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BRPI1007081A2 - composição de resina termofixavel reativa, produto curado, material hibrido organico/inorganico revestimento ou pelicula fina e processo para preparar um produto termofixo - Google Patents

composição de resina termofixavel reativa, produto curado, material hibrido organico/inorganico revestimento ou pelicula fina e processo para preparar um produto termofixo

Info

Publication number
BRPI1007081A2
BRPI1007081A2 BRPI1007081A BRPI1007081A BRPI1007081A2 BR PI1007081 A2 BRPI1007081 A2 BR PI1007081A2 BR PI1007081 A BRPI1007081 A BR PI1007081A BR PI1007081 A BRPI1007081 A BR PI1007081A BR PI1007081 A2 BRPI1007081 A2 BR PI1007081A2
Authority
BR
Brazil
Prior art keywords
product
thermosetting
preparing
organic
thin film
Prior art date
Application number
BRPI1007081A
Other languages
English (en)
Inventor
Hynek Benes
Jean-Francois Gerad
Ludovic Valette
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of BRPI1007081A2 publication Critical patent/BRPI1007081A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI1007081A 2009-04-30 2010-04-29 composição de resina termofixavel reativa, produto curado, material hibrido organico/inorganico revestimento ou pelicula fina e processo para preparar um produto termofixo BRPI1007081A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17425109P 2009-04-30 2009-04-30
PCT/US2010/032970 WO2010127118A1 (en) 2009-04-30 2010-04-29 Thermosettable resin compositions

Publications (1)

Publication Number Publication Date
BRPI1007081A2 true BRPI1007081A2 (pt) 2016-02-10

Family

ID=42313964

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1007081A BRPI1007081A2 (pt) 2009-04-30 2010-04-29 composição de resina termofixavel reativa, produto curado, material hibrido organico/inorganico revestimento ou pelicula fina e processo para preparar um produto termofixo

Country Status (7)

Country Link
US (1) US20120283356A9 (pt)
EP (1) EP2424917A1 (pt)
JP (1) JP2012525486A (pt)
KR (1) KR20120016116A (pt)
CN (1) CN102414242B (pt)
BR (1) BRPI1007081A2 (pt)
WO (1) WO2010127118A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102439070B (zh) * 2009-04-30 2013-12-11 陶氏环球技术有限责任公司 反应性无机簇
TW201307419A (zh) * 2011-04-15 2013-02-16 Dow Global Technologies Llc 熱固性交聯網路
EP2920227B1 (en) * 2012-11-13 2017-02-08 Dow Global Technologies LLC Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes
TWI734686B (zh) * 2015-05-19 2021-08-01 瑞士商亨斯邁先進材料授權（瑞士）有限公司 熱固性環氧樹脂之固化劑及製備電機工程用絕緣系統的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB882062A (en) * 1956-10-12 1961-11-08 Union Carbide Corp Organopolysiloxanes and process for producing same
US4604443A (en) * 1985-04-30 1986-08-05 Ppg Industries, Inc. Partial hydrolyzates containing hydrolyzable moieties from organosilane compounds
US4988778A (en) * 1990-01-18 1991-01-29 Ppg Industries, Inc. Polyamine-functional silane resin
US5135993A (en) * 1990-09-11 1992-08-04 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
JPH06240000A (ja) * 1993-02-17 1994-08-30 Shin Etsu Chem Co Ltd 分岐状オルガノポリシロキサンの製造方法
JP3941262B2 (ja) * 1998-10-06 2007-07-04 株式会社日立製作所 熱硬化性樹脂材料およびその製造方法
WO2005010115A1 (en) * 2003-07-16 2005-02-03 Dow Corning Corporation Coating compositions comprising epoxy resins and aminofunctional silicone resins

Also Published As

Publication number Publication date
US20120283356A9 (en) 2012-11-08
JP2012525486A (ja) 2012-10-22
WO2010127118A1 (en) 2010-11-04
CN102414242B (zh) 2014-12-17
KR20120016116A (ko) 2012-02-22
US20120136092A1 (en) 2012-05-31
EP2424917A1 (en) 2012-03-07
CN102414242A (zh) 2012-04-11

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]