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AU2001287188A1 - Molded shield structures and method for their fabrication - Google Patents

Molded shield structures and method for their fabrication

Info

Publication number
AU2001287188A1
AU2001287188A1 AU2001287188A AU8718801A AU2001287188A1 AU 2001287188 A1 AU2001287188 A1 AU 2001287188A1 AU 2001287188 A AU2001287188 A AU 2001287188A AU 8718801 A AU8718801 A AU 8718801A AU 2001287188 A1 AU2001287188 A1 AU 2001287188A1
Authority
AU
Australia
Prior art keywords
fabrication
shield structures
molded shield
molded
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001287188A
Inventor
Hassan S. Hashemi
Roberto U. Villanueva
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conexant Systems LLC
Original Assignee
Conexant Systems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conexant Systems LLC filed Critical Conexant Systems LLC
Publication of AU2001287188A1 publication Critical patent/AU2001287188A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W42/20—
    • H10W42/60—
    • H10W74/114—
    • H10W76/40—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5524—
    • H10W72/5525—
    • H10W90/754—
AU2001287188A 2000-08-22 2001-08-17 Molded shield structures and method for their fabrication Abandoned AU2001287188A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/644,035 US6757181B1 (en) 2000-08-22 2000-08-22 Molded shield structures and method for their fabrication
US09644035 2000-08-22
PCT/US2001/041767 WO2002017394A1 (en) 2000-08-22 2001-08-17 Molded shield structures and method for their fabrication

Publications (1)

Publication Number Publication Date
AU2001287188A1 true AU2001287188A1 (en) 2002-03-04

Family

ID=24583180

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001287188A Abandoned AU2001287188A1 (en) 2000-08-22 2001-08-17 Molded shield structures and method for their fabrication

Country Status (3)

Country Link
US (1) US6757181B1 (en)
AU (1) AU2001287188A1 (en)
WO (1) WO2002017394A1 (en)

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US7132736B2 (en) * 2001-10-31 2006-11-07 Georgia Tech Research Corporation Devices having compliant wafer-level packages with pillars and methods of fabrication
TWI286832B (en) * 2002-11-05 2007-09-11 Advanced Semiconductor Eng Thermal enhance semiconductor package
US20080112151A1 (en) 2004-03-04 2008-05-15 Skyworks Solutions, Inc. Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
US7198987B1 (en) 2004-03-04 2007-04-03 Skyworks Solutions, Inc. Overmolded semiconductor package with an integrated EMI and RFI shield
US8399972B2 (en) 2004-03-04 2013-03-19 Skyworks Solutions, Inc. Overmolded semiconductor package with a wirebond cage for EMI shielding
US20050278936A1 (en) * 2004-06-18 2005-12-22 Nikolaus Schunk Optoelectronic apparatus with a shielding cage, and methods for production of an optoelectronic apparatus with a shielding cage.
US20060151207A1 (en) * 2004-12-02 2006-07-13 Brian Redman RF shielding structure
US7728417B2 (en) * 2005-05-27 2010-06-01 Stats Chippac Ltd. Integrated circuit package system including shield
US7327030B2 (en) * 2005-12-16 2008-02-05 Atmel Corporation Apparatus and method incorporating discrete passive components in an electronic package
US20070163802A1 (en) * 2006-01-19 2007-07-19 Triquint Semiconductors, Inc. Electronic package including an electromagnetic shield
US7787250B2 (en) * 2007-12-28 2010-08-31 Universal Scientific Industrial (Shanghai) Co., Ltd. Metallic cover of miniaturization module
US8212339B2 (en) * 2008-02-05 2012-07-03 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8350367B2 (en) * 2008-02-05 2013-01-08 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8022511B2 (en) 2008-02-05 2011-09-20 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US7989928B2 (en) * 2008-02-05 2011-08-02 Advanced Semiconductor Engineering Inc. Semiconductor device packages with electromagnetic interference shielding
US8410584B2 (en) * 2008-08-08 2013-04-02 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US20100110656A1 (en) * 2008-10-31 2010-05-06 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US20100207257A1 (en) * 2009-02-17 2010-08-19 Advanced Semiconductor Engineering, Inc. Semiconductor package and manufacturing method thereof
US8110902B2 (en) 2009-02-19 2012-02-07 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US7999197B1 (en) * 2009-04-20 2011-08-16 Rf Micro Devices, Inc. Dual sided electronic module
US8212340B2 (en) 2009-07-13 2012-07-03 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US8368185B2 (en) * 2009-11-19 2013-02-05 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8030750B2 (en) * 2009-11-19 2011-10-04 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8378466B2 (en) 2009-11-19 2013-02-19 Advanced Semiconductor Engineering, Inc. Wafer-level semiconductor device packages with electromagnetic interference shielding
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (en) 2010-03-22 2013-10-01 日月光半導體製造股份有限公司 Semiconductor package and method of manufacturing same
TWI540698B (en) 2010-08-02 2016-07-01 日月光半導體製造股份有限公司 Semiconductor package and method of manufacturing same
US9007273B2 (en) 2010-09-09 2015-04-14 Advances Semiconductor Engineering, Inc. Semiconductor package integrated with conformal shield and antenna
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
US9679869B2 (en) 2011-09-02 2017-06-13 Skyworks Solutions, Inc. Transmission line for high performance radio frequency applications
US10631413B1 (en) * 2011-11-28 2020-04-21 The United States Of America As Represented By The Secretary Of The Army Enhanced protective layering process to accommodate circuit board heat dissipation
US9900988B1 (en) * 2011-11-28 2018-02-20 The United States Of America As Represented By The Secretary Of The Army Protective layering process for circuit board EMI sheilding and thermal management
US9254588B1 (en) * 2011-11-28 2016-02-09 The United States Of America As Represented By The Secretary Of The Army Protective layering process for circuit boards
US8541883B2 (en) 2011-11-29 2013-09-24 Advanced Semiconductor Engineering, Inc. Semiconductor device having shielded conductive vias
US8937376B2 (en) 2012-04-16 2015-01-20 Advanced Semiconductor Engineering, Inc. Semiconductor packages with heat dissipation structures and related methods
US8786060B2 (en) 2012-05-04 2014-07-22 Advanced Semiconductor Engineering, Inc. Semiconductor package integrated with conformal shield and antenna
US8704341B2 (en) 2012-05-15 2014-04-22 Advanced Semiconductor Engineering, Inc. Semiconductor packages with thermal dissipation structures and EMI shielding
US8948712B2 (en) 2012-05-31 2015-02-03 Skyworks Solutions, Inc. Via density and placement in radio frequency shielding applications
US8653634B2 (en) 2012-06-11 2014-02-18 Advanced Semiconductor Engineering, Inc. EMI-shielded semiconductor devices and methods of making
KR20160006257A (en) 2012-06-14 2016-01-18 스카이워크스 솔루션즈, 인코포레이티드 Power amplifier modules with bifet and harmonic termination and related systems, devices, and methods
WO2014011808A1 (en) 2012-07-13 2014-01-16 Skyworks Solutions, Inc. Racetrack design in radio frequency shielding applications
US9153542B2 (en) 2012-08-01 2015-10-06 Advanced Semiconductor Engineering, Inc. Semiconductor package having an antenna and manufacturing method thereof
US9978688B2 (en) 2013-02-28 2018-05-22 Advanced Semiconductor Engineering, Inc. Semiconductor package having a waveguide antenna and manufacturing method thereof
US9837701B2 (en) 2013-03-04 2017-12-05 Advanced Semiconductor Engineering, Inc. Semiconductor package including antenna substrate and manufacturing method thereof
US9129954B2 (en) 2013-03-07 2015-09-08 Advanced Semiconductor Engineering, Inc. Semiconductor package including antenna layer and manufacturing method thereof
US9172131B2 (en) 2013-03-15 2015-10-27 Advanced Semiconductor Engineering, Inc. Semiconductor structure having aperture antenna
CN103400825B (en) 2013-07-31 2016-05-18 日月光半导体制造股份有限公司 Semiconductor package and manufacturing method thereof
EP3306625A1 (en) 2016-10-05 2018-04-11 ABB Schweiz AG Conductive screen for power electronic elements enclosed in an insulating medium
US11721639B2 (en) * 2020-06-29 2023-08-08 Qualcomm Incorporated Multi-component modules (MCMs) including configurable electro-magnetic isolation (EMI) shield structures, and related methods
DE102023204910A1 (en) * 2023-05-25 2024-11-28 Volkswagen Aktiengesellschaft Method for producing a power electronic device and use of such a device in a motor vehicle

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US5166772A (en) * 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
US5309321A (en) * 1992-09-22 1994-05-03 Microelectronics And Computer Technology Corporation Thermally conductive screen mesh for encapsulated integrated circuit packages
US5355016A (en) * 1993-05-03 1994-10-11 Motorola, Inc. Shielded EPROM package
US5455456A (en) * 1993-09-15 1995-10-03 Lsi Logic Corporation Integrated circuit package lid
US5436203A (en) * 1994-07-05 1995-07-25 Motorola, Inc. Shielded liquid encapsulated semiconductor device and method for making the same
US5530202A (en) * 1995-01-09 1996-06-25 At&T Corp. Metallic RF or thermal shield for automatic vacuum placement
US5767447A (en) * 1995-12-05 1998-06-16 Lucent Technologies Inc. Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
KR100192760B1 (en) * 1996-02-29 1999-06-15 황인길 Method for manufacturing a BAG semiconductor package using a metal carrier frame and the semiconductor package
US5761053A (en) * 1996-05-08 1998-06-02 W. L. Gore & Associates, Inc. Faraday cage
US6191360B1 (en) * 1999-04-26 2001-02-20 Advanced Semiconductor Engineering, Inc. Thermally enhanced BGA package

Also Published As

Publication number Publication date
US6757181B1 (en) 2004-06-29
WO2002017394A1 (en) 2002-02-28

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