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BE783729A - Transistor monte selon la technique du type flip-chip - Google Patents

Transistor monte selon la technique du type flip-chip

Info

Publication number
BE783729A
BE783729A BE783729A BE783729A BE783729A BE 783729 A BE783729 A BE 783729A BE 783729 A BE783729 A BE 783729A BE 783729 A BE783729 A BE 783729A BE 783729 A BE783729 A BE 783729A
Authority
BE
Belgium
Prior art keywords
flip
mounted according
chip technique
transistor mounted
transistor
Prior art date
Application number
BE783729A
Other languages
English (en)
Inventor
B A Hegarty
L H Trevail
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of BE783729A publication Critical patent/BE783729A/fr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
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    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
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    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
BE783729A 1971-05-20 1972-05-19 Transistor monte selon la technique du type flip-chip BE783729A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14540671A 1971-05-20 1971-05-20

Publications (1)

Publication Number Publication Date
BE783729A true BE783729A (fr) 1972-09-18

Family

ID=22512964

Family Applications (1)

Application Number Title Priority Date Filing Date
BE783729A BE783729A (fr) 1971-05-20 1972-05-19 Transistor monte selon la technique du type flip-chip

Country Status (8)

Country Link
AU (1) AU4236672A (fr)
BE (1) BE783729A (fr)
DE (1) DE2224334A1 (fr)
ES (1) ES402719A1 (fr)
FR (1) FR2138731A1 (fr)
GB (1) GB1374867A (fr)
IT (1) IT955650B (fr)
NL (1) NL7206816A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114256215A (zh) * 2021-12-29 2022-03-29 广东晶科电子股份有限公司 一种照明器件及其制备方法

Also Published As

Publication number Publication date
NL7206816A (fr) 1972-11-22
GB1374867A (en) 1974-11-20
DE2224334A1 (de) 1972-11-30
AU4236672A (en) 1973-11-22
FR2138731A1 (fr) 1973-01-05
IT955650B (it) 1973-09-29
ES402719A1 (es) 1975-12-01

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