BRPI0519233A2 - precursor curÁvel de uma composiÇço de epàxi retardadora de chama com densidade baixa e essencialmente livre de halogÊnio, composiÇço de epàxi retardadora de chama com densidade baixa e essencialmente livre de halogÊnio, e, uso de um precursor - Google Patents
precursor curÁvel de uma composiÇço de epàxi retardadora de chama com densidade baixa e essencialmente livre de halogÊnio, composiÇço de epàxi retardadora de chama com densidade baixa e essencialmente livre de halogÊnio, e, uso de um precursorInfo
- Publication number
- BRPI0519233A2 BRPI0519233A2 BRPI0519233-1A BRPI0519233A BRPI0519233A2 BR PI0519233 A2 BRPI0519233 A2 BR PI0519233A2 BR PI0519233 A BRPI0519233 A BR PI0519233A BR PI0519233 A2 BRPI0519233 A2 BR PI0519233A2
- Authority
- BR
- Brazil
- Prior art keywords
- density
- precursor
- epoxy composition
- flame retardant
- free low
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 5
- 239000003063 flame retardant Substances 0.000 title abstract 4
- 239000002243 precursor Substances 0.000 title abstract 4
- 239000004593 Epoxy Substances 0.000 title abstract 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title 2
- -1 epoxide compound Chemical class 0.000 abstract 2
- 150000002118 epoxides Chemical group 0.000 abstract 2
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000012766 organic filler Substances 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/02—Inorganic materials
- C09K21/04—Inorganic materials containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/02—Inorganic materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PRECURSOR CURÁVEL DE UMA COMPOSIÇçO DE EPàXI RETARDADORA DE CHAMA COM DENSIDADE BAIXA E ESSENCIALMENTE LIVRE DE HALOGÊNIO, COMPOSIÇçO DE EPàXI RETARDADORA DE CHAMA COM DENSIDADE BAIXA E ESSENCIALMENTE LIVRE DE HALOGÊNIO, E, USO DE UM PRECURSOR. A presente invenção diz respeito a um precursor curável de uma composição de epóxi retardadora de chama com densidade baixa e essencialmente livre de halogênio que compreende (i) de 10 a 70 porcento em peso de pelo menos um composto de epóxido orgânico com uma funcionalidade de epóxido de pelo menos um, (ii) de 1 a 55 porcento em peso de pelo menos um endurecedor, (iii) de 5 a 50 porcento em peso de um sistema retardador de chama essencialmente livre de halogênio que inclui uma mistura de: (1) pelo menos um composto selecionado do grupo compreendendo hidróxidos de metal alcalino terroso e hidróxidos do grupo de alumínio, e (2) pelo menos um material contendo fósforo, (iv) de 10 a 60 porcento em peso de um sistema de cargas capaz de reduzir a densidade do precursor que inclui uma mistura de (1) pelo menos uma carga inorgânica de densidade baixa tendo uma densidade entre 0,1 a 0,5 g cm^ -3^, (2) pelo menos uma carga orgânica de densidade baixa tendo uma densidade entre 0,01 a 0,30 g/cm^ -3^ e sendo compressível.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04030580A EP1674518A1 (en) | 2004-12-23 | 2004-12-23 | Fire-retardant low-density epoxy composition |
PCT/US2005/046940 WO2006071820A1 (en) | 2004-12-23 | 2005-12-23 | Fire-retardant low-density epoxy composition |
Publications (2)
Publication Number | Publication Date |
---|---|
BRPI0519233A2 true BRPI0519233A2 (pt) | 2009-01-06 |
BRPI0519233B1 BRPI0519233B1 (pt) | 2016-06-07 |
Family
ID=34927947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0519233A BRPI0519233B1 (pt) | 2004-12-23 | 2005-12-23 | precursor curável de uma composição de epóxi retardadora de chama com densidade baixa e essencialmente livre de halogênio, composição de epóxi retardadora de chama com densidade baixa e essencialmente livre de halogênio, e, uso de um precursor |
Country Status (11)
Country | Link |
---|---|
US (1) | US8188165B2 (pt) |
EP (2) | EP1674518A1 (pt) |
JP (1) | JP5384830B2 (pt) |
KR (1) | KR20070090032A (pt) |
CN (1) | CN101124275B (pt) |
AT (1) | ATE390459T1 (pt) |
BR (1) | BRPI0519233B1 (pt) |
CA (1) | CA2592305C (pt) |
DE (1) | DE602005005722T2 (pt) |
ES (1) | ES2302256T3 (pt) |
WO (1) | WO2006071820A1 (pt) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101308263B1 (ko) | 2006-11-15 | 2013-09-13 | 히타치가세이가부시끼가이샤 | 열경화성 광반사용 수지 조성물 및 그 제조방법, 및 그 수지 조성물을 이용한 광반도체 소자 탑재용 기판 및 광반도체 장치 |
GB0905362D0 (en) * | 2009-03-30 | 2009-05-13 | 3M Innovative Properties Co | Fire resistant epoxy resin based core filler material developing low exothermic heat |
CN102181128B (zh) * | 2011-03-30 | 2012-10-24 | 吴江固德电材系统股份有限公司 | 环氧树脂预混料及其配制工艺 |
US9169426B2 (en) * | 2012-09-25 | 2015-10-27 | United States Gypsum Company | Joint compound, wall assembly, and methods and products related thereto |
EP2818490B1 (en) | 2013-06-28 | 2019-04-10 | 3M Innovative Properties Company | Use of an epoxy resin-based composition as a filler honeycomb cells |
RU2540648C1 (ru) * | 2013-07-30 | 2015-02-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Волгоградский государственный технический университет" (ВолгГТУ) | Огнестойкая композиция |
WO2015089179A1 (en) * | 2013-12-10 | 2015-06-18 | General Cable Technologies Corporation | Thermally conductive compositions and cables thereof |
TWI504734B (zh) * | 2013-12-31 | 2015-10-21 | Ind Tech Res Inst | 防火耐燃複合材料、板材與塗層 |
KR20160018895A (ko) * | 2014-08-07 | 2016-02-18 | (주)이레화학상사 | 자동차용 접착제 조성물 및 그 제조방법 |
JP2017530214A (ja) | 2014-08-12 | 2017-10-12 | スリーエム イノベイティブ プロパティズ カンパニー | フィルム粘着剤 |
WO2016044013A1 (en) * | 2014-09-16 | 2016-03-24 | Henkel IP & Holding GmbH | Use of hollow polymeric microspheres in composite materials requiring flame resistance |
TWI591109B (zh) * | 2015-06-11 | 2017-07-11 | Mitsubishi Rayon Co | Epoxy resin composition, molded article, prepreg, fiber reinforced Composites and structures |
EP3239207B1 (en) | 2016-04-27 | 2021-07-28 | 3M Innovative Properties Company | Curable epoxy compositions |
KR101708252B1 (ko) * | 2016-05-13 | 2017-02-21 | 한국신발피혁연구원 | 난연성이 우수한 난연 보드 |
EP3489271B1 (en) | 2017-11-22 | 2020-05-27 | 3M Innovative Properties Company | Thermal cycling resistant low density composition |
EP3666812B1 (en) * | 2018-12-13 | 2021-10-13 | 3M Innovative Properties Company | Room temperature stable one-part void filler |
KR20210142588A (ko) * | 2018-12-18 | 2021-11-25 | 사이텍 인더스트리스 인코포레이티드 | 난연성 에폭시 조성물 및 이의 사용 방법 |
US20220396719A1 (en) | 2019-11-13 | 2022-12-15 | Zephyros, Inc. | Potting Paste for Honeycomb Reinforcement |
JP7388235B2 (ja) * | 2020-02-20 | 2023-11-29 | 味の素株式会社 | 樹脂組成物 |
EP3875556A1 (en) * | 2020-03-03 | 2021-09-08 | Jotun A/S | Coating |
RU2768641C1 (ru) * | 2021-03-12 | 2022-03-24 | Федеральное государственное бюджетное учреждение науки "Федеральный исследовательский центр Южный научный центр Российской академии наук" | Способ получения высокопрочных, термо- и огнестойких сферопластиков |
EP4098704A1 (en) * | 2021-06-04 | 2022-12-07 | Jotun A/S | Coating |
EP4353473A1 (de) * | 2022-10-11 | 2024-04-17 | 3D Core GmbH & Co. KG | Schichtverbund mit brandhemmendem kompositwerkstoff |
CN115595091B (zh) * | 2022-11-23 | 2023-04-18 | 江西天永诚高分子材料有限公司 | 一种超低密度超阻燃有机硅隔热灌封胶及其制备方法 |
CN118652648B (zh) * | 2024-08-21 | 2024-11-05 | 潍坊鑫百顺工贸有限公司 | 一种环保型聚氨酯粘合剂及其制备工艺 |
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US3445436A (en) * | 1966-06-14 | 1969-05-20 | Tremco Mfg Co | Polyurethane polyepoxides |
US3615972A (en) * | 1967-04-28 | 1971-10-26 | Dow Chemical Co | Expansible thermoplastic polymer particles containing volatile fluid foaming agent and method of foaming the same |
GB1576879A (en) * | 1976-09-20 | 1980-10-15 | Hitachi Ltd | Flame-retardant epoxy resin compositions |
US4861643A (en) * | 1987-03-13 | 1989-08-29 | The Boeing Company | Aerospace structure having a cast-in-place noncompressible void filler |
US5019605A (en) * | 1989-03-15 | 1991-05-28 | Minnesota Mining And Manufacturing Company | Low density, self-extinguishing epoxide composition |
EP0459951A3 (en) | 1990-05-30 | 1993-09-15 | Ciba-Geigy Ag | Char forming nonhalogenated flame retardant epoxy composition |
FR2703689B1 (fr) * | 1993-04-09 | 1995-06-16 | Minnesota Mining & Mfg | Composition epoxyde ignifuge pratiquement exempte d'halogene. |
JP3183780B2 (ja) * | 1993-07-09 | 2001-07-09 | キヤノン株式会社 | フィルタの製造方法、および該フィルタの製造方法を含んでなるインクジェットヘッドの製造方法 |
EP0814121B1 (en) | 1996-06-20 | 2001-09-26 | Minnesota Mining And Manufacturing Company | Low density, fire retardant one-part epoxy composition |
EP0838499A1 (en) * | 1996-10-28 | 1998-04-29 | Minnesota Mining And Manufacturing Company | Two-part low density curing epoxy composition and use thereof as void filler |
JP3816604B2 (ja) * | 1996-12-06 | 2006-08-30 | ソマール株式会社 | フィルムコンデンサ用難燃性エポキシ樹脂組成物及びそれを用いたフィルムコンデンサ |
US5834526A (en) * | 1997-07-11 | 1998-11-10 | Wu; Huey S. | Expandable hollow particles |
EP1060210A1 (de) | 1998-03-04 | 2000-12-20 | Siemens Aktiengesellschaft | Halogenfrei flammwidriger verbundwerkstoff |
IL142339A0 (en) * | 1998-10-23 | 2002-03-10 | Vantico Ag | Method for filling and reinforcing honeycomb sandwich panels |
DE19909270A1 (de) * | 1999-03-03 | 2000-09-07 | Henkel Teroson Gmbh | Hitzehärtbarer, thermisch expandierbarer Formkörper |
JP2001064481A (ja) * | 1999-08-24 | 2001-03-13 | Kansai Putty Kako Kk | 可撓性エポキシパテ組成物 |
JP4633214B2 (ja) * | 1999-12-08 | 2011-02-16 | 富士通株式会社 | エポキシ樹脂組成物 |
TW490474B (en) * | 2000-01-04 | 2002-06-11 | Nat Science Council | Phosphorus group containing flame retardant hardener, advanced epoxy resins and cured epoxy resins thereof |
JP2002220489A (ja) * | 2000-11-27 | 2002-08-09 | Sanyo Chem Ind Ltd | 切削加工性樹脂複合成形品及びその製法 |
US20030069321A1 (en) * | 2001-10-05 | 2003-04-10 | Lin Wendy Wen-Ling | High modulus, impact resistant foams for structural components |
US7455798B2 (en) * | 2002-08-23 | 2008-11-25 | James Hardie International Finance B.V. | Methods for producing low density products |
-
2004
- 2004-12-23 EP EP04030580A patent/EP1674518A1/en not_active Withdrawn
-
2005
- 2005-12-23 EP EP05855491A patent/EP1838776B1/en active Active
- 2005-12-23 WO PCT/US2005/046940 patent/WO2006071820A1/en active Application Filing
- 2005-12-23 JP JP2007548563A patent/JP5384830B2/ja not_active Expired - Fee Related
- 2005-12-23 US US11/721,833 patent/US8188165B2/en active Active
- 2005-12-23 CA CA2592305A patent/CA2592305C/en not_active Expired - Fee Related
- 2005-12-23 KR KR1020077016629A patent/KR20070090032A/ko not_active Withdrawn
- 2005-12-23 ES ES05855491T patent/ES2302256T3/es active Active
- 2005-12-23 AT AT05855491T patent/ATE390459T1/de not_active IP Right Cessation
- 2005-12-23 BR BRPI0519233A patent/BRPI0519233B1/pt not_active IP Right Cessation
- 2005-12-23 CN CN2005800485459A patent/CN101124275B/zh not_active Expired - Fee Related
- 2005-12-23 DE DE602005005722T patent/DE602005005722T2/de active Active
Also Published As
Publication number | Publication date |
---|---|
US8188165B2 (en) | 2012-05-29 |
CA2592305C (en) | 2013-05-14 |
DE602005005722D1 (de) | 2008-05-08 |
EP1838776A1 (en) | 2007-10-03 |
EP1674518A1 (en) | 2006-06-28 |
EP1838776B1 (en) | 2008-03-26 |
KR20070090032A (ko) | 2007-09-04 |
JP2008525599A (ja) | 2008-07-17 |
US20080167412A1 (en) | 2008-07-10 |
WO2006071820A1 (en) | 2006-07-06 |
DE602005005722T2 (de) | 2009-04-16 |
CN101124275B (zh) | 2010-09-01 |
ES2302256T3 (es) | 2008-07-01 |
ATE390459T1 (de) | 2008-04-15 |
JP5384830B2 (ja) | 2014-01-08 |
BRPI0519233B1 (pt) | 2016-06-07 |
CN101124275A (zh) | 2008-02-13 |
CA2592305A1 (en) | 2006-07-06 |
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Legal Events
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B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 07/06/2016, OBSERVADAS AS CONDICOES LEGAIS. |
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B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 15A ANUIDADE. |
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B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2610 DE 12-01-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |