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AU8858298A - Thermally insulated integrated circuits - Google Patents

Thermally insulated integrated circuits

Info

Publication number
AU8858298A
AU8858298A AU88582/98A AU8858298A AU8858298A AU 8858298 A AU8858298 A AU 8858298A AU 88582/98 A AU88582/98 A AU 88582/98A AU 8858298 A AU8858298 A AU 8858298A AU 8858298 A AU8858298 A AU 8858298A
Authority
AU
Australia
Prior art keywords
integrated circuits
thermally insulated
insulated integrated
thermally
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU88582/98A
Inventor
Richard Goldman
David John Miles
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU8858298A publication Critical patent/AU8858298A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
AU88582/98A 1997-07-10 1998-07-07 Thermally insulated integrated circuits Abandoned AU8858298A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9714573A GB2327146A (en) 1997-07-10 1997-07-10 Thermal insulation of integrated circuit components
GB9714573 1997-07-10
PCT/EP1998/004214 WO1999003147A1 (en) 1997-07-10 1998-07-07 Thermally insulated integrated circuits

Publications (1)

Publication Number Publication Date
AU8858298A true AU8858298A (en) 1999-02-08

Family

ID=10815670

Family Applications (1)

Application Number Title Priority Date Filing Date
AU88582/98A Abandoned AU8858298A (en) 1997-07-10 1998-07-07 Thermally insulated integrated circuits

Country Status (3)

Country Link
AU (1) AU8858298A (en)
GB (1) GB2327146A (en)
WO (1) WO1999003147A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6680240B1 (en) * 2002-06-25 2004-01-20 Advanced Micro Devices, Inc. Silicon-on-insulator device with strained device film and method for making the same with partial replacement of isolation oxide

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534619U (en) * 1978-08-25 1980-03-06
JPS56137661A (en) * 1980-03-31 1981-10-27 Toshiba Corp Semiconductor device
JPS60160646A (en) * 1984-02-01 1985-08-22 Hitachi Ltd Manufacturing method of SOI type semiconductor device
SE447318B (en) * 1985-05-21 1986-11-03 Nils Goran Stemme INTEGRATED SEMICONDUCTOR CIRCUIT WITH JOINT OF THERMALLY INSULATING SUBJECT, SET TO MAKE CIRCUIT AND ITS USE IN A FLOOD METER
DE4006158A1 (en) * 1990-02-27 1991-09-12 Fraunhofer Ges Forschung METHOD FOR PRODUCING AN INSULATED, SINGLE-CRYSTAL SILICON ISLAND
JPH07273282A (en) * 1994-03-30 1995-10-20 Rohm Co Ltd Semiconductor device
KR0131723B1 (en) * 1994-06-08 1998-04-14 김주용 Manufacturing method for semiconductor device
JPH08222700A (en) * 1995-02-16 1996-08-30 Nissan Motor Co Ltd Semiconductor device
US5577309A (en) * 1995-03-01 1996-11-26 Texas Instruments Incorporated Method for forming electrical contact to the optical coating of an infrared detector

Also Published As

Publication number Publication date
GB2327146A (en) 1999-01-13
WO1999003147A1 (en) 1999-01-21
GB9714573D0 (en) 1997-09-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase