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ATE458276T1 - Durchsichtige led-anzeigevorrichtung - Google Patents

Durchsichtige led-anzeigevorrichtung

Info

Publication number
ATE458276T1
ATE458276T1 AT05425255T AT05425255T ATE458276T1 AT E458276 T1 ATE458276 T1 AT E458276T1 AT 05425255 T AT05425255 T AT 05425255T AT 05425255 T AT05425255 T AT 05425255T AT E458276 T1 ATE458276 T1 AT E458276T1
Authority
AT
Austria
Prior art keywords
display device
led display
stretches
led sources
conductive paths
Prior art date
Application number
AT05425255T
Other languages
English (en)
Inventor
Piermario Repetto
Sabino Sinesi
Sara Padovani
Stefano Bernard
Denis Bollea
Davide Capello
Alberto Pairetti
Michele Antonipieri
Original Assignee
Fiat Ricerche
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fiat Ricerche filed Critical Fiat Ricerche
Application granted granted Critical
Publication of ATE458276T1 publication Critical patent/ATE458276T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142Two-dimensional arrangements, e.g. asymmetric LED layout
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
AT05425255T 2005-04-21 2005-04-21 Durchsichtige led-anzeigevorrichtung ATE458276T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05425255A EP1715522B1 (de) 2005-04-21 2005-04-21 Durchsichtige LED-Anzeigevorrichtung

Publications (1)

Publication Number Publication Date
ATE458276T1 true ATE458276T1 (de) 2010-03-15

Family

ID=35058813

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05425255T ATE458276T1 (de) 2005-04-21 2005-04-21 Durchsichtige led-anzeigevorrichtung

Country Status (6)

Country Link
US (1) US7932524B2 (de)
EP (1) EP1715522B1 (de)
JP (2) JP2006301650A (de)
CN (1) CN100514637C (de)
AT (1) ATE458276T1 (de)
DE (1) DE602005019384D1 (de)

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ATE393374T1 (de) 2006-02-15 2008-05-15 Fiat Ricerche Leuchtanzeige für automobil-satelliten- navigationssysteme
CN100585820C (zh) * 2007-05-24 2010-01-27 宏齐科技股份有限公司 具高效率发光效果的发光二极管封装方法及其封装结构
CN101494173B (zh) * 2008-01-23 2011-04-13 宏齐科技股份有限公司 具有粗糙发光面的发光二极管芯片封装结构及其封装方法
US8174103B2 (en) * 2008-05-01 2012-05-08 International Business Machines Corporation Enhanced architectural interconnect options enabled with flipped die on a multi-chip package
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US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
DE112011101327T5 (de) * 2010-04-15 2013-01-31 Citizen Electronics Co., Ltd. Licht aussendende Vorrichtung
US10158057B2 (en) 2010-10-28 2018-12-18 Corning Incorporated LED lighting devices
TWI457675B (zh) * 2011-08-29 2014-10-21 Au Optronics Corp 畫素結構、液晶顯示面板與透明液晶顯示器
US9202996B2 (en) 2012-11-30 2015-12-01 Corning Incorporated LED lighting devices with quantum dot glass containment plates
KR102096874B1 (ko) * 2012-12-14 2020-04-03 한국전자통신연구원 투명 디스플레이 패널을 이용한 조명 장치 및 조광 제어 방법
CN103107274B (zh) * 2013-02-19 2016-06-08 河北神通光电科技有限公司 一种采用过渡电极实现的led集成封装模块
US9722160B2 (en) 2014-10-31 2017-08-01 Nichia Corporation Light emitting device and adaptive driving beam headlamp system
JP6507729B2 (ja) 2015-03-10 2019-05-08 日本電気硝子株式会社 透明導電膜付ガラス基板及びその製造方法
KR102104126B1 (ko) * 2015-08-06 2020-04-23 이 린 Led화소점, 발광부재, 발광패널 및 디스플레이 스크린
DE102015215301A1 (de) * 2015-08-11 2017-02-16 Osram Gmbh Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung
KR20170131910A (ko) 2016-05-23 2017-12-01 주식회사 루멘스 발광소자 및 이를 포함하는 발광벌브
WO2018211808A1 (ja) 2017-05-15 2018-11-22 ソニー株式会社 照明装置、および表示装置
FR3071033B1 (fr) * 2017-09-12 2021-11-19 Valeo Vision Procede d'obtention d'un dispositif lumineux dont l'aspect eteint est different de l'aspect allume
WO2019146634A1 (ja) 2018-01-25 2019-08-01 Agc株式会社 透明表示装置、及び透明表示装置を備えた合わせガラス
DE102018118974A1 (de) * 2018-08-03 2020-02-06 Osram Opto Semiconductors Gmbh Optoelektronische leuchtvorrichtung und verfahren zum steuern einer optoelektronischen leuchtvorrichtung
EP3848919A4 (de) 2018-09-04 2022-06-01 Agc Inc. Transparente anzeigevorrichtung, glasplatte mit transparenter anzeigevorrichtung, verbundglas mit transparenter anzeigevorrichtung und sich bewegender körper
CN111381372A (zh) * 2018-12-28 2020-07-07 永众科技股份有限公司 穿透式显示设备及增强现实显示器
WO2020196134A1 (ja) * 2019-03-22 2020-10-01 Agc株式会社 透明表示装置、透明表示装置付きガラス板、透明表示装置付き合わせガラス、及び移動体
WO2021010219A1 (ja) 2019-07-16 2021-01-21 Agc株式会社 透明センシングデバイス、合わせガラス、及び透明センシングデバイスの製造方法
WO2024075856A1 (ko) * 2022-10-04 2024-04-11 엘지전자 주식회사 발광 소자를 이용한 투명 디스플레이 장치
US20250022352A1 (en) * 2023-07-13 2025-01-16 Royce Hutain Gender Reveal System
CN117038778A (zh) * 2023-08-18 2023-11-10 电子科技大学长三角研究院(衢州) 一种适用于可见光通信的快速、高响应InxGa1-xN光电探测阵列

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Also Published As

Publication number Publication date
JP2006301650A (ja) 2006-11-02
EP1715522B1 (de) 2010-02-17
US20060238326A1 (en) 2006-10-26
DE602005019384D1 (de) 2010-04-01
US7932524B2 (en) 2011-04-26
EP1715522A1 (de) 2006-10-25
CN1855481A (zh) 2006-11-01
JP3169479U (ja) 2011-08-04
CN100514637C (zh) 2009-07-15

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Legal Events

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