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BE882957A - Procede, matiere et appareil de fabrication de circuits imprimes - Google Patents

Procede, matiere et appareil de fabrication de circuits imprimes

Info

Publication number
BE882957A
BE882957A BE0/200356A BE200356A BE882957A BE 882957 A BE882957 A BE 882957A BE 0/200356 A BE0/200356 A BE 0/200356A BE 200356 A BE200356 A BE 200356A BE 882957 A BE882957 A BE 882957A
Authority
BE
Belgium
Prior art keywords
printed circuits
manufacturing printed
manufacturing
circuits
printed
Prior art date
Application number
BE0/200356A
Other languages
English (en)
Inventor
R C Des Marais Jr
Original Assignee
Shipley Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co filed Critical Shipley Co
Publication of BE882957A publication Critical patent/BE882957A/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0027—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or layers by lamination or by fusion of the coatings or layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
BE0/200356A 1976-07-21 1980-04-24 Procede, matiere et appareil de fabrication de circuits imprimes BE882957A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70735576A 1976-07-21 1976-07-21

Publications (1)

Publication Number Publication Date
BE882957A true BE882957A (fr) 1980-10-24

Family

ID=24841370

Family Applications (1)

Application Number Title Priority Date Filing Date
BE0/200356A BE882957A (fr) 1976-07-21 1980-04-24 Procede, matiere et appareil de fabrication de circuits imprimes

Country Status (7)

Country Link
JP (1) JPS55162293A (fr)
BE (1) BE882957A (fr)
DE (1) DE2922304A1 (fr)
FR (1) FR2458202B1 (fr)
GB (1) GB2050702B (fr)
NL (1) NL8001942A (fr)
SE (1) SE440844B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2496386A1 (fr) * 1980-12-12 1982-06-18 Grace W R Ltd Procede pour former un revetement conducteur sur un substrat et procede pour former une planche de circuit

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2505367A1 (fr) * 1981-05-08 1982-11-12 Lignes Telegraph Telephon Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride
DE19511553C2 (de) * 1995-03-29 1997-02-20 Litton Precision Prod Int Verfahren zur Erzeugung elektrisch leitfähiger Strukturen, eine nach dem Verfahren erhaltene elektrisch leitfähige Struktur sowie Kombination zur Erzeugung elektrisch leitfähiger Strukturen
GB2380068B (en) * 2001-09-15 2005-08-03 Jaybee Graphics Low Conductive Ink Composition
JP2015195329A (ja) * 2014-03-28 2015-11-05 株式会社秀峰 導電配線の製造方法および導電配線
JP2016039171A (ja) * 2014-08-05 2016-03-22 株式会社秀峰 導電配線の製造方法および導電配線
WO2016166751A1 (fr) * 2015-04-13 2016-10-20 Printcb Ltd. Impression de circuits multi-couches

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1075179B (de) * 1960-02-11 Woodbridge Suffolk Lawrence John Young (Großbritannien) Verfahren zur Herstellung gedruckter Schaltungen
GB691121A (en) * 1950-07-11 1953-05-06 Nat Res Dev Improvements in or relating to the deposition of metals on surfaces
FR1420044A (fr) * 1963-12-26 1965-12-03 Matsushita Electric Ind Co Ltd Procédé de fabrication des circuits imprimés
US3506482A (en) * 1967-04-25 1970-04-14 Matsushita Electric Ind Co Ltd Method of making printed circuits
US3910852A (en) * 1971-03-22 1975-10-07 Conshohocken Chemicals Inc Conductive resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2496386A1 (fr) * 1980-12-12 1982-06-18 Grace W R Ltd Procede pour former un revetement conducteur sur un substrat et procede pour former une planche de circuit

Also Published As

Publication number Publication date
NL8001942A (nl) 1981-11-02
FR2458202B1 (fr) 1985-10-25
GB2050702A (en) 1981-01-07
FR2458202A1 (fr) 1980-12-26
SE8002343L (sv) 1981-09-27
JPS55162293A (en) 1980-12-17
SE440844B (sv) 1985-08-19
GB2050702B (en) 1984-02-08
DE2922304A1 (de) 1981-04-09

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: SHIPLEY CY INC.

Effective date: 19890430