CA1276767C - Method of making particle boards - Google Patents
Method of making particle boardsInfo
- Publication number
- CA1276767C CA1276767C CA000512532A CA512532A CA1276767C CA 1276767 C CA1276767 C CA 1276767C CA 000512532 A CA000512532 A CA 000512532A CA 512532 A CA512532 A CA 512532A CA 1276767 C CA1276767 C CA 1276767C
- Authority
- CA
- Canada
- Prior art keywords
- chips
- flakes
- water
- particle boards
- wood
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N1/00—Pretreatment of moulding material
- B27N1/006—Pretreatment of moulding material for increasing resistance to swelling by humidity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
- B27D1/06—Manufacture of central layers; Form of central layers
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
The present invention provides a method of making water-resistant particle boards by molding and adhering chips or flakes of wood or other vegetable fiber material together by the use of adhesive, the improvement comprising the step of heating said chips or flakes at a temperature of 100 °C to 200 °C at least for one hour in an atmosphere of 95% or more of incombustible gas while rotating said chips or flakes, whereby water and sap contained in said chips or flakes can completely be removed, prior to the adhering of said chips or flakes.
The present invention provides a method of making water-resistant particle boards by molding and adhering chips or flakes of wood or other vegetable fiber material together by the use of adhesive, the improvement comprising the step of heating said chips or flakes at a temperature of 100 °C to 200 °C at least for one hour in an atmosphere of 95% or more of incombustible gas while rotating said chips or flakes, whereby water and sap contained in said chips or flakes can completely be removed, prior to the adhering of said chips or flakes.
Description
7ti~
METHOD OF MAKING PARTICLE BOARDS
BACKGROUND OF THE INVENTION
Field of the Invention:
The present invention relates to a method of making water-resistant particle boards.Description Or the Prior Art:
Particle boards are made of wood or other vegetable fiber chips or flakes which are molded into a desired board configuration and adhered together by the use of any suitable 10 adhesive material. Such particle boards have substantially no anisotropy and none of knars, warps and the like which have been found in the conventional woody products. The particle boards can be molded to have practically sufficient strengths and desired dimensions from valueless wood materials including logs 15 Or small diameters. The particle boards can be produced with increased yields. For such reasons, particle boards are currently used as rurniture materials, building materials and others.
However, the wood chips or flakes molding particle boards 20 have water or moisture absorption as in the conventional woody products. When the particle boards are subjected to water or moisture, therefore, they may swell to change their dimensions such as thickness, width and length. Further, moisture or water penetrated into the chips or flakes does not easily evaporate.
76~
Thus, the swe]led particte boards can hardly be restored into their original configurations and will be reduced in strength. Such phenomena provide problems in manufacturing and working products from the particle boards. To overcome such disadvantages, various proposals have been made, for example, to improve adhesive for adhering wood chips or flakes together or to resinify wood chips or flakes.
However, no proposal has still been made to provide a particle board having a perfect water or moisture resistance.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a method of making particle boards by molding chips or flakes of wood or other vegetable fiber materials into a desired board configuration and adhering said chips or flakes together by adhesive, the improvemen~ comprising the step of heating said chips or flakes up to a temperature of 100C to 200C at least for one hour while rotating in an atmosphere of 95% or more incombustible gas to completely remove moisture and sap from said chips or flakes, prior to said step of adhering said chips or flakes together.
Since the dried chips or flakes include only fibers without any water and sap, adhesive can penetrate sufficiently into the tissue of the chips or flakes to adhere or join them together with an increased strength.
When a particle board is made of such adhered or joined chips or flakes, it cannot swell even if it is subjected to water or moisture. Thus, the method according to the present invention provides a particle board improved in 7~7~7 water- and moisture-resistances and strength.
BRIEF DESCRIPTION OF THE DRAWING
A single drawing is a graph showing test results Or particle boards constructed according to the method Or the present invention and samples constructed in accordance with the prior art.
DESCRIPTION OF PREFERRED EMBODIMENTS
In accordance with the present invention, an adhesive is first be applied to chips or flakes of any suitable wood or other 10 vegetable fiber material. The chips or flakes are then molded into a desired board configuration. The novel and essential ~eature Or the present invention resides in that the chips or flakes are treated to have the water-resistance prior to the step Or applying the adhesive to the chips or flakes. The process Or 15 the present invention will be described below in more details.
Wood materials used to produce chips or rlakes in the present invention is not limited to any particular kind Or wood material. For example, any wood material used to produce the conventional particle boards may similarly be utilized. Wood 20 materials containing more water and sap may similarly be used in the method Or the present invention since they can be dried to completely remove the water and sap.
The wood blanks are then cut or worked into chips or flakes in any suitable manner as in the conventional processes. The 25 shape and size of the chips or flakes are suitably determined depending on the quality and class of particle boards to be lZ7f~767 produced, as in the conventional processes. Chips or flakes may be obtained by breaking or cutting unseasoned woods Or high water content. If wood materials of about 6% of water content are used, the process of the present invention can be shortened in time.
The chips or flakes so produced are then thrown in a drying container or autoclave which may be conventional. Subsequently, air is extracted from the interior of the drying container or autoclave. An incombustible gas selected from the group of inert 10 gases such as argon, helium and krypton, carbon dioxide, ammonia, sulfur dioxide and nitrogen is then charged into the drying container or autoclave to provide an atmosphere of 95% or more of incombustible gas. The incombustible gas to be charged may be include a combination of two or more incombustible gases 15 mentioned above. In brief, it is desirable that the atmosphere in the interior of the drying container contains no or very small amount of oxygen. If an increased amount Or oxygen exists in the drying container, the chips or flakes would be burned or carbonized to decrease their strength when they are heated up to 20 a raised temperature as will be described.
The temperature Or the drying container or autoclave is subsequently increased within the range of 100 C to 200 C.
This temperature may suitably be selected depending on the property of the chips or flakes placed within the drying 25 container. In most cases, it is desirable to heat the chips or flakes to a temperature of 200 C since they can be dried into the most desirable state in the concept of the present invention, 1.;Z7f~7~7 under whicll state water and sap are completely removed rrom the chips or flakes. Ir the chips or flakes are heated to a temperature Or 100 C or less, water and sap are insurficiently removed. On the contrary, ir the chips or rlakes are heated up to a temperature Or more than 200 C, they would be burned or carbonized to be become unsuitable for particle board materials.
Preferably, such atmosphere and temperature conditions are maintained at least for one hour at a normal pressure. At the same time, the chips or flakes are rotated, for example, by 10 rolling the drying container or autoclave. This improves the removal of the water and sap from the chips or flakes. Time for which the chips or flakes are heated at a selected temperature is determined depending on the property, size and other ractors of the chips or flakes. In any event, the time should be at least 15 one hour for the intended purpose. Normally, the chips or flakes are heated at a selected temperature for four to eight hours.
After the chips or flakes have been heated at a selected temperature for a selected time, water and sap are completely removed from the chips or flakes with only fibers remaining in 20 their tissues. The weight Or the chips or flakes so treated is smaller than those Or chips or flakes used to produce the conventional particle boards. The chips or flakes so treated are not burned or carbonized since they are heated in the above atmosphere Or incombustible gas. In addition, the chips or 25 flakes are uniformly treated since they are rotated during heating.
A synthetic resin adhesive, for example, urea resin adhesive J '~ 76767 is applied to the dried chips or flakes in the conventional manner. The quality and amount of the synthetic resin adhesive are similar to those of the synthetic resin adhesive used in the conventional process. In other words, they are determined within 5 an appropriate range depending on various factors required in the finished products, such as quality, class, workability, manufacturing cost and others. In this step, -the adhesive can penetrate sufficiently into the interior of each of the chips or flakes since it includes only fibers without any water and sap.
OTherearter, the chips or flakes are molded into a desired board configuration and also adhered together by the use Or a conventional molding apparatus. The molded board is then subjected to the conventional treating steps such as hot-pressing, size finishing, surface abrading and others to provide 15a finished product.
The particle board so obtained will not swell if subjected to water or moisture since it is made of the water-resistant chips or flakes adhered together. The particle board has its increased strength and its decreased weight since the chips or 20flakes therein are more firmly adhered together. The workability of the particle board is similar to that of the conventional particle board. The particle board can resist rot and insect since the water and sap are completely removed therefrom.
An example will now be described below.
Chips were first placed within an autoclave. Air in the autoclave was then replaced by an atmosphere containing 95% or more Or inert gas. The chips in the autoclave were heated at a 1~7f~767 ternperature Or lO0 ^C to 200 C f~or a time between one hour and two hours. Thereafter, the water content in the chips was controlled up to 4%.
A conventional adhesive and water repellent material were applied to the dried chips. The chips were then formed into a desired board configuration in the conventional manner without any particular and additional instrument and tool.
The formed boards were hot-pressed under a pressure of 15 to kg/cm2 at a temperature Or 170 to 180 C for five minutes.
10 The resulting particle boards fulrilled the requirements Or JIS
5908 Quality Standard under which a particle board should have a density Or 0.72-0.75, a water content Or 5-8%, a flexural strength Or 180 kg/cm2 or more, a peeling strength Or 3 kg ~ a force ror holding wood screws Or 50 kg/cm2 or more, an amount Or 15 discharged formaldehyde equal to or less than 5 mg/l and so on.
Water-resistant particle boards produced according to the method of the present invention and particle board samples produced according to the prior art methods were subjected to comparison tests for expansivity on the basis of JIS 5908 20 standards. The results are shown in the accompanying drawing in which letters A and B indicate the prior art particle boards while a letter C indicates particle boards Or the present invention. It is apparent from this graph that the expansivity Or the water-resistant particle boards according to the present 25 invention are smaller than those of the prior art boards.
METHOD OF MAKING PARTICLE BOARDS
BACKGROUND OF THE INVENTION
Field of the Invention:
The present invention relates to a method of making water-resistant particle boards.Description Or the Prior Art:
Particle boards are made of wood or other vegetable fiber chips or flakes which are molded into a desired board configuration and adhered together by the use of any suitable 10 adhesive material. Such particle boards have substantially no anisotropy and none of knars, warps and the like which have been found in the conventional woody products. The particle boards can be molded to have practically sufficient strengths and desired dimensions from valueless wood materials including logs 15 Or small diameters. The particle boards can be produced with increased yields. For such reasons, particle boards are currently used as rurniture materials, building materials and others.
However, the wood chips or flakes molding particle boards 20 have water or moisture absorption as in the conventional woody products. When the particle boards are subjected to water or moisture, therefore, they may swell to change their dimensions such as thickness, width and length. Further, moisture or water penetrated into the chips or flakes does not easily evaporate.
76~
Thus, the swe]led particte boards can hardly be restored into their original configurations and will be reduced in strength. Such phenomena provide problems in manufacturing and working products from the particle boards. To overcome such disadvantages, various proposals have been made, for example, to improve adhesive for adhering wood chips or flakes together or to resinify wood chips or flakes.
However, no proposal has still been made to provide a particle board having a perfect water or moisture resistance.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a method of making particle boards by molding chips or flakes of wood or other vegetable fiber materials into a desired board configuration and adhering said chips or flakes together by adhesive, the improvemen~ comprising the step of heating said chips or flakes up to a temperature of 100C to 200C at least for one hour while rotating in an atmosphere of 95% or more incombustible gas to completely remove moisture and sap from said chips or flakes, prior to said step of adhering said chips or flakes together.
Since the dried chips or flakes include only fibers without any water and sap, adhesive can penetrate sufficiently into the tissue of the chips or flakes to adhere or join them together with an increased strength.
When a particle board is made of such adhered or joined chips or flakes, it cannot swell even if it is subjected to water or moisture. Thus, the method according to the present invention provides a particle board improved in 7~7~7 water- and moisture-resistances and strength.
BRIEF DESCRIPTION OF THE DRAWING
A single drawing is a graph showing test results Or particle boards constructed according to the method Or the present invention and samples constructed in accordance with the prior art.
DESCRIPTION OF PREFERRED EMBODIMENTS
In accordance with the present invention, an adhesive is first be applied to chips or flakes of any suitable wood or other 10 vegetable fiber material. The chips or flakes are then molded into a desired board configuration. The novel and essential ~eature Or the present invention resides in that the chips or flakes are treated to have the water-resistance prior to the step Or applying the adhesive to the chips or flakes. The process Or 15 the present invention will be described below in more details.
Wood materials used to produce chips or rlakes in the present invention is not limited to any particular kind Or wood material. For example, any wood material used to produce the conventional particle boards may similarly be utilized. Wood 20 materials containing more water and sap may similarly be used in the method Or the present invention since they can be dried to completely remove the water and sap.
The wood blanks are then cut or worked into chips or flakes in any suitable manner as in the conventional processes. The 25 shape and size of the chips or flakes are suitably determined depending on the quality and class of particle boards to be lZ7f~767 produced, as in the conventional processes. Chips or flakes may be obtained by breaking or cutting unseasoned woods Or high water content. If wood materials of about 6% of water content are used, the process of the present invention can be shortened in time.
The chips or flakes so produced are then thrown in a drying container or autoclave which may be conventional. Subsequently, air is extracted from the interior of the drying container or autoclave. An incombustible gas selected from the group of inert 10 gases such as argon, helium and krypton, carbon dioxide, ammonia, sulfur dioxide and nitrogen is then charged into the drying container or autoclave to provide an atmosphere of 95% or more of incombustible gas. The incombustible gas to be charged may be include a combination of two or more incombustible gases 15 mentioned above. In brief, it is desirable that the atmosphere in the interior of the drying container contains no or very small amount of oxygen. If an increased amount Or oxygen exists in the drying container, the chips or flakes would be burned or carbonized to decrease their strength when they are heated up to 20 a raised temperature as will be described.
The temperature Or the drying container or autoclave is subsequently increased within the range of 100 C to 200 C.
This temperature may suitably be selected depending on the property of the chips or flakes placed within the drying 25 container. In most cases, it is desirable to heat the chips or flakes to a temperature of 200 C since they can be dried into the most desirable state in the concept of the present invention, 1.;Z7f~7~7 under whicll state water and sap are completely removed rrom the chips or flakes. Ir the chips or flakes are heated to a temperature Or 100 C or less, water and sap are insurficiently removed. On the contrary, ir the chips or rlakes are heated up to a temperature Or more than 200 C, they would be burned or carbonized to be become unsuitable for particle board materials.
Preferably, such atmosphere and temperature conditions are maintained at least for one hour at a normal pressure. At the same time, the chips or flakes are rotated, for example, by 10 rolling the drying container or autoclave. This improves the removal of the water and sap from the chips or flakes. Time for which the chips or flakes are heated at a selected temperature is determined depending on the property, size and other ractors of the chips or flakes. In any event, the time should be at least 15 one hour for the intended purpose. Normally, the chips or flakes are heated at a selected temperature for four to eight hours.
After the chips or flakes have been heated at a selected temperature for a selected time, water and sap are completely removed from the chips or flakes with only fibers remaining in 20 their tissues. The weight Or the chips or flakes so treated is smaller than those Or chips or flakes used to produce the conventional particle boards. The chips or flakes so treated are not burned or carbonized since they are heated in the above atmosphere Or incombustible gas. In addition, the chips or 25 flakes are uniformly treated since they are rotated during heating.
A synthetic resin adhesive, for example, urea resin adhesive J '~ 76767 is applied to the dried chips or flakes in the conventional manner. The quality and amount of the synthetic resin adhesive are similar to those of the synthetic resin adhesive used in the conventional process. In other words, they are determined within 5 an appropriate range depending on various factors required in the finished products, such as quality, class, workability, manufacturing cost and others. In this step, -the adhesive can penetrate sufficiently into the interior of each of the chips or flakes since it includes only fibers without any water and sap.
OTherearter, the chips or flakes are molded into a desired board configuration and also adhered together by the use Or a conventional molding apparatus. The molded board is then subjected to the conventional treating steps such as hot-pressing, size finishing, surface abrading and others to provide 15a finished product.
The particle board so obtained will not swell if subjected to water or moisture since it is made of the water-resistant chips or flakes adhered together. The particle board has its increased strength and its decreased weight since the chips or 20flakes therein are more firmly adhered together. The workability of the particle board is similar to that of the conventional particle board. The particle board can resist rot and insect since the water and sap are completely removed therefrom.
An example will now be described below.
Chips were first placed within an autoclave. Air in the autoclave was then replaced by an atmosphere containing 95% or more Or inert gas. The chips in the autoclave were heated at a 1~7f~767 ternperature Or lO0 ^C to 200 C f~or a time between one hour and two hours. Thereafter, the water content in the chips was controlled up to 4%.
A conventional adhesive and water repellent material were applied to the dried chips. The chips were then formed into a desired board configuration in the conventional manner without any particular and additional instrument and tool.
The formed boards were hot-pressed under a pressure of 15 to kg/cm2 at a temperature Or 170 to 180 C for five minutes.
10 The resulting particle boards fulrilled the requirements Or JIS
5908 Quality Standard under which a particle board should have a density Or 0.72-0.75, a water content Or 5-8%, a flexural strength Or 180 kg/cm2 or more, a peeling strength Or 3 kg ~ a force ror holding wood screws Or 50 kg/cm2 or more, an amount Or 15 discharged formaldehyde equal to or less than 5 mg/l and so on.
Water-resistant particle boards produced according to the method of the present invention and particle board samples produced according to the prior art methods were subjected to comparison tests for expansivity on the basis of JIS 5908 20 standards. The results are shown in the accompanying drawing in which letters A and B indicate the prior art particle boards while a letter C indicates particle boards Or the present invention. It is apparent from this graph that the expansivity Or the water-resistant particle boards according to the present 25 invention are smaller than those of the prior art boards.
Claims (4)
1. A method of making water-resistant particle boards by molding and adhering chips or flakes of wood or other vegetable fiber material together by the use of adhesive, the improvement comprising the step of heating said chips or flakes at a temperature of 100 °C to 200 °C at least for one hour in an atmosphere of 95% or more of incombustible gas while rotating said chips or flakes, whereby water and sap contained in said chips or flakes can completely be removed, prior to the adhering said chips or flakes.
2. A method as defined in claim 1 wherein said chips or flakes are heated in a rotary autoclave.
3. A method as defined in claim 1 further comprising a step of hot-pressing the resulting particle boards.
4. A method as defined in claim 1 wherein said incombustible gas is selected from the group consisting of inert gases including argon, helium, krypton and others, carbon dioxide, ammonia, sulfur dioxide, nitrogen and a combination of two or more of said gases.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60269946A JPS62130801A (en) | 1985-12-01 | 1985-12-01 | Manufacture of particle board |
| JP269946/1985 | 1985-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1276767C true CA1276767C (en) | 1990-11-27 |
Family
ID=17479406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000512532A Expired - Fee Related CA1276767C (en) | 1985-12-01 | 1986-06-26 | Method of making particle boards |
Country Status (14)
| Country | Link |
|---|---|
| JP (1) | JPS62130801A (en) |
| KR (1) | KR930007667B1 (en) |
| AU (1) | AU589713B2 (en) |
| BE (1) | BE905829A (en) |
| CA (1) | CA1276767C (en) |
| DE (1) | DE3616985A1 (en) |
| DK (1) | DK164732C (en) |
| FI (1) | FI862363A (en) |
| FR (1) | FR2590833A1 (en) |
| GB (1) | GB2185748B (en) |
| IT (1) | IT1195088B (en) |
| NL (1) | NL193793C (en) |
| NO (1) | NO169642C (en) |
| SE (1) | SE465413B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2603521B1 (en) * | 1986-09-04 | 1989-01-13 | Du Pin Cellulose | COMPOSITE MATERIALS BASED ON A POLYESTER RESIN MATRIX REINFORCED BY DISCONTINUOUS CELLULOSIC FIBERS AND METHOD OF MANUFACTURE |
| JPH06270110A (en) * | 1993-03-18 | 1994-09-27 | Hikari Sangyo:Yugen | Manufacture of resin molded piece using wood flour |
| FI104569B (en) * | 1994-11-11 | 2000-02-29 | Valtion Teknillinen | A process for preparing compositions comprising cellulose-based fibers |
| DE19822485A1 (en) * | 1998-05-19 | 1999-11-25 | Kvaerner Panel Sys Gmbh | Fabrication method for fiber/chip board panels |
| FR2870154B1 (en) * | 2004-05-13 | 2012-12-14 | Bio 3D Applic | BIO-THERMAL METHOD AND SYSTEM FOR STABILIZING LUMBER |
| US7963048B2 (en) * | 2005-05-23 | 2011-06-21 | Pollard Levi A | Dual path kiln |
| US8201501B2 (en) | 2009-09-04 | 2012-06-19 | Tinsley Douglas M | Dual path kiln improvement |
| US10619921B2 (en) | 2018-01-29 | 2020-04-14 | Norev Dpk, Llc | Dual path kiln and method of operating a dual path kiln to continuously dry lumber |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB155753A (en) * | 1916-12-15 | 1921-11-24 | Ernest Vanlaethem | Improved means for drying wood, and other material |
| DE722782C (en) * | 1936-10-27 | 1942-07-21 | Ver Korkindustrie Ag | Process for the production of porous, thermal and acoustic insulating material in small pieces |
| FR2520292B1 (en) * | 1982-01-26 | 1986-09-12 | Isorel | COMPOSITE PANELS BASED ON LIGNOCELLULOSIC FIBERS AND POLYOLEFIN FIBERS, AND THEIR MANUFACTURING METHOD |
| GR69554B (en) * | 1982-05-12 | 1982-06-30 | Staurakellis Panagiotis |
-
1985
- 1985-12-01 JP JP60269946A patent/JPS62130801A/en active Pending
-
1986
- 1986-05-20 KR KR1019860003913A patent/KR930007667B1/en not_active IP Right Cessation
- 1986-05-21 DE DE19863616985 patent/DE3616985A1/en not_active Ceased
- 1986-05-26 NO NO862076A patent/NO169642C/en not_active IP Right Cessation
- 1986-06-03 FI FI862363A patent/FI862363A/en not_active IP Right Cessation
- 1986-06-03 SE SE8602505A patent/SE465413B/en not_active IP Right Cessation
- 1986-06-03 DK DK260586A patent/DK164732C/en not_active IP Right Cessation
- 1986-06-11 GB GB8614245A patent/GB2185748B/en not_active Expired
- 1986-06-26 CA CA000512532A patent/CA1276767C/en not_active Expired - Fee Related
- 1986-07-08 IT IT48244/86A patent/IT1195088B/en active
- 1986-11-27 FR FR8616544A patent/FR2590833A1/en active Pending
- 1986-11-28 NL NL8603045A patent/NL193793C/en not_active IP Right Cessation
- 1986-11-28 AU AU65806/86A patent/AU589713B2/en not_active Ceased
- 1986-11-28 BE BE2/61095A patent/BE905829A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DK164732C (en) | 1992-12-28 |
| KR930007667B1 (en) | 1993-08-18 |
| FI862363A0 (en) | 1986-06-03 |
| SE8602505L (en) | 1987-06-02 |
| AU589713B2 (en) | 1989-10-19 |
| BE905829A (en) | 1987-03-16 |
| NL8603045A (en) | 1987-07-01 |
| DK260586A (en) | 1987-06-02 |
| FI862363A (en) | 1987-06-02 |
| GB2185748B (en) | 1989-12-06 |
| AU6580686A (en) | 1987-06-04 |
| DK164732B (en) | 1992-08-10 |
| DK260586D0 (en) | 1986-06-03 |
| IT1195088B (en) | 1988-10-12 |
| NL193793C (en) | 2000-11-06 |
| SE8602505D0 (en) | 1986-06-03 |
| FR2590833A1 (en) | 1987-06-05 |
| NO862076L (en) | 1987-06-02 |
| NL193793B (en) | 2000-07-03 |
| GB8614245D0 (en) | 1986-07-16 |
| NO169642C (en) | 1992-07-22 |
| NO169642B (en) | 1992-04-13 |
| JPS62130801A (en) | 1987-06-13 |
| IT8648244A0 (en) | 1986-07-08 |
| DE3616985A1 (en) | 1987-06-04 |
| KR870005765A (en) | 1987-07-07 |
| SE465413B (en) | 1991-09-09 |
| GB2185748A (en) | 1987-07-29 |
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