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AU1833470A - Improvements in electroless metal deposition - Google Patents

Improvements in electroless metal deposition

Info

Publication number
AU1833470A
AU1833470A AU18334/70A AU1833470A AU1833470A AU 1833470 A AU1833470 A AU 1833470A AU 18334/70 A AU18334/70 A AU 18334/70A AU 1833470 A AU1833470 A AU 1833470A AU 1833470 A AU1833470 A AU 1833470A
Authority
AU
Australia
Prior art keywords
metal deposition
electroless metal
electroless
deposition
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU18334/70A
Inventor
JR. JOHN FRANCIS McCORMACK and RUDOLPH J. ZEBLISKY FREDERICK WILLIAM SCHNELLE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of AU1833470A publication Critical patent/AU1833470A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AU18334/70A 1969-08-04 1970-08-03 Improvements in electroless metal deposition Expired AU1833470A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84742169A 1969-08-04 1969-08-04
USUS847,421 1969-08-04

Publications (1)

Publication Number Publication Date
AU1833470A true AU1833470A (en) 1972-02-10

Family

ID=25300584

Family Applications (1)

Application Number Title Priority Date Filing Date
AU18334/70A Expired AU1833470A (en) 1969-08-04 1970-08-03 Improvements in electroless metal deposition

Country Status (4)

Country Link
US (1) US3635758A (en)
JP (1) JPS5033970B1 (en)
AU (1) AU1833470A (en)
CA (1) CA927220A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1833570A (en) * 1969-08-04 1972-02-10 Photocircuits Corporation A Division Cf Kollmorgen Corporation Improvements in electroless metal deposition

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3873357A (en) * 1971-11-26 1975-03-25 Western Electric Co Method of depositing a metal on a surface of a substrate
US3873360A (en) * 1971-11-26 1975-03-25 Western Electric Co Method of depositing a metal on a surface of a substrate
BE794048A (en) * 1972-01-17 1973-07-16 Dynachem Corp COPPER COATING PROCESS AND SOLUTION WITHOUT ELECTRICAL TREATMENT
US3964906A (en) * 1973-12-12 1976-06-22 Western Electric Company, Inc. Method of forming a hydrophobic surface by exposing a colloidal sol to UV radiation
US4138267A (en) * 1976-12-28 1979-02-06 Okuno Chemical Industry Company, Limited Compositions for chemical copper plating
US4217182A (en) * 1978-06-07 1980-08-12 Litton Systems, Inc. Semi-additive process of manufacturing a printed circuit
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
DE4440299A1 (en) * 1994-11-11 1996-05-15 Metallgesellschaft Ag Process for the electroless deposition of copper coatings on iron and iron alloy surfaces
US5753309A (en) * 1995-12-19 1998-05-19 Surface Tek Specialty Products, Inc. Composition and method for reducing copper oxide to metallic copper
US5721014A (en) * 1995-12-19 1998-02-24 Surface Tek Specialty Products, Inc. Composition and method for reducing copper oxide to metallic copper
US5900186A (en) * 1995-12-19 1999-05-04 Morton International, Inc. Composition and method for reducing copper oxide to metallic copper
US5853798A (en) * 1997-09-12 1998-12-29 United Technologies Corporation Process for formation of an electrode on an anion exchange membrane
JP4595237B2 (en) * 2001-04-27 2010-12-08 日立金属株式会社 Copper plating solution and copper plating method
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
EP1938367A2 (en) * 2005-09-20 2008-07-02 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1833570A (en) * 1969-08-04 1972-02-10 Photocircuits Corporation A Division Cf Kollmorgen Corporation Improvements in electroless metal deposition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3119709A (en) * 1956-09-28 1964-01-28 Atkinson Lab Inc Material and method for electroless deposition of metal
US3257215A (en) * 1963-06-18 1966-06-21 Day Company Electroless copper plating
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1833570A (en) * 1969-08-04 1972-02-10 Photocircuits Corporation A Division Cf Kollmorgen Corporation Improvements in electroless metal deposition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1833570A (en) * 1969-08-04 1972-02-10 Photocircuits Corporation A Division Cf Kollmorgen Corporation Improvements in electroless metal deposition

Also Published As

Publication number Publication date
US3635758A (en) 1972-01-18
JPS5033970B1 (en) 1975-11-05
CA927220A (en) 1973-05-29

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