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ORCIDTaesub Jung
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2020 – today
- 2024
[c10]Seunghwan Lee, Jeongjin Cho, Shinyoung Choi, Sung Yoon Min, Eunjung Lee, Minji Jung, Kyoungmok Son, Hyunchaul Jeong, Heetak Han, Sachoun Park, Sanghyuck Moon, Seungki Jung, Junseok Yang, Taesub Jung, Howoo Park, Bumsuk Kim, Kyungho Lee, Jesuk Lee:
A Temporal Noise Reduction via 40% Enhanced Conversion Gain in Dual-Pixel CMOS Image Sensor with Full-Depth Deep-Trench Isolation and Locally Lowered-Stack Technology. VLSI Technology and Circuits 2024: 1-2- 2023
- [c9]Hyuncheol Kim, Yun Hyeok Kim, Sanghyuck Moon, Hwanwoong Kim, Byeongjun Yoo, Jueun Park, Seyoung Kim, June-Mo Koo, Sewon Seo, Hye Ji Shin, Younghwan Choi, Jinwoo Kim, Kyungil Kim, Jae-Hoon Seo, Seunghyun Lim, Taesub Jung, Howoo Park, Sangil Jung, Juhyun Ko, Kyungho Lee, JungChak Ahn, Joonseo Yim:
A 0.64μm 4-Photodiode 1.28μm 50Mpixel CMOS Image Sensor with 0.98e- Temporal Noise and 20Ke- Full-Well Capacity Employing Quarter-Ring Source-Follower. ISSCC 2023: 96-97 - 2022
- [c8]Taesub Jung, Masato Fujita, Jeongjin Cho, Kyungduck Lee, Doosik Seol, Sungmin An, Chanhee Lee, Youjin Jeong, Minji Jung, Sachoun Park, Seungki Baek, Seungki Jung, Seunghwan Lee, Jungbin Yun, Eun Sub Shim, Heetak Han, Eunkyung Park, Haesick Sul, Sehyeon Kang, Kyungho Lee, JungChak Ahn, Duckhyun Chang:
A 1/1.57-inch 50Mpixel CMOS Image Sensor With 1.0μm All-Directional Dual Pixel by 0.5μm-Pitch Full-Depth Deep-Trench Isolation Technology. ISSCC 2022: 102-104 - 2021
- [c7]Jungwook Lim, Jihun Kim, Long Yan, Hyunpil Noh, Seungki Jung, Doosik Seol, Junghyung Pyo, Taesub Jung, Jungbin Yun, Dukseo Park, Howoo Park, Kyungho Lee, Takashi Nagano, JungChak Ahn:
A single chip PPG sensor with enhanced IR sensitivity for low power and small size. Imaging Sensors and Systems 2021: 1-5 - [c6]Eun Sub Shim, Kyungho Lee, Junghyung Pyo, Wooseok Choi, Jungbin Yun, Taesub Jung, Kyungduck Lee, Seyoung Kim, Chanhee Lee, Seungki Baek, Hyuncheol Kim, Sungsoo Choi, Junseok Yang, Kyoungmok Son, Jongwon Choi, Howoo Park, Bumsuk Kim, JungChak Ahn, Duckhyun Chang:
All-Directional Dual Pixel Auto Focus Technology in CMOS Image Sensors. VLSI Circuits 2021: 1-2 - 2020
- [j1]Min-Sun Keel
, Young-Gu Jin, Youngchan Kim, Daeyun Kim, Yeomyung Kim, Myunghan Bae, Bumsik Chung, Sooho Son, Hogyun Kim, Taemin An, Sung-Ho Choi, Taesub Jung, Yonghun Kwon, Sungyoung Seo, Sae-Young Kim, Kwanghyuk Bae, Seung-Chul Shin, Myoungoh Ki, Seoung-Jae Yoo, Chang-Rok Moon, Hyunsurk Ryu, Joonseok Kim:
A VGA Indirect Time-of-Flight CMOS Image Sensor With 4-Tap 7- $\mu$ m Global-Shutter Pixel and Fixed-Pattern Phase Noise Self-Compensation. IEEE J. Solid State Circuits 55(4): 889-897 (2020) - [c5]Taesub Jung, Yonghun Kwon, Sungyoung Seo, Min-Sun Keel, Changkeun Lee, Sung-Ho Choi, Sae-Young Kim, Sunghyuck Cho, Youngchan Kim, Young-Gu Jin, Moosup Lim, Hyunsurk Ryu, Yitae Kim, Joonseok Kim, Chang-Rok Moon:
A 4-tap global shutter pixel with enhanced IR sensitivity for VGA time-of-flight CMOS image sensors. Imaging Sensors and Systems 2020: 1-6
2010 – 2019
- 2019
- [c4]Min-Sun Keel, Young-Gu Jin, Youngchan Kim, Daeyun Kim, Yeomyung Kim, Myunghan Bae, Bumsik Chung, Sooho Son, Hogyun Kim, Taemin An, Sung-Ho Choi, Taesub Jung, Yonghun Kwon, Sungyoung Seo, Sae-Young Kim, Kwanghyuk Bae, Seung-Chul Shin, Myoungoh Ki, Chang-Rok Moon, Hyunsurk Ryu:
A 640×480 Indirect Time-of-Flight CMOS Image Sensor with 4-tap 7-μm Global-Shutter Pixel and Fixed-Pattern Phase Noise Self-Compensation Scheme. VLSI Circuits 2019: 258- - 2018
- [c3]Yitae Kim, Wonchul Choi, Donghyuk Park, Heegeun Jeoung, Bumsuk Kim, Youngsun Oh, Sunghoon Oh, Byungjun Park, Euiyeol Kim, Yunki Lee, Taesub Jung, Yongwoon Kim, Sukki Yoon, Seokyong Hong, Jesuk Lee, Sangil Jung, Changrok Moon, Yongin Park, Duckhyung Lee, Duckhyun Chang:
A 1/2.8-inch 24Mpixel CMOS image sensor with 0.9μm unit pixels separated by full-depth deep-trench isolation. ISSCC 2018: 84-86 - 2014
- [c2]JungChak Ahn, Kyungho Lee, Yitae Kim, Heegeun Jeong, Bumsuk Kim, Hongki Kim, Jongeun Park, Taesub Jung, Wonje Park, Taeheon Lee, Eunkyung Park, Sangjun Choi, Gyehun Choi, Haeyong Park, Yujung Choi, Seungwook Lee, Yunkyung Kim, Y. J. Jung, Donghyuk Park, Seungjoo Nah, Youngsun Oh, Mihye Kim, Yooseung Lee, Youngwoo Chung, Ihara Hisanori, Joon-Hyuk Im, Daniel-K J Lee, Byunghyun Yim, GiDoo Lee, Heesang Kown, Sungho Choi, Jeonsook Lee, Dongyoung Jang, Youngchan Kim, Tae Chan Kim, Hiroshige Goto, Chi-Young Choi, Duckhyung Lee, Gab-soo Han:
7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate. ISSCC 2014: 124-125 - 2011
- [c1]Sangjoo Lee, Kyungho Lee, Jongeun Park, Hyungjun Han, Younghwan Park, Taesub Jung, Youngheup Jang, Bumsuk Kim, Yitae Kim, Shay Hamami, Uzi Hizi, Mickey Bahar, Changrok Moon, JungChak Ahn, Duckhyung Lee, Hiroshige Goto, Yun-Tae Lee:
A 1/2.33-inch 14.6M 1.4μm-pixel backside-illuminated CMOS image sensor with floating diffusion boosting. ISSCC 2011: 416-418
Coauthor Index
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