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BRPI0820937A2 - Peças em material compósito eletroestrutural - Google Patents

Peças em material compósito eletroestrutural

Info

Publication number
BRPI0820937A2
BRPI0820937A2 BRPI0820937-5A BRPI0820937A BRPI0820937A2 BR PI0820937 A2 BRPI0820937 A2 BR PI0820937A2 BR PI0820937 A BRPI0820937 A BR PI0820937A BR PI0820937 A2 BRPI0820937 A2 BR PI0820937A2
Authority
BR
Brazil
Prior art keywords
electrostructural
composite material
material parts
parts
composite
Prior art date
Application number
BRPI0820937-5A
Other languages
English (en)
Inventor
Jesus Aspas-Puertolas
Original Assignee
Eads Europ Aeronautic Defence
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eads Europ Aeronautic Defence filed Critical Eads Europ Aeronautic Defence
Publication of BRPI0820937A2 publication Critical patent/BRPI0820937A2/pt

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681Mesh conductors, e.g. as a ground plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Insulated Conductors (AREA)
  • Installation Of Indoor Wiring (AREA)
BRPI0820937-5A 2007-12-10 2008-12-09 Peças em material compósito eletroestrutural BRPI0820937A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0759671A FR2924894B1 (fr) 2007-12-10 2007-12-10 Pieces en materiau composite electro-structural.
PCT/EP2008/067090 WO2009074564A1 (fr) 2007-12-10 2008-12-09 Pièces en matériau composite électro-structural

Publications (1)

Publication Number Publication Date
BRPI0820937A2 true BRPI0820937A2 (pt) 2015-06-23

Family

ID=39535362

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0820937-5A BRPI0820937A2 (pt) 2007-12-10 2008-12-09 Peças em material compósito eletroestrutural

Country Status (8)

Country Link
US (1) US8581103B2 (pt)
EP (1) EP2227927B1 (pt)
CN (1) CN101897242B (pt)
BR (1) BRPI0820937A2 (pt)
ES (1) ES2605743T3 (pt)
FR (1) FR2924894B1 (pt)
RU (1) RU2498927C2 (pt)
WO (1) WO2009074564A1 (pt)

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* Cited by examiner, † Cited by third party
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FR2953092B1 (fr) * 2009-11-25 2011-12-16 European Aeronautic Defence & Space Co Eads France Raidisseur electro-structural en materiau composite
FR2975864A1 (fr) 2011-05-27 2012-11-30 Eads Europ Aeronautic Defence Semi-produit sous la forme d'une bande conductrice integrable dans un materiau composite et procede de fabrication d'une telle bande
GB2497807B (en) * 2011-12-22 2014-09-10 Rolls Royce Plc Electrical harness
US9478896B2 (en) 2011-12-22 2016-10-25 Rolls-Royce Plc Electrical connectors
GB2497809B (en) 2011-12-22 2014-03-12 Rolls Royce Plc Method of servicing a gas turbine engine
GB2498006B (en) 2011-12-22 2014-07-09 Rolls Royce Plc Gas turbine engine systems
EP2706164A1 (en) * 2012-09-10 2014-03-12 Mir Arastirma ve Gelistirme A.S. Modular hybrid wall assembly
GB201301431D0 (en) * 2013-01-28 2013-03-13 Rolls Royce Plc Component having a heat protection system
GB201306674D0 (en) * 2013-04-12 2013-05-29 Rolls Royce Plc Rigid Raft for a Gas Turbine Engine
US9406462B2 (en) * 2013-06-28 2016-08-02 The Boeing Company Truss interconnect
US9561760B2 (en) * 2013-10-11 2017-02-07 The Boeing Company Modular equipment center distributed equipment packaging truss
US9123998B1 (en) * 2014-03-04 2015-09-01 The Boeing Company Lightning protected radome system
US10167550B2 (en) * 2014-06-03 2019-01-01 Aurora Flight Sciences Corporation Multi-functional composite structures
US10368401B2 (en) * 2014-06-03 2019-07-30 Aurora Flight Sciences Corporation Multi-functional composite structures
US9554476B2 (en) * 2014-08-14 2017-01-24 Continental Automotive Systems, Inc. Compliant staple pin for connecting multiple printed circuit boards
US9845142B2 (en) * 2014-08-15 2017-12-19 The Boeing Company Conductive thermoplastic ground plane for use in an aircraft
US10285219B2 (en) 2014-09-25 2019-05-07 Aurora Flight Sciences Corporation Electrical curing of composite structures
JP6578646B2 (ja) 2014-10-24 2019-09-25 セイコーエプソン株式会社 ロボット
JP2016083716A (ja) * 2014-10-24 2016-05-19 セイコーエプソン株式会社 ロボット
FR3039923B1 (fr) 2015-08-04 2020-10-09 Abmi Sud Est Procede de fabrication d'un materiau composite
US10329030B2 (en) * 2016-03-04 2019-06-25 The Boeing Company Conductive radius filler system and method
CN106275373A (zh) * 2016-08-30 2017-01-04 成都创客空间科技有限公司 一种基于3d打印技术的组合式飞行器机架
DE102018208011A1 (de) * 2018-05-22 2019-11-28 Airbus Operations Gmbh Faserverbundbauteil
CA3083463A1 (en) * 2019-06-14 2020-12-14 Hutchinson Aeronautique & Industrie Ltee Composite panel comprising an integrated electrical circuit and manufacturing method thereof
EP3915884B1 (fr) * 2020-05-28 2023-02-15 Thales Distribution de puissance électrique intégrée à un panneau structural de satellite
US20220009613A1 (en) * 2020-07-10 2022-01-13 Aerion Intellectual Property Management Corporation Aircraft body section with multilayer electrically conductive structure and methods of fabrication
GB2601798B (en) * 2020-12-10 2024-05-22 Safran Seats Gb Ltd Layered Arrangement For Liquid Transfer Printing
EP4138525A1 (de) * 2021-08-17 2023-02-22 Airbus S.A.S. Verfahren zur herstellung eines paneels mit integrierter elektronik

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US4972197A (en) * 1987-09-03 1990-11-20 Ford Aerospace Corporation Integral heater for composite structure
WO1991011891A1 (en) * 1990-01-24 1991-08-08 Hastings Otis Electrically conductive laminate for temperature control of surfaces
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ATE155312T1 (de) * 1992-08-13 1997-07-15 Amp Akzo Linlam Vof Herstellungsverfahren einer vielschicht- leiterplatte
US5648137A (en) * 1994-08-08 1997-07-15 Blackmore; Richard Advanced cured resin composite parts and method of forming such parts
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JP4276881B2 (ja) * 2003-04-30 2009-06-10 日本圧着端子製造株式会社 多層プリント配線板の接続構造
SE525146C2 (sv) * 2003-05-05 2004-12-07 Pilgrimsfalken Ab Golvskiva med en inbakad, elektriskt påverkbar folie
WO2005123376A1 (en) * 2004-06-18 2005-12-29 Textronics, Inc. Perforated functional textile structures
RU2288842C2 (ru) * 2004-09-06 2006-12-10 Александр Викторович Евдокимов Способ изготовления объемной конструкции из композитных материалов и объемная конструкция, получаемая этим способом
US20060138279A1 (en) * 2004-12-23 2006-06-29 Nathan Pisarski Aircraft floor panel
UA26643U (en) * 2007-07-19 2007-09-25 Anatolii Mykolaiovych Tonkovyd Electric heater "termo-r11"

Also Published As

Publication number Publication date
US8581103B2 (en) 2013-11-12
CN101897242A (zh) 2010-11-24
CN101897242B (zh) 2012-05-30
RU2498927C2 (ru) 2013-11-20
ES2605743T3 (es) 2017-03-16
US20110011627A1 (en) 2011-01-20
EP2227927A1 (fr) 2010-09-15
FR2924894A1 (fr) 2009-06-12
FR2924894B1 (fr) 2010-12-10
WO2009074564A1 (fr) 2009-06-18
EP2227927B1 (fr) 2016-08-31
RU2010128574A (ru) 2012-01-20

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: MANTIDO O INDEFERIMENTO UMA VEZ QUE NAO FOI APRESENTADO RECURSO DENTRO DO PRAZO LEGAL