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ATE539135T1 - PHOSPHORUS COMPOSITION AND LIGHT EMITTING DEVICE THEREFROM - Google Patents

PHOSPHORUS COMPOSITION AND LIGHT EMITTING DEVICE THEREFROM

Info

Publication number
ATE539135T1
ATE539135T1 AT09007211T AT09007211T ATE539135T1 AT E539135 T1 ATE539135 T1 AT E539135T1 AT 09007211 T AT09007211 T AT 09007211T AT 09007211 T AT09007211 T AT 09007211T AT E539135 T1 ATE539135 T1 AT E539135T1
Authority
AT
Austria
Prior art keywords
light
emitting device
phosphor
luminous element
red phosphor
Prior art date
Application number
AT09007211T
Other languages
German (de)
Inventor
Shozo Oshio
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39697774&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE539135(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP2004250739A external-priority patent/JP2005336450A/en
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of ATE539135T1 publication Critical patent/ATE539135T1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Devices (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device which emits a high luminous flux of high color rendering properties, especially, a light-emitting device which emits warm white light.SOLUTION: The light-emitting device includes a luminous element and a phosphor layer. The luminous element is a blue luminous element that emits light which has the luminescence peak in a wavelength region of 440 nm or more and less than 500 nm. The phosphor layer includes: a green phosphor which contains Euor Ceas the emission major ions; and a red phosphor of a nitride or an oxynitride containing Euas the emission major ions. The green phosphor and the red phosphor emit light by being excited by the light emitted by the blue luminous element. The light-emitting device outputs light which includes light components emitted from the green phosphor, the red phosphor and the blue luminous element. The green phosphor has the excitation peak at the shorter wavelength side than the excitation wavelength which is the peak of the light emitted by the blue luminous element. The red phosphor is a nitride-aluminosilicate-based red phosphor.
AT09007211T 2004-04-27 2005-04-26 PHOSPHORUS COMPOSITION AND LIGHT EMITTING DEVICE THEREFROM ATE539135T1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004131770 2004-04-27
JP2004182797 2004-06-21
JP2004194196 2004-06-30
JP2004250739A JP2005336450A (en) 2004-04-27 2004-08-30 Phosphor composition, method for producing the same and light-emitting device using the same phosphor composition
JP2004363534A JP4128564B2 (en) 2004-04-27 2004-12-15 Light emitting device

Publications (1)

Publication Number Publication Date
ATE539135T1 true ATE539135T1 (en) 2012-01-15

Family

ID=39697774

Family Applications (2)

Application Number Title Priority Date Filing Date
AT08010928T ATE546506T1 (en) 2004-04-27 2005-04-26 LIGHT EMITTING DEVICE
AT09007211T ATE539135T1 (en) 2004-04-27 2005-04-26 PHOSPHORUS COMPOSITION AND LIGHT EMITTING DEVICE THEREFROM

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT08010928T ATE546506T1 (en) 2004-04-27 2005-04-26 LIGHT EMITTING DEVICE

Country Status (4)

Country Link
JP (8) JP4128564B2 (en)
KR (1) KR20110016506A (en)
AT (2) ATE546506T1 (en)
TW (2) TW200611963A (en)

Families Citing this family (139)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050053798A (en) 1996-06-26 2005-06-08 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 Light-emitting semiconductor component with luminescence conversion element
JP2006525682A (en) 2003-04-30 2006-11-09 クリー　インコーポレイテッド High power solid state light emitting device package
US7005679B2 (en) 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
JP3837588B2 (en) 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 Phosphors and light emitting devices using phosphors
WO2005103199A1 (en) 2004-04-27 2005-11-03 Matsushita Electric Industrial Co., Ltd. Phosphor composition and method for producing the same, and light-emitting device using the same
JP4128564B2 (en) * 2004-04-27 2008-07-30 松下電器産業株式会社 Light emitting device
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
KR20140063899A (en) 2005-04-01 2014-05-27 미쓰비시 가가꾸 가부시키가이샤 Alloy powder for aw material of inorganic functional material and phosphor
JP2007049114A (en) 2005-05-30 2007-02-22 Sharp Corp Light emitting device and manufacturing method thereof
US7262439B2 (en) 2005-11-22 2007-08-28 Lumination Llc Charge compensated nitride phosphors for use in lighting applications
US7859182B2 (en) 2005-08-31 2010-12-28 Lumination Llc Warm white LED-based lamp incoporating divalent EU-activated silicate yellow emitting phosphor
JP4832995B2 (en) * 2005-09-01 2011-12-07 シャープ株式会社 Light emitting device
JP2009527071A (en) 2005-12-22 2009-07-23 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド Lighting device
NL2000033C1 (en) * 2006-03-20 2007-09-21 Univ Eindhoven Tech Device for converting electromagnetic radiation energy into electrical energy and a method for manufacturing such a device.
JP5239182B2 (en) * 2006-03-27 2013-07-17 三菱化学株式会社 Phosphor and light emitting device using the same
JP2007312374A (en) * 2006-04-19 2007-11-29 Mitsubishi Chemicals Corp Color image display device
EP2009486A4 (en) * 2006-04-19 2009-12-09 Mitsubishi Chem Corp Color image display device
EP2011164B1 (en) 2006-04-24 2018-08-29 Cree, Inc. Side-view surface mount white led
JP5141107B2 (en) * 2006-06-27 2013-02-13 三菱化学株式会社 Lighting device
WO2008001799A1 (en) 2006-06-27 2008-01-03 Mitsubishi Chemical Corporation Illuminating device
KR101258229B1 (en) * 2006-06-30 2013-04-25 서울반도체 주식회사 Light emitting device
JP5100059B2 (en) * 2006-08-24 2012-12-19 スタンレー電気株式会社 Phosphor, method for producing the same, and light emitting device using the same
KR100771772B1 (en) * 2006-08-25 2007-10-30 삼성전기주식회사 White LED Module
JP5378644B2 (en) * 2006-09-29 2013-12-25 Ｄｏｗａホールディングス株式会社 Method for producing nitride phosphor or oxynitride phosphor
JP4837045B2 (en) * 2006-10-12 2011-12-14 パナソニック株式会社 Light emitting device and manufacturing method thereof
US7804239B2 (en) 2006-10-17 2010-09-28 Samsung Led Co., Ltd. White light emitting diode
KR100862695B1 (en) * 2006-10-17 2008-10-10 삼성전기주식회사 White light emitting diode
JP2008116849A (en) * 2006-11-07 2008-05-22 Sony Corp Display device
JP5367218B2 (en) 2006-11-24 2013-12-11 シャープ株式会社 Method for manufacturing phosphor and method for manufacturing light emitting device
JP4520972B2 (en) * 2006-11-28 2010-08-11 Ｄｏｗａエレクトロニクス株式会社 Light emitting device and manufacturing method thereof
JP4228012B2 (en) * 2006-12-20 2009-02-25 Ｎｅｃライティング株式会社 Red light emitting nitride phosphor and white light emitting device using the same
JP5137395B2 (en) * 2006-12-25 2013-02-06 京セラ株式会社 Light emitting device
JP4824600B2 (en) * 2007-02-21 2011-11-30 富士フイルム株式会社 Planar illumination device, evaluation method for planar illumination device, and manufacturing method using the same
JP2008208238A (en) * 2007-02-27 2008-09-11 Showa Denko Kk Fluorescent substance, method for manufacturing the same, and lighting apparatus and image display apparatus including the same
JP2008218485A (en) * 2007-02-28 2008-09-18 Toshiba Lighting & Technology Corp Light emitting device
JP2008244469A (en) * 2007-02-28 2008-10-09 Toshiba Lighting & Technology Corp Light emitting device
JP2008244468A (en) * 2007-02-28 2008-10-09 Toshiba Lighting & Technology Corp Light emitting device
JP2008270781A (en) * 2007-03-23 2008-11-06 Toshiba Lighting & Technology Corp Light emitting device
JP2008251664A (en) * 2007-03-29 2008-10-16 Toshiba Lighting & Technology Corp Lighting device
JP2008285662A (en) * 2007-04-18 2008-11-27 Mitsubishi Chemicals Corp Method for producing inorganic compound, phosphor, phosphor-containing composition, light emitting device, lighting device, and image display device
US9279079B2 (en) 2007-05-30 2016-03-08 Sharp Kabushiki Kaisha Method of manufacturing phosphor, light-emitting device, and image display apparatus
JP2009019163A (en) * 2007-07-13 2009-01-29 Sharp Corp Phosphor particle assembly for light emitting device, light emitting device, and backlight device for liquid crystal display
JPWO2009011205A1 (en) * 2007-07-19 2010-09-16 シャープ株式会社 Light emitting device
KR101173741B1 (en) 2007-08-30 2012-08-13 니치아 카가쿠 고교 가부시키가이샤 Light emitting de?ce
JP5092667B2 (en) * 2007-10-05 2012-12-05 三菱化学株式会社 Light emitting device
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
JPWO2009110285A1 (en) 2008-03-03 2011-07-14 シャープ株式会社 Light emitting device
US8598618B2 (en) 2008-04-17 2013-12-03 Kabushiki Kaisha Toshiba White light emitting device, backlight, liquid crystal display device, and illuminating device
JP2009289957A (en) * 2008-05-29 2009-12-10 Yamaguchi Univ Semiconductor light-emitting device and imaging device
WO2010023840A1 (en) * 2008-08-28 2010-03-04 Panasonic Corporation Semiconductor light emitting device and backlight source, backlight source system, display device, and electronic device using the same
WO2010029872A1 (en) 2008-09-09 2010-03-18 昭和電工株式会社 Light emitting unit, light emitting module, and display device
JP5220527B2 (en) * 2008-09-11 2013-06-26 昭和電工株式会社 Light emitting device, light emitting module
JP5220526B2 (en) * 2008-09-11 2013-06-26 昭和電工株式会社 Light emitting device, light emitting module, display device
TW201011942A (en) * 2008-09-11 2010-03-16 Advanced Optoelectronic Tech Method and system for configuring high CRI LED
JP2010151851A (en) * 2008-11-28 2010-07-08 Toshiba Corp Display device
JP2010177620A (en) * 2009-02-02 2010-08-12 Showa Denko Kk Production process of light-emitting device
JP5483898B2 (en) * 2009-02-19 2014-05-07 住友金属鉱山株式会社 Method for producing oxide phosphor
CN102405538A (en) 2009-08-26 2012-04-04 三菱化学株式会社 Semiconductor white light-emitting device
WO2011024296A1 (en) * 2009-08-28 2011-03-03 株式会社 東芝 Process for producing fluorescent substance and fluorescent substance produced thereby
CN102630288B (en) 2009-09-25 2015-09-09 科锐公司 There is the lighting apparatus of low dazzle and high brightness levels uniformity
JP5824676B2 (en) * 2009-09-29 2015-11-25 パナソニックＩｐマネジメント株式会社 LED illumination light source and illumination device
JP5712428B2 (en) * 2009-10-23 2015-05-07 国立大学法人山梨大学 Red phosphor for ultraviolet excitation light source
CN102686700B (en) * 2010-02-26 2015-03-25 三菱化学株式会社 Halophosphate phosphor and white light emitting device
US20110220920A1 (en) * 2010-03-09 2011-09-15 Brian Thomas Collins Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
US8643038B2 (en) 2010-03-09 2014-02-04 Cree, Inc. Warm white LEDs having high color rendering index values and related luminophoric mediums
EP2546897B1 (en) * 2010-03-12 2019-01-23 Kabushiki Kaisha Toshiba White lighting device
JP2011225696A (en) * 2010-04-19 2011-11-10 Sharp Corp Red-type light-emitting phosphor, process for producing the same and light-emitting device using the red-type light-emitting phosphor
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
JP2012060097A (en) * 2010-06-25 2012-03-22 Mitsubishi Chemicals Corp White semiconductor light-emitting device
KR101243773B1 (en) 2010-08-17 2013-03-14 순천대학교 산학협력단 Light-emitting device and wavelength conversion composition for solar cell, light-emitting device and solar cell comprising this composition and method of manufacturing the wavelength conversion composition
JP5185421B2 (en) 2010-09-09 2013-04-17 株式会社東芝 Red light emitting phosphor and light emitting device using the same
JP5864851B2 (en) 2010-12-09 2016-02-17 シャープ株式会社 Light emitting device
US9617469B2 (en) 2011-01-06 2017-04-11 Shin-Etsu Chemical Co., Ltd. Phosphor particles, making method, and light-emitting diode
JP2012246462A (en) * 2011-05-31 2012-12-13 Sharp Corp Light-emitting device
US8747697B2 (en) * 2011-06-07 2014-06-10 Cree, Inc. Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same
JP2013007610A (en) 2011-06-23 2013-01-10 Canon Inc Color measuring unit and image forming apparatus
MX2011007939A (en) * 2011-07-13 2013-01-24 William J Odom Jr Avian house lighting apparatus and method.
CN103764788B (en) * 2011-08-04 2016-04-20 皇家飞利浦有限公司 Photoconverter and the lighting unit comprising such photoconverter
DE202011106052U1 (en) * 2011-09-23 2011-11-09 Osram Ag Light source with phosphor and associated lighting unit.
JP5899470B2 (en) * 2011-12-16 2016-04-06 パナソニックＩｐマネジメント株式会社 Lighting device
JP2013163722A (en) * 2012-02-09 2013-08-22 Denki Kagaku Kogyo Kk Phosphor and light-emitting device
JP2013163725A (en) * 2012-02-09 2013-08-22 Denki Kagaku Kogyo Kk Phosphor and light-emitting device
JP2015083617A (en) * 2012-02-09 2015-04-30 電気化学工業株式会社 Phosphor and light-emitting device
JP2015083618A (en) * 2012-02-09 2015-04-30 電気化学工業株式会社 Phosphor and light emitting device
JP2013163723A (en) * 2012-02-09 2013-08-22 Denki Kagaku Kogyo Kk Phosphor and light-emitting device
KR101409489B1 (en) 2012-02-27 2014-06-18 경기대학교 산학협력단 Silicon oxynitride phosphor and light device having the same
WO2013129854A1 (en) 2012-02-27 2013-09-06 경기대학교 산학협력단 Silicon oxynitride phosphor, production method for same, and optical element comprising same
JP2013207241A (en) * 2012-03-29 2013-10-07 Mitsubishi Chemicals Corp Semiconductor light-emitting device, semiconductor light-emitting system, and luminaire
WO2013158930A1 (en) * 2012-04-18 2013-10-24 Nitto Denko Corporation Phosphor ceramics and methods of making the same
CN104583365B (en) * 2012-07-18 2016-05-11 英特曼帝克司公司 Based on the red emitting phosphor of nitride
EP3176836B1 (en) * 2012-10-04 2024-04-10 Seoul Semiconductor Co., Ltd. White light emitting device, lighting system, and dental lighting system
WO2014119313A1 (en) * 2013-01-31 2014-08-07 株式会社 東芝 Light emitting device and led light bulb
JP6853614B2 (en) * 2013-03-29 2021-03-31 株式会社朝日ラバー LED lighting device, its manufacturing method and LED lighting method
EP2803715B1 (en) * 2013-05-16 2020-02-26 LG Innotek Co., Ltd. Phosphor and light emitting device package including the same
CN104241262B (en) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 Light emitting device and display device
JP6266923B2 (en) * 2013-08-26 2018-01-24 シチズン電子株式会社 LED light emitting device
US9142733B2 (en) * 2013-09-03 2015-09-22 Panasonic Intellectual Property Management Co., Ltd. Light source device including a high energy light source and a wavelength conversion member, illuminating device comprising the same, and vehicle
EP3557635B1 (en) 2013-10-02 2020-05-27 Glbtech Co. Ltd. White light emitting device having high color rendering
JP2015082596A (en) 2013-10-23 2015-04-27 株式会社東芝 Light emitting device
US9837585B2 (en) * 2013-11-08 2017-12-05 Lumimicro Corp. Ltd. Light emitting device
KR101487961B1 (en) 2013-11-25 2015-01-30 율촌화학 주식회사 White light emitting device and light emitting apparatus including the same
JP6195117B2 (en) 2013-12-03 2017-09-13 パナソニックＩｐマネジメント株式会社 Acid chloride phosphor, light emitting device, lighting device, and vehicle
JP6358457B2 (en) * 2014-01-20 2018-07-18 パナソニックＩｐマネジメント株式会社 Light emitting device, illumination light source, and illumination device
JP6323177B2 (en) * 2014-05-30 2018-05-16 日亜化学工業株式会社 Semiconductor light emitting device
JP6405738B2 (en) * 2014-06-19 2018-10-17 三菱ケミカル株式会社 Light emitting device
JP6407654B2 (en) * 2014-10-08 2018-10-17 株式会社東芝 LED module and lighting device
JP2016111267A (en) * 2014-12-09 2016-06-20 パナソニックＩｐマネジメント株式会社 Illumination module, lighting device and liquid crystal display device
JP6755090B2 (en) * 2014-12-11 2020-09-16 シチズン電子株式会社 Light emitting device and manufacturing method of light emitting device
US9716212B2 (en) 2014-12-19 2017-07-25 Nichia Corporation Light emitting device
JP6428245B2 (en) * 2014-12-19 2018-11-28 日亜化学工業株式会社 Light emitting device
JP6506037B2 (en) * 2015-02-02 2019-04-24 富士フイルム株式会社 Phosphor-Dispersed Composition, Fluorescent Molded Product Obtained Using the Same, Wavelength Conversion Film, Wavelength Conversion Member, Backlight Unit, Liquid Crystal Display Device
DE102015202159B4 (en) * 2015-02-06 2023-06-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung semiconductor lighting device
JP6666341B2 (en) 2015-06-24 2020-03-13 株式会社東芝 White light source system
JP6707728B2 (en) * 2015-06-24 2020-06-10 東芝マテリアル株式会社 White light source system for medical facility lighting
JP6856890B2 (en) * 2015-08-28 2021-04-14 株式会社小糸製作所 Fluorescent material
EP3135746B1 (en) 2015-08-28 2019-05-29 Nichia Corporation Method for producing nitride fluorescent material
KR102514150B1 (en) * 2016-01-05 2023-04-04 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device and lighting unit having thereof
US10256374B2 (en) 2016-03-04 2019-04-09 Nichia Corporation Light emitting device
JP6460040B2 (en) * 2016-03-04 2019-01-30 日亜化学工業株式会社 Light emitting device
EP3241880B1 (en) * 2016-05-03 2018-04-18 Lumileds Holding B.V. Wavelength converting material for a light emitting device
JP6477779B2 (en) * 2016-05-26 2019-03-06 日亜化学工業株式会社 Light emitting device
JP2016189488A (en) * 2016-07-07 2016-11-04 日亜化学工業株式会社 Light emitting device
JP6848637B2 (en) * 2016-12-02 2021-03-24 豊田合成株式会社 Light emitting device
JP7004892B2 (en) * 2017-04-11 2022-01-21 日亜化学工業株式会社 Luminescent device
JP6934316B2 (en) * 2017-04-24 2021-09-15 日本特殊陶業株式会社 Wavelength conversion member
JP6861389B2 (en) * 2017-07-26 2021-04-21 パナソニックＩｐマネジメント株式会社 Outdoor lighting equipment
US10837607B2 (en) * 2017-09-26 2020-11-17 Lumileds Llc Light emitting device with improved warm-white color point
JP7009879B2 (en) * 2017-09-26 2022-01-26 豊田合成株式会社 Luminescent device
JP2019062173A (en) * 2017-09-26 2019-04-18 パナソニックＩｐマネジメント株式会社 Luminaire apparatus and light-emitting device
KR102130817B1 (en) * 2018-01-25 2020-07-08 지엘비텍 주식회사 White Light Emitting Device with High Color Rendering Index
JP2020053664A (en) * 2018-09-20 2020-04-02 豊田合成株式会社 Light emitting device
KR20210105892A (en) 2018-12-27 2021-08-27 덴카 주식회사 Phosphor substrates, light emitting substrates and lighting devices
WO2020137762A1 (en) 2018-12-27 2020-07-02 デンカ株式会社 Fluorescent substrate, light-emitting substrate, and lighting device
WO2020137760A1 (en) * 2018-12-27 2020-07-02 デンカ株式会社 Phosphor substrate, light-emitting substrate, and lighting device
EP3905345B1 (en) 2018-12-27 2024-01-24 Denka Company Limited Light-emitting substrate, and lighting device
CN113228316B (en) 2018-12-27 2025-01-10 电化株式会社 Phosphor substrate, light-emitting substrate, and lighting device
WO2020175710A1 (en) * 2019-02-28 2020-09-03 京セラ株式会社 Light emitting device and illumination device
CN110364598B (en) * 2019-06-20 2020-10-09 华灿光电(苏州）有限公司 Light-emitting diode epitaxial wafer and method of making the same
CN116462497B (en) * 2023-03-16 2024-09-13 河北光兴半导体技术有限公司 Tb (Tb)3+Doped aluminate green fluorescent ceramic and preparation method and application thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6850002B2 (en) * 2000-07-28 2005-02-01 Osram Opto Semiconductors Gmbh Light emitting device for generating specific colored light, including white light
JP4619509B2 (en) * 2000-09-28 2011-01-26 株式会社東芝 Light emitting device
DE10133352A1 (en) * 2001-07-16 2003-02-06 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Lighting unit with at least one LED as a light source
EP2017901A1 (en) * 2001-09-03 2009-01-21 Panasonic Corporation Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting DEV
DE10147040A1 (en) * 2001-09-25 2003-04-24 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Lighting unit with at least one LED as a light source
JP4221950B2 (en) * 2002-05-23 2009-02-12 日亜化学工業株式会社 Phosphor
JP2003321675A (en) * 2002-04-26 2003-11-14 Nichia Chem Ind Ltd Nitride fluorophor and method for producing the same
US7642708B2 (en) * 2002-03-25 2010-01-05 Koninklijke Philips Electronics N.V. Tri-color white light led lamp
FR2840748B1 (en) * 2002-06-05 2004-08-27 France Telecom METHOD AND SYSTEM FOR VERIFYING ELECTRONIC SIGNATURES AND MICROCIRCUIT CARD FOR IMPLEMENTING THE METHOD
CN100552283C (en) * 2002-06-06 2009-10-21 埃莱特技术公司 By using fluorescent dye to come the lighting device of simulate neon
JP4207489B2 (en) * 2002-08-06 2009-01-14 株式会社豊田中央研究所 α-sialon phosphor
EP1413619A1 (en) * 2002-09-24 2004-04-28 Osram Opto Semiconductors GmbH Luminescent material, especially for LED application
JP3837588B2 (en) * 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 Phosphors and light emitting devices using phosphors
JP4362625B2 (en) * 2004-02-18 2009-11-11 独立行政法人物質・材料研究機構 Method for manufacturing phosphor
JP3921545B2 (en) * 2004-03-12 2007-05-30 独立行政法人物質・材料研究機構 Phosphor and production method thereof
JP4128564B2 (en) * 2004-04-27 2008-07-30 松下電器産業株式会社 Light emitting device

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