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JPS57101687A - Copper-tin alloy plating bath - Google Patents

Copper-tin alloy plating bath

Info

Publication number
JPS57101687A
JPS57101687A JP17950880A JP17950880A JPS57101687A JP S57101687 A JPS57101687 A JP S57101687A JP 17950880 A JP17950880 A JP 17950880A JP 17950880 A JP17950880 A JP 17950880A JP S57101687 A JPS57101687 A JP S57101687A
Authority
JP
Japan
Prior art keywords
alloy plating
plating bath
copper
tin alloy
polyethyleneimine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17950880A
Other languages
Japanese (ja)
Inventor
Hiroshige Ikeno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP17950880A priority Critical patent/JPS57101687A/en
Publication of JPS57101687A publication Critical patent/JPS57101687A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To obtain copper-tin alloy plating with good gloss in a wide current density range, in a copper cyanide-alkali stannate alloy plating bath, by adding a thiocyanate and polyethyleneimine or a derivative thereof thereto.
CONSTITUTION: A thiocyanate and polyethyleneimine or a derivative thereof is added to a copper cyanide-alkali stannate alloy plating bath to obtain a cop- per-tin alloy plating bath. For example, said plating bath contains about 100g/l sodium stannate, about 28.5g/l NaCN, about 11.5g/l copper cyanide, about 10g/lNaOH, about 40g/lNaSCN and about 0.5ml/l polyethyleneimine (as 30% aqueous solution). When plating is carried out in this bath under stirring by air by using a Ni plate anode, silver white gloss plating is obtained in a current density range of about 0.5W3.5A/dm2.
COPYRIGHT: (C)1982,JPO&Japio
JP17950880A 1980-12-18 1980-12-18 Copper-tin alloy plating bath Pending JPS57101687A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17950880A JPS57101687A (en) 1980-12-18 1980-12-18 Copper-tin alloy plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17950880A JPS57101687A (en) 1980-12-18 1980-12-18 Copper-tin alloy plating bath

Publications (1)

Publication Number Publication Date
JPS57101687A true JPS57101687A (en) 1982-06-24

Family

ID=16067026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17950880A Pending JPS57101687A (en) 1980-12-18 1980-12-18 Copper-tin alloy plating bath

Country Status (1)

Country Link
JP (1) JPS57101687A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6372117B1 (en) 1999-12-22 2002-04-16 Nippon Macdermid Co., Ltd. Bright tin-copper alloy electroplating solution

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6372117B1 (en) 1999-12-22 2002-04-16 Nippon Macdermid Co., Ltd. Bright tin-copper alloy electroplating solution

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