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ATE400405T1 - Verfahren zur herstellung eines schleifgegenstands - Google Patents

Verfahren zur herstellung eines schleifgegenstands

Info

Publication number
ATE400405T1
ATE400405T1 AT06000630T AT06000630T ATE400405T1 AT E400405 T1 ATE400405 T1 AT E400405T1 AT 06000630 T AT06000630 T AT 06000630T AT 06000630 T AT06000630 T AT 06000630T AT E400405 T1 ATE400405 T1 AT E400405T1
Authority
AT
Austria
Prior art keywords
producing
backing
coating composition
grinding article
abrasive coating
Prior art date
Application number
AT06000630T
Other languages
English (en)
Inventor
Michael J Muilenburg
Chong Yong Kim
Jerry J Fizel
Richard J Webb
John J Gagliardi
Daniel B Pendergrass
Robert J Streifel
Wesley J Bruxvoort
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE400405T1 publication Critical patent/ATE400405T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/005—Making abrasive webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
AT06000630T 2000-11-29 2001-04-11 Verfahren zur herstellung eines schleifgegenstands ATE400405T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/726,064 US20020072296A1 (en) 2000-11-29 2000-11-29 Abrasive article having a window system for polishing wafers, and methods

Publications (1)

Publication Number Publication Date
ATE400405T1 true ATE400405T1 (de) 2008-07-15

Family

ID=24917074

Family Applications (2)

Application Number Title Priority Date Filing Date
AT01926874T ATE320881T1 (de) 2000-11-29 2001-04-11 Schleifmittel mit einem fenstersystem zum polieren von wafern und verfahren hierfür
AT06000630T ATE400405T1 (de) 2000-11-29 2001-04-11 Verfahren zur herstellung eines schleifgegenstands

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT01926874T ATE320881T1 (de) 2000-11-29 2001-04-11 Schleifmittel mit einem fenstersystem zum polieren von wafern und verfahren hierfür

Country Status (13)

Country Link
US (3) US20020072296A1 (de)
EP (2) EP1655103B1 (de)
JP (1) JP2004516947A (de)
KR (1) KR100711160B1 (de)
CN (1) CN1238161C (de)
AT (2) ATE320881T1 (de)
AU (1) AU2001253382A1 (de)
CA (1) CA2430377A1 (de)
DE (2) DE60118171T2 (de)
IL (1) IL155856A0 (de)
MY (1) MY126929A (de)
TW (1) TW564202B (de)
WO (1) WO2002043925A1 (de)

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US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US6960120B2 (en) 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
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US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
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US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
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US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
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US10675794B2 (en) 2011-02-24 2020-06-09 3M Innovative Properties Company Coated abrasive article with foam backing and method of making
CN102689270B (zh) * 2011-03-22 2015-04-01 中芯国际集成电路制造(上海)有限公司 固结磨料抛光垫及其制备方法
JP6432497B2 (ja) * 2015-12-10 2018-12-05 信越半導体株式会社 研磨方法
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
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Also Published As

Publication number Publication date
MY126929A (en) 2006-10-31
KR100711160B1 (ko) 2007-05-16
ATE320881T1 (de) 2006-04-15
US20030064663A1 (en) 2003-04-03
TW564202B (en) 2003-12-01
EP1337380A1 (de) 2003-08-27
CN1238161C (zh) 2006-01-25
US20030022598A1 (en) 2003-01-30
DE60118171D1 (de) 2006-05-11
IL155856A0 (en) 2003-12-23
KR20030048484A (ko) 2003-06-19
DE60118171T2 (de) 2007-01-25
JP2004516947A (ja) 2004-06-10
CN1476368A (zh) 2004-02-18
US6604985B2 (en) 2003-08-12
DE60134797D1 (de) 2008-08-21
EP1655103B1 (de) 2008-07-09
CA2430377A1 (en) 2002-06-06
EP1655103A1 (de) 2006-05-10
US20020072296A1 (en) 2002-06-13
EP1337380B1 (de) 2006-03-22
WO2002043925A1 (en) 2002-06-06
AU2001253382A1 (en) 2002-06-11
US6786810B2 (en) 2004-09-07

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