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Abundant and consistent wind resource of deep water ocean have attracted offshore wind energy industry to look for the possible expansions and adoption of various oil and gas floating platform technologies. This has compelled the industry... more
Abundant and consistent wind resource of deep water ocean have attracted offshore wind energy industry to look for the possible expansions and adoption of various oil and gas floating platform technologies. This has compelled the industry to venture in to floating offshore installations for wind turbines. The floating installations lead to complex rotor motions in 6 degrees of freedom. The current study focuses on the dynamic effects of the platform pitching motion on the rotor aerodynamics for OC3 phase IV case 5.1 with modified wave height. High fidelity CFD (Computational Fluid Dynamics) software was employed along with semi empirical tool, FAST developed by NREL, USA by assuming the wind turbine as a rigid body. The hydrodynamic effects leading to the pitching motion of the turbine platform are obtained from FAST. These pitching motions are coupled with the rotating blades to study transient flow behaviors using CFD. The results are compared with the standard BEM based methods h...
... GPWiddowson, Liao Youyong ASGaunekar THKuah and N.Srikanth ASM Technology Singapore. ... For the Y axis, the line of action of the force hm the two motors must be kept at the centre of CG to avoid any moment loading on the linear... more
... GPWiddowson, Liao Youyong ASGaunekar THKuah and N.Srikanth ASM Technology Singapore. ... For the Y axis, the line of action of the force hm the two motors must be kept at the centre of CG to avoid any moment loading on the linear guides, as this would cause the beam to ...
ABSTRACT A minimum mass design study applicable to thin circular tube is performed for various modes of eccentric compressive loading. Axial crushing failure mode, frequently noticeable in uniform axial compressive loading of thin... more
ABSTRACT A minimum mass design study applicable to thin circular tube is performed for various modes of eccentric compressive loading. Axial crushing failure mode, frequently noticeable in uniform axial compressive loading of thin circular tube, does not appear in eccentric compression. Hence, other compressive failure modes, e.g., global buckling, yield and local buckling are studied with respect to non-dimensional load and geometric shape factors for a fixed-free condition. These modes are predominant in ductile engineering alloys. A failure mode map in terms of non-dimensional load and shape-factor for a given load-eccentricity are obtained and the prescription for minimum mass is given.
ABSTRACT Wire bonding is an important method of interconnection in microelectronics. The micro welding of the contact pad to the gold wire is achieved by a thermosonic wire bonding process. Ultrasonic energy is known to soften metallic... more
ABSTRACT Wire bonding is an important method of interconnection in microelectronics. The micro welding of the contact pad to the gold wire is achieved by a thermosonic wire bonding process. Ultrasonic energy is known to soften metallic materials and hence when used in the wire bond process to decrease the flow stress similar to thermal energy. But experimental results shows for some lead frame designs neck fatigue, squashed bonds and poor wire pull strength are observed for some particular leads. Detailed resonance studies shows that those leads have closeby resonance compared to the bonding frequency which causes enhanced vibration resulting in smeared and squashed ball as well as localized fatigue at both the neck and heel of the wirebond. Hence precautions during lead frame design are necessary to avoid closeby resonance motion that are in the in-plane direction along the capillary vibration direction. This can be determined apriori using finite element method
PurposeWire bonding is an important method of interconnection in microelectronics. Ultrasonic energy is known to soften metallic materials and hence when used in the wire bond process it is effective to decrease the flow stress similar to... more
PurposeWire bonding is an important method of interconnection in microelectronics. Ultrasonic energy is known to soften metallic materials and hence when used in the wire bond process it is effective to decrease the flow stress similar to thermal energy. The paper aims to address this issue.Design/methodology/approachDetailed resonance studies show that some designs have closeby resonance compared to the bonding frequency which causes enhanced vibration resulting in such over squashed bonds. Hence, precautions in the design stage are necessary to understand the closeby resonance frequencies and corresponding mode shapes of the leadframe that are in‐plane in nature along the transducer axis that can be excited by the capillary's motion. This can be determined a priori using numerical methods such as finite element method. In this paper, one such case study has been dealt in detail to explain the overall methodology.FindingsTo minimize the effects of resonance, damping should be i...
Cu bonding has been making a wave in the IC packaging industry due to the combined efforts of wire, capillary and wirebonder manufacturers. The present challenge in copper bonding resides in minimizing the aluminium squeeze of the... more
Cu bonding has been making a wave in the IC packaging industry due to the combined efforts of wire, capillary and wirebonder manufacturers. The present challenge in copper bonding resides in minimizing the aluminium squeeze of the aluminium metallization of bond pads. This demands the copper ball to possess a lower yield stress for reduced energy to deform. In this
Key Engineering Materials22793-100KEMA
The integration of stacked dice into convention packaging formats provides a promising capability in reducing the cost, weight and size of the package while increasing the overall functionality of the system. It has been well accepted as... more
The integration of stacked dice into convention packaging formats provides a promising capability in reducing the cost, weight and size of the package while increasing the overall functionality of the system. It has been well accepted as enabling approach for smaller handheld devices such as cellular phones and digital camera. Among the various process steps in the packaging of these
In the present study, energy dissipation capability of magnesium containing variable amounts of nanosize alumina (Al2O3) particle is investigated. Synthesis of materials was accomplished using a solidification processing route. Energy... more
In the present study, energy dissipation capability of magnesium containing variable amounts of nanosize alumina (Al2O3) particle is investigated. Synthesis of materials was accomplished using a solidification processing route. Energy dissipation in the form of damping capacity was determined using a free–free type suspended beam arrangement coupled with a circle-fit approach. This technique is based on the classical vibration theory, by which the geometry and material properties of the metal matrix composites are related to resonant frequency and structural damping of the test specimen. Using the fact that the ratio of the vibration response to the applied force fits to a circle in the Argand plane for each resonant frequency of the test specimen, the damping factor and natural frequency is predicted accurately for the test specimen. The results revealed that an increase in the Al2O3 content upto 1.134 vol.% lead to an increase in the damping capacity upto 64%. Attempt is made to c...
A new bimetal magnesium/aluminium (Mg/Al) macrocomposite containing mm-scale Al core reinforcement was fabricated via casting and hot coextrusion. Characterization revealed fairly uniform Al volume fraction along the extruded rod length... more
A new bimetal magnesium/aluminium (Mg/Al) macrocomposite containing mm-scale Al core reinforcement was fabricated via casting and hot coextrusion. Characterization revealed fairly uniform Al volume fraction along the extruded rod length attributable to mechanical interlocking between Mg shell and Al core. Major defects were absent and Mg–Al interfacial integrity was good. Thermal stability of the macrocomposite was marginally improved when compared
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In the present study, a new methodology of using free-free method coupled with circle-fit approach is used to determine damping of ceramic reinforced magnesium composites. This technique is based on classical vibration theory, by which... more
In the present study, a new methodology of using free-free method coupled with circle-fit approach is used to determine damping of ceramic reinforced magnesium composites. This technique is based on classical vibration theory, by which the geometry and material properties of the metal matrix composites are related to the resonant frequency and structural damping of the test specimen. Using the
... Using conventional casting, the aluminium based composites containing 1.6, 3.1 and 4.7 vol.% of inter-connected reinforcement were synthesized to understand the variation of damping with volume fraction of reinforcement. ... 3.3.... more
... Using conventional casting, the aluminium based composites containing 1.6, 3.1 and 4.7 vol.% of inter-connected reinforcement were synthesized to understand the variation of damping with volume fraction of reinforcement. ... 3.3. Density and porosity measurement. ...
It is known that reinforcement of a ductile metallic matrix with stiff ceramic particles enhances damping arising from various sources. Among them elasto-thermodynamic damping can arise due to the inhomogeneity in stress distribution in a... more
It is known that reinforcement of a ductile metallic matrix with stiff ceramic particles enhances damping arising from various sources. Among them elasto-thermodynamic damping can arise due to the inhomogeneity in stress distribution in a metal matrix composite which is theoretically predictable using the second law of thermodynamics. A literature review shows earlier studies developed analytical models but assumed a spherical shape for the particle and the metallic matrix. In this study, a novel unit cell model is developed that is based on a finite element method which predicts the elasto-thermodynamic damping capacity of metal matrix composites under uniaxial cyclic loading. The model can account for the particle’s size and morphology features such as aspect ratio and stress concentration effects. It is also capable of predicting the effects of particle defects such as particle debond, particle breakage, etc., and the presence of process-induced defects such as voids and cracks in the metallic matrix on the composite damping characteristics.
Fine copper wire bonding is capable of making reliable electrical interconnections in microelectronic packages. Copper wires of 0.8–6mil diameter have been successfully bonded to different bond pad metallized and plated substrate... more
Fine copper wire bonding is capable of making reliable electrical interconnections in microelectronic packages. Copper wires of 0.8–6mil diameter have been successfully bonded to different bond pad metallized and plated substrate materials such as Al, Cu, Ag, Au and Pd. The three metallurgical related factors; solid-solubility and diffusion of dissimilar contact metals, oxide film breakage and plastic deformation of asperities play a critical role in the bonding. Plastic deformation of an asperity is the most significant factor one has to consider to attain good bonding. Soft aluminum metal (30–40 VHN), with a lower % asperity threshold deformation is easier to wire bond than harder metallic surfaces (Ni, W, Mo, Cr, Co, Ta) of 150–500 VHN. Good adhesion of wire bonding is achieved for the surface roughness (Ra) of 0.01–0.15μm and 0.02–0.6μm of bare and plated surfaces respectively. It is rationalized that the application of ultrasonic energy principally breaks the oxide film and def...
The idea of using low-k materials compared to conventional silica (SiO2) poses a large challenge to the back end processes such as wire bonding. In this study, numerical methods such as finite element method is used to characterize the... more
The idea of using low-k materials compared to conventional silica (SiO2) poses a large challenge to the back end processes such as wire bonding. In this study, numerical methods such as finite element method is used to characterize the permissible compressive bonding load at the bond pad. Since micro and nano hardness test conventionally use a conical indenter while the wirebond process experiences a spherical indentation, a comparison is made in terms of the force-indentation depth graphs. Results shows that the conical indenter induces early damage and their prediction of the force can be taken as a conservative measure during the wirebond process design. Further a numerical model can be made to verify for its sufficiency to squash the gold ball for a required dimension and to check for any damage within the device. In addition, the strain contours within the device at different metal layers provides better insight to modify the device’s active circuit layout below bond pad to dis...
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Research Interests:
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... The materials were synthesised using conventional casting. ... Typical circle ®t plots obtained from experimental data for the pure aluminium sample and the ... DENSITY AND POROSITYMEASUREMENT The results of the density measurements... more
... The materials were synthesised using conventional casting. ... Typical circle ®t plots obtained from experimental data for the pure aluminium sample and the ... DENSITY AND POROSITYMEASUREMENT The results of the density measurements and volume per-centage porosity ...
ABSTRACT Moisture ingression in plastic packages essentially occurs through delaminated interfaces. Hence, package reliability depends on the interfacial integrity between the various materials. In the present work, the adhesion of... more
ABSTRACT Moisture ingression in plastic packages essentially occurs through delaminated interfaces. Hence, package reliability depends on the interfacial integrity between the various materials. In the present work, the adhesion of epoxy-based molding compound and the copper leadframe is discussed. Results show that by the growth of a copper oxide layer, the surface roughness improves which promotes interlocking between the molding compound and leadframe during mold packing stage. Also by controlling the oxide thickness with pore-free structure, the adhesion strength can be significantly improved.
AZ31 nanocomposite containing Al2O3 nanoparticle reinforcement was fabricated using solidification processing followed by hot extrusion. The Al2O3 nanoparticle reinforcement was isolated prior to melting by wrapping in Al foil of minimal... more
AZ31 nanocomposite containing Al2O3 nanoparticle reinforcement was fabricated using solidification processing followed by hot extrusion. The Al2O3 nanoparticle reinforcement was isolated prior to melting by wrapping in Al foil of minimal weight (<0.50wt% with respect to AZ31 matrix weight). The AZ31 nanocomposite exhibited slightly smaller grain and intermetallic particle sizes than monolithic AZ31, reasonable Al2O3 nanoparticle distribution, non-dominant (0002) texture
In this study, two types of new bimetal magnesium/aluminium (Mg/Al) macrocomposites with millimetre-scale Al core reinforcement were fabricated using casting coupled with hot coextrusion. The first macrocomposite was fabricated with an... more
In this study, two types of new bimetal magnesium/aluminium (Mg/Al) macrocomposites with millimetre-scale Al core reinforcement were fabricated using casting coupled with hot coextrusion. The first macrocomposite was fabricated with an unthreaded Al core while the second one had a threaded Al core. Microstructural characterization revealed Mg texture change and interdiffusion of Mg and Al into each other across the interface in an unbalanced manner. Stress at the bimetal interface was attributed to solid solution formation, thermal expansion mismatch, unbalanced Kirkendall strain, lattice misfit strain and strain localization effects. Results revealed that the presence of the Al core leads to a decrease in strength but an increase in failure strain and toughness (work of fracture) of Mg. The threaded Al core reduced 0.2%YS and UTS of Mg by 17% and 15%, respectively, and enhanced the failure strain and toughness of Mg by 102% and 73%, respectively. This was 1.4 and 1.6 times less the reduction, and about 6 and 7 times more the increment, when compared with the corresponding changes of 0.2%YS, UTS, failure strain and toughness of the unthreaded macrocomposite, respectively. The toughening mechanisms in bimetal Mg/Al macrocomposites are investigated in this paper.
AZ31 nanocomposite containing carbon nanotube (CNT) reinforcement was fabricated using solidification processing followed by hot extrusion. The CNT reinforcement was integrated with AZ31 using an Al foil method. The AZ31 nanocomposite... more
AZ31 nanocomposite containing carbon nanotube (CNT) reinforcement was fabricated using solidification processing followed by hot extrusion. The CNT reinforcement was integrated with AZ31 using an Al foil method. The AZ31 nanocomposite exhibited slightly smaller grain and intermetallic particle sizes than monolithic AZ31, reasonable CNT distribution, dominant (10 - 11) texture in the transverse and longitudinal directions unlike monolithic AZ31, and 48% higher hardness than monolithic AZ31. Compared to monolithic AZ31, the AZ31 nanocomposite exhibited higher 0.2%TYS, UTS, tensile failure strain and tensile work of fracture (WOF) (+10%, +17%, +68% and +92%, respectively). Similarly, compared to monolithic AZ31, the AZ31 nanocomposite exhibited higher 0.2%CYS, UCS, average compressive failure strain and compressive WOF (+58%, +3%, +5% and +17%, respectively). Inclusive of crystallographic texture changes, the effect of CNT integration on the enhancement of tensile and compressive properties of AZ31 is investigated in this paper.
New bimetal AZ31–Al2O3/AA5052 macrocomposite comprising (a) Al2O3 nanoparticle-reinforced magnesium alloy AZ31 shell and (b) aluminum alloy AA5052 millimeter-scale core reinforcement was fabricated using solidification processing followed... more
New bimetal AZ31–Al2O3/AA5052 macrocomposite comprising (a) Al2O3 nanoparticle-reinforced magnesium alloy AZ31 shell and (b) aluminum alloy AA5052 millimeter-scale core reinforcement was fabricated using solidification processing followed by hot coextrusion. Microstructural characterization revealed more rounded intermetallic particle of decreased size, reasonable Al2O3 nanoparticle distribution, and non-dominant (0 0 0 2) texture in the longitudinal and transverse directions in the AZ31–Al2O3 nanocomposite shell. Interdiffusion of Mg and Al across the core–shell macrointerface into each other was also significant. Compared to monolithic AZ31, the AZ31–Al2O3 shell exhibited significantly higher hardness (+33%). In tension, the presence of Al2O3 nanoparticles (in the AZ31 shell) and AA5052 core significantly increased stiffness (+39%), yield strength (0.2% TYS) (+9%), ultimate strength (UTS) (+19%), average failure strain (+7%), and work of fracture (WOF) (+27%) of AZ31. In compression, the presence of Al2O3 nanoparticles (in the AZ31 shell) and AA5052 core significantly increased yield strength (0.2% CYS) (+58%), ultimate strength (UCS) (+4%), average failure strain (+11%), and WOF (+49%) of AZ31. The effect of joint presence of (a) Al2O3 nanoparticles (in the AZ31 shell) and (b) AA5052 millimeter-scale core on tensile and compressive properties of AZ31 is investigated in this article.
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ABSTRACT Metallic material with enhanced stiffness and damping characteristics is actively sought in the design of dynamic mechanical systems for mechanical components. Germanium is known to remain distinct in an aluminium matrix without... more
ABSTRACT Metallic material with enhanced stiffness and damping characteristics is actively sought in the design of dynamic mechanical systems for mechanical components. Germanium is known to remain distinct in an aluminium matrix without forming any intermetallic phases. The effect of the presence of germanium particles in the aluminium matrix is of interest and can be studied in terms of variation in overall damping property, which signifies the internal friction arising at the matrix-particle interface. Damping was measured using an impact-based vibration measurement of a suspended beam coupled with circle-fit approach. Results showed the presence of 1.9 vol. % of Ge in the Al matrix increases the damping capacity by 46% compared to pure Al which is equal to the improvement offered by the presence of 10.2 vol. % of SiC particulates. The present work also extends the study of the additional reinforcement rendered by the presence of SiC particulates along with Ge particulates. The experimental observation of this enhancement in damping characteristics has been rationalized in terms of the microstructural changes such as the presence of plastic zones at the matrix-reinforcement interface.
ABSTRACT In microelectronic packaging technology wire bonding is a common interconnect technique. The quality and reliability of wire bonds are generally evaluated by ball shear and stitch pull testing. From the load versus time and load... more
ABSTRACT In microelectronic packaging technology wire bonding is a common interconnect technique. The quality and reliability of wire bonds are generally evaluated by ball shear and stitch pull testing. From the load versus time and load versus tool tip displacement plots of the shear test, three regions can be observed. Region I primarily exhibits elastic-plastic deformation occur while crack nucleate in region II which propagates in region III which finally ends in a catastrophic failure. Fractographs reveal in the case of gold ball bonds shows fracture occurs in Al bond pad metallization close to Au-Al intermetallics. In Cu ball bonds of 1, 2, and 4 ml wire sizes also Al bond pad metallization cracks but penetrate deeper into the pad which indirectly shows that the bonding layer is stronger than that of gold ball bonds. Optical microscopic observation of the sheared copper bond surfaces reveal sticking of Al which provides qualitative information of the area of the bond between the ball bond and the bond pad. In thermally aged gold ball bonds, the gold above the intermetallic layer fractures. The energy required to fracture a gold or copper ball bond of I ml wire size is around 370 J/m(2), while an aged gold ball bond consumes about 520 J/m(2). Void nucleation and coalescence mechanism of ductile fracture takes place in the ball and stitch bonds, however silicon particles may be the preferential void nucleation sites in bond pad aluminum metallization failures. To understand the second bond strength, a stitch pull test was conducted and the results showed the neck of the stitched wire cracks thus leaving behind a tail bond on the lead finger.
... 6. Bohlen, J., Dobron, P., Swiostek, J., Letzig, D., Chmelik, F., Lukac, P. and Kainer, KU (2007). ... 10. Paramsothy, M., Srikanth, N. and Gupta, M. (2008). Processing, Microstructure and Properties of a Mg/Al Bimetal Macrocomposite,... more
... 6. Bohlen, J., Dobron, P., Swiostek, J., Letzig, D., Chmelik, F., Lukac, P. and Kainer, KU (2007). ... 10. Paramsothy, M., Srikanth, N. and Gupta, M. (2008). Processing, Microstructure and Properties of a Mg/Al Bimetal Macrocomposite, Journal of Composite Materials, in press. 11. ...
New bimetal magnesium/aluminium macrocomposites containing millimeter-scale Al-based core reinforcement were fabricated using solidification processing followed by hot coextrusion. Two approaches were attempted for enhancing the... more
New bimetal magnesium/aluminium macrocomposites containing millimeter-scale Al-based core reinforcement were fabricated using solidification processing followed by hot coextrusion. Two approaches were attempted for enhancing the performance of AZ31: (a) AZ31 shell integration with pure Al core (pure Al core approach) and (b) AZ31 shell integration with AA5052 core (AA5052 core approach), in that order. In the AA5052 core approach eventually,
Page 1. Processing, Microstructure, and Properties of a Mg/Al Bimetal Macrocomposite M. PARAMSOTHY AND M. GUPTA* Department of Mechanical Engineering, National University of Singapore 9 Engineering Drive 1, Singapore 117576 ...

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