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BR9902664A - Uso de uma composição formadora de gel de silicone - Google Patents

Uso de uma composição formadora de gel de silicone

Info

Publication number
BR9902664A
BR9902664A BR9902664-3A BR9902664A BR9902664A BR 9902664 A BR9902664 A BR 9902664A BR 9902664 A BR9902664 A BR 9902664A BR 9902664 A BR9902664 A BR 9902664A
Authority
BR
Brazil
Prior art keywords
silicone gel
forming composition
compressible
silicone
composition
Prior art date
Application number
BR9902664-3A
Other languages
English (en)
Inventor
Lucrece De Ridder
Jean-Paul Mollie
Original Assignee
Dow Corning Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Sa filed Critical Dow Corning Sa
Publication of BR9902664A publication Critical patent/BR9902664A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H01B3/465—Silicone oils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Micro-Capsules (AREA)

Abstract

''USO DE UMA COMPOSIçãO FORMADORA DE GEL DE SILICONE''. Uma composição de silicone compressível formável a partir de uma composição formadora de gel de silicone e uma carga compressível oca, que é adaptada para ser usada em uma vedação eletricamente isolante. A composição de silicone compressível compreende uma mistura de compostos de organossilício que pode reticular para formar um gel de silicone e microesferas compressíveis ocas.
BR9902664-3A 1998-07-10 1999-07-09 Uso de uma composição formadora de gel de silicone BR9902664A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9815080.8A GB9815080D0 (en) 1998-07-10 1998-07-10 Compressible silicone composition

Publications (1)

Publication Number Publication Date
BR9902664A true BR9902664A (pt) 2000-05-23

Family

ID=10835363

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9902664-3A BR9902664A (pt) 1998-07-10 1999-07-09 Uso de uma composição formadora de gel de silicone

Country Status (8)

Country Link
US (1) US6194476B1 (pt)
EP (1) EP0971369A1 (pt)
JP (1) JP2000063791A (pt)
KR (1) KR20000011600A (pt)
CN (1) CN1244560A (pt)
BR (1) BR9902664A (pt)
CA (1) CA2277410A1 (pt)
GB (1) GB9815080D0 (pt)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2765884B1 (fr) * 1997-07-09 2001-07-27 Rhodia Chimie Sa Composition silicone pour l'enduction de substrats en matiere souple, notamment textile
FR2770220B1 (fr) * 1997-10-29 2003-01-31 Rhodia Chimie Sa Composition silicone reticulable en gel adhesif et amortisseur avec microspheres
SE0003050D0 (sv) * 2000-08-30 2000-08-30 Abb Ab Komposit
DE10146392A1 (de) * 2001-09-20 2003-04-24 Wacker Chemie Gmbh Siliconkautschukzusammensetzung zur Herstellung von Kabeln bzw. Profilen mit Funktionserhalt im Brandfall
US6602102B2 (en) 2001-10-10 2003-08-05 South Valley Specialties Buoyant silicone rubber compound
US20050003216A1 (en) * 2003-06-30 2005-01-06 Jean-Marc Frances Microparticle containing silicone release coatings having improved anti-block and release properties
US7214735B2 (en) * 2004-02-02 2007-05-08 3M Innovative Properties Company Microsphere-filled sealant materials
US7141738B2 (en) 2004-02-02 2006-11-28 3M Innovative Properties Company Re-enterable splice enclosure
DK1877002T3 (da) 2005-04-25 2013-05-27 G & G Biotechnology Ltd Letvægts implanterbar proteseanordning
US20070197719A1 (en) * 2006-02-21 2007-08-23 United Technologies Corporation Turbine friendly abradable material
US8020875B2 (en) * 2006-02-21 2011-09-20 United Technologies Corporation Turbine friendly abradable material
US8048351B2 (en) * 2006-08-14 2011-11-01 Swagelok Company Bio-pharmaceutical hose
EP2078971A1 (en) * 2007-12-20 2009-07-15 ABB Research Ltd. A cable, a method of producing such a cable, and use thereof
JP5115716B2 (ja) * 2008-03-21 2013-01-09 信越化学工業株式会社 低比重シリコーンゴム接着剤組成物
CH698970A1 (de) * 2008-06-04 2009-12-15 Trench Switzerland Ag Hochspannungs-Messwandler mit flexibler Isolierung.
TR201815113T4 (tr) * 2010-01-18 2018-11-21 G&G Biotechnology Ltd Hafif meme implant materyali.
US9371129B1 (en) 2011-02-03 2016-06-21 4M Company Lightweight aircraft seal material
US20150296883A1 (en) * 2012-12-28 2015-10-22 Changming Wu Tobacco vaporizer
FR3009643B1 (fr) * 2013-08-09 2015-08-07 Schneider Electric Ind Sas Ampoule a vide, pole de disjoncteur comprenant une telle ampoule a vide et procedes de fabrication de tels dispositifs
EP2842992B1 (de) * 2013-08-27 2017-02-08 ContiTech Elastomer-Beschichtungen GmbH Isolationsmaterial
EP3267942B1 (en) 2015-03-12 2022-05-04 G&G Biotechnology Ltd. Composite implant material
EP3523354B1 (en) * 2016-10-06 2022-05-11 3M Innovative Properties Company Curable compositions and related methods
US20180111777A1 (en) 2016-10-26 2018-04-26 Cpfilms Inc. Packaged flexible film and flexible film packaging system therefor
ES2971593T3 (es) 2018-02-18 2024-06-06 G&G Biotechnology Ltd Implantes con adhesión de cubierta mejorada

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615972A (en) 1967-04-28 1971-10-26 Dow Chemical Co Expansible thermoplastic polymer particles containing volatile fluid foaming agent and method of foaming the same
US3864181A (en) 1972-06-05 1975-02-04 Pratt & Lambert Inc Polymer foam compositions
US4044176A (en) 1973-07-12 1977-08-23 Pratt & Lambert, Inc. Graphic arts and graphic media
US4006273A (en) 1975-02-03 1977-02-01 Pratt & Lambert, Inc. Washable and dry-cleanable raised printing on fabrics
SE439599B (sv) 1981-01-14 1985-06-24 Kema Nord Ab Sett att torka och expandera i vetska dispergerade, termoplastiska mikrosferer innehallande, flyktiga, flytande jesmedel
SE452471B (sv) 1982-11-26 1987-11-30 Casco Nobel Ab Forfarande for expandering av termoplastiska mikrosferer
KR930004059B1 (ko) 1984-12-28 1993-05-19 가부시끼가이샤 큐우빅 엔지니어링 완충재용 복합형 실리콘겔재
US4843104A (en) 1987-03-19 1989-06-27 Pierce & Stevens Syntactic polymer foam compositions containing microsphere fillers
US4722943A (en) 1987-03-19 1988-02-02 Pierce & Stevens Corporation Composition and process for drying and expanding microspheres
JPH0791530B2 (ja) 1990-04-26 1995-10-04 信越化学工業株式会社 ハードディスク装置用カバー・スポンジパッキン組立体
JPH086039B2 (ja) * 1990-08-01 1996-01-24 信越化学工業株式会社 オルガノポリシロキサン組成物及びそのゲル硬化物
US5599894A (en) * 1994-06-07 1997-02-04 Shin-Etsu Chemical Co., Ltd. Silicone gel compositions
DE19540886A1 (de) 1995-11-02 1997-05-07 Wacker Chemie Gmbh Kompressibler Siliconkautschuk

Also Published As

Publication number Publication date
US6194476B1 (en) 2001-02-27
EP0971369A1 (en) 2000-01-12
KR20000011600A (ko) 2000-02-25
JP2000063791A (ja) 2000-02-29
GB9815080D0 (en) 1998-09-09
CN1244560A (zh) 2000-02-16
CA2277410A1 (en) 2000-01-10

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 4A , 5A , 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1871 DE 14/11/2006.