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ATE293516T1 - Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel - Google Patents

Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel

Info

Publication number
ATE293516T1
ATE293516T1 AT01971086T AT01971086T ATE293516T1 AT E293516 T1 ATE293516 T1 AT E293516T1 AT 01971086 T AT01971086 T AT 01971086T AT 01971086 T AT01971086 T AT 01971086T AT E293516 T1 ATE293516 T1 AT E293516T1
Authority
AT
Austria
Prior art keywords
particulate
polishing pad
polymer
crosslinked
binder
Prior art date
Application number
AT01971086T
Other languages
English (en)
Inventor
Robert G Swisher
Alan E Wang
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Application granted granted Critical
Publication of ATE293516T1 publication Critical patent/ATE293516T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT01971086T 2000-09-15 2001-09-14 Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel ATE293516T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/663,180 US6477926B1 (en) 2000-09-15 2000-09-15 Polishing pad
PCT/US2001/028948 WO2002022309A1 (en) 2000-09-15 2001-09-14 Polishing pad comprising particulate polymer and crosslinked polymer binder

Publications (1)

Publication Number Publication Date
ATE293516T1 true ATE293516T1 (de) 2005-05-15

Family

ID=24660789

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01971086T ATE293516T1 (de) 2000-09-15 2001-09-14 Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel

Country Status (8)

Country Link
US (1) US6477926B1 (de)
EP (1) EP1318891B1 (de)
CN (1) CN100346930C (de)
AT (1) ATE293516T1 (de)
AU (1) AU2001291016A1 (de)
DE (1) DE60110248T2 (de)
TW (1) TW550165B (de)
WO (1) WO2002022309A1 (de)

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US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
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US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
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JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) * 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
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US7824249B2 (en) * 2007-02-05 2010-11-02 San Fang Chemical Industry Co., Ltd. Polishing material having polishing particles and method for making the same
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
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US7530887B2 (en) * 2007-08-16 2009-05-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with controlled wetting
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US8512427B2 (en) * 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
US9439334B2 (en) 2012-04-03 2016-09-06 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US10906287B2 (en) 2013-03-15 2021-02-02 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
CN103878707B (zh) * 2014-03-31 2016-04-13 湖北鼎龙化学股份有限公司 化学机械抛光的抛光垫及其制备方法
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
WO2016062879A1 (de) * 2014-10-24 2016-04-28 Basf Se Schleifelemente und verfahren zu deren herstellung von schleifelementen
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
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US20180134918A1 (en) * 2016-11-11 2018-05-17 Jh Rhodes Company, Inc. Soft polymer-based material polishing media
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WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR101949905B1 (ko) * 2017-08-23 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
US11179822B2 (en) * 2017-08-31 2021-11-23 Hubei Dinghui Microelectronics Materials Co., Ltd Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material
EP3762871B1 (de) 2018-03-07 2024-08-07 X-Card Holdings, LLC Metallkarte
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
KR102743611B1 (ko) * 2019-07-12 2024-12-17 씨엠씨 머티리얼즈 엘엘씨 폴리아민 및 시클로헥산디메탄올 경화제를 사용한 폴리싱 패드
KR102293765B1 (ko) * 2019-11-21 2021-08-26 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
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Also Published As

Publication number Publication date
CN100346930C (zh) 2007-11-07
CN1474735A (zh) 2004-02-11
TW550165B (en) 2003-09-01
EP1318891A1 (de) 2003-06-18
DE60110248D1 (de) 2005-05-25
AU2001291016A1 (en) 2002-03-26
DE60110248T2 (de) 2006-03-09
WO2002022309A1 (en) 2002-03-21
US6477926B1 (en) 2002-11-12
EP1318891B1 (de) 2005-04-20

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