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AU1833570A - Improvements in electroless metal deposition - Google Patents

Improvements in electroless metal deposition

Info

Publication number
AU1833570A
AU1833570A AU18335/70A AU1833570A AU1833570A AU 1833570 A AU1833570 A AU 1833570A AU 18335/70 A AU18335/70 A AU 18335/70A AU 1833570 A AU1833570 A AU 1833570A AU 1833570 A AU1833570 A AU 1833570A
Authority
AU
Australia
Prior art keywords
metal deposition
electroless metal
electroless
deposition
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU18335/70A
Inventor
JR. JOHN FRANCIS McCORMACK and RUDOLPH J. ZEBLISKY FREDERICK WILLIAM SCHNELLE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of AU1833570A publication Critical patent/AU1833570A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AU18335/70A 1969-08-04 1970-08-03 Improvements in electroless metal deposition Expired AU1833570A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84742269A 1969-08-04 1969-08-04
USUS847,422 1969-08-04

Publications (1)

Publication Number Publication Date
AU1833570A true AU1833570A (en) 1972-02-10

Family

ID=25300588

Family Applications (1)

Application Number Title Priority Date Filing Date
AU18335/70A Expired AU1833570A (en) 1969-08-04 1970-08-03 Improvements in electroless metal deposition

Country Status (3)

Country Link
US (1) US3615737A (en)
AU (1) AU1833570A (en)
CA (1) CA923252A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1833470A (en) * 1969-08-04 1972-02-10 Photocircuits Corporation A Divison Of Kollmorgen Corporation Improvements in electroless metal deposition

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2064822C3 (en) * 1970-12-17 1974-06-20 Photocircuits Division Of Kollmorgen Corp., Hartford, Conn. (V.St.A.) Method for the electrometric determination of the cyanide ion concentration in solutions
US4124399A (en) * 1977-09-13 1978-11-07 Shipley Company Inc. Stabilized electroless plating solutions
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
JPH0634448B2 (en) * 1988-07-25 1994-05-02 株式会社日立製作所 Multilayer printed wiring board and manufacturing method thereof
US5721014A (en) * 1995-12-19 1998-02-24 Surface Tek Specialty Products, Inc. Composition and method for reducing copper oxide to metallic copper
US5753309A (en) * 1995-12-19 1998-05-19 Surface Tek Specialty Products, Inc. Composition and method for reducing copper oxide to metallic copper
US5900186A (en) * 1995-12-19 1999-05-04 Morton International, Inc. Composition and method for reducing copper oxide to metallic copper
JP4596553B2 (en) * 2005-07-20 2010-12-08 Ｊｘ日鉱日石金属株式会社 Electroless palladium plating solution
WO2012022660A1 (en) * 2010-08-17 2012-02-23 Chemetall Gmbh Process for the electroless copper plating of metallic substrates
JP5854727B2 (en) * 2010-09-21 2016-02-09 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ Silver electroplating solution without cyanide
JP6030848B2 (en) * 2012-05-07 2016-11-24 上村工業株式会社 Electroless copper plating bath and electroless copper plating method
US10294569B2 (en) * 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1833470A (en) * 1969-08-04 1972-02-10 Photocircuits Corporation A Divison Of Kollmorgen Corporation Improvements in electroless metal deposition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3257215A (en) * 1963-06-18 1966-06-21 Day Company Electroless copper plating
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
US3310430A (en) * 1965-06-30 1967-03-21 Day Company Electroless copper plating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1833470A (en) * 1969-08-04 1972-02-10 Photocircuits Corporation A Divison Of Kollmorgen Corporation Improvements in electroless metal deposition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1833470A (en) * 1969-08-04 1972-02-10 Photocircuits Corporation A Divison Of Kollmorgen Corporation Improvements in electroless metal deposition

Also Published As

Publication number Publication date
US3615737A (en) 1971-10-26
CA923252A (en) 1973-03-27

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