ATE334237T1 - Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung - Google Patents

Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung

Info

Publication number: ATE334237T1
Authority: AT; Austria
Prior art keywords: copper alloy; solution; tin copper; electro plating; shiny tin
Prior art date: 1999-12-22

Application number

AT00309301T

Other languages

English (en)

Inventor

Takaaki Tamura

Original Assignee

Nippon Macdermid Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-12-22

Filing date

2000-10-23

Publication date

2006-08-15

2000-10-23 Application filed by Nippon Macdermid Co Ltd filed Critical Nippon Macdermid Co Ltd

2006-08-15 Application granted granted Critical

2006-08-15 Publication of ATE334237T1 publication Critical patent/ATE334237T1/de

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)

AT00309301T 1999-12-22 2000-10-23 Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung ATE334237T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP36540599A JP2001181889A (ja)	1999-12-22	1999-12-22	光沢錫−銅合金電気めっき浴

Publications (1)

Publication Number	Publication Date
ATE334237T1 true ATE334237T1 (de)	2006-08-15

Family

ID=18484176

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT00309301T ATE334237T1 (de)	1999-12-22	2000-10-23	Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung

Country Status (8)

Country	Link
US (1)	US6372117B1 (de)
EP (1)	EP1111097B1 (de)
JP (1)	JP2001181889A (de)
CN (1)	CN1134558C (de)
AT (1)	ATE334237T1 (de)
DE (1)	DE60029549T2 (de)
ES (1)	ES2267469T3 (de)
TW (1)	TW581828B (de)

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DE50106133D1 (de) *	2000-09-20	2005-06-09	Schloetter Fa Dr Ing Max	Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
JP4698904B2 (ja)	2001-09-20	2011-06-08	株式会社大和化成研究所	錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
US6562221B2 (en) *	2001-09-28	2003-05-13	David Crotty	Process and composition for high speed plating of tin and tin alloys
US6773573B2 (en) *	2001-10-02	2004-08-10	Shipley Company, L.L.C.	Plating bath and method for depositing a metal layer on a substrate
US6652731B2 (en) *	2001-10-02	2003-11-25	Shipley Company, L.L.C.	Plating bath and method for depositing a metal layer on a substrate
EP1408141B1 (de) *	2002-10-11	2014-12-17	Enthone Inc.	Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen
US20060260948A2 (en) *	2005-04-14	2006-11-23	Enthone Inc.	Method for electrodeposition of bronzes
KR20080088593A (ko) *	2005-12-30	2008-10-02	알케마 인코포레이티드	고속 주석 도금 방법
JP4925835B2 (ja) *	2007-01-12	2012-05-09	日東電工株式会社	物質検知センサ
EP1961840B1 (de) *	2007-02-14	2009-12-30	Umicore Galvanotechnik GmbH	Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
CN101270492B (zh) *	2007-03-21	2010-12-29	来明工业(厦门)有限公司	锡铜合金镀层的电镀液及电镀方法
TWI341554B (en) *	2007-08-02	2011-05-01	Enthone	Copper metallization of through silicon via
US8585885B2 (en)	2007-08-28	2013-11-19	Rohm And Haas Electronic Materials Llc	Electrochemically deposited indium composites
ATE486157T1 (de)	2008-05-08	2010-11-15	Umicore Galvanotechnik Gmbh	Modifizierter kupfer-zinn-elektrolyt und verfahren zur abscheidung von bronzeschichten
DE102008032398A1 (de)	2008-07-10	2010-01-14	Umicore Galvanotechnik Gmbh	Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
DE102011008836B4 (de)	2010-08-17	2013-01-10	Umicore Galvanotechnik Gmbh	Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
CN101922027B (zh) *	2010-08-19	2011-10-26	武汉风帆电镀技术有限公司	无氰碱性镀铜液及其制备方法
EP2660360A1 (de) *	2011-08-30	2013-11-06	Rohm and Haas Electronic Materials LLC	Haftungsförderung von cyanidfreier weißer Bronze
CN102605394B (zh) *	2012-03-07	2015-02-18	深圳市华傲创表面技术有限公司	一种无氰酸性白铜锡电镀液
CN103422130B (zh) *	2012-05-14	2016-06-29	中国科学院金属研究所	一种电镀光亮锡镀层的镀液及其方法
CN102748391A (zh) *	2012-06-15	2012-10-24	湖北东风佳华汽车部件有限公司	轴瓦的表面无铅电镀减摩层及电镀工艺方法
CN103668359B (zh) *	2012-09-06	2016-03-02	上海造币有限公司	一种多层无氰电镀铜-锡合金镀层的电镀液、电镀工艺及其硬币
CN102953098B (zh) *	2012-11-20	2016-06-01	广东致卓精密金属科技有限公司	一种碱性溶液电镀白铜锡电镀液及工艺
CN103008530A (zh) *	2012-12-21	2013-04-03	安徽中兴华汉机械有限公司	铝合金泡沫模表面光亮剂及其制造方法
CN103215624B (zh) *	2013-04-18	2016-03-23	江门市瑞期精细化学工程有限公司	一种酸性无氰铜锡合金电镀液
US20150122661A1 (en) *	2013-11-05	2015-05-07	Rohm And Haas Electronic Materials Llc	Plating bath and method
US20160097139A1 (en) *	2014-10-02	2016-04-07	Jx Nippon Mining & Metals Corporation	Method For Manufacturing High Purity Tin, Electrowinning Apparatus For High Purity Tin And High Purity Tin
CN106498463A (zh) *	2016-12-25	2017-03-15	苏州锆钒电子科技有限公司	一种新型无氰电镀铜锡合金工艺
JP7070360B2 (ja) *	2018-11-16	2022-05-18	トヨタ自動車株式会社	スズ膜形成用のスズ溶液、及びそれを用いたスズ膜の形成方法
JP7140176B2 (ja) *	2020-11-25	2022-09-21	三菱マテリアル株式会社	錫合金めっき液
CN113026064A (zh) *	2021-02-26	2021-06-25	深圳市新富华表面技术有限公司	一种无氰无铅白铜锡电镀工艺

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JPS5760092A (en)	1980-09-29	1982-04-10	Seiko Instr & Electronics Ltd	Copper-tin alloy plating bath
JPS57101687A (en)	1980-12-18	1982-06-24	Seiko Instr & Electronics Ltd	Copper-tin alloy plating bath
US4347107A (en) *	1981-04-02	1982-08-31	Hooker Chemicals & Plastics Corp.	Electroplating tin and tin alloys and baths therefor
JPS589839A (ja)	1981-07-03	1983-01-20	Nippon Telegr & Teleph Corp <Ntt>	光フアイバの被覆方法
US4384930A (en) *	1981-08-21	1983-05-24	Mcgean-Rohco, Inc.	Electroplating baths, additives therefor and methods for the electrodeposition of metals
JPS5891181A (ja)	1981-11-24	1983-05-31	Seiko Instr & Electronics Ltd	銅−スズ合金めつき浴
JPS594518A (ja)	1982-06-25	1984-01-11	Matsushita Electric Works Ltd	整列供給装置
US4641827A (en)	1983-06-02	1987-02-10	Richard R. Walton	Fabric pickup and the like
JP2725438B2 (ja)	1990-05-07	1998-03-11	三菱マテリアル株式会社	恒温鍛造法および恒温鍛造用潤滑シート
US5385661A (en) *	1993-09-17	1995-01-31	International Business Machines Corporation	Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
JPH0827590A (ja)	1994-07-13	1996-01-30	Okuno Chem Ind Co Ltd	光沢銅−錫合金めっき浴
JPH0827591A (ja)	1994-07-13	1996-01-30	Okuno Chem Ind Co Ltd	光沢銅−錫合金めっき浴
AU1813397A (en) *	1996-03-04	1997-09-22	Naganoken	Tin-silver alloy plating bath and process for producing plated object using the plating bath
JP3816241B2 (ja) *	1998-07-14	2006-08-30	株式会社大和化成研究所	金属を還元析出させるための水溶液
TW577938B (en) *	1998-11-05	2004-03-01	Uyemura C & Co Ltd	Tin-copper alloy electroplating bath and plating process therewith

1999
- 1999-12-22 JP JP36540599A patent/JP2001181889A/ja active Pending
2000
- 2000-07-05 US US09/609,785 patent/US6372117B1/en not_active Expired - Lifetime
- 2000-10-23 AT AT00309301T patent/ATE334237T1/de not_active IP Right Cessation
- 2000-10-23 DE DE60029549T patent/DE60029549T2/de not_active Expired - Lifetime
- 2000-10-23 ES ES00309301T patent/ES2267469T3/es not_active Expired - Lifetime
- 2000-10-23 EP EP00309301A patent/EP1111097B1/de not_active Expired - Lifetime
- 2000-12-08 TW TW089126190A patent/TW581828B/zh not_active IP Right Cessation
- 2000-12-22 CN CNB001358340A patent/CN1134558C/zh not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP1111097A3 (de)	2003-02-05
EP1111097A2 (de)	2001-06-27
DE60029549T2 (de)	2007-07-26
EP1111097B1 (de)	2006-07-26
US6372117B1 (en)	2002-04-16
DE60029549D1 (de)	2006-09-07
JP2001181889A (ja)	2001-07-03
CN1134558C (zh)	2004-01-14
CN1302921A (zh)	2001-07-11
TW581828B (en)	2004-04-01
ES2267469T3 (es)	2007-03-16

Publication	Publication Date	Title
ATE334237T1 (de)	2006-08-15	Lösung für das elektroplattieren einer glänzenden zinn-kupfer-legierung
BR0113458A (pt)	2003-07-08	Peças de alumìnio eletrogalvanizadas, processo para sua produção e produto obtido
ATE306572T1 (de)	2005-10-15	Zink-nickel-elektroplattierung
ES8306194A1 (es)	1983-05-01	Un metodo para la deposicion de estano metalico brillante o de aleaciones de estano con cobre o rodio sobre un sustrato.
EP1201789A3 (de)	2002-05-08	Plattierungsbad und Verfahren zur Plattierung von Zinn-Zink Legierungen
JPS56152989A (en)	1981-11-26	Electroplating bath having luster and ductility for gold alloy coating
ATE86313T1 (de)	1993-03-15	Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung.
TWI255870B (en)	2006-06-01	Process and composition for high speed plating of tin and tin alloys
NO872114D0 (no)	1987-05-20	Surt bad for elektrolytisk belegning med gull.
AU2003265466A8 (en)	2004-06-03	Brightener additive and bath for alkaline cyanide-free zinc electroplating
DE60019428D1 (de)	2005-05-19	Legierungsplattierung
SE7812869L (sv)	1979-06-16	Surt zinkelektropleteringsforfarande och komposition
FR2699321B1 (fr)	1995-03-10	Procédé de fabrication en continu d'un conducteur électrique en aluminium cuivre et étame, et conducteur ainsi obtenu.
SE8300416D0 (sv)	1983-01-27	Zink cobalt alloy plating
SE7905198L (sv)	1979-12-17	Nytt bad for elektropletering av glensande tenn
WO2020106253A2 (en)	2020-05-28	A plating hanger for obtaining homogeneous plating
DE59911392D1 (de)	2005-02-10	Verfahren zur galvanischen Abscheidung von Zinkniederschlägen und/oder Zinklegierungsniederschlägen
KR20230121097A (ko)	2023-08-17	경질 은 층의 침착을 위한 은-비스무트 전해질
Aroyo et al.	1995	Leveling in pulse plating with brighteners and hydrodynamically active additives
ATE176935T1 (de)	1999-03-15	Alkalisches oder neutrales bad zur galvanischen abscheidung von palladium oder legierungen des palladiums
Beekes	1984	Alkaline Zinc Plating Bath and Process
ATE267896T1 (de)	2004-06-15	Galvanisch abgeschiedene lagerlegierung, galvanisches bad und verfahren zum galvanischen abscheiden
Morrissey	2003	Platinum plating
Martin et al.	1985	Zinc and Zinc Alloy Electroplating
Sribnaya et al.	1997	Electroplating the bright coatings of zinc and its alloys in sulfate baths

Legal Events

Date	Code	Title	Description
2007-01-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties