BRPI0413715A - device and method for electrolytically treating electrically insulated structures - Google Patents
device and method for electrolytically treating electrically insulated structuresInfo
- Publication number
- BRPI0413715A BRPI0413715A BRPI0413715-9A BRPI0413715A BRPI0413715A BR PI0413715 A BRPI0413715 A BR PI0413715A BR PI0413715 A BRPI0413715 A BR PI0413715A BR PI0413715 A BRPI0413715 A BR PI0413715A
- Authority
- BR
- Brazil
- Prior art keywords
- electrically insulated
- contact
- electrolytically treating
- insulated structures
- conducting structures
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Electrolytic Production Of Metals (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
Abstract
Device for the electrolytic treatment of electrically conducting structures electrically insulated from each other on surfaces of strip-like material (1) comprises an arrangement consisting of contact electrodes (6) for the material and an electrolysis region in which counter electrodes (4) and the material are in contact with the treatment liquid. At least one of the contact electrodes is arranged outside of the electrolysis region and is not in contact with the treatment liquid. The contact electrode and the electrolysis region are arranged at a distance from each other so that small electrically conducting structures can be electrolytically treated. An independent claim is also included for a process for the electrolytic treatment of electrically conducting structures electrically insulated from each other on surfaces of strip-like material using the above device.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10342512A DE10342512B3 (en) | 2003-09-12 | 2003-09-12 | Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region |
PCT/EP2004/009436 WO2005026415A1 (en) | 2003-09-12 | 2004-08-19 | Device and method for electrolytically treating electrically insulated structures |
Publications (2)
Publication Number | Publication Date |
---|---|
BRPI0413715A true BRPI0413715A (en) | 2006-10-17 |
BRPI0413715B1 BRPI0413715B1 (en) | 2013-09-17 |
Family
ID=33039358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0413715-9B1A BRPI0413715B1 (en) | 2003-09-12 | 2004-08-19 | device and method for electrolytically treating electrically conductive structures |
Country Status (13)
Country | Link |
---|---|
US (1) | US20060201817A1 (en) |
EP (1) | EP1664390B1 (en) |
JP (1) | JP4474414B2 (en) |
KR (1) | KR101076947B1 (en) |
CN (1) | CN1849415A (en) |
AT (1) | ATE350514T1 (en) |
BR (1) | BRPI0413715B1 (en) |
CA (1) | CA2532451A1 (en) |
DE (2) | DE10342512B3 (en) |
HK (1) | HK1084423A1 (en) |
MX (1) | MXPA06002649A (en) |
TW (1) | TWI336358B (en) |
WO (1) | WO2005026415A1 (en) |
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JP4862513B2 (en) * | 2005-06-23 | 2012-01-25 | 東レ株式会社 | Power feeding roller and apparatus and method for producing film with electrolytic plating film |
DE102005031948B3 (en) | 2005-07-08 | 2006-06-14 | Höllmüller Maschinenbau GmbH | Device for electrolytically treating strip-like material comprises contact rollers made from metal arranged on at least one side of the material and counter rollers arranged on the opposite-lying side of the strip as a contact pair |
JP5301993B2 (en) | 2005-08-12 | 2013-09-25 | モジュメタル エルエルシー | Composition-modulated composite material and method for forming the same |
KR20090009876A (en) * | 2006-04-18 | 2009-01-23 | 바스프 에스이 | Electroplating Apparatus and Method |
DE502007002680D1 (en) * | 2006-04-18 | 2010-03-11 | Basf Se | DEVICE AND METHOD FOR GALVANIC COATING |
DE102006033353B4 (en) * | 2006-07-19 | 2010-11-18 | Höllmüller Maschinenbau GmbH | Method and device for treating flat, fragile substrates |
TW200829726A (en) * | 2006-11-28 | 2008-07-16 | Basf Ag | Method and device for electrolytic coating |
DE102008004592A1 (en) | 2008-01-16 | 2009-07-23 | Danziger, Manfred, Dr. | Belt electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip |
JP2009249659A (en) * | 2008-04-02 | 2009-10-29 | Nippon Mektron Ltd | Electroplating device and electroplating method |
US20100264035A1 (en) * | 2009-04-15 | 2010-10-21 | Solopower, Inc. | Reel-to-reel plating of conductive grids for flexible thin film solar cells |
DE102009022337A1 (en) * | 2009-05-13 | 2010-11-18 | Gebr. Schmid Gmbh & Co. | Method and device for treating a substrate |
CA2764887C (en) | 2009-06-08 | 2018-09-11 | Modumetal Llc | Electrodeposited, nanolaminate coatings and claddings for corrosion protection |
US8377267B2 (en) * | 2009-09-30 | 2013-02-19 | National Semiconductor Corporation | Foil plating for semiconductor packaging |
CN102383159A (en) * | 2011-08-09 | 2012-03-21 | 长春一汽富维高新汽车饰件有限公司 | Coarsening production and trivalent chromium electrolysis process incorporating device and method |
EP2626144A1 (en) * | 2012-02-07 | 2013-08-14 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Roll to roll manufacturing system having a clean room deposition zone and a separate processing zone |
US10472727B2 (en) | 2013-03-15 | 2019-11-12 | Modumetal, Inc. | Method and apparatus for continuously applying nanolaminate metal coatings |
CA2905548C (en) | 2013-03-15 | 2022-04-26 | Modumetal, Inc. | Nanolaminate coatings |
EA201500947A1 (en) | 2013-03-15 | 2016-03-31 | Модьюметл, Инк. | DEVICE AND METHOD OF ELECTRIC PROTECTION OF NANO-LAYERED COATING |
EA201500948A1 (en) | 2013-03-15 | 2016-03-31 | Модьюметл, Инк. | METHOD OF MANUFACTURING A PRODUCT AND A PRODUCT MANUFACTURED BY THE ABOVE INDICATED BY THE METHOD |
WO2014145588A1 (en) | 2013-03-15 | 2014-09-18 | Modumetal, Inc. | Nickel chromium nanolaminate coating having high hardness |
MX373825B (en) * | 2013-08-22 | 2020-03-23 | Ashworth Bros Inc | SYSTEM AND METHOD FOR ELECTROPOLISHING OR ELECTROPLATING CONVEYOR BELTS. |
CN104195611B (en) * | 2014-08-15 | 2016-09-14 | 洛阳弘洋机械有限公司 | A kind of bar continuous chromium plating production line |
BR112017005464A2 (en) | 2014-09-18 | 2017-12-05 | Modumetal Inc | Method and Apparatus for Continuously Applying Nannaminated Metal Coatings |
AR102068A1 (en) | 2014-09-18 | 2017-02-01 | Modumetal Inc | METHODS OF PREPARATION OF ITEMS BY ELECTRODEPOSITION AND ADDITIVE MANUFACTURING PROCESSES |
CN104928738B (en) * | 2015-05-21 | 2017-04-19 | 中国科学院山西煤炭化学研究所 | Continuous metal electroplating method and device for carbon fiber tows |
CN105177660B (en) * | 2015-10-09 | 2017-11-21 | 华晶精密制造股份有限公司 | A kind of flat upper sand device of diamond cutting secant industrial water |
AR109584A1 (en) | 2016-09-08 | 2018-12-26 | Modumetal Inc | PROCESSES TO PROVIDE LAMINATED COATINGS ON WORK PARTS, AND THE ARTICLES OBTAINED WITH THE SAME |
US12227869B2 (en) | 2016-09-09 | 2025-02-18 | Modumetal, Inc. | Application of laminate and nanolaminate materials to tooling and molding processes |
EP3512987A1 (en) | 2016-09-14 | 2019-07-24 | Modumetal, Inc. | System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom |
CN110114210B (en) | 2016-11-02 | 2022-03-04 | 莫杜美拓有限公司 | Topology-optimized high-interface filling structure |
CN110637107B (en) | 2017-03-24 | 2022-08-19 | 莫杜美拓有限公司 | Lift plunger with electroplated layer and system and method for producing the same |
CN110770372B (en) | 2017-04-21 | 2022-10-11 | 莫杜美拓有限公司 | Tubular article having an electrodeposited coating and system and method for producing same |
US11214884B2 (en) * | 2017-07-11 | 2022-01-04 | University Of South Florida | Electrochemical three-dimensional printing and soldering |
CN107523831B (en) * | 2017-09-30 | 2019-01-18 | 江阴康强电子有限公司 | It is roughened immersion plating pilot trench |
EP3784823A1 (en) | 2018-04-27 | 2021-03-03 | Modumetal, Inc. | Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation |
CN108950622B (en) * | 2018-08-28 | 2020-07-21 | 温州杰锐电子科技有限公司 | Electric brush plating device |
US10807823B2 (en) * | 2019-02-01 | 2020-10-20 | Assa Abloy Ab | Card stacker |
CN112249702A (en) * | 2019-07-22 | 2021-01-22 | 艾里亚设计股分有限公司 | Guide roller device |
US11713514B2 (en) * | 2019-08-08 | 2023-08-01 | Hutchinson Technology Incorporated | Systems for electroplating and methods of use thereof |
CN112111775B (en) * | 2020-08-15 | 2023-02-03 | 智兴(上海)五金有限公司 | Rapid oxidation treatment system for lead |
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NL129563C (en) * | 1964-02-04 | |||
US3535222A (en) * | 1964-02-04 | 1970-10-20 | Aluminium Lab Ltd | Apparatus for continuous electrolytic treatment |
US4282073A (en) * | 1979-08-22 | 1981-08-04 | Thomas Steel Strip Corporation | Electro-co-deposition of corrosion resistant nickel/zinc alloys onto steel substrates |
US4324633A (en) * | 1980-10-20 | 1982-04-13 | Lovejoy Curtis N | Electrolytic apparatus for treating continuous strip material |
US4401523A (en) * | 1980-12-18 | 1983-08-30 | Republic Steel Corporation | Apparatus and method for plating metallic strip |
US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
US4560445A (en) * | 1984-12-24 | 1985-12-24 | Polyonics Corporation | Continuous process for fabricating metallic patterns on a thin film substrate |
FR2653787B1 (en) * | 1989-10-27 | 1992-02-14 | Lorraine Laminage | INSTALLATION AND METHOD FOR ELECTROLYTIC COATING OF A METAL STRIP. |
DE4229403C2 (en) * | 1992-09-03 | 1995-04-13 | Hoellmueller Maschbau H | Device for electroplating thin plastic films provided with a conductive coating on one or both sides |
DE19612555C2 (en) * | 1996-03-29 | 1998-03-19 | Atotech Deutschland Gmbh | Process for the selective electrochemical treatment of printed circuit boards and device for carrying out the process |
DE19717512C3 (en) * | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Device for electroplating circuit boards under constant conditions in continuous systems |
US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
DE19951325C2 (en) * | 1999-10-20 | 2003-06-26 | Atotech Deutschland Gmbh | Method and device for the electrolytic treatment of electrically insulated, electrically conductive structures on surfaces of electrically insulating film material and applications of the method |
DE10043814C1 (en) * | 2000-09-06 | 2002-04-11 | Egon Huebel | Continuous electrochemical treatment of circuit boards or other goods, comprises placing electrically-insulating, ion-permeable material between electrodes and objects |
DE10065643C2 (en) * | 2000-12-29 | 2003-03-20 | Egon Huebel | Device and method for the electrochemical treatment of strip-like and plate-like material |
DE10065649C2 (en) * | 2000-12-29 | 2003-03-20 | Egon Huebel | Device and method for the electrochemical treatment of electrically conductive tapes |
WO2003038158A2 (en) * | 2001-10-25 | 2003-05-08 | Infineon Technologies Ag | Electroplating device and electroplating system for coating already conductive structures |
-
2003
- 2003-09-12 DE DE10342512A patent/DE10342512B3/en not_active Expired - Fee Related
-
2004
- 2004-08-19 DE DE602004004164T patent/DE602004004164T2/en not_active Expired - Lifetime
- 2004-08-19 MX MXPA06002649A patent/MXPA06002649A/en active IP Right Grant
- 2004-08-19 AT AT04764415T patent/ATE350514T1/en not_active IP Right Cessation
- 2004-08-19 JP JP2006525683A patent/JP4474414B2/en not_active Expired - Fee Related
- 2004-08-19 CA CA002532451A patent/CA2532451A1/en not_active Abandoned
- 2004-08-19 WO PCT/EP2004/009436 patent/WO2005026415A1/en active IP Right Grant
- 2004-08-19 EP EP04764415A patent/EP1664390B1/en not_active Expired - Lifetime
- 2004-08-19 KR KR1020067003313A patent/KR101076947B1/en not_active Expired - Fee Related
- 2004-08-19 CN CNA2004800260338A patent/CN1849415A/en active Pending
- 2004-08-19 US US10/566,227 patent/US20060201817A1/en not_active Abandoned
- 2004-08-19 BR BRPI0413715-9B1A patent/BRPI0413715B1/en not_active IP Right Cessation
- 2004-08-31 TW TW093126281A patent/TWI336358B/en not_active IP Right Cessation
-
2006
- 2006-06-14 HK HK06106798A patent/HK1084423A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI336358B (en) | 2011-01-21 |
MXPA06002649A (en) | 2006-06-06 |
US20060201817A1 (en) | 2006-09-14 |
KR101076947B1 (en) | 2011-10-26 |
JP4474414B2 (en) | 2010-06-02 |
DE602004004164D1 (en) | 2007-02-15 |
KR20060058116A (en) | 2006-05-29 |
CA2532451A1 (en) | 2005-03-24 |
JP2007505213A (en) | 2007-03-08 |
TW200510577A (en) | 2005-03-16 |
EP1664390A1 (en) | 2006-06-07 |
BRPI0413715B1 (en) | 2013-09-17 |
ATE350514T1 (en) | 2007-01-15 |
HK1084423A1 (en) | 2006-07-28 |
WO2005026415A1 (en) | 2005-03-24 |
CN1849415A (en) | 2006-10-18 |
EP1664390B1 (en) | 2007-01-03 |
DE10342512B3 (en) | 2004-10-28 |
DE602004004164T2 (en) | 2007-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B09X | Republication of the decision to grant [chapter 9.1.3 patent gazette] | ||
B09X | Republication of the decision to grant [chapter 9.1.3 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 19/08/2004, OBSERVADAS AS CONDICOES LEGAIS. |
|
B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 12A ANUIDADE. |
|
B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2385 DE 20-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |