BE792310A - Procede pour le depot de couches de cuivre sur des pieces moulees en polyimides - Google Patents

Procede pour le depot de couches de cuivre sur des pieces moulees en polyimides

Info

Publication number: BE792310A
Authority: BE; Belgium
Prior art keywords: polyimides; molded parts; depositing copper; copper coats; coats
Prior art date: 1971-12-08

Application number

Other languages

Original Assignee

Kalle Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1971-12-08

Publication date

1973-06-05

1973-06-05 Publication of BE792310A publication Critical patent/BE792310A/fr

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Metallurgy (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
General Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemically Coating (AREA)
Laminated Bodies (AREA)
Manufacturing Of Printed Wiring (AREA)

BE792310D 1971-12-08 Procede pour le depot de couches de cuivre sur des pieces moulees en polyimides BE792310A (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE2160821A DE2160821C3 (de)	1971-12-08	1971-12-08	Verfahren zur Abscheidung von Kupferschichten auf Formkörpern aus Polyimiden

Publications (1)

Publication Number	Publication Date
BE792310A true BE792310A (fr)	1973-06-05

Family

ID=5827354

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BE792310D BE792310A (fr)	1971-12-08		Procede pour le depot de couches de cuivre sur des pieces moulees en polyimides

Country Status (10)

Country	Link
US (1)	US3881049A (fr)
JP (1)	JPS4866168A (fr)
AT (1)	AT322320B (fr)
BE (1)	BE792310A (fr)
CA (1)	CA990593A (fr)
DE (1)	DE2160821C3 (fr)
FR (1)	FR2162526B1 (fr)
GB (1)	GB1403219A (fr)
IT (1)	IT973915B (fr)
NL (1)	NL7216124A (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL176479C (nl) *	1971-12-08	1985-04-16	Hoechst Ag	Werkwijze voor het bekleden van kunststofvoorwerpen met koper.
GB2040969B (en) *	1978-12-19	1983-04-13	Crown City Plating Co	Conditioning of polyamides for electroless plating
DE3328765A1 (de) *	1983-08-05	1985-02-14	Schering AG, 1000 Berlin und 4709 Bergkamen	Loesung zur vorbehandlung von polyimid
US4720401A (en) *	1985-01-11	1988-01-19	International Business Machines Corporation	Enhanced adhesion between metals and polymers
DE3743780A1 (de) *	1987-12-23	1989-07-06	Bayer Ag	Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen
US5032427A (en) *	1988-04-25	1991-07-16	Macdermid, Incorporated	Process for preparation printed circuit through-holes for metallization
EP0341504A3 (fr) *	1988-05-09	1991-01-16	General Electric Company	Empaquetage à support de puce en plastique et procédé pour sa préparation
US5242713A (en) *	1988-12-23	1993-09-07	International Business Machines Corporation	Method for conditioning an organic polymeric material
US4999251A (en) *	1989-04-03	1991-03-12	General Electric Company	Method for treating polyetherimide substrates and articles obtained therefrom
US5178956A (en) *	1989-10-03	1993-01-12	Shipley Company Inc.	Pretreatment process for electroless plating of polyimides
ATE156867T1 (de) *	1990-05-04	1997-08-15	Battelle Memorial Institute	Bildung eines dünnen keramischen oxidfilms durch niederschlagung auf modifizierten polymeroberflächen
US5187241A (en) *	1990-05-15	1993-02-16	International Business Machines Corporation	Isoimide modifications of a polyimide and reaction thereof with nucleophiles
US5441770A (en) *	1990-05-18	1995-08-15	Shipley Company Inc.	Conditioning process for electroless plating of polyetherimides
US5151304A (en) *	1991-01-22	1992-09-29	International Business Machines Corporation	Structure and method for enhancing adhesion to a polyimide surface
US5183692A (en) *	1991-07-01	1993-02-02	Motorola, Inc.	Polyimide coating having electroless metal plate
US5290597A (en) *	1992-04-27	1994-03-01	General Electric Company	Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon
JP4086946B2 (ja) *	1998-01-05	2008-05-14	日東電工株式会社	熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法
JP4917841B2 (ja) *	2006-06-09	2012-04-18	ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー．	樹脂表面への無電解めっき方法
US7981508B1 (en)	2006-09-12	2011-07-19	Sri International	Flexible circuits
US8895874B1 (en)	2009-03-10	2014-11-25	Averatek Corp.	Indium-less transparent metalized layers
TWI595024B (zh) *	2016-06-23	2017-08-11	臻鼎科技股份有限公司	聚醯胺酸、覆銅板及電路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3403035A (en) *	1964-06-24	1968-09-24	Process Res Company	Process for stabilizing autocatalytic metal plating solutions
US3544432A (en) *	1968-03-19	1970-12-01	Chisso Corp	Electroplating plastic articles
US3684572A (en) *	1970-07-13	1972-08-15	Du Pont	Electroless nickel plating process for nonconductors
US3704156A (en) *	1970-07-13	1972-11-28	Du Pont	Catalyst solution for electroless plating on nonconductors
DE2101049A1 (de) *	1971-01-11	1972-08-03	Siemens Ag	Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall
US3736170A (en) *	1971-06-28	1973-05-29	Ibm	Process for improved adhesion of electroless copper to a polyimide surface
US3791848A (en) *	1972-05-19	1974-02-12	Western Electric Co	A method of improving the adherence of a metal deposit to a polyimide surface

0
- BE BE792310D patent/BE792310A/fr unknown
1971
- 1971-12-08 DE DE2160821A patent/DE2160821C3/de not_active Expired
1972
- 1972-11-28 NL NL7216124A patent/NL7216124A/xx unknown
- 1972-12-05 GB GB5607872A patent/GB1403219A/en not_active Expired
- 1972-12-05 US US31227272 patent/US3881049A/en not_active Expired - Lifetime
- 1972-12-05 AT AT1033772A patent/AT322320B/de not_active IP Right Cessation
- 1972-12-06 IT IT5450572A patent/IT973915B/it active
- 1972-12-06 JP JP12237972A patent/JPS4866168A/ja active Pending
- 1972-12-06 CA CA158,211A patent/CA990593A/en not_active Expired
- 1972-12-07 FR FR7243524A patent/FR2162526B1/fr not_active Expired

Also Published As

Publication number	Publication date
JPS4866168A (fr)	1973-09-11
AT322320B (de)	1975-05-12
DE2160821C3 (de)	1979-02-08
IT973915B (it)	1974-06-10
US3881049A (en)	1975-04-29
FR2162526A1 (fr)	1973-07-20
FR2162526B1 (fr)	1976-08-20
NL7216124A (fr)	1973-06-13
DE2160821B2 (de)	1978-06-08
CA990593A (en)	1976-06-08
DE2160821A1 (de)	1973-06-20
GB1403219A (en)	1975-08-28

Publication	Publication Date	Title
BE792310A (fr)	1973-06-05	Procede pour le depot de couches de cuivre sur des pieces moulees en polyimides
PH10352A (en)	1976-12-20	Sydrometallurgical process for the production of copper
RO62435A (fr)	1978-03-15	Procede pour la preparation des 1,2,4-triazolenucleosides
BE788117A (fr)	1973-02-28	Procede de production d'elements pour circuits imprimes
RO65165A (fr)	1980-07-15	Procede de combustion pour les restes menageres
RO67478A (fr)	1980-03-15	Procede pour la preparation des pleuromutillines
RO62694A (fr)	1978-05-15	Procede pour la preparation des 3-methylencephalosporines
BE792936A (fr)	1973-06-18	Procede pour produire des supraconducteurs
BE782417A (fr)	1972-10-20	Procede pour la separation d'isomeres aromatiques
ZA727948B (en)	1973-09-26	Process for pyrorefining of copper
BE789028A (fr)	1973-01-15	Procede pour le depot de metaux sur des conducteurs de faibles dimensions fixes sur des supports souples
FR2071087A5 (fr)	1971-09-17	Montage-support pour depot electrolytique sur des elements de contact
CA963266A (en)	1975-02-25	Process for cementation of copper on iron
BE793567A (fr)	1973-06-29	Procede de coulee de metal
CH551238A (fr)	1974-07-15	Procede et machine pour la coulee continue de metal.
FR2330245A1 (fr)	1977-05-27	Procede pour deposer des couches conductrices sur des supports et produits obtenus par le procede
BE778943A (fr)	1972-08-03	Bis-diene-(1,3)-fer monocarbonyles et procede pour leur obtention
BE788787A (fr)	1973-01-02	Procede pour l'obtention de poudre de nickel
CH548455A (fr)	1974-04-30	Procede de depot electrolytique de chrome-molybdene sur des pieces de frottement et pieces ainsi revetues.
RO63053A (fr)	1978-05-15	Procede pour la preparation du 17-hydroxyvincamine
BE783344A (fr)	1972-11-13	Procede de formage d'embase pour lingotieres (
BE783585A (fr)	1972-11-17	Procede pour l'obtention de revetements sur des surfaces metalliques
BE783632A (fr)	1972-11-17	Procede de depot de metaux
BE784311A (fr)	1972-10-02	Procede pour fabriquer du monomethylterephtalate
RO74822A (fr)	1981-09-24	Procede pour la preparation des aminosulphonylpiriprocede pour la preparation des sulphonylaminopyrimidines