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AU2001276882A1 - Apparatus and method to dice integrated circuits from a wafer using a pressurized jet - Google Patents

Apparatus and method to dice integrated circuits from a wafer using a pressurized jet

Info

Publication number
AU2001276882A1
AU2001276882A1 AU2001276882A AU7688201A AU2001276882A1 AU 2001276882 A1 AU2001276882 A1 AU 2001276882A1 AU 2001276882 A AU2001276882 A AU 2001276882A AU 7688201 A AU7688201 A AU 7688201A AU 2001276882 A1 AU2001276882 A1 AU 2001276882A1
Authority
AU
Australia
Prior art keywords
wafer
integrated circuits
pressurized jet
dice
dice integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001276882A
Inventor
Chris P. Calkins
Robert Cole
David James Quirke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lightwave Microsystems Corp
Original Assignee
Lightwave Microsystems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/874,950 external-priority patent/US6705925B1/en
Application filed by Lightwave Microsystems Corp filed Critical Lightwave Microsystems Corp
Publication of AU2001276882A1 publication Critical patent/AU2001276882A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • B24C1/045—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass for cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
AU2001276882A 2000-10-20 2001-07-12 Apparatus and method to dice integrated circuits from a wafer using a pressurized jet Abandoned AU2001276882A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US69334700A 2000-10-20 2000-10-20
US09693347 2000-10-20
US09874950 2001-06-05
US09/874,950 US6705925B1 (en) 2000-10-20 2001-06-05 Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
PCT/US2001/021948 WO2002035585A1 (en) 2000-10-20 2001-07-12 Apparatus and method to dice integrated circuits from a wafer using a pressurized jet

Publications (1)

Publication Number Publication Date
AU2001276882A1 true AU2001276882A1 (en) 2002-05-06

Family

ID=27105153

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001276882A Abandoned AU2001276882A1 (en) 2000-10-20 2001-07-12 Apparatus and method to dice integrated circuits from a wafer using a pressurized jet

Country Status (3)

Country Link
AU (1) AU2001276882A1 (en)
TW (1) TW512450B (en)
WO (1) WO2002035585A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1873824B1 (en) * 2002-09-13 2009-03-11 Towa-Intercon Technology, Inc. Jet singulation of a substrate
US7153186B2 (en) 2002-09-13 2006-12-26 Towa Intercon Technology, Inc. Jet singulation
AU2003267172A1 (en) * 2002-09-13 2004-04-30 Towa-Intercon Technology, Inc. Jet singulation of a substrate
SG111091A1 (en) * 2002-10-29 2005-05-30 Advanced Systems Automation Handler for semiconductor singulation and method therefor
US7094633B2 (en) * 2003-06-23 2006-08-22 Sandisk Corporation Method for efficiently producing removable peripheral cards
AT518176B1 (en) * 2016-06-09 2017-08-15 Steger Heinrich Method for operating a CNC machine

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778935A (en) * 1972-01-26 1973-12-18 Pennwalt Corp Abrading apparatus with rotary index table
EP0180430A3 (en) * 1984-10-25 1988-01-13 Tandem Computers Incorporated A process of reducing a wafer size
US4893440A (en) * 1986-05-01 1990-01-16 Airsonics License Partnership Abrasive jet machining
US5160403A (en) * 1991-08-09 1992-11-03 Xerox Corporation Precision diced aligning surfaces for devices such as ink jet printheads
US5962862A (en) * 1997-08-12 1999-10-05 Micron Technology, Inc. Method and apparatus for verifying the presence or absence of a component

Also Published As

Publication number Publication date
WO2002035585A1 (en) 2002-05-02
TW512450B (en) 2002-12-01

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