
JPH05109954A (ja) 1993-04-30
JP2852148B2 (ja) 1999-01-27
CA2081045C (fr) 1997-05-27
EP0538833A1 (fr) 1993-04-28
US5329419A (en) 1994-07-12

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