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AU6385600A - Interconnect assemblies and methods - Google Patents

Interconnect assemblies and methods

Info

Publication number
AU6385600A
AU6385600A AU63856/00A AU6385600A AU6385600A AU 6385600 A AU6385600 A AU 6385600A AU 63856/00 A AU63856/00 A AU 63856/00A AU 6385600 A AU6385600 A AU 6385600A AU 6385600 A AU6385600 A AU 6385600A
Authority
AU
Australia
Prior art keywords
methods
interconnect assemblies
interconnect
assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU63856/00A
Inventor
Benjamin N Eldridge
Gaetan Mathieu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/364,788 external-priority patent/US7435108B1/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of AU6385600A publication Critical patent/AU6385600A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/4822—Beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
AU63856/00A 1999-07-30 2000-07-28 Interconnect assemblies and methods Abandoned AU6385600A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US36485599A 1999-07-30 1999-07-30
US09364788 1999-07-30
US09/364,788 US7435108B1 (en) 1999-07-30 1999-07-30 Variable width resilient conductive contact structures
US09364855 1999-07-30
PCT/US2000/020530 WO2001009952A2 (en) 1999-07-30 2000-07-28 Interconnect assemblies and methods

Publications (1)

Publication Number Publication Date
AU6385600A true AU6385600A (en) 2001-02-19

Family

ID=27002648

Family Applications (1)

Application Number Title Priority Date Filing Date
AU63856/00A Abandoned AU6385600A (en) 1999-07-30 2000-07-28 Interconnect assemblies and methods

Country Status (6)

Country Link
EP (1) EP1208595A2 (en)
JP (1) JP2003506873A (en)
KR (2) KR100807426B1 (en)
AU (1) AU6385600A (en)
TW (1) TW518916B (en)
WO (1) WO2001009952A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6888362B2 (en) 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6780001B2 (en) 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6627980B2 (en) 2001-04-12 2003-09-30 Formfactor, Inc. Stacked semiconductor device assembly with microelectronic spring contacts
DE10143790B4 (en) * 2001-09-06 2007-08-02 Infineon Technologies Ag Electronic component with at least one semiconductor chip
TWI288958B (en) 2002-03-18 2007-10-21 Nanonexus Inc A miniaturized contact spring
US7010854B2 (en) 2002-04-10 2006-03-14 Formfactor, Inc. Re-assembly process for MEMS structures
DE102008001038B4 (en) 2008-04-08 2016-08-11 Robert Bosch Gmbh Micromechanical component with a slanted structure and corresponding manufacturing method
US10281648B2 (en) * 2013-07-30 2019-05-07 President And Fellows Of Harvard College Device support structures from bulk substrates
KR102655504B1 (en) 2022-06-10 2024-04-11 영진전자산업 주식회사 The pcb chamfering device with spindle fine adjustment device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4423401A (en) * 1982-07-21 1983-12-27 Tektronix, Inc. Thin-film electrothermal device
US5152695A (en) 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
JPH05259584A (en) * 1992-01-14 1993-10-08 Internatl Business Mach Corp <Ibm> Integrated light defector and manufacture therefor
JPH06213929A (en) * 1993-01-19 1994-08-05 Sharp Corp Manufacture of probe head of inspecting apparatus and the probe head
JPH06260383A (en) * 1993-03-03 1994-09-16 Nikon Corp Exposure method
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
JPH08306708A (en) * 1995-05-09 1996-11-22 Sanyo Electric Co Ltd Semiconductor device and its fabrication
KR100252457B1 (en) * 1995-05-26 2000-04-15 이고르 와이. 칸드로스 Fabrication method of interconnection element using cantilever element and sacrificial layer
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
JP3611637B2 (en) * 1995-07-07 2005-01-19 ヒューレット・パッカード・カンパニー Electrical connection structure of circuit members
JP3294084B2 (en) * 1995-10-31 2002-06-17 沖電気工業株式会社 Device mounting structure and mounting method
JP3022312B2 (en) 1996-04-15 2000-03-21 日本電気株式会社 Method of manufacturing probe card
AU3127797A (en) * 1996-05-17 1997-12-09 Formfactor, Inc. Microelectronic contact structure and method of making same
JPH10303345A (en) * 1997-04-28 1998-11-13 Shinko Electric Ind Co Ltd Packaging structure to substrate of semiconductor chip
AU7491598A (en) * 1997-05-15 1998-12-08 Formfactor, Inc. Lithographically defined microelectronic contact structures
US5944537A (en) * 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices

Also Published As

Publication number Publication date
WO2001009952A2 (en) 2001-02-08
KR20070043856A (en) 2007-04-25
WO2001009952A3 (en) 2001-11-15
KR100807426B1 (en) 2008-02-25
JP2003506873A (en) 2003-02-18
TW518916B (en) 2003-01-21
KR100733525B1 (en) 2007-06-28
EP1208595A2 (en) 2002-05-29
KR20020022139A (en) 2002-03-25

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase